ISL5586 TM Data Sheet June 2001 Low Power Ringing SLIC for Home Gateways File Number 4924.1 Features • Interfaces to Broadcom 3352 cable modem device • Very low on-hook power consumption - 64mW @ Vbh = 75V • User Programmable constant current to the subscriber loop • On Chip ring generation - Balanced to 95 Vpk • Sinewave, Trapezoid, DC offset • Programmable loop start and ring trip detectors • Loop start, Ground Start, Polarity Reversal (soft/hard) • On-Hook transmission and pulse metering support • Integrated battery switch • Open circuit line voltage clamp • Compatible with 3.3V devices • TR-57 compliant Longitudinal balance • 28 PLCC packaging • Latch-up free Bipolar design • Thermal protection The ISL5586 is a very low power Ringing Subscriber Interface circuit designed for use with the Broadcom* BCM3352 Cable Modem Chip, with on-board voiceband codecs, or other 3.3V voiceband codec devices. The ISL5586 provides on board ringing signal generation up to 95V peak supporting sinusoidal or trapezoidal waveshapes with DC offset. Loop start and ground start trunks are supported, and an open circuit DC voltage of less than 56V is maintained on the subscriber loop in the on-hook condition, in compliance with MTU operation and the safety requirements of UL-1950. Together with the Broadcom BCM3352, the ISL5586 provides resistive and complex two wire impedance matching and transhybrid balancing. Also supported are onhook transmission of caller id signals, soft and hard polarity reversal and 12/16kHz subscriber pulse metering systems used in Europe and Asia, thereby allowing a low cost, low risk, global product design to be achieved. Applications • • • • • • • Related Literature • Evaluation Board for the ISL5586 family AN9918 • Technical Brief TB363 “Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs)” Cable Modems Voice Over DSL (VoDSL) Broadband Wireless Access Voice Over Internet Protocol (VoIP) ISDN Terminal Adapters (TA) Small Office Home Office PBX Wireless Local Loop Block Diagram POL CDCP CDCM DC CONTROL ILIM VBL VBH BATTERY SWITCH RINGING PORT VRSP VRSM TIP VRXP 2-WIRE PORT RING TRANSIENT CURRENT LIMIT TL VRXM TRANSMIT SENSING 4-WIRE PORT -IN VZO VFB VTXP VTXM INTERNAL LOOP BACK DETECTOR LOGIC RTD RD DET CONTROL LOGIC F2 F1 F0 BSEL *Broadcom is a registered trademark of Broadcom Corp. 4-1 RSLIC18™ is a trademark of Intersil Corporation. CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2001, All Rights Reserved ISL5586 Ordering Information LONGITUDINAL BALANCE HIGH BATTERY (VBH) PART NUMBER 100V 85V 75V 58dB • ISL5586FCM • ISL5586BIM • ISL5586DIM TEMP. RANGE oC PACKAGE • 0 to 75 28 Ld PLCC N28.45 -40 to 85 28 Ld PLCC N28.45 • -40 to 85 28 Ld PLCC N28.45 • -40 to 85 28 Ld PLCC N28.45 • • ISL5586CIM 53dB PACKAGE NO. Device Operating Modes MODE F2 F1 F0 DET DESCRIPTION Low Power Standby (LPS) 0 0 0 SHD MTU compliant on hook operating mode. Forward Active (FA) 0 0 1 SHD MTU compliant and OHT capable on hook mode, off hook loop feed mode. Unused 0 1 0 n/a Reverse Active (RA) 0 1 1 SHD Signalling mode which reverses direction of loop current, otherwise like Forward Active. Ringing 1 0 0 RTD Signalling mode used to generate high voltage balanced ringing signal. Forward Loop Back (FLB) 1 0 1 SHD Internal loop back mode which connects internal load across Tip and Ring terminals. Tip Open/Ground Start (TO) 1 1 0 SHD Signalling mode sets Tip to high impedance state, Ring output still active. Power Denial (PD) 1 1 n/a Loop disconnect mode which forces both Tip and Ring to high impedance. 1 Reserved for internal purposes. Pinout 4-2 VBH VBL BGND TIP RING RD ILIM ISL5586 (PLCC) TOP VIEW 4 3 2 1 28 27 26 6 24 CDCM F1 7 23 CDCP F0 8 22 VCC DET 9 21 TL VRSP 10 20 VFB VRSM 11 19 -IN 15 16 17 18 VZO 14 VRXM 13 VRXP 12 POL F2 AGND 25 RTD VTXM 5 VTXP BSEL ISL5586 Absolute Maximum Ratings TA = 25oC Thermal Information Maximum Supply Voltages VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7V VCC - VBAT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110V ESD (Human Body Model) . . . . . . . . . . . . . . . . . . . . . . . . . . 500V Maximum Tip/Ring Negative Voltage Pulse (Note 7) . . . . . .VBH-15V Maximum Tip/Ring Positive Voltage Pulse (Note 7). . . . . . . . . . + 8V Thermal Resistance (Typical, Note 1) PLCC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Maximum Junction Temperature Plastic . . . . . . . . . . . . . . . . .150oC Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (PLCC - Lead Tips Only) Operating Conditions Die Characteristics Temperature Range Industrial. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC Positive Power Supply (VCC). . . . . . . . . . . . . . . . . . . . . . . . . . . .+5V Negative Power Supply (VBH, VBL). . . . . . . . . . . . . . -100V to -24V Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -VBH Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bipolar-DI θJA (oC/W) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Unless Otherwise Specified, TA = -40oC to 85oC, VBL = -24V, VBH = -100V, VCC = +5V, AGND = BGND = 0V, loop current limit = 25mA. All AC Parameters are specified at 600Ω, 2-wire terminating impedance over the frequency band of 300Hz to 3.4kHz. Protection resistors = 0Ω. These parameters apply generically to each product offering. Electrical Specifications PARAMETER TEST CONDITIONS MIN TYP MAX UNITS RINGING PARAMETERS VRSP Input Impedance (Note 2) 35 - - MΩ VRSM input impedance (Note 2) 10 - - MΩ V/V Differential Ringing Gain (Note 3) VRS to 2-Wire, RLOAD = 5 REN - 99.5 - Ringing voltage Total Distortion RL = 1.3 kΩ, VT-R = |VBH| -5 - 0.8 5 % 4-Wire to 2-Wire Ringing Off Isolation Forward Active Mode, Referenced to VRS Input. - 100 - dB 2-Wire to 4-Wire Transmit Isolation Ringing Mode Referenced to the Differential Ringing Amplitude. - 100 - dB Tip, Referenced to VBH/2 + 0.5V -3.0 0.2 3.0 V Ring, Referenced to VBH/2 + 0.5V -3.0 0.2 3.0 V Centering Voltage Accuracy AC TRANSMISSION PARAMETERS Receive Input Impedance, VRXP (Note 2) 379 541 - kΩ Receive input Impedance, VRXM (Note 2) 100 142 - kΩ Transmit Output Impedance (Note 2) DC Transmit Output Drive Capability (Note 2) Current Capacitance to Ground - 0.01 - Ω 0.30 1.0 - mA - 1.0 100 pF 4-Wire Port Overload Level THD = 1% 3.1 3.5 - VPEAK 2-Wire Port Overload Level THD = 1% 3.1 3.5 - VPEAK 200Hz ≤ f ≤ 1kHz - 35 - dB 1kHz ≤ f ≤ 3.4kHz - 23 - dB False Detect 20 - - mA RMS mARMS 2-Wire Return Loss (Note 2) Longitudinal Current Capability per Wire (Note 2) False Detect in Low Power Standby 10 - - 2-Wire Longitudinal Balance (ON-Hook and OFF-Hook) (Notes 4, 5) 200Hz, 500Hz, 1000Hz 58 61 - dB 3000Hz 53 61 - dB 4-Wire Longitudinal Balance (ON-Hook and OFF-Hook) (Notes 4, 5) 200Hz, 500Hz, 1000Hz 58 64 - dB 3000Hz 53 62 - dB 4-Wire to 2-Wire Insertion Loss 0dBmo at 1kHz 2.72 2.92 3.12 dB 2-Wire to 4-Wire Insertion Loss 0dBmo at 1kHz -0.2 0 0.2 dB 4-Wire to 4-Wire Insertion Loss 0dBmo at 1kHz 2.72 2.92 3.12 dB Frequency Response, On Hook, 2-Wire to 4-Wire, 4-Wire Referenced to 0dBmo at 1004Hz, to 2-Wire, 4-Wire to 4-Wire 400Hz ≤ f ≤ 2800Hz -0.15 0.03 0.15 dB Frequency Response, Off Hook 2-Wire to 4-Wire, 4-Wire to 2-Wire, 4-Wire to 4-Wire -0.15 0.03 .15 dB 4-3 Referenced to 0dBmo at 1004Hz, f = 400Hz, 2800Hz ISL5586 Unless Otherwise Specified, TA = -40oC to 85oC, VBL = -24V, VBH = -100V, VCC = +5V, AGND = BGND = 0V, loop current limit = 25mA. All AC Parameters are specified at 600Ω, 2-wire terminating impedance over the frequency band of 300Hz to 3.4kHz. Protection resistors = 0Ω. These parameters apply generically to each product offering. (Continued) Electrical Specifications PARAMETER TEST CONDITIONS MIN TYP MAX UNITS - 0.02 - dB -37 to -50dBmo - 0.05 - dB -50 to -55dBmo - 0.10 - dB Amplitude Tracking, ON-Hook 0dBmo to -37dBmo, f = 1004Hz, Referenced to 0dBmo - 0.01 - dB Signal to Distortion, 2-Wire to 4-Wire, 4-Wire to 2-Wire, 4-Wire to 4-Wire, ON-Hook and OFF-Hook Input level 0dBmo to -30dBmo 33 45 - dB Input Level -30 to -40dBmo 27 40 - dB Input Level -40 to -45dBmo 22 29 - dB 0dBmo input, 0 Hz ≤ f ≤ 12kHz 28 45 - dB dB Amplitude Tracking, Off Hook, 2-Wire to 4-Wire, 4-Wire to +3dBmo to -37dBmo, f = 1004Hz, 2-Wire, 4-Wire to 4-Wire Referenced to 0dBmo Signal Frequency Distortion (0Hz to 12kHz) Single Frequency Distortion (0Hz to 4kHz) 0dBmo Input, 1004Hz ≤ f ≤ 1024Hz 40 50 - Intermodulation Distortion, 2-Wire to 4-Wire, 4-Wire to 2-Wire, 4-Wire to 4-Wire (IEEE Standard 743-1984) 4-Tone Second-Order Intermodulation Products 43 50 - dB 4-Tone Third-order Intermodulation Products 44 62 - dB Idle Channel Noise, 2-Wire (Note 5) C-Message, Forward Active, Low Battery Enabled - 10.0 13.0 dBrnc Idle Channel Noise, 4-Wire (Note 5) C-Message, Forward Active, Low Battery Enabled - 10.0 13.0 dBrnc Programming Accuracy (1% External Resistor) -8.5 1.0 +8.5 % Programming Range 15 - 45 mA Programming Accuracy -10 - +10 % Programming Range 40 - 100 mA DC PARAMETERS OFF-Hook Loop Current Limit OFF-Hook Transient Current Limit Loop Current During Low Power Standby Forward Polarity Only (R L = 600Ω) - 24 - mA Open Circuit Voltage (|Tip - Ring|) Forward and Reverse Active modes VBL = -16V - 7.0 - VDC VBL = -24V 13.5 14.5 16.5 VDC VBH > -60V 43 48 - VDC Open Circuit Voltage (|Tip-Ring|) LPS VBH > -60V 43 51 - VDC Absolute Open Circuit Voltage (Relative to GND) VRG in FA, VTG in RA, VBH > -60V - -53 -56 VDC Absolute Open Circuit Voltage VRG in LPS - -52 -56 VDC - - 52 V mA TEST ACCESS FUNCTIONS Loopback Max Battery LOOP DETECTORS AND SUPERVISORY FUNCTIONS Switch Hook Programming Range 5 - 15 -10 - +10 % - 1.0 - % Ring Trip Comparator Threshold 2.3 2.60 2.9 V Ring Trip Programming Current Accuracy -10 - +10 % - 175 - oC Switch Hook Programming Accuracy Assumes 1% External Programming Resistor Dial Pulse Distortion Thermal Shutdown Threshold IC Junction Temperature LOGIC INPUTS (F0, F1, F2, BSEL) Input Low Voltage - - 0.8 V Input High Voltage 2.0 - - V Input Low Current (F0, F1, F2) VIL = 0.4V - 7.5 20 µA Input Low Current (BSEL) VIL = 0.4V - 1.0 - µA Input High Current (F0, F1, F2, BSEL) VIH = 2.4V - 0.01 - µA - 0.15 0.4 V 2.4 3.2 3.5 V mA LOGIC OUTPUT (DET) Output Low Voltage IOL = 5mA Output High Voltage IOH = 100µA SUPPLY CURRENTS Low Power Standby, BSEL = 2.0V, VBH = -75V to -100V ICC - 3.2 5.0 IBH - 0.65 0.9 mA ICC - 5.0 6.5 mA IBL - 1.5 2.5 mA Forward or Reverse, BSEL =.8V 4-4 ISL5586 Unless Otherwise Specified, TA = -40oC to 85oC, VBL = -24V, VBH = -100V, VCC = +5V, AGND = BGND = 0V, loop current limit = 25mA. All AC Parameters are specified at 600Ω, 2-wire terminating impedance over the frequency band of 300Hz to 3.4kHz. Protection resistors = 0Ω. These parameters apply generically to each product offering. (Continued) Electrical Specifications PARAMETER Forward Active, BSEL = 2.0V, VBH = -100V Forward Active, BSEL = 2.0V, VBH = -85V Forward Active, BSEL = 2.0V, VBH = -75V Ringing, BSEL = 2.0V, VBH = -100V Ringing, BSEL = 2.0V, VBH = -85V Ringing, BSEL = 2.0V, VBH = -75V Forward Loopback, BSEL = 0.8V, VBL = -24V MIN TYP MAX UNITS ICC TEST CONDITIONS - 7.0 9.0 mA IBL - 1.4 2.0 mA IBH - 1.8 3.0 mA ICC - 6.6 8.5 mA IBL - 1.35 2.0 mA IBH - 1.60 2.75 mA ICC - 6.3 8.0 mA IBL - 1.25 2.0 mA IBH - 1.45 2.5 mA ICC - 7.4 10.0 mA IBL - 1.5 2.0 mA IBH - 2.2 3.0 mA ICC - 6.80 9.25 mA IBL - 1.36 2.0 mA IBH - 2.1 3.0 mA mA ICC - 6.4 8.5 IBL - 1.26 2.0 mA IBH - 2.0 3.0 mA mA ICC - 10.3 13.5 IBL - 23.0 32.0 mA ICC - 3.2 - mA IBL - 0.1 - mA ICC - 3.4 6.0 mA IBL - 0.22 0.50 mA Forward or Reverse VBL = -24V - 57 - mW Low Power Standby VBH = -100V - 83 - mW VBH = -85V - 70 - mW VBH = -75V - 64 - mW VBH = -100V - 294 - mW VBH = -85V - 236 - mW VBH = -75V - 206 - mW VBL = -24V, ILIM = 25mA, RL = 300Ω - 305 - mW f = 50kHz - 50 - dB f = 300Hz ≤ f ≤ 3400Hz - 45 - dB f = 8kHz ≤ f ≤ 16kHz - 28 - dB f = 50Hz - 70 - dB f = 300Hz ≤ f ≤ 3400Hz - 55 - dB f = 8kHz ≤ f ≤ 16kHz - 40 - dB dB Tip Open, BSEL = 2.0V Power Denial, BSEL = 0.8V or 2.0V ON HOOK POWER DISSIPATION (Note 6) Ringing OFF HOOK POWER DISSIPATION (Note 6) Forward or Reverse POWER SUPPLY REJECTION RATIO V CC to 2-Wire, BSEL = 0.8V VCC to 4-Wire, BSEL = 0.8V VBL to 2-Wire, BSEL = 0.8V VBL to 4-Wire, BSEL = 0.8V VBH to 2-Wire, BSEL = 2.0V 4-5 f = 50Hz - 25 - f = 300Hz ≤ f ≤ 3400Hz - 38 - dB f = 8kHz ≤ f ≤ 16kHz - 28 - dB dB f = 50Hz - 27 - f = 300Hz ≤ f ≤ 3400Hz - 36 - dB f = 8kHz ≤ f ≤ 16kHz - 23 - dB f = 50Hz - 27 - dB f = 300Hz ≤ f ≤ 3400Hz - 35 - dB f = 8kHz ≤ f ≤ 16kHz - 23 - dB ISL5586 Unless Otherwise Specified, TA = -40oC to 85oC, VBL = -24V, VBH = -100V, VCC = +5V, AGND = BGND = 0V, loop current limit = 25mA. All AC Parameters are specified at 600Ω, 2-wire terminating impedance over the frequency band of 300Hz to 3.4kHz. Protection resistors = 0Ω. These parameters apply generically to each product offering. (Continued) Electrical Specifications PARAMETER VBH to 4-Wire, BSEL = 2.0V TEST CONDITIONS f = 50Hz MIN TYP MAX UNITS - 76 - dB f = 300Hz ≤ f ≤ 3400Hz - 55 - dB f = 8kHz ≤ f ≤ 16kHz - 42 - dB NOTES: 2. These parameters are controlled via design and Statistical Process Control and are not directly tested. These parameters are characterized upon initial design release and upon design changes which would affect these characteristics. 3. Input voltage = 0.636VRMS for VBH = -100V, 0.530VRMS for VBH = -85V and 0.460VRMS for -75V devices. 4. Tested per IEEE455-1985, with 368Ω resistors connected to the Tip and Ring terminals. 5. These parameters are tested 100% at room temperature, and are guaranteed but not tested across the full temperature range via statistical characterization and design. 6. The power dissipation is based on actual device measurements and will be less than worst case calculations based on data sheet supply current limits. 7. Characterized with 2 x 10us and 10 x 1000us first level lightning surge waveform (GR-1089-CORE). Design Equations Refer to Figure 14 for programming resistor connections. Loop Supervision Thresholds illustrated in Figure 1, a complex programming network is required. RESISTIVE IMPEDANCE SYNTHESIS SWITCH HOOK DETECT The desired switch hook detect threshold current (ISH) is set by a single external resistor, RSH as follows (EQ. 1) R SH = 615 ⁄ I SH The loop current threshold programming range is from 5mA to 15mA. RING TRIP DETECT The AC source resistance of the SLIC is synthesized with a single external resistor RS as follows: 400 R S = Z0 × ---------- = 133.3 ( Z0 ) 3 (EQ. 4) The synthesized resistance (Z0) is determined by the characteristic line resistance and protection resistors as shown in Equation 5. (EQ. 5) Z O = R L – ( RP 1 + RP 2 ) The ring trip detect threshold (IRT) is set by a single external resistor, R RT as follows. (EQ. 2) R R T = 1800 ⁄ I R T IRT should be set between the peak ringing current and the peak off hook current while still ringing. In addition, the ring trip current must be set below the transient current limit including tolerances. The ringing signal filter capacitor C RT, in parallel with RRT sets the ring trip response time. COMPLEX IMPEDANCE SYNTHESIS A complex network is used in place of RS when the termination impedance of the line is complex as shown in Figure 1. 2-WIRE TERMINATION IMPEDANCE (ZL) C2 R1 RS R2 LOOP CURRENT LIMIT The DC loop current limit (ILIM ) is programmed by the external resistor RIL as follows. 1760 R IL = ------------ILI M (EQ. 3) The loop current limit programming range is from 15mA to 45mA. PROGRAMMING NETWORK (ZS) CP RP FIGURE 1. COMPLEX PROGRAMMING NETWORK The component R S has a different design equation than the RS used for resistive impedance synthesis. The design equations for each component are provided below where RP1 and RP2 are the protection resistors and RP is a component of the programming network. Impedance Matching The AC source impedance of the SLIC is programmed with the external impedance network ZS as described next. To synthesize and match Resistive line terminations the programming network is simply a resistor (RS) as shown in Figure 14. For complex line terminations such as the one 4-6 R S = 133.3 × ( R1 – RP 1 – RP 2 ) (EQ. 6) R P = 133.3 × R 2 (EQ. 7) C P = C 2 ⁄ 133.3 (EQ. 8) ISL5586 Z O = ( R1 – RP1 – RP2 ) + R2 C2 (EQ. 9) 4-WIRE TO 2-WIRE GAIN The 4-wire to 2-wire gain (G42) is defined as the receive gain. It is a function of the terminating impedance, synthesized impedance and protection resistors. The gain is defined from the Receive input terminals (VRXP, VRXM) to the terminating impedance (ZL) on the 2-wire side, and is illustrated in Figure 12. ZL G 42 = – 2.8 ------------------------------------------ Z + 2R O P + Z L (EQ. 10) For example, a source current limit setting of 50mA is programmed with a 35.6kΩ resistor connected from pin 16 of the device to ground. This setting determines the maximum amount of current which flows from Tip to Ring during an off hook event until the DC loop current limit responds. In addition this setting also determines the amount of current which will flow from Tip or Ring when external battery faults occur. SINK CURRENT PROGRAMMING The sink current limit is internally offset 20% higher than the externally programmed source current limit setting. (EQ. 14) I SN K = 1.20 × I SRC When the device source impedance and the protection resistors equal the terminating impedance, the receive gain equals 2.92dB and is inverted with respect to the input. If the source current limit is set to 50mA, the sink current limit will be 60mA. This setting will determine the amount of current which flows into Tip or Ring when external ground faults occur. 2-WIRE TO 4-WIRE GAIN FUNCTIONAL DESCRIPTION The 2-wire to 4-wire gain (G24) is the gain from tip and ring to the transmit differential output. The transmit gain is given by Equation 11. Note that VTR is defined on the line side of the protection resistors (reference Figure 13). With ZL set to 600 ohms, the protection resistors set to 50Ω/terminal and Z0 = ZL-2RP the Transmit gain equals -0.833 (-1.59dB) and is inverted with respect to the 2-wire input (VTR ). Each amplifier is designed to limit source current and sink current. The diagram below shows the functionality of the circuit for the case of limiting the source current. A similar diagram applies to the sink current limit with current polarity changed accordingly. ZO G 24 = – 2 ------------------------------------------ Z O + 2R P + ZL (EQ. 11) IO/K IREF = 1.21/TL I ERR 200K TRANSHYBRID GAIN The transhybrid gain is defined as the 4-wire to 4-wire gain (G 44) and is given by Equation 12 (Reference Figure 14)). ZO G 44 = – 2.8 --------------------------------------- Z + 2 R + Z O P L TIP or RING + ISIG VB/2 20 IO (EQ. 12) FIGURE 2. CURRENT LIMIT FUNCTIONAL DIAGRAM Transient Current Limit The drive current capability of the output amplifiers is determined by an externally programmable output current limit circuit which is separate from the DC loop current limit function. The transient current limit is programmed with a resistor to ground at the TL pin. The current limit circuit works in both the source and sink direction, with an internally fixed offset to prevent the current limit functions from turning on simultaneously. The current limit function is provided by sensing line current and reducing the voltage drive to the load when the externally set threshold is exceeded, hence forcing a constant source or sink current. SOURCE CURRENT PROGRAMMING The source current is externally programmed as shown in Equation 13. 1780 R TL = ------------ISRC (EQ. 13) 4-7 During normal operation, the error current (IERR) is zero and the output voltage is determined by the signal current (ISIG) multiplied by the 200K feedback resistor. With the current polarity as shown for ISIG, the output voltage moves positive with respect to half battery. Assuming the amplifier output is driving a load at a more negative potential, the amplifier output will source current. During excessive output source current flow, the scaled output current (IO /K) exceeds the reference current (IREF) forcing an error current (IERR). With the polarity as shown the error current subtracts from the signal current, which reduces the amplifier output voltage. By reducing the output voltage the source current to the load is decreased and the output current is limited. DETERMINING THE PROPER SETTING Since this feature programs the maximum output current of the device, the setting must be high enough to allow for detection of ring trip or programmed off hook loop current, whichever is greater. ISL5586 To allow for proper ring trip operation, the transient current limit setting should be set at least 25% higher than the peak ring trip current setting. Setting the transient current 25% higher should account for programming tolerances of both the ring trip threshold and the transient current limit. GND 600Ω TIP AMP TIP If loop current is larger than ring trip current (low REN applications) then the transient current limit should be set at least 35% higher than the loop current setting. The slightly higher offset accounts for the slope of the loop current limit function. Attention to detail should be exercised when programming the transient current limit setting. If ring trip detect does not occur while ringing, then re-examine the transient current limit and ring trip threshold settings. Low Power Standby Mode Overview The low power standby mode (LPS, 000) should be used in conjunction with the high battery during idle line conditions. The SLIC is designed to operate from the high battery during this mode so MTU compliance can be met. Most of the internal circuitry is powered down, resulting in low power dissipation. If MTU compliance is not required during idle line conditions, the device may be operated from the low battery which will decrease the standby power dissipation. TABLE 1. DEVICE INTERFACES DURING LPS INTERFACE ON OFF NOTES AC transmission, impedance matching and ringing are disabled during this mode. Receive - x Ringing - x Transmit - x 2-Wire x - Amplifiers disabled. Loop Detect x - Switch hook. 2-Wire Interface In the LPS mode, the 2-wire interface is maintained with internal switches, resistors, and voltage references. The Tip and Ring amplifiers are turned off to conserve power. The device will provide MTU compliance, loop current, and loop supervision. Figure 2 represents the internal circuitry providing the 2-wire interface when in this mode of operation. RING RING AMP 600Ω MTU REF FIGURE 3. LPS 2-WIRE INTERFACE CIRCUIT DIAGRAM MTU Compliance Maintenance Termination Unit or MTU compliance places DC voltage requirements on the 2-wire terminals during idle line conditions. The minimum idle voltage for compliance is 42.75V. The high side of the MTU range is 56V. The voltage is expressed as the difference between Tip and Ring. The Tip voltage is held near ground through a 600Ω resistor and switch. The Ring voltage is nominally limited to -49V by the MTU reference. A switch and 600Ω resistor connect the MTU reference to the Ring terminal. When the high battery voltage exceeds the MTU reference of -49V, the Ring terminal will be clamped by the internal reference. The same Ring relationships apply when operating from the low battery. For operating battery voltages (VBH) less than or equal to the internal MTU reference, the Ring voltage will be approximately 4.5 volts more positive than VBH . Loop Current In the LPS mode, the device is capable of providing DC current to a load through a path of resistors and switches. The current available for switch hook detect is a function of the off hook loop resistance (R LOOP). This includes the off hook phone resistance and copper loop resistance. The current available during LPS is given by Equation 15. I LOOP = ( – 1 – ( – 49 ) ) ⁄ ( 600 + 600 + R LOOP ) (EQ. 15) Internal current limiting of the standby switches will limit the maximum current to approximately 23mA. The longitudinal current capability is guaranteed to be greater than or equal to 10mARMS per pin. When longitudinal currents exceed this level, false off hook detection may occur. The reduction in longitudinal current capability with respect to the Forward Active mode is a result of turning off the Tip and Ring amplifiers. On Hook Power Dissipation The on hook power dissipation of the SLIC in the LPS mode is determined by the operating voltages and quiescent currents and is calculated below. P LPS = V BH × I BH Q + V BL × I BLQ + V C C × ICC Q 4-8 (EQ. 16) ISL5586 The quiescent current terms are specified in the electrical tables for each operating mode. Load power dissipation is not a factor since this is an on hook mode. Some applications may specify a standby current. The standby current may be a charging current required for modern telephone electronics. RB VIN RCS + RL RC - + Any standby line current, ISLC , introduces an additional power dissipation term PSLC . Equation 17 illustrates the power contribution is zero when the standby line current is zero. (EQ. 17) If the battery voltage is less than -49V (the MTU clamp is off), the standby line current power contribution reduces to Equation 18. P SLC = ISLC × ( V BH + 1 + ISLC x1200 ) - VOUT Standby Current Power Dissipation P SLC = ISLC × ( V BH – 49 + 1 + I SLC x1200 ) RA (EQ. 18) Most applications do not specify charging current requirements during standby. When specified, the typical charging current may be as high as 5mA. Forward Active Mode Overview The Forward Active mode (FA, 001) is the primary AC transmission mode of the SLIC. On hook transmission, DC loop feed and voice transmission are supported during this mode. The device may be operated from either high or low battery for on-hook transmission and from low battery for loop feed. Loop supervision is provided by the switch hook detector at the DET output. When DET goes low, the low battery should be selected for DC loop feed and voice transmission. KS FIGURE 4. VOLTAGE FEED CURRENT SENSE DIAGRAM By monitoring the current at the amplifier outputs, a negative feedback mechanism sets the output voltage for a defined load. The amplifier closed loop gains are set by internal resistor ratios (R A , RB , RC) providing all the performance benefits of matched resistors. The internal sense resistor RCS , is much smaller than the gain resistors and are typically 20Ω. The feedback mechanism, KS , represents the gain configuration providing negative feedback to the loop. DC Loop Feed The feedback mechanism for monitoring the DC portion of the loop current is contained within the loop detector block. A low pass filter is used in the feedback loop to block voice and other signals from interfering with the loop current limit function. The pole of the low pass filter is set by the external 4.7µF capacitor (CDC) and an internal 8KΩ resistor. The DC feed characteristic of the SLIC will drive Tip and Ring towards half battery to regulate the DC loop current. For light loads, Tip will be near -4V and Ring will be near VVBL + 4.5V. Most applications will operate the device from low battery while off hook. The following diagram depicts the DC feed characteristic. VTR(OC) m = (∆VTR/∆IL) = 11.1kΩ The primary purpose of on hook transmission will be to support caller ID and other advanced signalling features. The transmission over load level while on hook is 3.1V PEAK . When operating from the high battery, the DC voltages at Tip and Ring are MTU compliant. The typical Tip voltage is -4V and the Ring voltage is a function of the battery voltage for battery voltages less than -60V as shown in Equation 19. V RING = V BH + 4.5V (EQ. 19) Feed Architecture The SLIC design implements a voltage feed current sense architecture. The voltage across Tip and Ring is controlled by sensing the load current. Resistors are placed in series with the Tip and Ring outputs to provide the current sensing function. The diagram below illustrates the concept. 4-9 VTR , DC (V) On-Hook Transmission ILOOP (mA) ILIM FIGURE 5. DC FEED CHARACTERISTIC The point on the y-axis labeled VTR(OC) is the open circuit Tip to Ring voltage and is defined by the feed battery voltage. V TR ( OC ) = VBL – 9 (EQ. 20) The curve of Figure 5 shows the loop current for a given set of loop conditions. The loop conditions are determined by the low battery voltage and the DC loop resistance. The DC loop resistance is the sum of the protection resistance, copper resistance (ohms/foot) and the telephone off hook DC resistance. ISL5586 ISC Since the current relationships are different for constant current versus constant voltage, the region of device operation is critical to valid power dissipation calculations. IA IB ILOOP (mA) ILIM Reverse Active Mode Overview 2RP RLOOP (Ω) RKNEE FIGURE 6. ILOOP VERSUS R LOOP LOAD CHARACTERISTIC The slope of the feed characteristic and the battery voltage define the maximum loop current on the shortest possible loop as the short circuit current ISC . V TR ( OC ) – 2R P I LIM I SC = ILI M + -----------------------------------------------------1.1e 4 (EQ. 21) The term ILIM is the programmed current limit, 1760/RIL. The line segment IA represents the constant current region of the loop current limit function. VTR ( OC ) – R LOOP I LIM I A = I LIM + -------------------------------------------------------------1.1e4 (EQ. 22) The maximum loop resistance for a programmed loop current is defined as R KNEE . V TR ( OC ) R KNEE = -----------------------ILIM (EQ. 23) When RKNEE is exceeded, the device will transition from constant current feed to constant voltage, resistive feed. The line segment IB represents the resistive feed portion of the load characteristic. V TR ( OC ) I B = -----------------------R LOOP (EQ. 24) Power Dissipation The power dissipated by the SLIC in the Forward Active mode while on hook is strictly a function of the quiescent currents for each supply. + VBL × I BLQ + VCC × ICCQ P FAQ = V BH × I BH Q (EQ. 25) Off hook power dissipation is increased above the quiescent power dissipation by the DC load. If the loop length is less than or equal to R KNEE , the device is providing constant current (IA) , and the power dissipation is calculated using Equation 26. P FA ( IA ) = PFA ( Q ) + ( V BL xI A ) – ( R LOOP xI 2 A ) (EQ. 26) If the loop length is greater than RKNEE , the device is operating in the constant voltage, resistive feed region. The power dissipated in this region is calculated using Equation 27. P FA ( IB ) = PFA ( Q ) + ( V BL xI B ) – ( R LOOP xI 2 B ) 4-10 (EQ. 27) The reverse active mode (RA, 011) provides the same functionality as the forward active mode. On hook transmission, DC loop feed, and voice transmission are supported. Loop supervision is provided by the switch hook detector. The device may be operated from either high or low battery. When in the Reverse Active mode the Tip and Ring DC voltage characteristics exchange roles. That is, Ring is typically 4V below ground and Tip is typically 4.5V more positive than battery. Silent Polarity Reversal Changing from forward active to reverse active or vice versa is referred to as polarity reversal. Many applications require control of the polarity reversal transition time. Requirements range from minimizing cross talk to protocol signalling. The SLIC uses an external low voltage capacitor, CPOL , to set the reversal time. The capacitor is isolated from the AC loop so that loop stability is not influenced by its selection. Once CPOL is set, the reversal time will remain nearly constant over various load conditions. The internal circuitry used to set the polarity reversal time is shown in Figure 7. During Forward Active the switch is open and the current from source I1 charges the external timing capacitor CPOL. The internal resistor provides a clamping function for the voltage at the POL node. When the Reverse Active mode is initiated the switch closes and the difference current (I2-I1) discharges the timing capacitor. The voltage at the POL node drives one side of a transistor differential pair which forces the Forward or Reverse condition on the Tip and Ring amplifiers. The forward/reverse transition time is given by Equation 28, where ∆time is the required reversal time. ∆time C POL = ---------------75000 (EQ. 28) Polarized capacitors may be used for CPOL. The low voltage at the POL pin and minimal voltage excursion in the order of ±0.75V, are well suited for polarized capacitors. ISL5586 VBH V R = ----------- – ( 50 × V DIF ) 2 I1 POL 75kΩ (EQ. 30) When the differential input signal is zero, the Tip and Ring amplifier outputs are centered at half battery. The device provides auto centering for easy implementation of sinusoidal ringing waveforms. Both AC and DC control of the Tip and Ring outputs is available during ringing. This feature allows for DC offsets as part of the ringing waveform. CPOL I2 FIGURE 7. REVERSAL TIMING CONTROL Ringing Input Terminals Power Dissipation The power dissipation equations for forward active operation also apply to the reverse active mode. Ringing Overview The Ringing mode (RNG, 100) provides linear amplification to support a variety of ringing waveforms. A programmable ring trip function provides loop supervision and auto disconnect upon ring trip. The device is designed to operate from the high battery during this mode. Architecture The SLIC provides linear amplification to the differential signal applied to the ringing inputs (VRSP, VRSM ). The differential ringing gain of the device is 100V/V. The circuit model for the ringing path is shown in Figure 8. R 20 R/8 - + TIP RING 20 + - 1.25R - + 5:1 + VBH 2 1.25R R R + VRSP VRSM - - + R FIGURE 8. LINEAR RINGING MODEL The differential terminals feature high input impedance which allows the use of low value capacitors for AC coupling the ring signal if necessary. The Ringing input is enabled only during the ringing mode, therefore a free running oscillator may be connected at all times. When operating from a battery of -100V, each amplifier, Tip and Ring, will swing a maximum of 95VP-P . Hence, the maximum differential signal swing between VRSP and VRSM to achieve full scale ringing is approximately 1.9VP-P . Logic Control Ringing patterns consist of silent and ringing intervals. The ringing to silent pattern is called the ringing cadence. During the silent portion of ringing, the device can be programmed to any other operating mode. The most likely candidates are low power standby or forward active. Depending on system requirements, the low or high battery may be selected. Loop supervision is provided with the ring trip detector. The ring trip detector senses the change in loop current when the phone is taken off hook. The loop detector full-wave rectifies the ringing current, which is then filtered with external components RRT and CRT. The resistor RRT sets the trip threshold and the capacitor CRT sets the trip response time. Most applications will require a trip response time less than 150ms. Three very distinct actions occur when the device detects a ring trip. First, the DET output is latched low. The latching mechanism eliminates the need for software filtering of the detector output. The latch is cleared when the operating mode is changed externally. Second, the Ringing inputs are disabled, removing the ring signal from the line. Third, the device is internally forced to the forward active mode. Power Dissipation The voltage gain from the differential ringing input to the Tip output is 50V/V. The resistor ratios provide a gain of 10 and the current mirror provides a gain of 5. The voltage gain from the differential input to the Ring output is -50V/V. The equations for the Tip and Ring outputs during ringing are provided below. V BH V T = ----------- + ( 50 × VD IF ) 2 (EQ. 29) The power dissipation during ringing is dictated mostly by the load driving requirements and the ringing waveform. The key to valid power calculations is the correct definition of average and RMS currents. The average current defines the high battery supply current. The RMS current defines the load current. The cadence provides a time averaging reduction in the peak power. The total power dissipation consists of ringing power, Pr, and the silent interval power, Ps . tr ts P R NG = Pr × -------------- + P s × -------------t +t t +t r 4-11 s r s (EQ. 31) ISL5586 The terms tR and tS represent the cadence. The ringing interval is tR and the silent interval is tS . A typical cadence ratio tR :tS is 1:2. The quiescent power of the device in the Ringing mode is defined in Equation 32. P r ( Q ) = VBH × I BHQ + VBL × I BLQ + VCC × I CCQ (EQ. 32) The total power during the ringing interval is the sum of the quiescent power and loading power: 2 VRMS P r = Pr ( Q ) + VBH × IAVG – -----------------------------------------Z +R REN (EQ. 33) LOOP For sinusoidal waveforms, the average current, IAVG, is defined in Equation 34. V RMS × 2 2 I AVG = --- -----------------------------------------π Z REN + R LOOP (EQ. 34) The silent interval power dissipation will be determined by the quiescent power of the selected operating mode. Forward Loop Back Mode Overview The Forward Loop Back mode (FLB, 101) provides test capability for the SLIC. An internal signal path is enabled allowing for both DC and AC verification by the connection of an internal 600 ohm resistor across Tip and Ring. This internal terminating resistor has a tolerance of ±10% at room temperature. The device is intended to operate from only the low battery during this mode. Architecture When the forward loop back mode is initiated internal switches connect a 600Ω load across the outputs of the Tip and Ring amplifiers as shown below. TIP TIP AMP 600Ω RING AMP RING FIGURE 9. FORWARD LOOP BACK INTERNAL TERMINATION DC Verification When the internal signal path is provided, DC current will flow from Tip to Ring. The DC current will force DET low, indicating the presence of loop current. In addition to verifying device functionality, toggling the logic output verifies the interface to the system controller. 4-12 AC Verification The entire AC loop of the device is active during the forward loop back mode. Therefore a 4-wire to 4-wire level test capability is provided. Depending on the transhybrid balance implementation, test coverage is provided by a one or two step process. System architectures which cannot disable the transhybrid function would require a two step process. The first step would be to send a test tone to the device while on hook and not in forward loop back mode. The return signal amplitude would be the test signal amplitude times the gain of the transhybrid amplifier. Since the device would not be terminated in the on hook mode, cancellation would not occur. The second step would be to program the device to FLB mode and resend the test tone. The return signal would be much lower in amplitude than the first step, indicating the device was active and the internal termination attenuated the return signal. System architectures which can disable the transhybrid function would achieve test coverage with a signal step. Once the transhybrid function is disabled the SLIC can be programmed to the FLB mode and the test tone can be sent. The return signal level is determined by the 4-wire to 4-wire gain of the SLIC times the amplitude of the signal sent. Tip Open/Ground Start Mode Overview The Tip Open mode (TO, 110) is intended for compatibility with PBX type interfaces. The device does not provide transmission capability in this mode which is intended for idle line conditions. Loop supervision is provided by the switch hook detector and either high or low battery operation is supported. Functionality During Tip Open operation, the Tip switch is disabled and the Ring switch is enabled. The minimum Tip impedance is 30kΩ. The only active path through the device will be through the Ring switch. In keeping with the MTU characteristics of the device, Ring will not exceed -56V when operating from the high battery. Though MTU does not apply to Tip Open, safety requirements are satisfied. ISL5586 Power Denial from the low battery if MTU compliance is not required, further reducing standby power dissipation. Overview The power denial mode (111) will shutdown the entire device except for the logic interface. Loop supervision is not provided. This mode may be used as a sleep mode or to shut down the SLIC in the presence of fault conditions. Switching between high and low battery will have no effect during power denial. Functionality During power denial, both the Tip and Ring amplifiers are disabled, presenting high impedances to the line. The voltages at both outputs are near ground. Thermal Shutdown In the event the safe die temperature is exceeded due to a fault condition the device will automatically shut down. The thermal shutdown threshold is approximately 170ºC.When the device cools to a temperature below the thermal threshold it will power back up automatically. If the fault persists the part will continue to go in and out of thermal shutdown which can be observed as an oscillation on Tip or Ring. Programming power denial will shut down the device and stop the self cooling cycle. High Battery Operation Other than ringing, the high battery should be used for standby conditions which must provide MTU compliance. During standby operation the power consumption is typically 85mW with -100V battery. If ringing requirements do not require full 100V operation, then a lower battery will result in lower standby power. High Voltage Decoupling The 100V rating of the SLIC dictates a capacitor of higher voltage rating be used for decoupling. Suggested decoupling values for all device pins are 0.1µF. If the protection scheme shown in Figure 15 is implemented the VBH decoupling capacitor should be increased to 0.47uF. This is done to minimize the turn-on time of the battrax device during negative surge transients. Standard surface mount ceramic capacitors are rated at 100V. For applications driven by low cost and small size, the decoupling scheme shown in Figure 10 could be implemented. 0.22µ 0.22µ Battery Switching Overview The integrated battery switch selects between high battery and low battery operation. The battery switch is controlled with the logic input BSEL. When BSEL is a logic high, the high battery (VBH) is selected. A logic low will enable the low battery (VBL). All operating modes of the SLIC will function from high or low battery, but it is strongly recommended Forward Loop Back be enabled only with the low battery. Functionality The logic control is independent of the operating mode decode. Independent logic control provides the most flexibility and will support all application configurations. When changing device operating states, battery switching should occur simultaneously with or prior to changing the operating mode. In most cases, this will minimize overall power dissipation and prevent glitches on the DET output. VBH ISL5586 FIGURE 10. ALTERNATE DECOUPLING SCHEME It is important to place an external diode between the VBH pin and the decoupling capacitor. Connecting the decoupling capacitor directly to the VBH pin will degrade the reliability of the device. Refer to Figure 15 for the proper arrangement. This applies to both single and stacked and decoupling schemes. If VBL and VBH are tied together the battery switch function is overridden. In this case the external diode is not needed and the decoupling capacitor may be attached directly to VBH pin. R TIP 20 - V2W + - IL 1:1 VTR RING 20 VZO + - All off hook operating conditions should use the low battery to minimize power dissipation. A typical low battery operating voltage for the SLIC is -24V, however this may be increased to support longer loop lengths or high loop current requirements. Standby conditions may also operate 4-13 TA - R Low Battery Operation RF + + The only external component required to support the battery switch is a diode in series with the VBH supply lead. In the event that high battery is removed, the diode allows the device to transition to low battery operation. VBL 4R 3R -IN 4R 4R 4R 8K - + RS VSA 3R FIGURE 11. IMPEDANCE SYNTHESIS CFB VFB ISL5586 Impedance and Gain Derivations The feedback mechanism for monitoring the AC portion of the loop current consists of two amplifiers, the sense amplifier (SA) and the transmit amplifier (TA). The AC feedback signal is used for impedance synthesis. A detailed model of the AC feed back loop is provided below Impedance Programming Resistor Derivation The gain of the transmit amplifier, set by RS , determines the programmed resistance of the SLIC. For complex line terminations RS is replaced with a complex network ZS (Figure 1). The capacitor CFB blocks the DC component of the loop current. Figure 11 illustrates the impedance synthesis loop. Note that the ground symbols shown in Figures 11 through 14 represent AC grounds, not necessarily actual DC potentials. The receiver block provides a single-ended to differential conversion with a voltage gain of 2. The voltage at Tip and Ring due to the feedback from VZO is shown in Equation 35. VTR = – 2 × VZO (EQ. 35) The Feedback amplifier (TA) provides the programmable gain required for impedance synthesis to the Receiver block. The output voltage (V ZO) is a function of the Sense Amplifier output voltage and the gain of the feedback amplifier, which can be substituted for VZO . RS VTR = – 2 × VSA × ------------ 8KΩ VZO feedback current. This current is fed to the Tip and Ring amplifiers and yields the relationship shown in Equation 40. V TR = – 2 × ( Vrx – V ZO ) (EQ. 40) The voltage V ZO, is a function of the sense amplifier output voltage V SA. RS V Z0 = – V SA × -----------8KΩ (EQ. 41) VSA can be expressed in terms of loop current as shown in Equation 42. 3 V SA = – IL × 2 × 20 × --4 (EQ. 42) Substituting Equation 42 into Equation 41 gives Equation 43. RS 3 V Z0 = – IL × 2 × 20 × --- × -----------4 8KΩ (EQ. 43) The VZ0 term in Equation 40 can now be replaced by Equation 43 yielding Equation 44. RS 3 V TR = – 2 × V rx – 2 IL × 2 × 20 × --- × ------------ 4 8KΩ (EQ. 44) A loop equation can be derived for the 2-wire side that replaces VTR as shown in the equation below. RS 3 V 2W + IL × 2R p = – 2V rx – IL 4 × 20 × --- × ------------ 4 8KΩ (EQ. 45) (EQ. 36) The sense amplifier shown in Figure 11 is configured as a 4 input differential amplifier with a gain of 3/4. The output voltage, VSA , is a function of the voltage across the Tip and Ring sense resistors (20Ω each) which can also be expressed in terms of loop current. V SA = – 2 × 20 × IL × ( 3 ⁄ 4 ) (EQ. 37) Substituting Equation 37 into Equation 35 and rearranging terms yields Z0 , the SLIC’s synthesized 2-wire impedance. Rearranging and solving for RS , Equation 39 shows the relationship between the impedance programming resistor and the programmed impedance. Rs Rs VTR 3 Z 0 = ----------- = 4 × 20 × IL × --- × ------------ = 60 × -----------4 8KΩ IL 8KΩ (EQ. 38) R S = 133.3 × Z 0 (EQ. 39) 4-WIRE TO 2-WIRE GAIN The 4-wire to 2-wire gain is defined as the gain from the differential receive input to the 2-wire load ZL. The gain is a function of the terminating impedance, synthesized impedance and protection resistors and is illustrated in Figure 12. The input current to the receiver block Irx4w comes from the difference of the VRX input current and the 4-14 Expressing IL in terms of V2W/ZL, rearranging, and solving for V2W yields the relationship between the 2-wire voltage and the output of the Receive amplifier. ZL V 2W = – 2Vrx × -------------------------------------- ZL + Z 0 + 2R P (EQ. 46) The differential voice input is configured for a gain of 1.4. The relationship between VRX and the voice input is shown in Equation 47. Substituting for VRX , the 4-2-Wire gain is shown in Equation 48. Note that the differential voice input is outside the impedance synthesis loop, so the gain of the receive amplifier has no effect on the SLIC’s impedance. V rx = 1.4 × ( V R XP – V RXM ) = 1.4 × VRX4W ZL V 2W -------------------- = –2.8 ------------------------------------------ V RX4W Z O + 2R P + Z L (EQ. 47) (EQ. 48) When the combination of the device source impedance and the protection resistors equal the terminating impedance, the receive gain equals 2.92dB and is inverted with respect to the 4-wire input. 2-WIRE TO 4-WIRE GAIN The 2-wire to 4-wire gain (G24) is defined as the gain from the Tip and Ring terminals (VTR) to the VTX differential output. ISL5586 Irx4w 200K ZL TIP IL 200K + 1.4R 1.4R Iz0 1:1 Vtr VZO 20 RP 20 - V2W RP + + VRX 200K + - RING R TA R - + VRXM VRXP RS 200K 3R -IN + - 4R CFB 4R 8K - 4R + 4R 3R VRX4W VFB VSA FIGURE 12. SCHEMATIC FOR 4-WIRE TO 2-WIRE GAIN DERIVATION Note that in Figure 13, VTR is referenced on the line side of the protection resistors. On the 2-wire side, solving for IL in terms of V IN gives Equation 49. Equations 50 and 51 show the relationship of VIN to the outputs of the Sense Amplifier (VSA) and the Feedback Amplifier (VZ0) respectively. V IN IL = -------------------------------------- Z + Z + 2R L P 0 (EQ. 49) V IN 3 V SA = – -------------------------------------- × 2 × 20 × --- 4 Z + Z + 2R P L 0 RS VIN 3 V Z0 = – -------------------------------------- × 2 × 20 × --- × ----------- 4 Z + Z + 2R 8KΩ L P 0 (EQ. 50) (EQ. 51) Simplifying Equation 51 in terms of Z0 gives the following equation. VIN Z0 V Z0 = – -------------------------------------- × ----- ZL + Z 0 + 2R P 2 (EQ. 52) The resulting differential output voltage VTX4W , is shown in Equation 53. V TX4W = VTXP – VTXM = VZ0 – ( – V ) = 2V Z0 Z0 (EQ. 53) Note that the gain from VZ0 to the differential output is outside the impedance synthesis loop and will have no effect on the SLIC’s programmed impedance. Substituting Equation 53 into Equation 52 and rearranging terms gives the gain from the 2-wire source (VIN ) to the differential output of the Transmit Amplifier. Z0 V TX4W -------------------- = – -------------------------------------- VI N ZL + Z0 + 2R P (EQ. 54) 4-15 If the combination of the protection resistors and the programmed impedance of the SLIC are equal to ZL the voltage V TR will be 1/2 VIN . The 2-wire to 4-wire gain is defined by Equation 55. V TX4W 2Z 0 -------------------- = – -------------------------------------- V TR ZL + Z 0 + 2R P (EQ. 55) 4-WIRE TO 4-WIRE GAIN The 4-Wire to 4-Wire gain is defined in Equation 56 and is illustrated in Figure 14.The first term is identical to Equation 48. V 2W V TX4W V TX4W -------------------- = -------------------- × -------------------V R X4W VRX4W V 2W (EQ. 56) The second term is derived in a similar manner as the 2-wire to 4-wire gain starting with Equation 57. V 2W = IL × Z L (EQ. 57) Moving around the loop from the 2-wire side to the 4-wire output we solve for VSA and VZO . 3 V 2W 3 V SA = – I L × 2 × 20 × --- = ------------ × 40 × --4 4 ZL (EQ. 58) V2W Z 0 RS V2W 3 V Z0 = ------------ × ------------ × 40 × --- = ------------ × -----4 ZL 8KΩ ZL 2 (EQ. 59) The relationship between VZ0 and the 4-wire output is shown in Equation 53. Substituting Equation 59 into Equation 53 yields Equation 60, the second term in Equation 56. Z0 V TX4W -------------------- = -----V2W ZL (EQ. 60) ISL5586 Equations 48 and 60 can be combined to re-write the 4-wire to 4-wire gain equation. ZL VTX4W Z0 -------------------- = – 2.8 ------------------------------------------ × -----V R X4W Z + 2R + Z O P L Z L Simplifying the above yields the 4-wire to 4-wire gain. Z0 VTX4W -------------------- = – 2.8 ------------------------------------------ V R X4W Z + 2R + Z O P L (EQ. 61) (EQ. 62) 1.4R R 200K 200K IL VIN + ZL RP1 20 VRX - 200K + V - TIP R 1.4R 1:1 TR RING VRXP VRXM - + 20 VZO + - TA - + RP2 200K 4R 3R -IN 4R 8K - + 3R VTX4W R - - VFB VSA + R CFB 4R 4R VTXP RS + VTXM FIGURE 13. SCHEMATIC FOR 2-WIRE TO 4-WIRE GAIN DERIVATION 1.4R 200K RP1 20 + V2W ZL 200K VRX - - 20 R VRXM - VZO + - RP2 VRXP 1:1 IL R R + VRX4W 1.4R 200K + T - + TA - + 200K 4R 3R 4R 8K - + - -IN 4R 4R VTXP RS VSA CFB VFB R R - + + 3R FIGURE 14. SCHEMATIC FOR 4-WIRE TO 4-WIRE GAIN DERIVATION 4-16 VTX4W VTXM ISL5586 Pin Descriptions PLCC SYMBOL DESCRIPTION 1 TIP 2 BGND 3 VBL Low Battery Supply Connection. 4 VBH High Battery Supply Connection. 5 BSEL 6 F2 TTL Mode Control Input - MSB. 7 F1 TTL Mode Control Input. 8 F0 TTL Mode Control Input - LSB. 9 DET Detector Output - This TTL output provides on-hook/off-hook status of the loop based upon the selected operating mode. The detected output will either be switch hook or ring trip. 10 VRSP Non-Inverting Ringing Signal Input - Analog input for driving 2-wire interface while in Ring Mode. 11 VRSM Inverting Ringing Signal Input - Analog input for driving 2-wire interface while in Ring Mode. 12 VTXP Transmit Output Voltage - AC couples to CODEC. 13 VTXM Transmit Output Voltage - AC couples to CODEC. 14 AGND Analog Ground Reference. This pin should be externally connected to BGND. 15 POL An External Capacitor on this pin sets the polarity reversal time. 16 VRXP Non-Inverting Analog Receive Voltage - 4-wire analog audio input voltage. 17 VRXM Inverting Analog Receive Voltage - 4-wire analog audio input voltage. 18 VZO Connection Terminal for impedance matching programming resistor 19 -IN Connection Terminal for high pass filter capacitor and impedance matching components. 20 VFB Connection Terminal for high pass filter capacitor and impedance matching components. 21 TL 22 VCC 23 CDCP DC Biasing Filter Capacitor - Positive Terminal. 24 C DCM DC Biasing Filter Capacitor - Negative Terminal. 25 RTD Ring Trip Filter Network Connection Terminal. 26 ILIM Loop Current Limit programming resistor connection terminal. 27 RD Switch Hook Detection threshold programming resistor connection terminal. 28 RING TIP Power Amplifier Output. Battery Ground - To be connected to zero potential. All loop current and longitudinal current flow from this ground. Internally separate from AGND and SGND but should be connected to the same potential as AGND & SGND. Selects between high and low battery, with a logic “1” selecting the high battery and logic “0” the low battery. Transient Current Limit Programming Resistor Connection Terminal. Positive Voltage Power Supply, +5V +/-5%. RING Power Amplifier Output. 4-17 1 B1100CC 2 3 RTL CPOL CDC RIL CSH RSH RRT CRT AGND TL POL CDCP DET F2 F1 F0 BSEL VFB -IN VZO VTXM VTXP VRSM VRSP CPS3 CFB RS RP CP 0.068 µF CT2 100K 100K CT1 CR2 CX3 CX2 CX1 0.068µF 20K 20K CR3 CR1 FIGURE 15. SINGLE CHANNEL INTERFACE BETWEEN ISL5586 AND BCM3352 BGND ISL5586 CDCM ILIM RD RTD RING NOTE: CPS1 should be located as close as possible to the B1100CC to minimize turn-on time. Less than 2 inches is recommended. F1250T RP2 VCC 2 VBL VRXP VBH TIP VRXM 3 RP1 CPS2 B1100CC 1 D1 BCM3352 RINGING_OUT(-) RINGING_OUT(+) CMLEVEL VTX0(-) VTX0(+) VRX0(-) VRX0(+) SLIC_CTRL0 F1250T SLIC_CTRL1 CPS1 SLIC_CTRL2 4-18 SLIC_CTRL3 Basic Application Circuit ISL5586 SLIC_CTRL4 ISL5586 TABLE 2. BASIC APPLICATION CIRCUIT COMPONENT LIST VALUE TOLERANCE RATING U1 - Ringing SLIC COMPONENT ISL5586 N/A N/A R TL 17.8kΩ 1% 0.1W R RT 22.1kΩ 1% 0.1W R SH 40kΩ 1% 0.1W R IL 71.5kΩ 1% 0.1W RS 66.5kΩ 1% 0.1W 0Ω 1% 0.1W R P1,RP2 CP C RT , CPOL , CSH Not Populated 20% 10V 0.47µF 20% 10V CFB 1.0µF 20% 10V C DC 4.7µF 20% 10V C PS1 0.47µF 20% >100V C PS2 , CPS3 0.1µF 20% 100V C T1, CT2 4.7µF C R1, CR2, CR3 3300pF C X1, C X2, CX3 150pF 1N400X Type with Breakdown > 100V. D1 D 2,D 3 1N4935 Type R P1 , RP2 Protection resistor values are application dependent and will be determined by protection requirements. Standard applications will use ≥ 49Ω per side. Design Parameters: Ring Trip Threshold = 81mAPEAK , Switch Hook Threshold = 15mA, Loop Current Limit = 24.6mA, Synthesize Device Impedance = (3*66.5kΩ)/400 = 498.8Ω , protection resistors = 50Ω, impedance across Tip and Ring terminals = 599Ω. Transient current limit = 100mA. Interface Diagram The figure 15 above shows the electrical interface between the ISL5586 and the BCM3352. Only a single channel is shown to simplify the diagram. This diagram only shows electrical interfaces and pertinent external components Receive Interface The receive interface of the BCM3352 is directly coupled to the ISL5586 differential receive input. External filter capacitors are provided to minimize noise from the BCM3352. The ISL5586 is designed with a 4-wire to 2-wire gain of +2.98dB. the ISL5586 to the CMLEVEL of the BCM3352. Lastly, the external network attenuates the signal levels coming from the ISL5586. The ISL5586 is designed with a 2-wire to 4wire gain of 0dB and a 4-wire to 4-wire gain of +2.98dB. Ringing Interface The ISL5586 only passes the ringing signal on VRSP, VRSM to Tip and ring only during the ringing mode. Therefore, a single ringing generator as supplied by the BCM3352 drives all four sets of ringing inputs in the Broadcom reference design. The ISL5586 is designed with a differential ringing gain of 100V/V. Passive Component Values Transmit Interface The differential transmit output of the ISL5586 is AC coupled to an external passive network. The external passive network accomplishes many tasks. First, it filters the noise which may exist on the CMLEVEL output of the BCM3352. Second, it biases the ground referenced output signals of 4-19 The passive component values in the Broadcom reference design may not be reflected by this document. Please refer to the Broadcom reference design documentation for the most recent schematic and COM information. ISL5586 Plastic Leaded Chip Carrier Packages (PLCC) 0.042 (1.07) 0.048 (1.22) PIN (1) IDENTIFIER 0.042 (1.07) 0.056 (1.42) 0.004 (0.10) C 0.025 (0.64) R 0.045 (1.14) 0.050 (1.27) TP C L D2/E2 C L E1 E D2/E2 VIEW “A” 0.020 (0.51) MIN A1 A D1 D N28.45 (JEDEC MS-018AB ISSUE A) 28 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE INCHES MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.165 0.180 4.20 4.57 - A1 0.090 0.120 2.29 3.04 - D 0.485 0.495 12.32 12.57 - D1 0.450 0.456 11.43 11.58 3 D2 0.191 0.219 4.86 5.56 4, 5 E 0.485 0.495 12.32 12.57 - E1 0.450 0.456 11.43 11.58 3 E2 0.191 0.219 4.86 5.56 4, 5 N 28 28 SEATING -C- PLANE 0.020 (0.51) MAX 3 PLCS 0.026 (0.66) 0.032 (0.81) 0.013 (0.33) 0.021 (0.53) 0.025 (0.64) MIN 0.045 (1.14) MIN 6 Rev. 2 11/97 VIEW “A” TYP. NOTES: 1. Controlling dimension: INCH. Converted millimeter dimensions are not necessarily exact. 2. Dimensions and tolerancing per ANSI Y14.5M-1982. 3. Dimensions D1 and E1 do not include mold protrusions. Allowable mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1 and E1 include mold mismatch and are measured at the extreme material condition at the body parting line. 4. To be measured at seating plane -C- contact point. 5. Centerline to be determined where center leads exit plastic body. 6. “N” is the number of terminal positions. All Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at website www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site www.intersil.com Sales Office Headquarters EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 NORTH AMERICA Intersil Corporation 2401 Palm Bay Rd. Palm Bay, FL 32905 TEL: (321) 724-7000 FAX: (321) 724-7240 4-20 ASIA Intersil Ltd. 8F-2, 96, Sec. 1, Chien-kuo North, Taipei, Taiwan 104 Republic of China TEL: 886-2-2515-8508 FAX: 886-2-2515-8369