Product Sheet

V I S H AY I N T E R T E C H N O L O G Y, I N C .
POWER THICK FILM RESISTORS
LTO 30, LTO 50, LTO 100
30 W, 50 W, and 100 W Thick Film Power Resistors
KEY BENEFITS
•
•
•
•
•
•
Standard TO-220 and TO-247 packages
Non-inductive
Compact, low-profile 3.2 mm thickness
Wide resistance range; low values available from R01 in 1 % tolerance
Compliant to RoHS directive 2011/65/EU
Direct mounting of exposed ceramic on heatsink
APPLICATIONS
•
•
•
•
Power conversion
High-speed switching
RF applications
Current sensing
RESOURCES
•
•
•
•
Datasheet: LTO 30 - http://www.vishay.com/doc?50049
Datasheet: LTO 50 - http://www.vishay.com/doc?50050
Datasheet: LTO 100 - http://www.vishay.com/doc?50051
For technical questions contact [email protected]
A WORLD OF
SOLUTIONS
PRODUCT SHEET
1/2
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND
THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VMN-PT9158-1605
www.vishay.com
V I S H AY I N T E R T E C H N O L O G Y, I N C .
POWER THICK FILM RESISTORS
LTO 30, LTO 50, LTO 100
LTO 30
LTO 50
LTO 100
Vishay Sfernice
Vishay Sfernice
Vishay Sfernice
30 W, 50 W, and 100 W Thick Film Power Resistors
Power Resistor
Thick
Film
Technology
30 W Power Resistor
ThickPower
Film
Technology
100 Film Technology
Resistor
Thick
LTO 50
LTOLTO
50
LTO 100
LTO
30 30
LTO
Vishay Sfernice
Vishay
Sfernice
Vishay
Sfernice
FEATURE
LTO 50
VishaySfernice
Sfernice
Vishay
Vishay Sfernice
FEATURES
FEATURE
FEATURE
Vishay Sfernice
50 Wtemperature
and 100Power
W
at 25 ºC
case temperature
heatsink
 50temperature
W •
at 30
25 W,
°CFilm
case
heatsink
Resistor
Thick
Filmmounted
Technology
 30 W atResistor
25 °C case
heatsink
Power
Thick
Technology
Power Resistor Thick
Film Technology
 100
W at 25 °C case temperature heatsink
Power
Resistor Thick F
30 30
W Power
Resistor
Thick
Film
Technology
mounted
Power
Resistor
Thick
Film
Technology
•
Direct
mounting
ceramic
on
heatsink
mounted
W Power Resistor Thick Film Technology
mounted
 Direct •
mounting
on heatsink
Broadceramic
resistance
range: 0.010 Ω to 550 kΩ (LTO 30, LTO 50), 0.015 Ω
 Direct mounting ceramic on heatsink
 Direct
mounting ceramic on heatsink
FEATURE
to 1FEATURE
MΩ
(LTO
100)
 Broad resistance
range:
0.010
to 550 k
FEA
FEATURE
FEATURE
 Broad resistance
range:
0.010

to
550
k
FEATURE
• Non inductive
Broad
resistance
range: 0.015heatsink
to 1 M
50 W at
25 °C
case temperature
 100 W at 25 °C case temperature heat
 Non inductive
 50 W at 25 °C case temperature heatsink
 30 W at 25 °C case temperature
heatsink

50
W
at
25
°C
case
temperature
heatsink
 10
Vishay
Sfernice

Non
inductive
mounted
mounted
 30 W
at 25
°C case
temperature
heatsink
Vishay
Sfernice
•package:
TO-220
package
30,
LTO 50), TO-246
(LTO 100):mounted
compact and
TO-220
Compact
and(LTO
easy
to
mount
 Non inductive
mounted
mounted
m
mounted

Direct
mounting
ceramic
on
heatsink
easy
to
mount
 TO-220
package: Compact
and
easy to mount
 Direct mounting ceramic
on heatsink
 Directon
mounting
 Isolated
case
easy
Direct
mounting ceramic
heatsinkceramic on heatsink
 Direct mounting ceramic on heatsink

TO-247
package:
Compact
and
to
mount
 Di
 Broadonresistance
0.010 2002/95/EC
to 550 k
•2002/95/EC
Compliant
to
RoHSrange:
directive
 Direct
mounting
ceramic
heatsink
 Broad resistance range:
0.010 to
kdirective
 We
Compliant
to 550
RoHS
Compliant
to RoHS directive 2002/95/EC
LTO series
are the
extension
of RTO
types.
used
the
LTO series are the extension
of RTO
types.
Weseries
used
the the
 Broad resistance range:
to 550
k 0.015 to 1 M
Broad0.010
resistance
range:
LTO
are
extension
of RTO
types.
We used
the
 Broad
resistance
range:
Compliant
to 550 kto RoHS directive 2002/95/EC
 0.010
Non 0.010
inductive


Non
inductive
 Br
direct
ceramic
design
(no
metal
tab)
of
our
RCH

Broad
resistance
range:

to
550
k
direct ceramic mounting
design
(no mounting
metal tab)
of
our
RCH
direct ceramic mounting design (no metal tab) of our RCH
 Non inductive
power
resistors applied
to semiconductor
packages.
 Non inductive
power resistors applied
to semiconductor
packages.
 Non
inductive
power
resistors
applied
to semiconductor
packages.
 TO-220 package: Compact
and easy to mount
 TO-220
package:
Compact
and easy
to
mount
FEATURE

Non
inductive
 No
FEATURE
 TO-220 package: Compact and easy to mount
FEATUREDIMENSIONS in millimeters
 Isolated
caseto mount
 TO-220 package: Compact
and easy
 TO-247 package: Compact and easy to mo
Isolated case
DIMENSIONS
in millimeters
DIMENSIONS in millimeters

100
W
at
25
°C
case
temperature
heatsink

TO-220
package:
Compact
and
easy
to
mount
 Isolated case
 50 W at 25 °C case temperature heatsink
 TO
3.2
LTO 50
series
are the5.0
of RTO
types. We used the
10.4
LTO
LTO
LTO 100
 Compliant
toextension
RoHS directive
2002/95/EC
30 W
at 25
case
temperature
heatsink
LTO 30
series
are
the to
extension
of
RTO2002/95/EC
types.
We used
 Compliant
RoHS directive
mounted
are the extension of RTO
types.
We°C
used
the
15.76
 Compliant
to the
RoHS
directive
2002/95/EC
 Compliant
totypes.
RoHSWe
directive
2002/95/EC
10.4 types. We used the 3.2mounted
thetoextension
of RTO2002/95/EC
used the
LTO series are the extension of RTO
ofCompliant
RoHS
directive
 ofCompliant
RoHS
directive
2002/95/EC
LTO
theto
extension
of RTO
types.
We used
the LTO
direct
ceramic
mounting
design
(no metal
tab)series
ourare
RCH
ceramic
mounting
(no the
metal
tab)series
ourare
RCH
LTOtab)
series
areRCH
the direct
extension
of RTO
types.design
We used
 Co
mic mounting design (nomounted
metal
of our
ceramic
mounting
design (no metal tab) of our RCH
direct ceramic mounting design (no metal tab) of our RCH Directdirect
mounting
ceramic
on heatsink
ceramic
mounting
design
(noapplied
metal to
tab)
of our RCH
power
resistors
semiconductor
packages.
Directdirect
mounting
ceramic
on heatsink
resistors
to semiconductor
direct
ceramic mounting
design
(noapplied
metal3.2
tab)
of our RCH packages.
ors applied to semiconductor
packages.
DIMENSIONS
intopower
millimeters
3.2 resistors applied to semiconductor packages.
power
resistors
applied
to
semiconductor
packages.
semiconductor
packages.
power
Directresistors
mountingapplied
ceramic
on
heatsink
power
to 550 k
power resistors applied to semiconductor packages.  Broad resistance range: 0.010 5.33
DIMENSIONS in millimeters Broad resistance range: 0.015 to 1 M
DIMENSIONS in millimeters
SIONS in millimeters
 Broad resistance range: 0.010  to 550 k
DIMENSIONS in millimeters
DIMENSIONS in millimeters
 Non inductive
DIMENSIONS
in
millimeter
s 3.2
5.0
15.76
16.2
16.2 3.2
10.4
10.4
DIMENSIONS
Øin
3.2millimeters
Ø 3.2
20.7  Non inductive
15.76
3.2
 Non inductive
10.4

TO-220
package:
Compact
and
easy
to
mount
Ø
3.6
3.2
10.4
LTO 100
FEATURE
LTO 50
Power Resistor Thick Film Technology
Power Resistor Thick Film Technology
Resistor Thick Film Technology
3.2
10.4
 Isolated case
3.2
3.2
are thetoextension
of RTO
types. We used the
3.2
 Compliant
RoHS directive
2002/95/EC
LTO series
are thetoextension
of RTO
types. We used the LTO series

Compliant
RoHS
directive
2002/95/EC
. We used the
direct
ceramic
mounting
design
(no metal tab) of our RCH
1.3
1.3
3.5
3.5
direct ceramic mounting design (no metal tab) of our RCH
3.6
3.5
b) of our RCH
16.2
packages.
16.2 power resistors
Ø 3.2 applied to semiconductor
Ø 3.2
16.2
power resistors
applied to semiconductor packages.
Ø 3.2
12.7
16.2 12.7
ckages.
Ø 3.2
Ø 3.2
 TO-220 package: Compact and easy to mount
 TO-247 package: Compact and easy to mount
5.33
3.2
0.8
DIMENSIONS in millimeters
0.8
DIMENSIONS
in millimeters0.6
0.6
1.5
1.3
3.5
15.76
3.2
10.4
3.2
10.4
5.08
12.7 3.2
1.8
1.3
3.5
5.08 1.3
3.5
1.3 1.8 3.5
10.16
12.7
0.8
Note
Note3.2
0.8
Note
• Tolerances unless stated:
± 0.3 mm unless
• Tolerance
otherwise specified:
± 0.3 mm 0.8
0.8
• Tolerance0.6
unless otherwise specified:
± 0.3 mm 0.6
12.7
5.33
3.2
 Compliant to RoHS directive 2002/95/EC
Ø 3.6
16.2
14.5
0.6
20.7
Ø 3.6
5.0
3.6
1.3
2.4
12.7 5.33
1.5
0.8
0.6
3.5
3.5
0.6
12.7
0.6
16.2
20.7
MECHANICAL SPECIFICATIONS
Ø 3.2
16.2
Ø 3.6
MECHANICAL
SPECIFICATIONS
ELECTRICAL SPECIFICATIONS
MECHANICAL
SPECIFICATIONS
ELECTRICAL SPECIFICATIONS
1.8
1.8
ELECTRICAL
SPECIFICATIONS
Mechanical Protection
Molded
1.8
5.08
Mechanical
Protection
Molded
5.08
10.16
1.8
Resistance Range
0.010  to 550 k
3.6
3.5
14.5
0.6 1.5
2.4
1.8
Resistance
Range
0.010
 to 550 k
5.08
Protection
Molded
5.08
Resistive Element Resistive
Thick
filmNote Mechanical
10.16
Range
0.015  to 1 M
5.08
Element
Thick film
Note ± 1 % to ±Resistance
Tolerances
(Standard) Tolerances
(Standard) 10 %
± 1 % to ± 10 Note
%
Note
Resistive
Element
Thick
film
Note
Substrate
Alumina
•
Tolerance
unless
otherwise
specified:
±
0.3
mm
•
Tolerance
unless
otherwise
specified:
± 0.3 mm
Tolerances
(Standard)
± 1 % to ± 10 %
Note
Substrate
Alumina
unless otherwise specified:
± 0.3 mm unless stated: ± 0.3 mm
• Tolerances
1.3
3.6
3.5
3.5
Substrate
Alumina
Dissipation
Associated
a heatsink
Dissipation
andOnto
Associated
Onto a heatsink
• and
Tolerance
unless
otherwise
specified:
± 0.3 mm
• Tolerance unless otherwise specified: ± 0.3 mm
1.3
Connections
Tinned
copper± 0.3
3.5
• Tolerances
unless stated:
mmTinned copper
Connections
Dissipation and Associated
Onto a heatsink
ConnectionsSPECIFICATIONS
Tinned copper
50 W at + 25 °C (case temp.)
Weight
2 g SPECIFICATIONS
max. MECHANICAL
30 W at + 25 °C (case
temp.)
MECHANICAL
SPECIFICATIONS
ICAL SPECIFICATIONS
Weight
2 g max.
MECHANICAL
and
Power
Rating
and 12.7 Power Rating
100 W14.5
at + 25 °C (case temp.)
12.7
ELECTRICAL
SPECIFICATIONS
ELECTRICAL SPECIFICATIONS
Weight
3.5
g
max.
MECHANICAL
SPECIFICATIONS
MECHANICAL
SPECIFICATIONS
ELECTRICAL
SPECIFICATIONS
:
2.5
°C/W
R
MECHANICAL
SPECIFICATIONS
0.8
°C/WRating and
R
ELECTRICAL
SPECIFICATIONS
Power
TH (j - c)
Mounting
Torqure Mounting
1 Nm
1.5
TH (j - c): 4.2
0.8
Torqure
1
Nm
Thermal
Resistance
Thermal
Resistance
R
ELECTRICAL
SPECIFICATIONS
ELECTRICAL
EL
0.6
(j - c): 1.5 °C/W SPECIFICATIONS
0.6
Protection
Molded1 Nm
Mechanical
Protection
Molded
Protection
Molded
Free air:
Mounting
Torqure
Mechanical
Molded
0.6 Protection Mechanical
Free
air:
Thermal
Resistance
Resistance
Range
0.010
 toTH550
k
Resistance Range
0.015 
Resistance
Range
0.010
 to of
550
kComponent
Resistance
Range
0.010

to 550 k
the
Mechanical
Protection
Molded
of
the
Component
Mechanical
Protection
Molded
Free
air:
Mechanical
Protection
Resistive
Element
Thick film
Resistive
Element
Thick
film
Range Molded
0.010  to 550 k
Resistance Range
0.010 2.5
 toW550
Re
at
+k
25 °C ± 1 % Resistance
lement DIMENSIONS
Thick film
2.25
W at +of25
°CComponent
the
ResistiveDIMENSIONS
Element
Thick Tolerances
film
Tolerances
(Standard)
to3.5
± 10
(Standard)
± 1 % to
± 1 % toElement
± 10
%
W%
at + 25 °C Tolerances
Resistive Element Substrate
Thick film (Standard)
Resistive
Thick
film
Resistive
Element
Thick
film
Tolerances
(Standard)
±
1
%
to
±
10
%
Alumina
Substrate
Alumina
Alumina
DIMENSIONS
Tolerances (Standard)
± 1 % to ± 10 %
Substrate
Alumina
Temperature
Coefficient
Performance
table
To
Tolerances
(Standard)
± See
1%
to ± 10 %
Temperature
Coefficient
See
Performance
tableAssociated
Dissipation
and
OntoSee
a heatsink
1.8
Dissipation
and Associated
Onto a h
2.4
Dissipation and Associated
Onto a heatsink
Substrate
Alumina
Substrate
Alumina
Substrate
Alumina
Temperature
Coefficient
Performance
table
1.8
Standard
Package
TO220
package
Connections
Tinned
copper
Connections
Tinned
copper
Dissipation
and
Associated
Onto
a
heatsink
TO220
s 5.08
TinnedConnections
copper Standard PackageTinned copper
5.08 package
10.16
Dissipation and Associated
Onto a heatsink
Di
Standard
150 ppm/°C
Dissipation
and Associated
a± heatsink
Standard
± Tinned
150
ppm/°C
Standard
Package 2 g max.
TO247
package
50 Connections
W at + 25 °C±(case
temp.)
Connections
Tinned copper
Connections
copper Onto3.5
100 W at + 25 °
Tinned
copper
50
W
at
+
25
°C
(case
temp.)
Standard
150
ppm/°C
Weight
Weight
g
max.
2
g
max.
Power Rating
2 g max.
Note Weight
30Rating
WUat +and
25 °C (case temp.)
Power Rating and Note
50 and
W at + 25 °C (case temp.)
Limiting
ElementPower
V temp.)
: 2.5 °C/W
RTH (j - c)Power
L W at + 25 °C 500
:1
RTH (j - c)Po
Power
and
Weight SPECIFICATIONS
2SPECIFICATIONS
gTorqure
max.
Weight
2Voltage
g500
max.
: 2.5
°C/W
R
30
(case
Weight
3.5 g max.
Limiting
Element
U
TH
(j Voltage
- c)Rating
Rating
and
V
Mounting
1
Nm
L
Mounting
Torqure
1
Nm
Thermal
Resistance
Limiting
Element
Voltage
U
•
Tolerance
unless
otherwise
specified:
±
0.3
mm
Thermal
Resistance
500
V
orqure ENVIRONMENTAL
Nm Mounting
•1 Tolerance
unlessENVIRONMENTAL
otherwise
specified:
±
0.3
mm
:
4.2
°C/W
R
L
Thermal
Resistance
Power Rating and
Torqure
1 Nm
TH (j - c)
RTH (j - c): 2.5 °C/W
Free
air: Resistance 1 Nm
Free
Thermal
Resistance
ENVIRONMENTAL
SPECIFICATIONS
- 1 min
Dielectric Strength
VRMS
FreeTorqure
air:
°C/W
RTH (j1500
Mounting Torqure
1ofNm
Mounting
1V
NmComponent
Mounting
Torqure
- c): 4.2
Thermal
Th
of
the
of
the
Component
Free
air:
1
min
Dielectric
Strength
1500
the
Component
Thermal
Resistance
1
min
Dielectric
Strength
3000
V
RMS
Free
air:
RMS
Temperature Range Temperature
- 55 °C Range
to + 155 °C - 55 °C to + 155 °C
at the
+ 25Component
°C
3.5 W of
at
of
the
10air:
mA max. 2.5 W of
2.5
W Component
at +MIL-STD-202
25 °C
Free
DIMENSIONS
at + 25 °C
DIMENSIONS
10 mA max.
MIL -STD
202to + SPECIFICATIONS
of the
MECHANICAL
SPECIFICATIONS
ONS
10 mA max.
MIL2.25
STDW202
Temperature RangeMECHANICAL
55 °C
175
°C Component
2.5 W at + 25 °C
DIMENSIONS
Climatic
Category
55/155/56
4ELECTRICAL
2.25 W at+10
25
°C DIMENSIONS
Climatic
Category
55/155/56
Temperature Coefficient
See Performance
table
Temperature Coefficient
See Perform
SPECIFICATIONS
ELECTRICAL
SPECIFICATIONS
ELECTRICAL
SPECIFICATIONS
M
Insulation
DIMENSIONS
DIMENSIONS
Temperature
Coefficient
See Performance
table Resistance
4 M
4 M
Climatic
Category
55/175/56
Temperature
Coefficient
See
Performance
table
Insulation
Resistance

10
Insulation
Resistance

10
Temperature
Coefficient
See
Performance
table
Flammability
IEC
60695-11-5
Te
Standard
Package
TO220 Resistance
package
Mechanical
Protection
Molded
Standard
Package
TO247
package
Mechanical
Protection
Molded
Flammability
IEC
60695-11-5
ackage
TO220Standard
package
Package
TO2200.010
package
Standard
± Range
150 ppm/°C
Temperature
Coefficient
See
table
± 150 p
0.015  to 1 M Standard
0.010
 to 550
kPerformance
Inductance
0.1Resistance
µH
Resistance
Range
package
to 550 k Standard IEC
± Range
150
ppm/°C
Flammability
60695-11-5
Standard
Package
TO220
Standard
Package
TO220
package
Standard Package
TO247 package ± 150 ppm/°C
2 applications
s 2 applications
Inductance
0.1 µH
± 150 ppm/°C
Standard
Resistive
Element
ThickStandard
film Limiting
0.1 µH
Resistive Element
Thick film30
30
sInductance
Element
Voltage
500 V
Limiting
Element
± 1 % to
± 10 % Voltage UL
500
(Standard)
± 1 % to
± 10 % ±
Standard
150 ppm/°C
Resistance
L Tolerances (Standard)
5Uk
Limiting
500
Tolerances (Standard)
± 1 % toElement
± 10 % Voltage UL2Tolerances
applications
30 V
sCritical
separated
by
60
s
ENVIRONMENTAL
SPECIFICATIONS
Substrate
Alumina
ENVIRONMENTAL
SPECIFICATIONS
Substrate
Alumina
Critical
Resistance
NMENTAL SPECIFICATIONS
separated
by
60
s
2.5 Element
k
Limiting
Voltage UL
500 V
ENVIRONMENTAL SPECIFICATIONS
Lim
Limiting Element Voltage UDielectric
Critical Resistance
500 V
k Strength
L 8.33
- 1 min
1500and
VRMS
Dielectric
Strength
3000 VRM
Associated
Onto a heatsink
Dissipation
and
Associated
Onto
min
Dielectric
Strength Connections
1500
V
separated
by
60
s - 1Tinned
ENVIRONMENTAL
SPECIFICATIONS
ENVIRONMENTAL
SPECIFICATIONS
Limiting
Element
Voltage
UL a heatsink
500 V Dissipation
ENVIRONMENTAL
SPECIFICATIONS
RMS
Dissipation
and Associated
Onto a heatsink
copper
Connections
Tinned copper
Dielectric
1500 VRMS - 1 min
Di
10 mA
max. Strength
MIL-STD-202
Temperature
Range
- 55 °C to + 155Dielectric
°C
- 155
min
1500
VRMS
Strength
10 mA
Temperature
°C to + 175 °C
10 mA max.
MIL-STD-202
e Range
- 55 °CTemperature
to + 155 °C Range
- 55
to++25
155
°C temp.)
100 MIL
W atSTD
+ 25202
°C (case temp.)
50 W
at + Range
25 °C
(case
temp.)
min
Dielectric
Strength
1500
VRMS - 1Power
Weight
3.5
g
max.
30 °C
W
at
°C+(case
Weight
2
g
max.
Rating
and
Power
Rating
and
10
mA
max.
MIL-STD-202
Temperature
Range
55
°C
to
+
155
°C
Document
Number:
50050
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technical
questions,
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Temperature
Range
55
°C
to
155
°C
MI
-R55 °C :to1.5
+ °C/W
175 °C
4 MRange
10
mA
max.
MIL STD
202
Forwww.vishay.com
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Document
50049
Climatic
Category
55/155/56
Power Rating
and
For
questions,
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Document
Number: 50051
Climatic
Category
55/175/56 Temperature
Insulation
Resistance
 10
tegory www.vishay.com
55/155/56
Insulation
 104
°C/W
RTH (j -Number:
Climatic
Category
M 1202
Insulation
Resistance
104technical
TH (j - c) Resistance
c): 2.5
10 mA max.Thermal Resistance
MIL
STD
°C/W Mounting
RTH (j - c): 4.2
Torqure
Nm
Mounting
Torqure
1 Nm 55/155/56
Revision:
21-Jan-11
Thermal
Resistance
Climatic
Category
55/155/56
Climatic
Category
55/155/56
74
Revision:
21-Jan-11
Climatic77
Category
55/175/56
Revision:
21-Jan-11
Insulation
Resistance
 104 M
Thermal
Resistance
Ins
Flammability
IEC 60695-11-5
Flammability
IEC4 60695-11-5
Free air:
Free air:
ty
IEC 60695-11-5
Insulation
Resistance
 104 M
Flammability
IEC80
60695-11-5
Inductance
0.1 µH
Inductance
0.1
Free air:
Inductance
Insulation
0.1 µH
of theFlammability
Component
of theFlammability
Component
M
Resistance

10
IEC
60695-11-5
Flammability
IEC
60695-11-5
of the
Component
IEC
60695-11-5
3.5 W at + 25 °C 0.1 µH
2.5 W at + 25 °C
s
2 applications 30 s 5 Inductance
Ind
2 applications 30 s
2.25 WResistance
at30
+ 25
2 applications
s °C 2 applications 30
Inductance
0.1 µH
Critical
Resistance
k
Critical
Resistance
DIMENSIONS
2.5 k
5Inductance
k
2 applications
sseparated
2Critical
applications 30 s DIMENSIONS
2 applications
30 s 5 k
0.1 µH Temperature
by 60 s Coefficient
by 60 s Coefficient
Performance table
Temperature
See
Performance 30
table
separated
by 60 s Coefficient
Critical Resistance See
Cr
separated
by 60 s table separated
Temperature
See
Performance
Critical Resistance
8.33
k
separated
by
60
s
separated
by 60 s Standard Package
separated
by
60
s
TO247
package
Standard Package
TO220 package
Critical
Resistance
8.33 k
Standard
± 150 ppm/°C
Standard
± 150 ppm/°C
°C
0s
s
Standard
± 150 ppm/°C
Document
50050
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3000 VRMS - 1 min
77
10 mA max.
Limiting
Element Voltage UL
Limiting Element Voltage 80
UL
500Document
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Limiting Element Voltage
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ENVIRONMENTAL
SPECIFICATIONS
ENVIRONMENTAL
SPECIFICATIONS
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Document Number: 50049
80 Strength
Dielectric
Strength
1500 VRMS - 1 min
Dielectric
Revision: 21-Jan-11
Revision:
21-Jan-11
1500
Revision:
21-Jan-11
10 mA max.
MIL-STD-202
- 55 °C to + 155
°CVRMS - 1 min Temperature
MIL
STD 202
Range
- 55 °C to + 175 °C
10 mA max.
4
Climatic Category
55/155/56
ClimaticInsulation
CategoryResistance55/175/56
 10 M
Insulation Resistance
Insulation Resistance IEC 60695-11-5  104 M
Flammability
Flammability
IEC 60695-11-5 0.1 µH
Inductance
Inductance
2 applications 30 s0.1 µH
Inductance
2
applications
30
s
Critical Resistance
5 k
Critical Resistance
separated by 60 s
Critical Resistance separated by 60 s 8.33 k
74
Dielectric
Strength
74 Range
Temperature
MIL STD 202
Revision 21-Jan-11
mber: 50050
NS
Jan-11
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Number: 50050
echnical questions,
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PRODUCT SHEET
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2/2
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND
THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
 104 M
0.1 µH
2.5 k
Document Number: 50051
Revision: 21-Jan-11
VMN-PT9158-1605
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