MS Package 12-Lead Plastic MSOP (Reference LTC DWG # 05-08-1668 Rev A) 0.889 ±0.127 (.035 ±.005) 5.10 (.201) MIN 3.20 – 3.45 (.126 – .136) 4.039 ±0.102 (.159 ±.004) (NOTE 3) 0.65 (.0256) BSC 0.42 ±0.038 (.0165 ±.0015) TYP 12 11 10 9 8 7 RECOMMENDED SOLDER PAD LAYOUT 0.254 (.010) DETAIL “A” 3.00 ±0.102 (.118 ±.004) (NOTE 4) 4.90 ±0.152 (.193 ±.006) 0° – 6° TYP 0.406 ±0.076 (.016 ±.003) REF GAUGE PLANE 0.53 ±0.152 (.021 ±.006) DETAIL “A” 0.18 (.007) SEATING PLANE 1.10 (.043) MAX 0.22 – 0.38 (.009 – .015) TYP 1 2 3 4 5 6 0.650 (.0256) BSC NOTE: 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 0.86 (.034) REF 0.1016 ±0.0508 (.004 ±.002) MSOP (MS12) 0213 REV A