Assembly Instructions www.vishay.com Vishay Semiconductors Assembly Instructions GENERAL SOLDERING INSTRUCTIONS Vishay leaded IR receiver modules can be mounted in any position. The wire leads may be bent provided the bend is not less than 1.5 mm from the bottom of the plastic package. During bending, no forces should be transmitted from the leads to the package (e.g. by spreading the leads). If the device is to be mounted near heat generating components, the resultant increase in ambient temperature should not exceed the specified ratings. Protection against overheating is essential when a device is being soldered. It is recommended, where possible, that the length of the leads between the solder joint and the package be left as long as possible. The maximum permissible soldering temperature for plastic encapsulated devices is governed by the maximum permissible heat that may be applied to the encapsulant rather than by the maximum permissible junction temperature of the die. The maximum temperatures and soldering times for iron and wave soldering are given in table 1. TABLE 1 - MAXIMUM SOLDERING TEMPERATURES IRON SOLDERING DISTANCE OF THE SOLDERING IRON POSITION FROM TEMPERATURE THE LOWER EDGE OF THE CASE WAVE SOLDERING SOLDERING DISTANCE OF MAXIMUM TEMPERATURE THE SOLDERING ALLOWABLE SEE POSITION FROM SOLDERING TEMPERATURE THE LOWER EDGE TIME PER PIN TIME PROFILES OF THE CASE MAXIMUM ALLOWABLE SOLDERING TIME IR receiver for through hole assembly without holder 350 °C 2 mm 3s 260 °C 1 mm 10 s IR receiver for through hole assembly with plastic holder 350 °C n.a. 3s 260 °C n.a. 5s IR receiver for through hole assembly with metal holder 350 °C n.a. 3s 260 °C n.a. 10 s IR receiver for SMD assembly 350 °C n.a. 3s SOLDERING METHODS - Layout density - Optical spectrum of the radiation source - Ratio of radiated to convected energy A temperature-time profile of the reflow process, suitable only for SMD devices, is given in figure 2. Reflow soldering is not approved for leaded IR receivers. There are several commonly used methods to solder devices on-to the substrate. Some of them are listed in the following: (a) Reflow Soldering Reflow soldering uses contact-free heating and derives the energy for soldering the assembly either from convection heating or from direct infrared radiation. The heating rate in an IR furnace depends on the absorption coefficients of the material surfaces and on the ratio of the components’ masses to their irradiated surfaces. The temperature of parts in an IR furnace cannot be determined in advance. Temperature measurements may be performed by measuring the temperature of a certain component while it is being transported through the furnace. The temperatures of small components tend to change more than that of the larger ones with which they are soldered together and may rise up to 280 °C. The parameters which influence the internal temperature of the component are the following: - Time in the oven and power of the oven - Mass of the component - Size of the component - Size of the printed circuit board - Absorption coefficient of the surfaces Rev. 1.6, 03-Jul-12 Soldering Instructions • Reflow soldering must be done according MSL4 within 72 h after opening the dry pack envelope while stored under a maximum temperature of 30 °C and a relative humidity of 60 %. • Set the furnace temperatures for pre-heating and heating in accordance with the reflow temperature profile as shown in the diagram. Exercise extreme care to keep the maximum temperature below 260 °C. The temperature shown in the profile means the temperature at the device surface. Since there is a temperature difference between the component and the circuit board, it should be verified that the temperature of the device is accurately being measured. • Handling after reflow should be done only after the work surface has been cooled off. 1 Document Number: 80068 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Assembly Instructions www.vishay.com Vishay Semiconductors (b) Wave soldering In wave soldering, one or more continuously replenished waves are generated in a bath of molten solder. The substrates to be soldered are moved in the opposite direction to that of the wave and across the wave’s crest. A temperature-time profile of the entire process is given in figure 3. Wave soldering is applicable for leaded IR receiver but not for the SMD packages. LEVEL CAUTION This bag contains MOISTURE-SENSITIVE DEVICES 4 1. Shelf life in sealed bag: 12 months at < 40 °C and < 90 % relative humidity (RH) 2. After this bag is opened, devices that will be subjected to soldering reflow or equivalent processing (peak package body temp. 260 °C) must be 2a. Mounted within 72 hours at factory condition of < 30 °C/60 % RH or 2b. Stored at < 5 % RH Note for parts mounted in plastic holders: the temperatures used for soldering exceed the melting temperature of plastic. A wave-soldering process not exceeding 5 s will therefore often deform the hooks used to attach the holder to the PCB, but will not affect the functionality of the holder. 3. Devices require baking befor mounting if: Humidity Indicator Card is > 10 % when read at 23 °C ± 5 °C or 2a. or 2b. are not met. 4. If baking is required, devices may be baked for: 192 hours at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen) or 96 hours at 60 °C ± 5 °C and < 5 % RH for all device containers or 24 hours at 125 °C ± 5 °C not suitable for reels or tubes Bag Seal Date: (If blank, see barcode label) (c) Soldering iron Note: Level and body temperature defined by EIA JEDEC Standard JSTD-020 The process of hand soldering with an iron cannot be carried out in a repeatable and controlled way. This process should not be considered for use in applications where reliability is important. There is no SMD classification for this process. 22522 Fig. 1 - Example of JSTD-020 Level 4 Label Temperature-Time Profiles 300 • Use a soldering iron of 25 W or less. Adjust the temperature of the soldering iron below 350 °C. 250 • Finish soldering within 3 s. 200 T (°C) Manual Soldering for SMD • Handle products only after the temperature has cooled off. max. 260 °C 245 °C 255 °C 240 °C 217 °C max. 20 s 150 max. 100 s max. 120 s 100 WARNING max. Ramp Up 3 °C/s 19800 • Storage temperature 10 °C to 30 °C 300 0 0 50 100 150 200 t (s) 250 300 max. 2 cycles allowed Fig. 2 - Infrared Reflow Soldering of Opto Devices (SMD package only) 5s • Storage humidity at 60 % RH maximum 250 Temperature (°C) If the devices are stored for more than 72 h under these conditions, the moisture content will then be too high for reliable reflow soldering. The devices can be reconditioned to recover to an acceptable moisture content by drying under the following conditions: 192 h at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen) or 24 h at 125 °C + 5 ° not suitable for reel or tubes or 96 h at 60 °C ± 5 °C and < 5 % RH for all device containers. An EIA JEDEC Standard JSTD-020 level 4 label is included on all dry packs. Rev. 1.6, 03-Jul-12 max. Ramp Down 6 °C/s 50 Opto devices are sensitive to damage due to moisture release if they are subjected to infrared reflow or a similar soldering process (e.g. wave soldering) without being properly dried. Dry box storage is recommended as soon as the aluminum shipping bag has been opened to prevent moisture absorption by the device. The following conditions should be observed if dry boxes are not available: Lead Temperature 235 °C to 260 °C fullline: typical dotted line: process limits second wave first wave 200 ca. 2 K/s ca. 200 K/s 150 forced 100 100 °C to 130 °C cooling 2 K/s 50 0 0 18188 ca. 5 K/s 0 5 100 150 200 250 Time (s) Fig. 3 - Wave Soldering of Opto Devices (leaded IR receiver package only) 2 Document Number: 80068 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000