MS Package 16 (12)-Lead Plastic MSOP with 4 Pins Removed (Reference LTC DWG # 05-08-1847 Rev B) 1.0 (.0394) BSC 5.10 (.201) MIN 0.889 ±0.127 (.035 ±.005) 3.20 – 3.45 (.126 – .136) 4.039 ±0.102 (.159 ±.004) (NOTE 3) 16 14 121110 9 0.50 (.0197) BSC 0.305 ±0.038 (.0120 ±.0015) TYP RECOMMENDED SOLDER PAD LAYOUT 0.254 (.010) 0.280 ±0.076 (.011 ±.003) REF 3.00 ±0.102 (.118 ±.004) (NOTE 4) 4.90 ±0.152 (.193 ±.006) DETAIL “A” 0° – 6° TYP 1 GAUGE PLANE 0.53 ±0.152 (.021 ±.006) DETAIL “A” 0.18 (.007) SEATING PLANE 1.10 (.043) MAX 0.17 – 0.27 (.007 – .011) TYP 0.50 (.0197) BSC 3 567 8 1.0 (.0394) BSC 0.86 (.034) REF 0.1016 ±0.0508 (.004 ±.002) MSOP (MS12) 0213 REV B NOTE: 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX