FE Package 28-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1663 Rev K) Exposed Pad Variation EA 9.60 – 9.80* (.378 – .386) 7.56 (.298) 7.56 (.298) 28 2726 25 24 23 22 21 20 19 18 1716 15 6.60 ±0.10 4.50 ±0.10 3.05 (.120) SEE NOTE 4 0.45 ±0.05 EXPOSED PAD HEAT SINK ON BOTTOM OF PACKAGE 6.40 3.05 (.252) (.120) BSC 1.05 ±0.10 0.65 BSC RECOMMENDED SOLDER PAD LAYOUT 4.30 – 4.50* (.169 – .177) 0.09 – 0.20 (.0035 – .0079) 0.50 – 0.75 (.020 – .030) NOTE: 1. CONTROLLING DIMENSION: MILLIMETERS 2. DIMENSIONS ARE IN MILLIMETERS (INCHES) 3. DRAWING NOT TO SCALE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 0.25 REF 1.20 (.047) MAX 0° – 8° 0.65 (.0256) BSC 0.195 – 0.30 (.0077 – .0118) TYP 4. RECOMMENDED MINIMUM PCB METAL SIZE FOR EXPOSED PAD ATTACHMENT *DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.150mm (.006") PER SIDE 0.05 – 0.15 (.002 – .006) FE28 (EA) TSSOP REV K 0913