LC5223D Datasheet

LC5223D and LC5226D
Off-Line DC / DC LED Driver ICs
Features and Benefits
Description
• Buck and buck-boost topology; selectable by peripheral
circuit structure
• Built-in fixed reference voltage limiting constant current
control; high precision regulator improves current
precision and simplifies setting of current level
• Sleep function, with latch mode; input high, 3 V or more,
on REF pin turns off IC output to LEDs
• Enable function; input low on REF pin toggles IC output
to LEDs
• High input voltage; up to 250 V or 450 V, depending on
product
• Output Current: 1.0 A
• Built-in constant current control; PWM method, output
current adjustable by the voltage input on the REF pin
• External adjustable PWM dimming control
• Protection features:
▫ Open protection (OPP) with latched shutdown; protects
IC when a free-wheeling diode is open
▫ Undervoltage lockout (UVLO)
▫ Overcurrent protection (OCP) with latched shutdown;
variable OCP threshold linked to REF pin voltage
▫ Thermal shutdown (TSD) with auto restart
LC5220 series is a non-isolating, simple and efficient LED
driver. The high voltage capability allows direct connection
to a wide range of supply voltages ranging from 25 to 400 V
(recommended). The LC5220 uses constant current mode
to drive LEDs. and buck and buck-boost voltage converters
can be configured.
A power MOSFET and controller IC are incorporated in
one package. Because few external parts are required, the
LC5220 is ideal for use in small-size LED light bulbs.
Various control requirements can be supported through the
REF pin, including peak current control, output on/off, and
sleep mode enable.
Moreover, there is a protection circuit for freewheeling
diode open, protection for a buck-boost voltage converter
open LED load, and a variable overcurrent protection function. These features improve safety for both the LC5220 and
the LEDs.
Applications
• LED lighting fixtures
• LED light bulbs
Packages
DIP8
Not to scale
Typical Application
VIN
AC
Input
CIN
REG VBB
R1
R2
C3
LC5220
C1
C2
D1
REF
PWM
CPWM
OUT
GND
VLED
LEDs
Line
Filter
L1
SEN
RS
An example of a buck voltage converter application circuit
LC5223D/26D-DS
SANKEN ELECTRIC CO., LTD.
August 8, 2012
LC5223D and
LC5226D
Off-Line DC / DC LED Driver ICs
Selection Guide
Part
Number
Package
LC5223D
Maximum Input
Voltage
VBB(max)
(V)
Output MOSFET
RDS(ON)(max)
(Ω)
250
1.3
450
3
DIP8
LC5226D
The polarity value for current specifies a sink as "+," and a source as “−,” referencing the IC.
Absolute Maximum Ratings Unless specifically noted, TA is 25°C
Characteristic
Main Power Supply Voltage
Output Breakdown Voltage
Notes
Voltage2
Pins
LC5223D
VBB
6–8
LC5226D
LC5223D
VO(BR)
5–4
LC5226D
IO
Output Current1
PWM Pin
Symbol
Pulse width ≥ 1 μs
Rating
Unit
250
V
450
V
250
V
450
V
5–4
1.0
A
VPWM
2–8
−0.3 to VZ
V
REF Pin Input Voltage2
VREF
3–8
−0.3 to VZ
V
SEN Pin Voltage
VSEN
4–8
−0.3 to 4.0
V
Pulse width ≥ 1 μs
―
1.73
W
Operating Ambient Temperature
TA
―
−40 to 105
°C
Storage Temperature
Tstg
―
−40 to 150
°C
Junction Temperature
TJ
―
150
°C
Allowable Power
Dissipation3,4
PD
On Sanken evaluation PCB
1The
output current value may be restricted based on duty cycle, ambient air temperature, or heat dissipation conditions. In any case, please be sure
to keep from exceeding the junction temperature, TJ.
2Zener diodes are built-in between the PWM pin and GND, and between the REF pin and GND. V is the breakdown voltage of these internal Zener
Z
diodes, and VZ = 6.3 V (typ). In addition, the maximum sink current is 1 mA.
3Allowable loss, P , is dependent on the circuit layout of the PCB to be used.
D
4Please refer to the Ambient Temperature versus Power Dissipation Curve.
Ambient Temperature versus Power Dissipation
2.0
On Sanken evaluation PCB
Maximum Allowable
Power Dissipation, PD (W)
PD = 1.73 W
1.5
R
DIP
θJ
-A
=
72
°C
/W
1.0
0.5
0
0
25
50
75
100
125
150
Ambient Temperature, TA (°C)
LC5223D/26D-DS
SANKEN ELECTRIC CO., LTD.
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August 8, 2012
LC5223D and
LC5226D
Off-Line DC / DC LED Driver ICs
Recommended Operating Conditions
Characteristic
Symbol
Test Conditions
LC5223D
Power Supply Voltage
VBB
LC5226D
Average Output Current
REF Pin Input Voltage
Case Temperature
Minimum input voltage depends
on LED output voltage and
converter topology.
IO(AVG)
VREF
TC
Normal operation
Measured at the center of the branded side,
TJ ≤ 150°C.
Pins*
Min.
Max.
Unit
25
200
V
25
400
V
5–4
(5, 6 – 4)
―
0.8
A
3–8
0.2
2.5
V
–
―
105
°C
6–8
(7 – 8)
Note: Recommended Operating Conditions means the operation conditions to maintain normal functions shown in the Electrical Characteristics table.
*Where the pin numbers differ between the DIP8 and the SOP8 packages, the SOP8 pin number is written in parentheses.
LC5223D/26D-DS
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August 8, 2012
LC5223D and
LC5226D
Off-Line DC / DC LED Driver ICs
Electrical Characteristics Unless specifically noted, TA is 25°C, VBB = 140 V
Characteristic
Power Supply Current
Output MOSFET Breakdown Voltage
Output MOSFET On-Resistance
Body Diode Forward Voltage
Symbol
Pins
Min.
Typ.
Max.
Unit
IBBS
Output off
6–8
―
1
1.5
mA
IBB
Normal operation
6–8
―
2.5
4.0
mA
250
―
―
V
V(BR)DSS
RDS(ON)
Vf
Test Conditions
LC5223D
LC5226D
ID = 1 mA
LC5223D
ID = 1.0 A
LC5226D
ID = 1.0 A
LC5223D
If = 1.0 A
LC5226D
If = 1.0 A
5–4
5–4
4−5
450
―
―
V
―
0.7
1.3
Ω
―
1.7
3
Ω
―
0.75
1.2
V
―
0.88
1.0
V
UVLO Threshold (Turn on)
VUVLO(ON)
VBB pin voltage
6–8
―
14
―
V
UVLO Threshold (Turn off)
VUVLO(OFF)
VBB pin voltage
6–8
―
12
―
V
REG Pin Output Voltage
VREG
IREG = 0 mA
1−8
9.6
10
10.4
V
REG Pin Output Current
IREG
VREG = 9 V
1−8
−2
―
―
mA
Enable Output Threshold Voltage
VENB
REF pin voltage
3−8
―
0.15
0.19
V
Sleep Mode Threshold Voltage
VSLP
REF pin voltage
3−8
2.85
3.0
―
V
REF Pin Current
IREF
3−8
−10
―
10
μA
4−8
0.4 × VREF
− 0.03
0.4 × VREF
0.4 × VREF
+ 0.03
V
0.77
0.8
0.83
V
―
0.4 × VREF
+ 0.7
―
V
―
1.5
―
V
Current Control Detection Voltage1
VSEN
VREF = 0.2 to 2.0 V
VREF = 2.0 to 3.0 V
OCP Detection Voltage1
VOCP
VREF = 0.2 to 2.0 V
4−8
VREF = 2.0 to 3.0 V
SEN Pin Current
ISEN
4−8
−10
―
10
μA
PWM Pin Low Voltage
VPWM(L)
2−8
―
2
―
V
PWM Pin High Voltage
VPWM(H)
2−8
―
3
―
V
IPWM
2−8
―
−20
―
μA
PWM Blanking Time
tBLK(P)
―
―
0.3
―
μs
OCP Blanking Time
tBLK(O)
―
―
0.2
―
μs
2−8
―
―
200
kHz
PWM Pin Output Current
PWM Operation Frequency
fPWM
Duty cycle = 50%
PWM Off Time
toff
CPWM = 100 pF
―
―
17
―
μs
Output MOSFET Rise Time
tr
IO = 0.4 A
5–4
―
25
―
ns
tf
IO = 0.4 A
Output MOSFET Fall Time
5–4
―
50
―
ns
Thermal Shutdown Threshold2
TTSD
―
―
150
―
°C
Thermal Shutdown Hysteresis2
TTSD(HYS)
―
―
55
―
°C
1The
REF pin has different functions, depending on the voltage. Please refer to REF Pin Voltage Characteristics section.
2Chip temperature of control IC, T .
J
LC5223D/26D-DS
SANKEN ELECTRIC CO., LTD.
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August 8, 2012
LC5223D and
LC5226D
Off-Line DC / DC LED Driver ICs
Internal Reference Voltage (V)
REF Pin Voltage Characteristics
OCP_REF
_OS
VOCR
+
VCCR
R=
C
VO
0.8
VOCR_OS
CC_REF
.4
×0
Ref
V
=
CR
VC
0
0
1.0
0.15
2.0
3.0
REF Pin Input VoltageVREF (V)
On
(Enable)
Out
Latch
(Sleep)
Off (Disable)
Function
LC5223D/26D-DS
Conditions
Internal PWM reference
voltage, VCCR
• When VREF < 2 V, VCCR = 0.4 × VREF (V) (VCCR is proportional to VREF)
• When VREF > 2 V, VCCR = 0.8 V
OCP reference voltage, VOCR
VOCR is offset from VCCR by VOCP_OS ; VOCR_OS = 0.7 V (typ); VOCR has
negative temperature characteristics
Enable function
Enable mode is entered when VREF > VENB ; Enable mode is not latched, and
the IC stops operating when VREF falls below VENB; VENB = 0.15 V (typ)
Sleep function
Sleep mode is entered when VREF > VSLP , turning off the output;
VENB = 3.0 V (typ); Sleep mode is latched, and the latch is released when VBB
falls below VUVLO(OFF); VUVLO(OFF) = 12 V (typ)
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August 8, 2012
LC5223D and
LC5226D
Off-Line DC / DC LED Driver ICs
Functional Block Diagram
VBB
6
LC5220
Control Part
TSD
Band Gap
Reference
PWM 2
PWM _IN
CC
REF 3
Reference
Control
CC_REF
Current
Detect
OCP_REF
OC
SEN_IN
REG
5
OUT
4
SEN
UVLO
PWM
Control
OCP
Blanking
1
Regulator
UVLO
TSD
PWM
OCP
OPP
SLEEP
ENABLE
Output
Control
Logic
OPP
Logic
Gate Driver
8
GND
Pin List Table
Pin-out Diagram
REG 1
Name
Number
REG
1
Internal regulator supply, provides current to internal and external circuits;
connect a 0.1 μF bypass capacitor between this pin and GND.
PWM
2
Input for PWM control: to use internal PWM, connect a capacitor for setting
off-time; to use external PWM, connect to PWM signal source.
REF
3
Reference voltage input: sets peak output current of OUT pin (internal power
MOSFET) for internal PWM control, enables toggling output of OUT pin
(Enable function), and enables latched shutdown of output (Sleep function)
SEN
4
Output current detection: detects peak output current for internal PWM control,
and detects overcurrent for OCP; connect to current detection resistor.
OUT
5
Drain of internal power MOSFET.
8 GND
PWM 2
REF 3
6 VBB
SEN 4
5 OUT
LC5223D/26D-DS
Function
VBB
6
Supply voltage, provides power to internal circuits through internal regulator.
GND
8
Ground pin.
―
7
Pin removed to increase creepage distance between high voltage pin and low
voltage pin.
SANKEN ELECTRIC CO., LTD.
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August 8, 2012
LC5223D and
LC5226D
Off-Line DC / DC LED Driver ICs
Reference Components List of a Buck Configuration Circuit
(refer to Typical Application diagram); Input voltage: 100 VAC, LED output voltage: 15 V,
LED peak output current : 0.3 A
Name
Type
Value
Description
LED
LED
―
L1
Inductor
1 mH / 1 A
User-defined
D1
Fast recovery
rectifier diode
RD2A
CIN
Capacitor
Up to 4.7 μF / 450 V
C1
Capacitor
0.1 μF / 25 V
Internal regulator stabilizing capacitor
C2
Capacitor
1000 pF (to 0.1 μF) / 25 V
REF pin voltage stabilizing capacitor
Choke coil for smoothing current
Free-wheeling diode for recirculation
Main supply source filtering capacitor; 1 nF or higher can be used
C3
Capacitor
0.1 μF / 250 V
Smoothing capacitor for reducing LED ripple current (Optional)
CPWM
Capacitor
100 pF / 25 V
PWM off-time setting capacitor (internal PWM control)
R1
Resistor
620 kΩ / 1/8 W
Resistor for setting peak output current on OUT pin
R2
Resistor
51 kΩ / 1/8 W
Resistor for setting peak output current on OUT pin
RS
Resistor
1.0 Ω / 1 W
Resistor for output current detection
Note: Because no specific application or noise factor is considered in the typical application circuit diagrammed, it is required that
the user takes into consideration such issues during designing. Moreover, the above values are only reference examples. It is
required to change components according to the LED load and other conditions which are actually used.
LC5223D/26D-DS
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August 8, 2012
LC5223D and
LC5226D
Off-Line DC / DC LED Driver ICs
Package Outline Drawing
9.4 ±0.3
5
1
4
6.5 ±0.2
8
1.0 +0.3
-0.05
+0.3
1.52
-0.05
3.3 ±0.2
7.5 ±0.5
4.2 ±0.3
3.4 ±0.1
(7.6 TYP)
0.2 5 + 0.
- 0.01
5
0~15° 0~15°
2.54 TYP
0.89 TYP
0.5 ±0.1
Unit: mm
8
LC522x
SK YMD D
XXXX
1
Part Number
Lot Number
Y is the last digit of the year (0 to 9)
M is the month (1 to 9, O, N, or D)
D is a period of days (1 to 3):
1 – 1st to 10th
2 – 11th to 20th
3 – 21st to 31st
Sanken Control Number
Pb-free. Device composition compliant
with the RoHS directive.
LC5223D/26D-DS
SANKEN ELECTRIC CO., LTD.
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August 8, 2012
LC5223D and
LC5226D
Off-Line DC / DC LED Driver ICs
Because reliability can be affected adversely by improper storage
environments and handling methods, please observe the following
cautions.
Cautions for Storage
•
Ensure that storage conditions comply with the standard
temperature (5°C to 35°C) and the standard relative humidity
(around 40% to 75%); avoid storage locations that experience
extreme changes in temperature or humidity.
•
Avoid locations where dust or harmful gases are present and
avoid direct sunlight.
•
Reinspect for rust on leads and solderability of the products that
have been stored for a long time.
Cautions for Testing and Handling
When tests are carried out during inspection testing and other
standard test periods, protect the products from power surges
from the testing device, shorts between the product pins, and
wrong connections. Ensure all test parameters are within the
ratings specified by Sanken for the products.
Remarks About Using Silicone Grease with a Heatsink
• When silicone grease is used in mounting the products on a
heatsink, it shall be applied evenly and thinly. If more silicone
grease than required is applied, it may produce excess stress.
• Volatile-type silicone greases may crack after long periods of
time, resulting in reduced heat radiation effect. Silicone greases
with low consistency (hard grease) may cause cracks in the mold
resin when screwing the products to a heatsink.
Our recommended silicone greases for heat radiation purposes,
which will not cause any adverse effect on the product life, are
indicated below:
Type
Suppliers
G746
Shin-Etsu Chemical Co., Ltd.
YG6260
Momentive Performance Materials Inc.
SC102
Dow Corning Toray Co., Ltd.
LC5223D/26D-DS
Soldering
•
When soldering the products, please be sure to minimize the
working time, within the following limits:
260±5°C 10±1 s
(Flow, 2 times)
380±10°C 3.5±0.5 s (Soldering iron, 1 time)
• Soldering should be at a distance of at least 1.5 mm from the
body of the products.
Electrostatic Discharge
•
When handling the products, the operator must be grounded.
Grounded wrist straps worn should have at least 1 MΩ of
resistance from the operator to ground to prevent shock hazard,
and it should be placed near the operator.
•
Workbenches where the products are handled should be
grounded and be provided with conductive table and floor mats.
•
When using measuring equipment such as a curve tracer, the
equipment should be grounded.
•
When soldering the products, the head of soldering irons or the
solder bath must be grounded in order to prevent leak voltages
generated by them from being applied to the products.
•
The products should always be stored and transported in Sanken
shipping containers or conductive containers, or be wrapped in
aluminum foil.
SANKEN ELECTRIC CO., LTD.
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August 8, 2012
LC5223D and
LC5226D
Off-Line DC / DC LED Driver ICs
• The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the
latest revision of the document before use.
• Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or
any other rights of Sanken or any third party which may result from its use.
• Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures
including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device
failure or malfunction.
• Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.).
When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and
its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever
long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales
representative to discuss, prior to the use of the products herein.
The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required
(aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited.
• In the case that you use Sanken products or design your products by using Sanken products, the reliability largely depends on the
degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the
load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general,
derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such
as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. For these stresses,
instantaneous values, maximum values and minimum values must be taken into consideration.
In addition, it should be noted that since power devices or IC's including power devices have large self-heating value, the degree of
derating of junction temperature affects the reliability significantly.
• When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically
or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance
and proceed therewith at your own responsibility.
• Anti radioactive ray design is not considered for the products listed herein.
• Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken's distribution network.
• The contents in this document must not be transcribed or copied without Sanken's written consent.
LC5223D/26D-DS
SANKEN ELECTRIC CO., LTD.
10
August 8, 2012