INTERSIL HC5503PRCM

HC5503PRC
Data Sheet
December 1999
Low Cost SLIC For Large Telecom
Switches
• Wide Operating Battery Range (-40V to -58V)
• Single Additional +5V Supply
• 30mA Short Loop Current Limit
• Ring Relay Driver
• Switch Hook and Ring Trip Detect
• Low On-Hook Power Consumption
• On-Hook Transmission
• ITU-T Longitudinal Balance Performance
• Loop Power Denial Function
Ordering Information
PART NUMBER
4806
Features
The HC5503PRC is a low cost SLIC optimized for large
Telecom switches. It combines a flexible voltage feed
architecture with the Intersil latch-free DI bonded wafer
process, to provide a low component count, carrier class
solution at very low cost. The re-configurable design permits
simple, economical solutions for campus-wide call center
and PBX applications. External components can be used in
conjunction with the high battery voltage capability to meet
the complex impedance and long loop drive requirements of
Central Office switches, worldwide.
TEMP.
RANGE (oC)
File Number
PACKAGE
PKG.
NO.
HC5503PRCM
0 to 70
28 Ld PLCC
N28.45
HC5503PRCB
0 to 70
24 Ld SOIC
M24.3
• Thermal Protection
• Supports Tip, Ring or Balanced Ringing Schemes
• Low Profile SO and PLCC Surface Mount Packaging
Applications
• Central Office, PBX, Call Centers
• Related Literature
- AN571, Using Ring Sync with HC-5502A and HC-5504
SLICs
Block Diagram
RING RELAY
DRIVER
RD
RFS
4-WIRE
INTERFACE
VF SIGNAL
PATH
RING TRIP
DETECTOR
C2
TX
RX
TIP
TF
2-WIRE
INTERFACE
RING
LOOP CURRENT
DETECTOR
SHD
RS
RF
THERMAL LIMIT
LOGIC
INTERFACE
RC
PD
VBAT
VCC
AGND
BIAS
+
-
BGND
C1
OUT
+IN
-IN
DGND
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
HC5503PRC
Absolute Maximum Ratings (Note 1)
Thermal Information
Maximum Continuous Supply Voltages
(VB-) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -60 to 0.5V
(VB+) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 7V
(VB+ - VB-) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75V
Relay Drive Voltage (VRD) . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 15V
Thermal Resistance (Typical, Note 2)
θJA (oC/W)
24 Lead SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
75
28 Lead PLCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
65
Maximum Junction Temperature Plastic . . . . . . . . . . . . . . . . .150oC
Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC
(PLCC and SOIC - Lead Tips Only)
Operating Conditions
Operating Temperature Range . . . . . . . . . . . . . . . . . . . 0oC to 70oC
Relay Driver Voltage (VRD) . . . . . . . . . . . . . . . . . . . . . . . . 5V to 12V
Positive Supply Voltage (VB+) . . . . . . . . . . . . . . . . . . 4.75V to 5.25V
Negative Supply Voltage (VB-). . . . . . . . . . . . . . . . . . . .-40V to -58V
High Level Logic Input Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . 2.4V
Low Level Logic Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . 0.6V
Subscriber Loop Resistance . . . . . . . . . . . . . . . . . . . 200Ω - 1800Ω
Die Characteristics
Transistor Count. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185
Diode Count. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Die Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137 x 102
Substrate Potential. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Connected
Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bipolar-DI
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. Absolute maximum ratings are limiting values, applied individually, beyond which the serviceability of the circuit may be impaired. Functional
operability under any of these conditions is not necessarily implied.
2. θJA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
Unless Otherwise Specified, VB- = -48V, VB+ = 5V, AG = BG = DG = 0V, RP = 50Ω, RS = 100Ω, Typical
Parameters. TA = 25oC. Min-Max Parameters are Over Operating Temperature Range
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
On Hook Power Dissipation
ILONG = 0 (Note 4)
-
113
-
mW
Off Hook Power Dissipation
RL = 600Ω, ILONG = 0 (Notes 3, 4)
-
750
-
mW
On Hook IB+
RL = ∞, ILONG = 0
-
1.4
-
mA
Off Hook IB+
RL = 600Ω, ILONG = 0
-
2.8
-
mA
On Hook IB-
RL = ∞, ILONG = 0
-
2.2
-
mA
Off Hook IB-
RL = 600Ω, ILONG = 0
-
31
-
mA
Off Hook Loop Current
RL = 1800Ω (ILOOP = 0)
18
-
-
mA
Off Hook Loop Current
RL = 200Ω, ILONG = 0 (Note 3)
25
30
35
mA
TIP to Ground
-
27
-
mA
RING to Ground
-
55
-
mA
TIP to RING
-
30
-
mA
TIP and RING to Ground
-
69
-
mA
Fault Currents
Ring Relay Drive VOL
IOL = 62mA
-
0.2
0.5
V
Ring Relay Driver Off Leakage
VRD = 12V, RC = 1 = HIGH, TA = 25oC
-
-
100
µA
DC Ring Trip Threshold
8.1
10.8
13.5
mA
Switch Hook Detection Threshold
5.0
7.5
10
mA
Loop Current During Power Denial
RL = 200Ω
-
3.2
-
mA
Dial Pulse Distortion
(Note 4)
0
-
0.5
ms
Receive Input Impedance
(Note 4)
-
110
-
kΩ
Transmit Output Impedance
(Note 4)
-
10
20
Ω
2
HC5503PRC
Electrical Specifications
Unless Otherwise Specified, VB- = -48V, VB+ = 5V, AG = BG = DG = 0V, RP = 50Ω, RS = 100Ω, Typical
Parameters. TA = 25oC. Min-Max Parameters are Over Operating Temperature Range (Continued)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
-
15.5
-
dB
ERL
-
24
-
dB
SRL HI
-
31
-
dB
53
58
-
dB
2-Wire On Hook (Note 4)
53
58
-
dB
4-Wire Off Hook
50
58
-
dB
-
±0.05
±0.2
dB
-
±0.02
±0.05
dB
-
1
5
dBrnC
-
-89
-85
dBm0p
-
-
2
µs
30
40
-
dB
1.5
-
-
VPEAK
+3 to -40dBm
-
-
±0.05
dB
-40 to -50dBm
-
-
±0.1
dB
-50 to -55dBm
-
-
±0.3
dB
15
-
-
dB
VB+ to Transmit
15
-
-
dB
VB- to 2-Wire
15
-
-
dB
VB- to Transmit
15
-
-
dB
30
-
-
dB
VB+ to Transmit
30
-
-
dB
VB- to 2-Wire
30
-
-
dB
VB- to Transmit
30
-
-
dB
-
-
±100
µA
Logic ‘0’ VIL
-
-
0.8
V
Logic ‘1’ VIH
2.0
-
5.5
V
2-Wire Return Loss
(Referenced to 600Ω + 2.16µF), RP = RS = 150Ω
(Note 4)
SRL LO
Longitudinal Balance
1VRMS 200Hz - 3400Hz, (Note 4) IEEE Method
0oC ≤ TA ≤ 75oC, RP = RS = 150Ω
2-Wire Off Hook (Note 4)
Insertion Loss
2-Wire to 4-Wire, 4-Wire to 2-Wire
At 1kHz, 0dBm Input Level, Referenced 600Ω,
RP = RS = 150Ω
Frequency Response
200 - 3400Hz Referenced to Absolute Loss at 1kHz and
0dBm Signal Level, RP = RS = 150Ω (Note 4)
Idle Channel Noise
RP = RS = 150Ω (Note 4)
2-Wire to 4-Wire, 4-Wire to 2-Wire
Absolute Delay
RP = RS = 150Ω (Note 4)
2-Wire to 4-Wire, 4-Wire to 2-Wire
Trans Hybrid Loss
Balance Network Set Up for 600Ω Termination at 1kHz,
RP = RS = 150Ω (Note 4)
Overload Level
VB+ = +5V, RP = RS = 150Ω (Note 4)
2-Wire to 4-Wire, 4-Wire to 2-Wire
Level Linearity
2-Wire to 4-Wire, 4-Wire to 2-Wire (Note 4)
Power Supply Rejection Ratio
At 1kHz, (Note 4) Referenced to 0dBm Level,
RP = RS = 150Ω
RP = RS = 150Ω (Note 4)
30 - 60Hz, RL = 600Ω
VB+ to 2-Wire
VB+ to 2-Wire
200 - 16kHz, RL = 600Ω, RP = RS = 150Ω
Logic Input Current (RS, RC, PD)
0V ≤ VIN ≤ 5V
Logic Inputs
Logic Outputs
Logic ‘0’ VOL
ILOAD 800µA, VB+ = 5V
-
0.1
0.5
V
Logic ‘1’ VOH
ILOAD 40µA, VB+ = 5V
2.7
-
5.0
V
3
HC5503PRC
Electrical Specifications
Unless Otherwise Specified, VB- = -48V, VB+ = 5V, AG = BG = DG = 0V, RP = 50Ω, RS = 100Ω, Typical
Parameters. TA = 25oC. Min-Max Parameters are Over Operating Temperature Range (Continued)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Input Offset Voltage
-
±5
-
mV
Input Offset Current
-
±10
-
nA
Input Bias Current
-
20
-
nA
UNCOMMITTED OP AMP SPECIFICATIONS
Differential Input Resistance
(Note 4)
-
1
-
MΩ
Output Voltage Swing
RL = 10K, VB+ = 5V
-
±3
-
VPEAK
Output Resistance
AVCL = 1 (Note 4)
-
10
-
Ω
Small Signal GBW
(Note 4)
-
1
-
MHz
NOTES:
3. ILONG = Longitudinal Current
4. These parameters are controlled by design or process parameters and are not directly tested. These parameters are characterized upon initial
design release, upon design changes which would affect these characteristics, and at intervals to assure product quality and specification
compliance.
Pin Descriptions
28 PIN
PLCC
24 PIN
DIP/SOIC
SYMBOL
DESCRIPTION
2
1
TIP
An analog input connected to the TIP (more positive) side of the subscriber loop through a sense resistor
(RS) and a ring relay contact. Functions with the Ring terminal to receive voice signals from the telephone
and for loop monitoring purposes.
3
2
RING
An analog input connected to the RING (more negative) side of the subscriber loop through a sense resistor
(RS) and a ring relay contact. Functions with the Tip terminal to receive voice signals from the telephone and
for loop monitoring purposes.
4
3
RFS
Senses ring side of loop for ground key and ring trip detection. During ringing, the ring signal is inserted into
the line at this node and RF is isolated from RFS via a relay.
5
4
VB+
Positive Voltage Source - Most positive supply. VB+ is typically.
6
5
C1
Capacitor #1 - An external capacitor to be connected between this terminal and analog ground. Required
for proper operation of the loop current limiting function, and for filtering VB-. Typical value is 0.3µF, 30V.
7
6
DG
Digital Ground - To be connected to zero potential and serves as a reference for all digital inputs and outputs
on the SLIC microcircuit.
9
7
RS
Ring Synchronization Input - A TTL - compatible clock input. The clock should be arranged such that a
positive pulse transition occurs on the zero crossing of the ring voltage source, as it appears at the RFS
terminal. For Tip side injected systems, the RS pulse should occur on the negative going zero crossing and
for Ring injected systems, on the positive going zero crossing. This ensures that the ring relay activates and
deactivates when the instantaneous ring voltage is near zero. If synchronization is not required, the pin
should be tied to 5V.
10
8
RD
Relay Driver - A low active open collector logic output. When enabled, the external ring relay is energized.
11
9
TF
Tip Feed - A low impedance analog output connected to the TIP terminal through a sense resistor (RS).
Functions with the RF terminal to provide loop current, feed voice signals to the telephone set, and sink
longitudinal current.
12
10
RF
Ring Feed - A low impedance analog output connected to the RING terminal through a sense resistor (RS).
Functions with the TF terminal to provide loop current, feed voice signals to the telephone set, and sink
longitudinal current.
13
11
VB-
Negative Voltage Source - Most negative supply. VB- is typically -48V with an operational range of -42V to
-58V. Frequently referred to as “battery”.
14
12
BG
Battery Ground - To be connected to zero potential. All loop current and some quiescent current flows into
this ground terminal.
16
13
SHD
17
14
NC
Switch Hook Detection - A low active LS TTL - compatible logic output. This output is enabled for loop
currents exceeding the switch hook threshold.
Used during production test. Leave disconnected.
4
HC5503PRC
Pin Descriptions
(Continued)
28 PIN
PLCC
24 PIN
DIP/SOIC
SYMBOL
DESCRIPTION
18
15
PD
Power Denial - A low active TTL - Compatible logic input. When enabled, the ring feed voltage collapses to
the tip feed voltage (~4V). The DC feed is disabled, but the AC transmission is maintained. The switch hook
detect (SHD) is not necessarily valid, and the relay driver (RD) output is disabled.
19
16
RC
Ring Command - A low active TTL - Compatible logic input. When enabled, the relay driver (RD) output goes
low on the next high level of the ring sync (RS) input, as long as the SLIC is not in the power denial state
(PD = 0) or the subscriber is not already off- hook (SHD = 0).
20
17
NC
21
18
OUT
23
19
-IN
The inverting analog input of the spare operational amplifier.
24
20
+IN
The non-inverting analog input of the spare operational amplifier.
25
21
RX
Receive Input, Four Wire Side - A high impedance analog input which is internally biased. Capacitive
coupling to this input is required. AC signals appearing at this input differentially drive the Tip feed and Ring
feed terminals.
26
22
C2
Capacitor #2 - An external capacitor to be connected between this terminal and analog ground. This
capacitor is required for the proper operation of ring trip detection. Recommended value 0.82µF ±10% 10V
non-polarized.
27
23
AG
Analog Ground - To be connected to zero potential and serves as a reference for the transmit output (TX)
and receive input (RX) terminals.
28
24
TX
Transmit Output, Four Wire Side - A low impedance analog output proportional to the loop current.
Transhybrid balancing must be performed beyond this output to completely implement two to four wire
conversion. This output is unbalanced and referenced to analog ground. Since the DC level of this output
varies with loop current, capacitive coupling to the next stage is essential.
NC
No internal connection.
1, 8, 15, 22
Leave disconnected.
The analog output of the spare operational amplifier.
NOTE: All grounds (AG, BG, and DG) must be applied before VB+ or VB-. Failure to do so may result in premature failure of the part. If a user wishes
to run separate grounds off a line card, the AG must be applied first.
Functional Diagram
RING SYNC
RING COMMAND
RC
RD
RP
1/2 RING
RELAY
TIP
RING
TRIP
RS
RING
CONTROL
SHD SWITCH HOOK
DETECTION
LOOP
MONITORING
TIP
DIFF
AMP
+
RS
TX
TRANSMIT
OUTPUT
TF
2-WIRE
LOOP
VBSECONDARY
PROTECTION
BATTERY
FEED
VB -
OUT
+1
BG
+IN
RF
LOOP
CURRENT
LIMITER
RFS
1/2 RING
RELAY
LINE
DRIVERS
RING
VOLTAGE
RING
POWER DENIAL
VB -
RS: SENSE RESISTOR
RP: PROTECTION RESISTOR
5
-IN
RS
RING
RP
+
OP
AMP
PD
-1
SLIC MICROCIRCUIT
RX
RECEIVE
INPUT
HC5503PRC
SLIC FUNCTIONAL SCHEMATIC
SOIC PIN NUMBERS SHOWN
21
22
11
12
23
6
4
20
19
18
RX
C2
VBAT
BAT
GND
ANA
GND
DIG
GND
VB+
+
-
OUT
VB +
VB +
VB1
VB2
VB3
VB4
VB5
5V
VOLTAGE AND CURRENT
BIAS NETWORK
A-400
TIP FEED
AMP
TF
9
R17
+
VB+
VBAT
VB2
RING TRIP DETECTOR
R12
R7
TIP
1
VB+
QD3 QD36
RING
FEED
SENSE
R9
3
R22
R11
RING
R4
2
R1
+
VBAT
V + VBAT
R23 B
GK
R20
VBAT
+
IB7
-
-
SWITCH HOOK
DETECTOR
R14
QD27
R18
QD28
16
RFC
VB5
-
PD
VB5
15
+
+
VBAT
RC
THERMAL
LIMITING
LOAD CURRENT
LIMITING
IB2
A-300
RING FEED
AMP
10
13
VB1
R21
-
IB6
VBAT/2 REFERENCE
VB2
R19
VBAT
IB5
R13
VBAT
VBAT
C1
TX
RS
RD
5
24
7
8
6
17
SHD
SH
+
R6
R16
VBAT
NC
STTL
AND LOGIC
INTERFACE
VB+
VBAT
IB6
R2
14
+
VB3
A-100
TRANSV’L
I/V AMP
NC
GND SHORTS
CURRENT
LIMITING
IB1
IB8
VB +
+
R15
VB4
VBAT
R5
R3
RF
VB +
A-200
LONG’L
I/V AMP
R10
5V IB10 VB+
5V
-
R8
VBAT
IB3
IB1 IB2 IB3 IB4 IB5 IB6 IB7 IB8 VBAT IB9 IB10 IB11
-
IB4
A-500
OP AMP
HC5503PRC
LOGIC GATE SCHEMATIC
GK
LOGIC BIAS
2
1
DELAY
4
SH
6
8
7
9
3
5
12
16
10
13
11
RELAY
DRIVER
14
15
TTL
TO
STTL
TTL
TO
STTL
TTL
TO
STTL
TO
R21
A
STTL
TO
TTL
C
B
A
B
RS
RC
PD
C
RD
SHD
SCHOTTKY LOGIC
Surge Protection
TABLE 1.
The SLIC device, in conjunction with an external protection
bridge, will withstand high voltage lightning surges and
power line crosses.
The voltage withstand capability of pins ‘Tip’, ‘Ring’ and
‘RFs’ is ±450V with respect to ground, as shown in Table 1.
This device is intended for use with an appropriate
secondary protection circuit scheme.
The SLIC will withstand longitudinal currents up to a
maximum or 30mARMS , 15mARMS per leg, without any
performance degradation.
7
PARAMETER
TEST
CONDITION
PERFORMANCE
(MAX)
UNITS
Longitudinal
Surge
10µs Rise/
1000µs Fall
±450 (Plastic)
VPEAK
Metallic Surge
10µs Rise/
1000µs Fall
±450 (Plastic)
VPEAK
T/GND
R/GND
10µs Rise/
1000µs Fall
±450 (Plastic)
VPEAK
50/60Hz Current
T/GND
R/GND
11 Cycles
Limited to
10ARMS
315 (Plastic)
VRMS
HC5503PRC
Plastic Leaded Chip Carrier Packages (PLCC)
0.042 (1.07)
0.048 (1.22)
PIN (1) IDENTIFIER
N28.45 (JEDEC MS-018AB ISSUE A)
0.042 (1.07)
0.056 (1.42)
0.004 (0.10)
C
0.025 (0.64)
R
0.045 (1.14)
0.050 (1.27) TP
C
L
D2/E2
C
L
E1 E
D2/E2
VIEW “A”
A1
A
D1
D
0.020 (0.51) MAX
3 PLCS
0.020 (0.51)
MIN
0.045 (1.14)
MIN
0.013 (0.33)
0.021 (0.53)
0.025 (0.64)
MIN
VIEW “A” TYP.
NOTES:
1. Controlling dimension: INCH. Converted millimeter dimensions are
not necessarily exact.
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Allowable
mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1
and E1 include mold mismatch and are measured at the extreme
material condition at the body parting line.
4. To be measured at seating plane -C- contact point.
5. Centerline to be determined where center leads exit plastic body.
6. “N” is the number of terminal positions.
8
INCHES
MILLIMETERS
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
0.165
0.180
4.20
4.57
-
A1
0.090
0.120
2.29
3.04
-
D
0.485
0.495
12.32
12.57
-
D1
0.450
0.456
11.43
11.58
3
D2
0.191
0.219
4.86
5.56
4, 5
E
0.485
0.495
12.32
12.57
-
E1
0.450
0.456
11.43
11.58
3
E2
0.191
0.219
4.86
5.56
4, 5
N
28
28
6
Rev. 2 11/97
SEATING
-C- PLANE
0.026 (0.66)
0.032 (0.81)
28 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
HC5503PRC
Small Outline Plastic Packages (SOIC)
M24.3 (JEDEC MS-013-AD ISSUE C)
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
N
INDEX
AREA
H
0.25(0.010) M
B M
INCHES
E
-B1
2
3
L
SEATING PLANE
-A-
h x 45o
A
D
-C-
e
A1
B
0.25(0.010) M
C
0.10(0.004)
C A M
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
0.0926
0.1043
2.35
2.65
-
A1
0.0040
0.0118
0.10
0.30
-
B
0.013
0.020
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.5985
0.6141
15.20
15.60
3
E
0.2914
0.2992
7.40
7.60
4
e
α
B S
0.05 BSC
1.27 BSC
-
H
0.394
0.419
10.00
10.65
-
h
0.010
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
N
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
MILLIMETERS
α
24
0o
24
8o
0o
7
8o
Rev. 0 12/93
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: (321) 724-7000
FAX: (321) 724-7240
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
TEL: (32) 2.724.2111
FAX: (32) 2.724.22.05
9
ASIA
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Taipei, Taiwan
Republic of China
TEL: (886) 2 2716 9310
FAX: (886) 2 2715 3029