LS8 Package 8-Pin Leadless Chip Carrier (5mm × 5mm) (Reference LTC DWG # 05-08-1852 Rev B) 8 2.50 ±0.15 PACKAGE OUTLINE 7 1 0.5 2 6 2.54 ±0.15 1.4 3 1.50 ±0.15 4 0.70 ±0.05 × 8 e4 XYY ZZ ABCDEF Q12345 COMPONENT PIN “A1” 5.00 SQ ±0.15 5.80 SQ ±0.15 TRAY PIN 1 BEVEL APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 5.00 SQ ±0.15 1.45 ±0.10 0.95 ±0.10 4.20 SQ ±0.10 8 1 PIN 1 TOP MARK (SEE NOTE 5) 2 PACKAGE IN TRAY LOADING ORIENTATION 5.00 SQ ±0.15 8 R0.20 REF 2.00 REF 7 6 1 7 2 2.54 ±0.15 0.5 6 4.20 ±0.10 1.4 3 5 R0.20 REF 5 3 1.00 × 7 TYP 4 0.70 TYP NOTE: 1. ALL DIMENSIONS ARE IN MILLIMETERS 2. DRAWING NOT TO SCALE 3. DIMENSIONS PACKAGE DO NOT INCLUDE PLATING BURRS PLATING BURRS, IF PRESENT, SHALL NOT EXCEED 0.30mm ON ANY SIDE 4. PLATING—ELECTO NICKEL MIN 1.25UM, ELECTRO GOLD MIN 0.30UM 5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE LS8 0113 REV B 4 0.10 TYP 0.64 × 8 TYP