05-08-1950

FE Package
20-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1950 Rev Ø)
Exposed Pad Variation CC
6.40 – 6.60*
(.252 – .260)
2.74
(.108)
2.74
(.108)
20 1918 17 16 15 14 13 12 11
6.60 ±0.10
2.74
4.50 ±0.10 (.108)
6.40
2.74 (.252)
(.108) BSC
SEE NOTE 4
0.45 ±0.05
1.05 ±0.10
0.65 BSC
1 2 3 4 5 6 7 8 9 10
RECOMMENDED SOLDER PAD LAYOUT
4.30 – 4.50*
(.169 – .177)
0.09 – 0.20
(.0035 – .0079)
0.25
REF
0.50 – 0.75
(.020 – .030)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
MILLIMETERS
2. DIMENSIONS ARE IN
(INCHES)
3. DRAWING NOT TO SCALE
1.20
(.047)
MAX
0° – 8°
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
0.05 – 0.15
(.002 – .006)
FE20(CC) TSSOP REV Ø 0413
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE