LXDC2HN TypeF series Micro DC-DC converter 1. Features 2 Low EMI noise and small footprint (5mm ) using inductor-embedded ferrite substrate High efficiency using synchronous rectifier technology at 3MHz operation PFM/PWM automatic mode switching function Smooth mode transient between PFM mode and PWM mode with low-ripple-voltage PFM mode 2% DC voltage accuracy over full load current range Wide input voltage range : 2.3~5.5V Maximum Load Current: 600mA (depends on output voltage) Fixed output voltage: 0.8V – 4V (factory setting, 50mV step) Internal soft start, overcurrent protection Better reliability at high temperature operation compared to typeA 2. Description The LXDC2HN series is a low power step-down DC-DC converter, which is suitable for a space-limited or a noise-sensitive application. The device utilizes an inductor-embedded ferrite substrate, and the substrate eliminates radiated EMI noise and conduction noise efficiently. By just putting input/output capacitors, it can be used as a LDO replacement. Its low noise feature and easy to assembly feature assures reliable power supply quality. The device works in PFM mode at light load and it extends the battery life. At heavy load, its control mode changes to PMW mode automatically and it keeps high efficiency using synchronous rectifying technology. The device keeps good output voltage accuracy even in PFM mode. It keeps 2% DC voltage accuracy over full current range (0-600mA), and shows very smooth mode transient between PFM mode and PWM mode. LXDC2HN series has resin top coast to make it easy to be picked up in factory assembly. TypeF uses MLCC of X6S/X6T temperature characteristics, so it is suitable for applications which need higher reliability or higher operating temperature. 3. Typical Application Circuit 1 July 2015 LXDC2HN TypeF series Micro DC-DC converter 4. Mechanical details 4-1 Outline Device &Trace Code Top View W 1 pin Mark Bottom View a X X X X X c 1 2 4 3 b c L Resin Side View T Substrate Unit: mm Mark Dimension L 2.5 +/- 0.2 W 2.0 +/- 0.2 T 1.3 MAX a 0.85 +/- 0.1 b 0.60 +/- 0.1 c 0.15 +/- 0.15 4-2. Pin Function Pin 1 Symbol Vin I/O Input 2 EN Input 3 Vout Output 4 GND - Description Vin pin supplies current to the LXDC2HN internal regulator. This is the ON/OFF control pin of the device. Connecting this pin to GND keeps the device in shutdown mode. Pulling this pin to Vin enables the device with soft start. This pin must not be left floating and must be terminated. If this pin is left open, the device may be off around 100mA output. EN=H: Device ON, EN=L: Device OFF Regulated voltage output pin. Apply output load between this pin and GND. Ground pin 2 July 2015 LXDC2HN TypeF series Micro DC-DC converter 4-3. Functional Block Diagram 5. Ordering Information Part number Output Voltage Device Specific Feature MOQ LXDC2HN10F-238 1.0V MLCC lifetime improved type T/R, 2500pcs/R LXDC2HN11F-313 1.1V MLCC lifetime improved type T/R, 2500pcs/R LXDC2HN12F-162 1.2V MLCC lifetime improved type T/R, 2500pcs/R LXDC2HN1CF-262 1.25V MLCC lifetime improved type T/R, 2500pcs/R LXDC2HN13F-237 1.3V MLCC lifetime improved type T/R, 2500pcs/R LXDC2HN1DF-242 1.35V MLCC lifetime improved type T/R, 2500pcs/R LXDC2HN15F-231 1.5V MLCC lifetime improved type T/R, 2500pcs/R LXDC2HN18F-163 1.8V MLCC lifetime improved type T/R, 2500pcs/R LXDC2HN23F-177 2.3V MLCC lifetime improved type T/R, 2500pcs/R LXDC2HN25F-164 2.5V MLCC lifetime improved type T/R, 2500pcs/R LXDC2HN28F-234 2.8V MLCC lifetime improved type T/R, 2500pcs/R LXDC2HN30F-239 3.0V MLCC lifetime improved type T/R, 2500pcs/R LXDC2HN33F-175 3.3V MLCC lifetime improved type T/R, 2500pcs/R # Output voltage can be set 50mV step from 0.8V to 4.0V. Please ask Murata representative. 3 July 2015 LXDC2HN TypeF series Micro DC-DC converter 6. Electrical Specification 6-1 Absolute maximum ratings Parameter Input voltage Operating ambient temperature symbol rating Vin, EN 6.3 Ta Operating case temperature TC Storage temperature TSTO Unit V -40 to +85 o -40 to +125 o -40 to +85 o C C C 6-2 Electrical characteristics (Ta=25℃) Parameter Symbol Condition Min. Typ. Max. Unit Input voltage Vin 2.3 3.6 5.5 V UVLO voltage UVLO 1.0 1.4 1.8 V 0 2 uA LXDC2HN10F-238 LXDC2HN11F-313 LXDC2HN12F-162 LXDC2HN1CF-262 Vin=3.6V, EN=0V Input leak current LXDC2HN13F-237 LXDC2HN1DF-242 LXDC2HN15F-231 lin-off LXDC2HN18F-163 LXDC2HN23F-177 LXDC2HN25F-164 Vin=5.0V, EN=0V LXDC2HN28F-234 LXDC2HN30F-239 LXDC2HN33F-175 Vin-Vout>1V Output voltage accuracy Vout Vin-Vout>0.7V Vin-Vout>0.5V LXDC2HN10F-238 0.976 1.0 1.024 LXDC2HN11F-313 1.076 1.1 1.124 LXDC2HN12F-162 1.176 1.20 1.224 LXDC2HN1CF-262 1.225 1.25 1.275 LXDC2HN13F-237 1.27 1.30 1.33 LXDC2HN1DF-242 1.323 1.35 1.377 LXDC2HN15F-231 1.47 1.50 1.53 LXDC2HN18F-163 1.764 1.80 1.836 LXDC2HN23F-177 2.254 2.30 2.346 LXDC2HN25F-164 2.45 2.50 2.55 LXDC2HN28F-234 2.744 2.80 2.856 LXDC2HN30F-239 2.94 3.00 3.06 LXDC2HN33F-175 3.234 3.30 3.366 V 4 July 2015 LXDC2HN TypeF series Micro DC-DC converter Parameter Symbol Condition Min. Typ. Max. Unit LXDC2HN10F-238 LXDC2HN11F-313 LXDC2HN12F-162 LXDC2HN1CF-262 LXDC2HN13F-237 0 600 LXDC2HN1DF-242 Load current range Iout mA LXDC2HN15F-231 LXDC2HN18F-163 LXDC2HN23F-177 0 500 LXDC2HN28F-234 0 450 LXDC2HN30F-239 0 400 LXDC2HN33F-175 0 300 LXDC2HN25F-164 LXDC2HN10F-238 LXDC2HN11F-313 LXDC2HN12F-162 LXDC2HN1CF-262 Ripple voltage Vrpl Vin=3.6V, Iout=300mA, BW=100MHz LXDC2HN13F-237 LXDC2HN1DF-242 LXDC2HN15F-231 15 mV LXDC2HN18F-163 LXDC2HN23F-177 LXDC2HN25F-164 Vin=5V, Iout=300mA, BW=100MHz Vin=3.6V, Iout=150mA Efficiency EFF Vin=5V, Iout=150mA LXDC2HN28F-234 LXDC2HN30F-239 LXDC2HN33F-175 LXDC2HN10F-238 78 LXDC2HN11F-313 79 LXDC2HN12F-162 80 LXDC2HN1CF-262 81 LXDC2HN13F-237 81 LXDC2HN1DF-242 82 LXDC2HN15F-231 83 LXDC2HN18F-163 85 LXDC2HN23F-177 87 LXDC2HN25F-164 88 LXDC2HN28F-234 86 LXDC2HN30F-239 87 LXDC2HN33F-175 88 % 5 July 2015 LXDC2HN TypeF series Micro DC-DC converter Parameter EN control voltage SW Frequency Symbol Condition VENH ON ; Enable VENL OFF ; Disable Fosc Min. Typ. Max. Unit 1.4 Vin V 0 0.25 V MHz 2.5 3.0 3.5 600 900 1200 LXDC2HN10F-238 LXDC2HN11F-313 LXDC2HN12F-162 LXDC2HN1CF-262 LXDC2HN13F-237 LXDC2HN1DF-242 mA LXDC2HN15F-231 OCP Over current protection LXDC2HN18F-163 LXDC2HN23F-177 500 900 1200 LXDC2HN28F-234 500 900 1200 LXDC2HN30F-239 400 700 1200 LXDC2HN33F-175 300 700 1200 LXDC2HN25F-164 If the over current event continues less than Tlatch, auto-recovery. If the over current event continues more than Tlatch, latch-up. Restart by toggling EN voltage or Vin voltage Tlatch Start-up time Latch-up mask time @Vout=0.8×Vnom Ton 20 usec 0.9 msec (*1) External capacitors (Cin:4.7uF,Cout:10uF) shall be placed near the module in order to proper operation. (*2)The above characteristics are tested using the application circuit on section 8 6 July 2015 LXDC2HN TypeF series Micro DC-DC converter 6-3 Thermal and Current De-rating Information The following figure shows the power dissipation and temperature rise characteristics example. These data are measured on Murata’s evaluation board of this device at no air-flow condition. Loss - ΔT Characteristics (Vin=3.6V, Vo=1.8V) 50 350 45 40 300 35 250 ΔT ( oC） Power Dissipation (mW) Io - Loss Characteristics (Vin=3.6V, Vo=1.8V) 400 200 150 30 25 20 15 100 10 50 5 0 0 0 100 200 300 400 500 600 Io (mA) 0 100 200 300 400 Power Dissipation (mW) The output current of the device may need to be de-rated if it is operated in a high ambient temperature or in a continuous power delivering application. The amount of current de-rating is highly dependent on the environmental thermal conditions, i.e. PCB design, nearby components or effective air flows. Care should o especially be taken in applications where the device temperature exceeds 85 C. o The case temperature of the device must be kept lower than the maximum rating of 125 C. It is generally recommended to take an appropriate de-rating to IC temperature for a reliable operation. A general de-rating for the temperature of semiconductor is 80%. MLCC capacitor’s reliability and the lifetime is also dependant on temperature and applied voltage stress. Higher temperature and/or higher voltage cause shorter lifetime of MLCC, and the degradation can be described by the Arrhenius model. The most critical parameter of the degradation is IR (Insulation Resistance). The below figure shows MLCC’s B1 life based on a failure rate reaching 1%. It should be noted that wear-out mechanisms in MLCC capacitor is not reversible but cumulative over time. 7 July 2015 LXDC2HN TypeF series Micro DC-DC converter Capacitor B1 Life vs Capacitor Case temperature 1000000 Vin=5V Vin=3.6V Capacitor B1 Life(Thousand Hours) ) s r100000 u o H d n 10000 a s u o T ( 1000 fe i L 1 B r 100 o ti c a p a C 10 Vin=3.3V Vin=2.5V 1 20 40 60 80 100 120 CapacitorCase Case temperature(℃) Temprature (o C ) Capacitor The following steps should be taken before the design fix of user’s set for a reliable operation. o 1. The ambient temperature of the device should be kept below 85 C 2. The case temperature should be measured on the worst condition of each application. The temperature must o be kept below 125 C. An appropriate de-rating of temperature and/or output current should be taken. 3. The MLCC temperature should be considered as same as the case temperature. Considering the above figure, it should be checked if the expected B1 life of MLCC is acceptable or not. 8 July 2015 LXDC2HN TypeF series Micro DC-DC converter 7. Detailed Description PFM/PWM Mode If the load current decreases, the converter will enter PFM mode automatically. In PFM mode, the device operates in discontinuous current mode with a sporadic one switching pulse to keep high efficiency at light load. The device uses constant on time control in PFM operation, which produces a low ripple voltage and accurate output voltage compared with other PFM architectures. Because of the architecture, DC output voltage can be kept within +/-2% range of the nominal voltage and the output ripple voltage in PFM mode can be reduced by just increasing output capacitor. The transition between PFM and PWM is also seamless and smooth. The transition current between PFM and PWM is depend on Vin, Vout and other factors, but the ballpark threshold is about 100-200mA PFM mode at light load PWM mode at heavy load Nominal output voltage UVLO (Under Voltage Lock Out) The input voltage (Vin) must reach or exceed the UVLO voltage (1.4Vtyp) before the device begins the start up sequence even when EN pin kept high. UVLO function keeps away of an unstable operation at low Vin range Soft Start The device has an internal soft-start function that limits the inrush current during start-up. The soft-start system progressively increases the switching on-time from a minimum pulse-width to that of normal operation. Because of the function, the output voltage increases gradually from zero to nominal voltage at start-up event. The nominal soft-start time is 0.9msec. If you prefer a faster soft-start time, please contact Murata representative. Enable The device starts operation when EN is set high and starts up with soft start. For proper operation, the EN pin must be terminated to logic high and must not be left floating. If the pin is left open, the device may operate at light load but will not work at heavy load. Pulling the EN pin to logic low forces the device shutdown. The device does not have a discharge function when it turns off. If you prefer a discharge function, please contact Murata representative. 100% Duty Cycle Operation The device can operate 100% duty cycle mode, in which high-side switch is constantly turned ON, thereby providing a low input-to-output voltage difference. When Vin and Vout becomes close and the duty gets close to 100%, the switching pulse will skip the nominal switching period and the output voltage ripple may be larger than other condition. It should be noted that this condition does not mean a failure of the device. Over Current Protection When the output current reaches the OCP threshold, the device narrows the switching duty and decrease the output voltage. If the OCP event is removed within the mask time (20usec typ), the output voltage recovers to the nominal value automatically. If the OCP event continues over the mask time, the device will shutdown. After it is shut down, it can be restarted by toggling the Vin or EN voltage. 9 July 2015 LXDC2HN TypeF series Micro DC-DC converter 8. Test Circuit LXDC2HN Cin : 4.7uF/6.3V (GRM188B30J475K) Cout : 10uF/6.3V (GRM188B30J106M) 10 July 2015 LXDC2HN TypeF series Micro DC-DC converter 9. Measurement Data Micro DC-DC Converter evaluation board (P2LX0244) Measurement setup The enable switch has three positions. 1. When it is toggled to “ON” side, the device starts operation. 2. When it is toggled to “OFF” side, the device stop operation and keep shut down status. 3. When it is set to middle of “ON” and “OFF”, the EN pin becomes floated and can be applied an external voltage through the EN terminal pin on the EVB. If you don’t apply external voltage to EN pin, the enable switch should not to be set to the middle position. ※The 47uF capacitor is for the evaluation kit only, and has been added to compensate for the long test cables. 11 July 2015 LXDC2HN TypeF series Micro DC-DC converter Typical Measurement Data (reference purpose only) (Ta=25℃) Efficiency ・Vin=3.6V, Vout=1.0V ・Vin=3.6V, Vout=1.2V Efficiency 85 75 80 EFF [%] EFF [%] Efficiency 80 70 65 75 70 60 65 1 10 100 1000 1 10 Iout [mA] 100 1000 100 1000 ・Vin=3.6V, Vout=1.5V Efficiency Efficiency 85 85 80 80 EFF [%] EFF [%] 1000 Iout [mA] ・Vin=3.6V, Vout=1.35V 75 70 75 70 65 65 1 10 100 1000 1 10 Iout [mA] Iout [mA] ・Vin=3.6V, Vout=1.8V ・Vin=3.6V, Vout=2.5V Efficiency Efficiency 90 95 85 90 EFF [%] EFF [%] 100 80 75 85 80 70 75 1 10 100 1000 1 Iout [mA] 10 Iout [mA] 12 July 2015 LXDC2HN TypeF series Micro DC-DC converter ・Vin=5.0V, Vout=3.0V ・Vin=5.0V, Vout=3.3V Efficiency 95 90 90 EFF [%] EFF [%] Efficiency 95 85 80 85 80 75 75 1 10 100 1000 1 Iout [mA] 10 100 1000 Iout [mA] 13 July 2015 LXDC2HN TypeF series Micro DC-DC converter Typical Measurement Data (reference purpose only) (Ta=25℃) Load Regulation ・Vin=3.6V, Vout=1.0V Load Regulation 1.024 Load Regulation 1.224 1.012 Vout [V] Vout [V] ・Vin=3.6V, Vout=1.2V 1.000 0.988 1.212 1.200 1.188 0 100 200 300 400 500 600 0 100 200 Iout [mA] Load Regulation 600 500 600 500 600 Load Regulation 1.530 1.515 Vout [V] Vout [V] 500 ・Vin=3.6V, Vout=1.5V 1.364 1.350 1.500 1.485 1.337 1.470 1.323 0 100 200 300 400 500 0 600 100 200 ・Vin=3.6V, Vout=1.8V 400 ・Vin=3.6V, Vout=2.5V Load Regulation 1.836 300 Iout [mA] Iout [mA] Load Regulation 2.550 2.525 Vout [V] 1.818 Vout [V] 400 Iout [mA] ・Vin=3.6V, Vout=1.35V 1.377 300 1.800 1.782 2.500 2.475 1.764 2.450 0 100 200 300 400 500 600 0 Iout [mA] 100 200 300 400 Iout [mA] 14 July 2015 LXDC2HN TypeF series Micro DC-DC converter ・Vin=5.0V, Vout=3.0V ・Vin=5.0V, Vout=3.3V Load Regulation 3.060 3.333 Vout [V] 3.030 Vout [V] Load Regulation 3.366 3.000 3.300 2.970 3.267 2.940 3.234 0 100 200 300 400 500 0 600 100 200 300 400 500 600 Iout [mA] Iout [mA] 15 July 2015 LXDC2HN TypeF series Micro DC-DC converter Typical Measurement Data (reference purpose only) Output Ripple-Noise ・Vin=3.6V, Vout=1.0V, BW : 150MHz ・Vin=3.6V, Vout=1.2V, BW: 150MHz Output Ripple Noise Vrpl [mV] Vrpl [mV] Output Ripple Noise 50 45 40 35 30 25 20 15 10 5 0 0 100 200 300 400 500 50 45 40 35 30 25 20 15 10 5 0 600 0 100 200 Iout [mA] 300 400 500 600 0 100 200 600 500 600 Output Ripple Noise Vrpl [mV] Vrpl [mV] Output Ripple Noise 300 400 ・Vin=3.6V, Vout=2.5V, BW: 150MHz 50 45 40 35 30 25 20 15 10 5 0 200 300 Iout [mA] ・Vin=3.6V, Vout=1.8V, BW: 150MHz 100 500 50 45 40 35 30 25 20 15 10 5 0 Iout [mA] 0 600 Output Ripple Noise Vrpl [mV] Vrpl [mV] Output Ripple Noise 200 500 ・Vin=3.6V, Vout=1.5V, BW: 150MHz 50 45 40 35 30 25 20 15 10 5 0 100 400 Iout [mA] ・Vin=3.6V, Vout=1.35V, BW: 150MHz 0 300 400 500 600 50 45 40 35 30 25 20 15 10 5 0 0 Iout [mA] 100 200 300 400 Iout [mA] 16 July 2015 LXDC2HN TypeF series Micro DC-DC converter ・Vin=5.0V, Vout=3.0V, BW: 150MHz ・Vin=5.0V, Vout=3.3V, BW: 150MHz Output Ripple Noise Vrpl [mV] Vrpl [mV] Output Ripple Noise 50 45 40 35 30 25 20 15 10 5 0 0 100 200 300 400 500 50 45 40 35 30 25 20 15 10 5 0 0 600 100 200 300 400 500 600 Iout [mA] Iout [mA] 17 July 2015 LXDC2HN TypeF series Micro DC-DC converter Typical Measurement Data (reference purpose only) Load Transient Response ・Vin=3.6V, Vout=1.0V 100mV/div 58mV -88mV ΔIo=600mA ・Vin=3.6V, Vout=1.2V 58mV 100mV/div -80mV ΔIo=600mA 18 July 2015 LXDC2HN TypeF series Micro DC-DC converter ・Vin=3.6V, Vout=1.35V 66mV 100mV/div -86mV ΔIo=600mA ・Vin=3.6V, Vout=1.5V 66mV 100mV/div -86mV ΔIo=600mA 19 July 2015 LXDC2HN TypeF series Micro DC-DC converter ・Vin=3.6V, Vout=1.8V 100mV/div 76mV -108mV ΔIo=600mA ・Vin=3.6V, Vout=2.5V 100mV/div 114mV -140mV ΔIo=500mA 20 July 2015 LXDC2HN TypeF series Micro DC-DC converter ・Vin=5.0V, Vout=3.0V 100mV/div 106mV -128mV ΔIo=400mA Vin=5.0V, Vout=3.3V 100mV/div 106mV -112mV ΔIo=300mA 21 July 2015 LXDC2HN TypeF series Micro DC-DC converter 10.Reliability Tests No. 1 2 3 Items Vibration Resistance Result (NG) 18 G (0) Frequency : 10~2000 Hz 2 Acceleration : 196 m/s Direction : X,Y,Z 3 axis Period : 2 h on each direction Total 6 h. Solder specimens on the testing jig (glass epoxy boards) shown in appended Fig.2 by a Pb free solder. The soldering shall be done either by iron or reflow and be conducted with care so that the soldering is uniform and free of defect such as by heat shock. Deflection : 1.6mm Solder specimens onto test jig shown below. Apply pushing force at 0.5mm/s until electrode pads are peeled off or ceramics are broken. Pushing force is applied to longitudinal direction. 18 G (0) Pushing Direction 18 G (0) 18 G (0) 18 G (0) Test Methods Appearance : No severe damages Solder specimens on the testing jig (glass fluorine boards) shown in appended Fig.1 by a Pb free solder. The soldering shall be done either by iron or reflow and be conducted with care so that the soldering is uniform and free of defect such as by heat shock. Deflection Soldering strength (Push Strength) QTY Specifications 9.8 N Minimum Specimen 4 5 Solderability of Termination Resistance to Soldering Heat (Reflow) 75% of the terminations is to be soldered evenly and continuously. Appearance No severe damages Electrical specifications Satisfy specifications listed in paragraph 6-2. Jig Immerse specimens first an ethanol solution of rosin, then in a Pb free solder solution for 3±0.5 sec. at 245±5 °C. Preheat : 150 °C, 60 sec. Solder Paste : Sn-3.0Ag-0.5Cu Flux : Solution of ethanol and rosin (25 % rosin in weight proportion) Preheat Temperature : 150-180 °C Preheat Period : 90+/-30 sec. High Temperature : 220 °C High Temp. Period : 20sec. Peak Temperature : 260+5/-0 °C Specimens are soldered twice with the above condition, and then kept in room condition for 24 h before measurements. 22 July 2015 LXDC2HN TypeF series Micro DC-DC converter No. 6 7 8 9 Items Specifications Test Methods High Temp. Exposure Temperature：85±2 ℃ Period：1000+48/-0 h Room Condition：2～24h Temperature Cycle Condition：100 cycles in the following table Humidity (Steady State) Appearance No severe damages Electrical specifications Satisfy specifications listed in paragraph 6-2. Low Temp. Exposure Step Temp(°C) Time(min) 1 Min. Operating Temp.+0/-3 30±3 2 Max. Operating Temp.+3/-0 30±3 Temperature：85±2 ℃ Humidity：80～90%RH Period：1000+48/-0 h Room Condition：2～24h Temperature：-40±2 ℃ Period：1000+48/-0 h Room Condition：2～24h QTY Result (NG) 18 G (0) 18 G (0) 18 G (0) 18 G (0) 10 ESD(Machine Model) C：200pF、R：0Ω TEST Voltage ：+/-100V Number of electric discharges：1 5 G (0) ESD(Human Body Model) C：100pF、R：1500Ω TEST Voltage ：+/-1000V Number of electric discharges：1 5 G (0) 11 23 July 2015 LXDC2HN TypeF series Micro DC-DC converter Fig.1 Land Pattern a d b c d c Unit：mm Symbol Dimensions a 0.85 b 0.60 c 0.5 d 0.2 ・Reference purpose only. 24 July 2015 LXDC2HN TypeF series Micro DC-DC converter Fig.2 Testing board Unit：mm ■： Land pattern is same as figure1 Glass-fluorine board t＝1.6mm Copper thickness over 35 mm Mounted situation Unit：mm チップ Device 45 45 Test method Unit：mm 20 50 R230 deflection 25 July 2015 LXDC2HN TypeF series Micro DC-DC converter 11. Tape and Reel Packing 1）Dimensions of Tape (Plastic tape) Unit: mm Φ1.5+0.1 0 (0.25) 1.75±0.1 (3.5) 8.0±0.2 (2.3) (2.8) 4.0±0.1 2.0±0.05 (1.5) 4.0±0.1 Feeding direction 2） Dimensions of Reel Unit: mm 2±0.5 Φ60 Φ13±0.2 Φ180 (9.0) 13.0±1.4 26 July 2015 LXDC2HN TypeF series Micro DC-DC converter 3）Taping Diagrams [1] Feeding Hole : [2] Hole for chip : As specified in (1) [3] Cover tape : 50um in thickness [4] Base tape : As specified in (1) [3] [3] As specified in (1) [1] [1] [2] [2] [3] [3] [4] [4] Feeding Hole Feeding Direction Chip 27 July 2015 LXDC2HN TypeF series Micro DC-DC converter 4）Leader and Tail tape A B Components 部品収納部 Symbol C Items Ratings(mm) A No components at trailer min 160 B No components at leader min 100 C Whole leader min 400 5）The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user. 6）Packaging unit: 2,500 pcs./ reel 7） Material： Base Tape Reel … Plastic … Plastic Antistatic coating for both base tape and reel 8）Peeling of force 0.7 N max. 0.1~1.0N 165 to 180 ° Cover Tape カバーテープ ベーステープ Base Tape 28 July 2015 LXDC2HN TypeF series Micro DC-DC converter NOTICE 1. Storage Conditions: ・The product shall be stored without opening the packing under the ambient temperature from 5 to 35 deg.C and humidity from 20 to 70%RH. (Packing materials, in particular, may be deformed at the temperature over 40 deg.C.) ・The product left more than 6 months after reception, it needs to be confirmed the solderbility before used. - The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.). - Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object and dropping the product, shall not be applied in order not to damage the packing materials. ・After the packing opened, the product shall be stored at < 30 deg.C / < 60 %RH and the product shall be used within 168 hours. When the color of the indicator in the packing changed, the product shall be baked before soldering. This product is applicable to MSL3 (Based on IPC/JEDEC J-STD-020) 2. Handling Conditions: Be careful in handling or transporting the product. Excessive stress or mechanical shock may damage the product because of the nature of ceramics structure. Do not touch the product, especially the terminals, with bare hands. Doing so may result in poor solderability. 3. Standard PCB Design (Land Pattern and Dimensions): All the ground terminals should be connected to ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions. The recommended land pattern and dimensions are shown for a reference purpose only. Electrical, mechanical and thermal characteristics of the product shall depend on the pattern design and material / thickness of the PCB. Therefore, be sure to check the product performance in the actual set. When using underfill materials, be sure to check the mechanical characteristics in the actual set. 29 July 2015 LXDC2HN TypeF series Micro DC-DC converter 4. Soldering Conditions: Soldering is allowed up through 2 times. Carefully perform preheating ：△T less than 130 °C. When products are immersed in solvent after mounting, pay special attention to maintain the temperature difference within 100 °C. Soldering must be carried out by the above mentioned conditions to prevent products from damage. Contact Murata before use if concerning other soldering conditions. Reflow soldering standard conditions (example) Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less. 30 July 2015 LXDC2HN TypeF series Micro DC-DC converter 5. Cleaning Conditions: The product is not designed to be cleaned after soldering. 6. Operational Environment Conditions: Products are designed to work for electronic products under normal environmental conditions (ambient temperature, humidity and pressure). Therefore, products have no problems to be used under the similar conditions to the above-mentioned. However, if products are used under the following circumstances, it may damage products and leakage of electricity and abnormal temperature may occur. - In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.). - In an atmosphere containing combustible and volatile gases. - In a dusty environment. - Direct sunlight - Water splashing place. - Humid place where water condenses. - In a freezing environment. If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use. If static electricity is added to this product, degradation and destruction may be produced. Please use it after consideration enough so that neither static electricity nor excess voltage is added at the time of an assembly and measurement. If product malfunctions may result in serious damage, including that to human life, sufficient fail-safe measures must be taken, including the following: (1) Installation of protection circuits or other protective device to improve system safety (2) Installation of redundant circuits in the case of single-circuit failure. 7. Input Power Capacity: Products shall be used in the input power capacity as specified in this specifications. Inform Murata beforehand, in case that the components are used beyond such input power capacity range . 31 July 2015 LXDC2HN TypeF series Micro DC-DC converter 8. Limitation of Applications: The products are designed and produced for application in ordinary electronic equipment (AV equipment, OA equipment, telecommunication, etc). If the products are to be used in devices requiring extremely high reliability following the application listed below, you should consult with the Murata staff in advance. - Aircraft equipment. - Aerospace equipment - Undersea equipment. - Power plant control equipment. - Medical equipment. - Transportation equipment (vehicles, trains, ships, etc.). - Automobile equipment which includes the genuine brand of car manufacture, car factory-installed option and dealer-installed option. - Traffic signal equipment. - Disaster prevention / crime prevention equipment. - Data-procession equipment. - Application which malfunction or operational error may endanger human life and property of assets. - Application which related to occurrence the serious damage - Application of similar complexity and/ or reliability requirements to the applications listed in the above. ! Note: Please make sure that your product has been evaluated and confirmed against your specifications when our product is mounted to your product. Product specifications are subject to change or our products in it may be discontinued without advance notice. This catalog is for reference only and not an official product specification document, therefore, please review and approve our official product specification before ordering this product. 32 July 2015