LXDC44A series Micro DC-DC converter 1. Features Small footprint boost converter for up to 700mA output current application Low EMI noise by using an inductor-embedded ferrite substrate Input voltage range : 2.7 to 5.5V Output voltage : 5V-6V (Adjustable to one fixed voltage at factory setting: 5.0 to 6.0V) Switching frequency : 3.3MHz Automatic PWM/PFM mode switching for high efficiency 2.Description The LXDC44A series is a small boost converter for products powered by either a three-cell alkaline, NiCd or NiMH battery, or an one-cell Li-Ion or Li-polymer battery. The wide input voltage range is ideal to power portable applications like mobile phones or for computer peripherals. The device utilizes an inductor-embedded ferrite substrate that reduces radiated EMI noise and conduction noise. At light load currents the converter will automatically enter PFM (Pulse Frequency Modulation) mode and keep good conversion efficiency. When load current increases, it operates in PWM (Pulse Width Modulation) mode. The converter utilizes a quasi-constant on-time valley current mode control, which offers fast load transient response. 3. Typical Application Circuit LXDC44A Cin ：10uF／6.3V (GRM188B30J106M） Cout ：22uF／6.3V (GRM21BB30J226M） 1 July 2015 LXDC44A series Micro DC-DC converter 4. Mechanical details 4-1 Outline Unit:mm Mark Dimension Mark Dimension L 4.0±0.2 c 0.4 +/- 0.1 W 4.0±0.2 d 0.4 +/- 0.1 T 2.0 (Max) e 0.4 +/- 0.1 a 1.0 +/- 0.1 f 0.2 +/- 0.2 b 0.8 +/- 0.1 4-2. Pin Function Pin number Symbol I/O 2,3,8 GND - 4,5,6 Vout Output 7 NC - 9 PG Output Function Ground pin Regulated voltage output pin. Apply output load between this pin and GND. No connection Power good voltage output pin (Open drain). This is to indicate whether the output voltage has reached its appropriate level or not. This is the ON/OFF control pin of the device. The device is in 10 EN Input shutdown when the voltage to this pin is below 0.3V. Pulling this pin above 1.4V enables the device with soft start. This pin should not be left floating. 1,11,12 Vin Input EN=H: Device ON, EN=L: Device OFF Vin pin supplies current to the LXDC44A internal regulator. 2 July 2015 LXDC44A series Micro DC-DC converter 4-3. Functional Block Diagram 5. Ordering Information Part number Output Voltage Device Specific Feature MOQ LXDC44AAAC–169 5.0V Standard Type T/R,1000pcs/R LXDC44AAAC–212 6.0V Standard Type T/R,1000pcs/R 3 July 2015 LXDC44A series Micro DC-DC converter 6. Electrical Specification 6-1. Absolute maximum ratings Parameter Symbol Rating Unit Maximum input Voltage Vin 6.0 V Operating ambient temperature Ta -40 to +85 ℃ Operating IC temperature Tic -40 to +125 ℃ TSTO -40 to +85 ℃ Storage temperature 6-2. Electrical characteristics (Ta=25°C) Parameter Input Voltage Range Symbol Condition Vin UVLO Threshold Voltage Vuvlo Input leakage current Iin-off Output Voltage Vout Iout Typ 2.7 2.0 Vin=3.6V Max Unit 5.5 V 2.2 V 3.5 uA LXDC44AAAC–169 4.85 5.0 5.15 LXDC44AAAC–212 5.82 6.0 6.18 LXDC44AAAC–169 Output Current Range Min 3.3V≦VIN≦4.5V LXDC44AAAC–212 3.3V≦VIN≦5.5V 0 V 700 mA 0 Vin=3.6V, Iout=300mA 550 Vout Ripple Vrpl Efficiency EFF EN,MODE input H Level VH 1.4 Vin V EN,MODE input L Level VL 0 0.3 V Start-up Time Ton 0.35 msec FOSC 3.3 MHz Switching Frequency BW=100MHz Vin=3.6V, Iout=300mA LXDC44AAAC-169 Over Current Protection OCP Auto recovery LXDC44AAAC-212 Auto recovery Over Temperature Protection OTP Auto recovery 700 10 mV 90 % 900 1800 mA 550 750 140 1800 o C (*1) External capacitors (Cin:10uF,Cout:22uF) shall be placed near the module in order to proper operation. (*2)The above characteristics are tested using the application circuit on section 8 4 July 2015 LXDC44A series Micro DC-DC converter 6-3 Thermal and Current De-rating Information The following figures show the power dissipation and temperature rise characteristics. These data are measured on Murata’s evaluation board of this device at no air-flow condition. The output current of the device may need to be de-rated if it is operated in a high ambient temperature or in a continuous power delivering application. The amount of current de-rating is highly dependent on the environmental thermal conditions, i.e. PCB design, nearby components or effective air flows. Care should o especially be taken in applications where the device temperature exceeds 85 C. o The IC temperature of the device must be kept lower than the maximum rating of 125 C. It is generally recommended to take an appropriate de-rating to IC temperature for a reliable operation. A general de-rating for the temperature of semiconductor is 80%. MLCC capacitor’s reliability and the lifetime is also dependant on temperature and applied voltage stress. Higher temperature and/or higher voltage cause shorter lifetime of MLCC, and the degradation can be described by the Arrhenius model. The most critical parameter of the degradation is IR (Insulation Resistance). The below figure shows MLCC’s B1 life based on a failure rate reaching 1%. It should be noted that wear-out mechanisms in MLCC capacitor is not reversible but cumulative over time. 5 July 2015 LXDC44A series Capacitor B1 Life(Thousand Hours) Micro DC-DC converter Capacitor Case temperature(℃) The following steps should be taken before the design fix of user’s set for reliable operation. o 1. The ambient temperature of the device should be kept below 85 C 2. The IC temperature should be measured on the worst condition of each application. The temperature must be o kept below 125 C. An appropriate de-rating of temperature and/or output current should be taken. 3. The MLCC temperature should be measured on the worst condition of each application. Considering the above figure, it should be checked if the expected B1 life of MLCC is acceptable or not. 6 July 2015 LXDC44A series Micro DC-DC converter 7. Detailed Description PFM MODE The device integrates a PFM mode to improve efficiency at light load. In PFM mode the converter only operates when the output voltage trips below a set threshold voltage. It ramps up the output voltage with several pulses. During the PFM operation when the output voltage is above the set threshold the converter turns off some of the inner circuits to save energy. The converter goes into PWM mode in case the output current can no longer be supported in PFM mode. UVLO (Under Voltage Lock Out) The under voltage lockout circuit prevents the device from malfunctioning at low input voltages and the battery from excessive discharge. It disables the output stage of the converter once the falling VIN trips the under-voltage lockout threshold VUVLO which is typically 2.0V. The device starts operation once the rising VIN trips VUVLO threshold plus its hysteresis of 100 mV at typ. 2.1V. Soft Start The device has an internal soft start circuit that controls the ramp-up of the current during start-up and prevents the converter from inrush current that exceeds the set current limit. For typical 100 μs the current is ramped to the set current limit. After reaching the current limit threshold it stays there until Vin = Vout then the converter starts switching and boosting up the voltage to its nominal output voltage. During the complete start-up the input current does not exceed the current limit. POWER GOOD The device has a built in power good function to indicate whether the output voltage operates within appropriate levels. The power good output (PG) is set high after the output voltage reaches 95% of its nominal value and stays there until the output voltage falls below 90 % of the nominal value. The power good is operable as long as the converter is enabled and Vin is present. If the converter is disabled by pulling the EN pin low the PG open drain output is high resistive. That means it follows the voltage it is connected to via the pull-up resistor. Over Current Protection LXDC44A series integrates a current limit function to avoid inrush current and to protect internal components against heavy load including short circuit event. When over current event is removed, the device returns to the normal operation automatically. Over Temperature Shutdown o As soon as the internal IC’s junction temperature exceeds 140 C (typ), the device goes into thermal shutdown. The device returns to its normal operation when the Internal IC’s junction temperature again falls below o 120 C(typ). 7 July 2015 LXDC44A series Micro DC-DC converter 8. Test Circuit Cin : 10uF/6.3V (GRM188B30J106M) Cout : 22uF/6.3V (GRM21BB30J226M) 8 July 2015 LXDC44A series Micro DC-DC converter 9. Micro DC-DC Converter evaluation board (P2LX0720A) Measurement setup 1MOhm The enable switch has three states (ON, OFF and Open). 1. When it is shorted to “ON” side, the device starts operation. 2. When it is shorted to “OFF” side, the device stop operation and keep shut down status. 3. When it is set to open, the EN pin becomes floated and can be applied an external voltage through the EN terminal pin on the EVB. If you don’t apply external voltage to EN pin, the enable switch should NOT to be set to the middle position. ※The 47uF capacitor is for the evaluation kit only, and has been added to compensate for the long test cables. 9 July 2015 LXDC44A series Micro DC-DC converter Typical Measurement Data (reference purpose only) (Ta=25oC) Conversion Efficiency P/N : LXDC44AAAC–169 P/N : LXDC44AAAC–212 10 July 2015 LXDC44A series Micro DC-DC converter Load Regulation P/N : LXDC44AAAC–169 P/N : LXDC44AAAC–212 11 July 2015 LXDC44A series Micro DC-DC converter Typical Measurement Data (reference purpose only) (Ta=25oC) Output Ripple-Noise P/N : LXDC44AAAC–169 Vin=3.6V, Vout=5.0V, BW : 150MHz P/N : LXDC44AAAC–212 Vin=3.6V, Vout=6.0V, BW : 150MHz 12 July 2015 LXDC44A series Micro DC-DC converter Load Transient Response P/N : LXDC44AAAC–169 Vo(100mV/div) 200mVpp Io(0.5A/div) 13 July 2015 LXDC44A series Micro DC-DC converter 10.Reliability Tests No. 1 2 3 Items Vibration Resistance Result (NG) 18 G (0) Frequency : 10~2000 Hz 2 Acceleration : 196 m/s Direction : X,Y,Z 3 axis Period : 2 h on each direction Total 6 h. Solder specimens on the testing jig (glass epoxy boards) shown in appended Fig.2 by a Pb free solder. The soldering shall be done either by iron or reflow and be conducted with care so that the soldering is uniform and free of defect such as by heat shock. Deflection : 1.6mm Solder specimens onto test jig shown below. Apply pushing force at 0.5mm/s until electrode pads are peeled off or ceramics are broken. Pushing force is applied to longitudinal direction. 18 G (0) Pushing Direction 18 G (0) 18 G (0) 18 G (0) Test Methods Appearance : No severe damages Solder specimens on the testing jig (glass fluorine boards) shown in appended Fig.1 by a Pb free solder. The soldering shall be done either by iron or reflow and be conducted with care so that the soldering is uniform and free of defect such as by heat shock. Deflection Soldering strength (Push Strength) QTY Specifications 9.8 N Minimum Specimen 4 5 Solderability of Termination Resistance to Soldering Heat (Reflow) 75% of the terminations is to be soldered evenly and continuously. Appearance No severe damages Electrical specifications Satisfy specifications listed in paragraph 6-2. Jig Immerse specimens first an ethanol solution of rosin, then in a Pb free solder solution for 3±0.5 sec. at 245±5 °C. Preheat : 150 °C, 60 sec. Solder Paste : Sn-3.0Ag-0.5Cu Flux : Solution of ethanol and rosin (25 % rosin in weight proportion) Preheat Temperature : 150-180 °C Preheat Period : 90+/-30 sec. High Temperature : 220 °C High Temp. Period : 20sec. Peak Temperature : 260+5/-0 °C Specimens are soldered twice with the above condition, and then kept in room condition for 24 h before measurements. 14 July 2015 LXDC44A series Micro DC-DC converter No. 6 7 8 9 Items Specifications Test Methods High Temp. Exposure Temperature：85±2 ℃ Period：1000+48/-0 h Room Condition：2～24h Temperature Cycle Condition：100 cycles in the following table Humidity (Steady State) Appearance No severe damages Electrical specifications Satisfy specifications listed in paragraph 6-2. Low Temp. Exposure Step Temp(°C) Time(min) 1 Min. Operating Temp.+0/-3 30±3 2 Max. Operating Temp.+3/-0 30±3 Temperature：85±2 ℃ Humidity：80～90%RH Period：1000+48/-0 h Room Condition：2～24h Temperature：-40±2 ℃ Period：1000+48/-0 h Room Condition：2～24h QTY Result (NG) 18 G (0) 18 G (0) 18 G (0) 18 G (0) 10 ESD(Machine Model) C：200pF、R：0Ω TEST Voltage ：+/-100V Number of electric discharges：1 5 G (0) ESD(Human Body Model) C：100pF、R：1500Ω TEST Voltage ：+/-1000V Number of electric discharges：1 5 G (0) 11 15 July 2015 LXDC44A series Micro DC-DC converter Fig.1 Land Pattern Unit:mm Symbol Dimension a 1.0 b 0.8 c 0.4 d 0.4 e 0.4 ・Reference purpose only. 16 July 2015 LXDC44A series Micro DC-DC converter Fig.2 Testing board Unit：mm 100 40 ■： Land pattern is same as figure1 Glass-fluorine board t＝1.6mm Copper thickness over 35 mm Mounted situation Unit：mm チップ Device 45 45 Test method Unit：mm 20 50 R230 deflection たわみ量 17 July 2015 LXDC44A series Micro DC-DC converter 11.Tape and Reel Packing 1）Dimensions of Tape (Paper tape) (Unit : mm) Feeding direction 2） Dimensions of Reel (Unit : mm) 2±0.5 Φ100 Φ330 Φ13±0.2 (13.5) 17.5±1.0 18 July 2015 LXDC44A series Micro DC-DC converter 3）Taping Diagrams [1] Feeding Hole : As specified in (1) [2] Hole for chip : As specified in (1) [3] Cover tape : 50um in thickness [4] Base tape : As specified in (1) [3] [1] [2] [3] [4] Feeding Hole Feeding Direction Chip 19 July 2015 LXDC44A series Micro DC-DC converter 4）Leader and Tail tape A B Components 部品収納部 Symbol C Items Ratings(mm) A No components at trailer min 160 B No components at leader min 100 C Whole leader min 400 5）The tape for chips are wound clockwise and the feeding holes are to the right side as the tape is pulled toward the user. 6）Packaging unit: 1,000 pcs./ reel 7）Material： Base Tape Reel … Plastic … Plastic Antistatic coating for both base tape and reel 8）Peeling of force 0.7 N max. 0.1~1.3N 165 to 180 ° Cover Tape カバーテープ ベーステープ Base Tape 20 July 2015 LXDC44A series Micro DC-DC converter NOTICE 1. Storage Conditions: ・The product shall be stored without opening the packing under the ambient temperature from 5 to 35 deg.C and humidity from 20 to 70%RH. (Packing materials, in particular, may be deformed at the temperature over 40 deg.C.) ・The product left more than 6 months after reception, it needs to be confirmed the solderbility before used. - The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.). - Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object and dropping the product, shall not be applied in order not to damage the packing materials. ・After the packing opened, the product shall be stored at < 30 deg.C / < 60 %RH and the product shall be used within 168 hours. When the color of the indicator in the packing changed, the product shall be baked before soldering. This product is applicable to MSL3 (Based on IPC/JEDEC J-STD-020) 2. Handling Conditions: Be careful in handling or transporting the product. Excessive stress or mechanical shock may damage the product because of the nature of ceramics structure. Do not touch the product, especially the terminals, with bare hands. Doing so may result in poor solderability. 3. Standard PCB Design (Land Pattern and Dimensions): All the ground terminals should be connected to ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions. The recommended land pattern and dimensions are shown for a reference purpose only. Electrical, mechanical and thermal characteristics of the product shall depend on the pattern design and material / thickness of the PCB. Therefore, be sure to check the product performance in the actual set. When using underfill materials, be sure to check the mechanical characteristics in the actual set. 21 July 2015 LXDC44A series Micro DC-DC converter 4. Soldering Conditions: Soldering is allowed up through 2 times. Carefully perform preheating ：△T less than 130 °C. When products are immersed in solvent after mounting, pay special attention to maintain the temperature difference within 100 °C. Soldering must be carried out by the above mentioned conditions to prevent products from damage. Contact Murata before use if concerning other soldering conditions. Reflow soldering standard conditions (example) Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less. 22 July 2015 LXDC44A series Micro DC-DC converter 5. Cleaning Conditions: The product is not designed to be cleaned after soldering. 6. Operational Environment Conditions: Products are designed to work for electronic products under normal environmental conditions (ambient temperature, humidity and pressure). Therefore, products have no problems to be used under the similar conditions to the above-mentioned. However, if products are used under the following circumstances, it may damage products and leakage of electricity and abnormal temperature may occur. - In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.). - In an atmosphere containing combustible and volatile gases. - In a dusty environment. - Direct sunlight - Water splashing place. - Humid place where water condenses. - In a freezing environment. If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use. If static electricity is added to this product, degradation and destruction may be produced. Please use it after consideration enough so that neither static electricity nor excess voltage is added at the time of an assembly and measurement. If product malfunctions may result in serious damage, including that to human life, sufficient fail-safe measures must be taken, including the following: (1) Installation of protection circuits or other protective device to improve system safety (2) Installation of redundant circuits in the case of single-circuit failure 7. Input Power Capacity: Products shall be used in the input power capacity as specified in this specifications. Inform Murata beforehand, in case that the components are used beyond such input power capacity range. 23 July 2015 LXDC44A series Micro DC-DC converter 8. Limitation of Applications: The products are designed and produced for application in ordinary electronic equipment (AV equipment, OA equipment, telecommunication, etc). If the products are to be used in devices requiring extremely high reliability following the application listed below, you should consult with the Murata staff in advance. - Aircraft equipment. - Aerospace equipment - Undersea equipment. - Power plant control equipment. - Medical equipment. - Transportation equipment (vehicles, trains, ships, etc.). - Automobile equipment which includes the genuine brand of car manufacture, car factory-installed option and dealer-installed option. - Traffic signal equipment. - Disaster prevention / crime prevention equipment. - Data-procession equipment. - Application which malfunction or operational error may endanger human life and property of assets. - Application which related to occurrence the serious damage - Application of similar complexity and/ or reliability requirements to the applications listed in the above. ! Note: Please make sure that your product has been evaluated and confirmed against your specifications when our product is mounted to your product. Product specifications are subject to change or our products in it may be discontinued without advance notice. This catalog is for reference only and not an official product specification document, therefore, please review and approve our official product specification before ordering this product. 24 July 2015