TFBS4711 Vishay Semiconductors Serial Infrared Transceiver SIR, 115.2 kbit/s, 2.7 V to 5.5 V Operation Description The TFBS4711 is a low profile, Infrared Data Transceiver module. It supports IrDA data rates up to 115.2 kbit/s (SIR). The transceiver module consists of a PIN photodiode, an infrared emitter (IRED), and a low-power CMOS control IC to provide a total frontend solution in a single package. The device is designed for the low power IrDA standard with an extended range on-axis up to 1 m. The RXD pulse width is independent of the duration of TXD pulse and always stays at a fixed width thus making the device optimum for all standard SIR Encoder/ Decoder and interfaces. The Shut Down (SD) feature cuts current consumption to typically 10 nA. 20208 Features • Compliant with the latest IrDA physical layer low power specification ( 9.6 kbit/s to 115.2 kbit/s) • Small package: e4 H 1.9 mm x D 3.1 mm x L 6.0 mm • Industries smallest footprint - 6.0 mm length - 1.9 mm height • Typical Link distance on-axis up to 1 m • Battery & power management features: > Idle Current - 75 µA Typical > Shutdown current - 10 nA typical > Operates from 2.4 V - 5.5 V within specification over full temperature range from - 25 °C to + 85 °C • Remote Control - transmit distance up to 8 meters • Tri-State receiver output, floating in shutdown with a weak pull-up • Constant RXD output pulse width (2 µs typical) • Meets IrFM Fast Connection requirements • Split power supply, an independent, unregulated supply for IRED Anode and a well regulated supply for VCC • Directly interfaces with various Super I/O and Controller Devices and Encoder/ Decoder such as TOIM4232 • Lead (Pb)-free device • Qualified for lead (Pb)-free and Sn/Pb processing (MSL4) • Device in accordance with RoHS 2002/95/EC and WEEE 2002/96EC Applications • • • • • • • Ideal for battery operated devices PDAs Mobile phones Electronic wallet (IrFM) Notebook computers Digital still and video cameras Printers, fax machines, photocopiers, screen projectors • • • • • • • • Data loggers External infrared adapters (Dongles) Diagnostics systems Medical and industrial data collection devices Kiosks, POS, Point and Pay devices GPS Access control Field programming devices Parts Table Description Qty/Reel TFBS4711-TR1 Part Oriented in carrier tape for side view surface mounting 1000 pcs TFBS4711-TR3 Oriented in carrier tape for side view surface mounting 2500 pcs TFBS4711-TT1 Oriented in carrier tape for top view surface mounting 1000 pcs Document Number 82633 Rev. 1.9, 07-Nov-06 www.vishay.com 1 TFBS4711 Vishay Semiconductors Functional Block Diagram V CC Amp Comp RXD Driver IRED A Power SD Driver Control TXD 18280 GND Pinout Definitions: TFBS4711 weight 50 mg In the Vishay transceiver data sheets the following nomenclature is used for defining the IrDA operating modes: SIR: 2.4 kbit/s to 115.2 kbit/s, equivalent to the basic serial infrared standard with the physical layer version IrPhy 1.0 MIR: 576 kbit/s to 1152 kbit/s FIR: 4 Mbit/s VFIR: 16 Mbit/s MIR and FIR were implemented with IrPhy 1.1, followed by IrPhy PIN 1 1.2, adding the SIR Low Power Standard. 19428 Pin Description Pin Number Function Description 1 IRED Anode IRED Anode is directly connected to a power supply. The LED current can be decreased by adding a resistor in series between the power supply and IRED Anode. A separate unregulated power supply can be used at this pin. I/O Active 2 TXD This Input is used to turn on IRED transmitter when SD is low. An on-chip protection circuit disables the LED driver if the TXD pin is asserted for longer than 80 μs I HIGH 3 RXD Received Data Output, normally stays high but goes low for a fixed duration during received pulses. It is capable of driving a standard CMOS or TTL load. O LOW 4 SD Shutdown. Setting this pin active switches the device into shutdown mode I HIGH 5 VCC Supply Voltage 6 GND Ground Absolute Maximum Ratings Reference Point Ground, Pin 6 unless otherwise noted. Parameter Test Conditions Supply voltage range, all states Input current For all Pins except IRED Anode Pin Symbol Min VCC - 0.5 ICC Output sink current, RXD Average output current, pin 1 20 % duty cycle Repetitive pulsed output current < 90 µs, ton < 20 % IIRED (DC) IIRED (RP) Typ. Max Unit + 6.0 V 10.0 mA 25.0 mA 80 mA 400 mA VIREDA - 0.5 + 6.0 V VIN - 0.5 + 6.0 V Ambient temperature range (operating) Tamb - 30 + 85 °C Storage temperature range Tstg - 40 + 100 °C 260 °C IRED anode voltage, pin 1 Voltage at all inputs and outputs Vin > VCC is allowed Soldering temperature www.vishay.com 2 See Recommended Solder Profile Document Number 82633 Rev. 1.9, 07-Nov-06 TFBS4711 Vishay Semiconductors Eye safety information Symbol Min Typ. Virtual source size Parameter Method: (1-1/e) encircled energy Test Conditions d 1.3 1.5 Maximum intensity for class 1 IEC60825-1 or EN60825-1, edition Jan. 2001, operating below the absolute maximum ratings Ie Max Unit mm mW/sr *) (500)**) Electrical Characteristics Transceiver Tamb = 25 °C, VCC = VIREDA = 2.4 V to 5.5 V unless otherwise noted. Parameter Test Conditions Supply voltage range, all states Idle supply current at VCC1 (receive mode, no signal) Receive current Shutdown current Symbol Min VCC 2.4 Typ. Max Unit 5.5 V 130 µA SD = Low, Ee = 1 klx*), Tamb = - 25 °C to + 85 °C, VCC = 2.7 V to 5.5 V ICC1 SD = Low, Ee = 1 klx*), Tamb = 25 °C, VCC = 2.7 V to 5.5 V ICC1 75 µA VCC = 2.7 V ICC 80 µA SD = High, T = 25 °C, Ee = 0 klx ISD < 0.1 SD = High, T = 85 °C ISD TA Operating temperature range 2 µA 3 µA - 25 + 85 °C Output voltage low, RXD IOL = 1 mA VOL - 0.5 0.15 x VCC V Output voltage high, RXD IOH = - 500 µA VOH 0.8 x VCC VCC + 0.5 V IOH = - 250 µA VOH 0.9 x VCC VCC + 0.5 V RRXD 400 600 kΩ RXD to VCC impedance 500 VIL - 0.5 0.5 V VIH VCC - 0.5 6.0 V Input leakage current (TXD, SD) Vin = 0.9 x VCC IICH -2 Controlled pull down current SD, TXD = "0" or "1", 0 < Vin < 0.15 VCC IIRTx SD, TXD = "0" or "1" Vin > 0.7 VCC IIRTx Input voltage low: TXD, SD Input voltage high: TXD, SD Input capacitance Document Number 82633 Rev. 1.9, 07-Nov-06 CMOS level (0.5 x VCC typ, threshold level) CIN -1 0 +2 µA + 150 µA 1 µA 5 pF www.vishay.com 3 TFBS4711 Vishay Semiconductors Optoelectronic Characteristics Receiver Tamb = 25 °C, VCC = 2.4 V to 5.5 V unless otherwise noted Parameter Test Conditions Symbol Minimum irradiance Ee in angular range **) 9.6 kbit/s to 115.2 kbit/s λ = 850 nm - 900 nm, α = 0°, 15° Ee Maximum irradiance Ee in angular range***) λ = 850 nm - 900 nm Ee Maximum no detection irradiance Ee Min Typ. Max Unit 35 (3.5) 80 (8) mW/m2 5 (500) kW/m2 (mW/cm2) 4 (0.4) Rise time of output signal 10 % to 90 %, CL = 15 pF tr(RXD) Fall time of output signal 90 % to 10 %, CL = 15 pF tf(RXD) 10 RXD pulse width Input pulse width > 1.2 µs tPW 1.7 Leading edge jitter Standby /Shutdown delay, receiver startup time (µW/cm2) mW/m2 (µW/cm2) 10 100 ns 100 ns 3.0 µs Input Irradiance = 100 mW/m2, ≤ 115.2 kbit/s 250 ns After shutdown active or power-on 150 µs 150 µs 2.0 tL Latency **) IrDA sensitivity definition: Minimum Irradiance Ee In Angular Range, power per unit area. The receiver must meet the BER specification while the source is operating at the minimum intensity in angular range into the minimum half-angle range at the maximum Link Length. ***) Maximum Irradiance Ee In Angular Range, power per unit area. The optical delivered to the detector by a source operating at the maximum intensity in angular range at Minimum Link Length must not cause receiver overdrive distortion and possible related link errors. If placed at the Active Output Interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER). For more definitions see the document “Symbols and Terminology” on the Vishay Website (http://www.vishay.com/docs/82512/82512.pdf). Transmitter Tamb = 25 °C, VCC = 2.4 V to 5.5 V unless otherwise noted. Parameter Symbol Min IRED operating current Tamb = - 25 °C to + 85 °C Test Conditions ID 200 Transceiver operating peak supply current During pulsed IRED operation at ID = 300 mA ICC IRED leakage current TXD = 0 V, 0 < VCC < 5.5 V IIRED -1 1 µA Output radiant intensity α = 0°, TXD = High, SD = Low, R = 0 Ω, VLED = 2.4 V Ie 45 60 300 mW/sr α = 0°, 15°, TXD = High, SD = Low, R = 0 Ω, VLED = 2.4 V Ie 25 35 300 mW/sr VCC = 5.0 V, α = 0°, 15°, TXD = High or SD = High (Receiver is inactive as long as SD = High) Ie 0.04 mW/sr Output radiant intensity, angle of half intensity α λp Δλ Optical rise time tropt Optical fall time tfopt 10 Input pulse width 1.63 µs, 115.2 kbit/s topt 1.41 Input pulse width tTXD < 20 µs topt tTXD Input pulse width tTXD ≥ 20 µs topt www.vishay.com 4 Unit 300 400 mA mA ± 22 Peak-emission wavelength Optical overshoot Max 0.57 Spectral bandwidth Optical output pulse duration Typ. 880 ° 900 45 10 nm 100 1.63 nm ns 100 ns 2.23 µs tTXD + 0.15 µs 300 µs 25 % Document Number 82633 Rev. 1.9, 07-Nov-06 TFBS4711 Vishay Semiconductors Recommended Solder Profiles Manual Soldering Manual soldering is the standard method for lab use. However, for a production process it cannot be recommended because the risk of damage is highly dependent on the experience of the operator. Nevertheless, we added a chapter to the above mentioned application note, describing manual soldering and desoldering. Solder Profile for Sn/Pb soldering 260 10 s max. at 230 °C 240 °C max. 240 220 2...4 °C/s 200 180 140 120 s...180 s 120 90 s max. 100 80 2...4 °C/s 60 40 20 0 0 50 100 150 200 250 300 350 Time/s 19431 Figure 1. Recommended Solder Profile for Sn/Pb soldering Lead (Pb)-Free, Recommended Solder Profile The TFBS4711 is a lead (Pb)-free transceiver and qualified for lead (Pb)-free processing. For lead (Pb)-free solder paste like Sn(3.0-4.0)Ag(0.5-0.9)Cu, there are two standard reflow profiles: Ramp-SoakSpike (RSS) and Ramp-To-Spike (RTS). The RampSoak-Spike profile was developed primarily for reflow ovens heated by infrared radiation. With widespread use of forced convection reflow ovens the Ramp-ToSpike profile is used increasingly. Shown below in figure 2 is VISHAY's recommended profiles for use with the TFBS4711 transceivers. For more details please refer to Application note: SMD Assembly Instruction. Storage The storage and drying processes for all VISHAY transceivers (TFDUxxxx and TFBSxxx) are equivalent to MSL4. The data for the drying procedure is given on labels on the packing and also in the application note "Taping, Labeling, Storage and Packing" (http://www.vishay.com/docs/82601/82601.pdf). 280 T ≥ 255 °C for 20 s max 260 T peak = 260 °C max. 240 T ≥ 217 °C for 50 s max 220 200 180 Temperature/°C Temperature/°C 160 °C max. 160 160 20 s 140 120 90 s...120 s 100 50 s max. 2 °C...4 °C/s 80 60 2 °C...4 °C/s 40 20 0 0 50 100 150 200 250 300 350 19261 Time/s Figure 2. Solder Profile, RSS Recommendation Wave Soldering For TFDUxxxx and TFBSxxxx transceiver devices wave soldering is not recommended. Document Number 82633 Rev. 1.9, 07-Nov-06 www.vishay.com 5 TFBS4711 Vishay Semiconductors Recommended Circuit Diagram V CC IR Controller Vdd TFBS4711 Rled IREDA (1) TXD IRTX IRRX IRMODE R1= 47Ω (2) RXD (3) SD (4) Vcc (5) GND (6) GND C4 C2 C3 C1 4.7 μF 0.1μF 4.7 μF 0.1 μF 18510 Figure 3. Recommended Application Circuit Operated at a clean low impedance power supply the TFBS4711 needs no additional external components when the internal current control is used. For reducing the IRED drive current for low power applications with reduced range an additional resistor can be used to connect the IRED to the separate power supply. Depending on the entire system design and board layout, additional components may be required. (see figure 3). Worst-case conditions are test set-ups with long cables to power supplies. In such a case capacitors are necessary to compensate the effect of the cable inductance. In case of small applications as e.g. mobile phones where the power supply is close to the transceiver big capacitors are normally not necessary. The capacitor C1 is buffering the supply voltage and eliminates the inductance of the power supply line. This one should be a small ceramic version or other fast capacitor to guarantee the fast rise time of the IRED current. The resistor R1 is optional for reducing the IRED drive current. Vishay transceivers integrate a sensitive receiver and a built-in power driver. The combination of both needs a careful circuit board layout. The use of thin, long, resistive and inductive wiring should be avoided. The inputs (TXD, SD) and the output RXD should be directly (DC) coupled to the I/O circuit The capacitor C2 combined with the resistor R2 is the low pass filter for smoothing the supply voltage when noisy supply voltage is used or pick-up via the wiring is expected. R2, C1 and C2 are optional and dependent on the quality of the supply voltage VCCX and injected noise. An unstable power supply with dropping voltage during transmission may reduce the sensitivity (and transmission range) of the transceiver. The placement of these parts is critical. It is strongly recommended to position C2 as close as possible to the transceiver power supply pins. In any case, when connecting the described circuit to the power supply, low impedance wiring should be used. When extended wiring is used the inductance of the power supply can cause dynamically a voltage drop at VCC2. Often some power supplies are not to follow the fast current rise time. In that case another 10 µF capacitor at VCC2 will be helpful. The recommended components in table 1 are for test set-ups Keep in mind that basic RF - design rules for circuit design should be taken into account. Especially longer signal lines should not be used without termination. See e.g. "The Art of Electronics" Paul Horowitz, Winfield Hill, 1989, Cambridge University Press, ISBN: 0521370957 I/O and Software In the description, already different I/Os are mentioned. Different combinations are tested and the function verified with the special drivers available from the I/O suppliers. In special cases refer to the I/ O manual, the Vishay application notes, or contact directly Vishay Sales, Marketing or Application. Table 1. Recommended Application Circuit Components Component Recommended Value C1, C3 4.7 µF, 16 V 293D 475X9 016B C2, C4 0.1 µF, Ceramic VJ 1206 Y 104 J XXMT R1 47 Ω, 0.125 W CRCW-1206-47R0-F-RT1 www.vishay.com 6 Vishay Part Number Document Number 82633 Rev. 1.9, 07-Nov-06 TFBS4711 Vishay Semiconductors Table 2. Truth table SD TXD Optical input Irradiance RXD Transmitter Operation mW/m2 Inputs Inputs Inputs Outputs Outputs Remark high x x weakly pulled (500 Ω) to VCC1 0 Shutdown low high x high inactive Ie Transmitting low high > 300 µs x high inactive 0 Protection is active low low <4 high inactive 0 Ignoring low signals below the IrDA defined threshold for noise immunity low low > Min. Detection Threshold Irradiance < Max. Detection Threshold Irradiance low (active) 0 Response to an IrDA compliant optical input signal low low > Max. Detection Threshold Irradiance undefined 0 Overload conditions can cause unexpected outputs Package Dimensions in mm 19612 Figure 4. Package drawing of TFBS4711, tolerance of height is + 0.1mm, - 0.2 mm, other tolerances ± 0.2 mm Document Number 82633 Rev. 1.9, 07-Nov-06 www.vishay.com 7 TFBS4711 Vishay Semiconductors 19728 Figure 5. Recommended Solder Footprint Reel Dimensions Drawing-No.: 9.800-5090.01-4 Issue: 1; 29.11.05 14017 Tape Width W2 max. W3 min. W3 max. N mm mm mm mm mm mm mm 16 330 50 16.4 22.4 15.9 19.4 www.vishay.com 8 W1 min. A max. Document Number 82633 Rev. 1.9, 07-Nov-06 TFBS4711 Vishay Semiconductors Tape Dimensions in mm 19613 Document Number 82633 Rev. 1.9, 07-Nov-06 www.vishay.com 9 TFBS4711 Vishay Semiconductors Tape Dimensions in mm 20416 www.vishay.com 10 Document Number 82633 Rev. 1.9, 07-Nov-06 TFBS4711 Vishay Semiconductors Ozone Depleting Substances Policy Statement It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Document Number 82633 Rev. 1.9, 07-Nov-06 www.vishay.com 11 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1