HI5714 8-Bit, 40/60/75/80 MSPS A/D Converter January 1998 Features Description • Sampling Rate . . . . . . . . . . . . . . . . . . 40/60/75/80 MSPS The HI5714 is a high precision, monolithic, 8-bit, Analog-toDigital Converter fabricated in Intersil’ advanced HBC10 BiCMOS process. • Low Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .325mW • 7.65 ENOB at 4.43MHz The HI5714 is optimized for a wide range of applications such as ultrasound imaging, mass storage, instrumentation, and video digitizing, where accuracy and low power consumption are essential. The HI5714 is offered in 40 MSPS, 60 MSPS, and 75 MSPS sample rates. • Overflow/Underflow Three-State TTL Output • Operates with Low Level AC Clock • Very Low Analog Input Capacitance • TTL Compatible I/O The HI5714 delivers ±0.4 LSB differential nonlinearity while consuming only 325mW power (Typical) at 75 MSPS. The digital inputs and outputs are TTL compatible, as well as allowing for a low-level sine wave clock input. • Pin-Compatible to Philips TDA8714 Ordering Information • No Buffer Amplifier Required • No Sample and Hold Required PART NUMBER TEMP. RANGE (oC) SAMPLING FREQUENCY (MHz) PKG. NO. • QAM Demodulator HI5714/4CB 0 to 70 24 Ld SOIC 40 M24.3 • Digital Cable Setup Box HI5714/6CB 0 to 70 24 Ld SOIC 60 M24.3 • Tape Drive/Mass Storage HI5714/7CB 0 to 70 24 Ld SOIC 75 M24.3 • Medical Ultrasound Imaging HI5714/8CB 0 to 70 24 Ld SOIC 80 M24.3 • Communication Systems HI5714EVAL 25 Applications • Video Digitizing PACKAGE Evaluation Board Pinout HI5714 (SOIC) TOP VIEW D1 1 24 D2 D0 2 23 D3 NC 3 22 OE 21 VCCO2 VRB 4 NC 5 20 OGND AGND 6 19 VCCO1 18 VCCD VCCA 7 VIN 8 17 DGND VRT 9 16 CLK NC 10 15 D4 O/UF 11 14 D5 D7 12 13 D6 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999 1 File Number 3973.4 HI5714 Functional Block Diagram CLK VCCA 7 VCCD 16 OE 18 22 CLOCK DRIVER 9 VRT VIN 8 VRB ANALOG TO DIGITAL CONVERTER TTL OUTPUTS LATCHES 4 OGND 20 OVERFLOW/UNDERFLOW LATCH 6 17 AGND DGND 12 D7 13 D6 14 15 D5 23 D3 24 D2 1 D1 2 D0 19 VCCO1 21 VCCO2 11 O/UF D4 TTL OUTPUT Typical Application Schematic +5VA 16 CLOCK + 3.6V - 0.1 + 9 4 1.3V - 0.1 22 D0 CLK D1 D2 VRT D3 D4 VRB D5 D6 OE HI5714 VIN 8 + - +5VA DGND AGND 7 1nF 0.1µF 5 6 VIN VCCA NC AGND 2 1 24 23 15 14 13 12 D7 11 O/UF 19 VCCO 21 VCCO 18 VCCD 1nF +5VD 0.1µF 20 OGND 3 NC 17 DGND 10 NC BNC 1nF and 0.1µF CAPS are placed as close to part as possible. NOTES: 1. Pin 5 should be connected to AGND and pins 3 and 10 to DGND to reduce noise coupling into the device. 2. Analog and Digital supplies should be separated and decoupled to reduce digital noise coupling into the analog supply. 2 HI5714 Absolute Maximum Ratings TA = 25oC Thermal Information Thermal Resistance (Typical, Note 1) θJA (oC/W) SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) VCCA, VCCD, VCCO . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6.0V VCCA - VCCD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3V VCCO - VCCD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3V VCCA - VCCO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3V VIN , VCLK , VRT , VRB , OE . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6.0V IOUT , Digital Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10mA Input Current, All Pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1mA Digital I/O Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . OGND to VCCO Operating Conditions Temperature Range HI5714CB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. θJA is measured with the component mounted on an evaluation PC board in free air. Electrical Specifications VCCA = VCCD = VCCO = +5V; VRB = 1.3V; VRT = 3.6V; TA = 25oC, Unless Otherwise Specified PARAMETER TEST CONDITION MIN TYP MAX UNITS Logic Input Voltage Low, VIL 0 - 0.8 V Logic Input Voltage High, VIH 2.0 - VCCD V CLOCK (Referenced to DGND) (Note 1) Logic Input Current Low, IIL VCLK = 0.4V -400 - - µA Logic Input Current High, IIH VCLK = 2.7V - - 300 µA Input Impedance, ZIN fCLK = 75MHz (Note 8) - 2 - kΩ Input Capacitance, CIN fCLK = 75MHz (Note 8) - 4.5 - pF Logic Input Voltage Low, VIL 0 - 0.8 V Logic Input Voltage High, VIH 2.0 - VCCD V OE (Referenced to DGND) Logic Input Current Low, IIL VIL = 0.4V -400 - - µA Logic Input Current High, IIH VIH = 2.7V - - 20 µA Input Current Low, IIL VIN = 1.2V - 0 - µA Input Current High, IIH VIN = 3.5V - 100 180 µA Input Impedance, ZIN fIN = 4.43MHz - 10 - kΩ Input Capacitance, CIN fIN = 4.43MHz - 14 - pF Bottom Reference Range, VRB 1.2 1.3 1.6 V Top Reference Range, VRT 3.5 3.6 3.9 V Reference Range, VREF (VRT - VRB) 1.9 2.3 2.7 V Reference Current, IREF - 10 - mA Reference Ladder Resistance, RLAD - 240 - Ω RLADTC - 0.24 - Ω/oC - 255 - mV VIN (Referenced to AGND) REFERENCE INPUT Bottom Offset Voltage, VOB (Note 4) 3 HI5714 Electrical Specifications VCCA = VCCD = VCCO = +5V; VRB = 1.3V; VRT = 3.6V; TA = 25oC, Unless Otherwise Specified (Continued) PARAMETER TEST CONDITION MIN TYP MAX UNITS VOBTC (Note 4) - 136 - µV/oC Top Offset Voltage, VOT (Note 4) - -300 - mV VOTTC (Note 4) - 480 - µV/oC 0 - 0.4 V DIGITAL OUTPUTS (D0 to D7 and O/UF Referenced to OGND) Logic Output Voltage Low, VOL IO = 1mA Logic Output Voltage High, VOH IO = -0.4mA 2.7 - VCCO V Output Leakage Current, ID 0.4V < VOUT < VCCO -20 - +20 µA HI5714/8 80 - - MHz HI5714/7 75 - - MHz HI5714/6 60 - - MHz HI5714/4 40 - - MHz Clock Pulse Width High, tCPH 6 - - ns Clock Pulse Width Low, tCPL 6 - - ns SWITCHING CHARACTERISTICS (Notes 3, 4) See Figure 9 Sample Rate, fCLK ANALOG SIGNAL PROCESSING (fCLK = 40MHz) Differential Gain, DG (Notes 5, 8) - 1.0 - % Differential Phase, DP (Notes 5, 8) - 0.05 - degree Second Harmonic, H2 fIN = 4.43MHz - -63 - dB Third Harmonic, H3 fIN = 4.43MHz - -65 - dB Total Harmonic Distortion, THD fIN = 4.43MHz - -59 - dB Spurious Free Dynamic Range, SFDR fIN = 4.43MHz - 62 - dB - 18 - MHz HARMONICS (fCLK = 75MHz) Analog Input Bandwidth (-3dB) TRANSFER FUNCTION Differential Linearity Error, DNL (Note 6) - ±0.4 - LSB Integral Linearity Error, INL (Note 6) - ±0.75 - LSB fIN = 4.43MHz - 7.65 - Bits fIN = 7.5MHz - 7.5 - Bits fIN = 4.43MHz - 7.65 - Bits fIN = 7.5MHz - 7.5 - Bits fIN = 4.43MHz - 7.4 - Bits fIN = 7.5MHz - 7.15 - Bits fIN = 10MHz - 6.8 - Bits EFFECTIVE NUMBER OF BITS ENOB HI5714/4 (fCLK = 40MHz) HI5714/6 (fCLK = 60MHz) HI5714/7 (fCLK = 75MHz) 4 HI5714 Electrical Specifications VCCA = VCCD = VCCO = +5V; VRB = 1.3V; VRT = 3.6V; TA = 25oC, Unless Otherwise Specified (Continued) PARAMETER MIN TYP MAX UNITS fIN = 4.43MHz - 7.3 - Bits fIN = 7.5MHz - 7.0 - Bits fIN = 10MHz - 6.64 - Bits - 10-11 - Times/ Sample Sampling Delay, tSD - - 2 ns Output Hold Time, tHD 5 - - ns HI5714/8 (fCLK = 80MHz) Bit Error Rate, BER TEST CONDITION (Note 7) TIMING (fCLK = 75MHz) See Figures 1, 2 Output Delay Time, tD HI5714/4/6/7 - 10 13 ns Output Delay Time, tD HI5714/8 - 10 12.25 ns Output Enable Delay, tPZH Enable to High - 14.6 - ns Output Enable Delay, tPZL Enable to Low - 17.8 - ns Output Disable Delay, tPHZ Disable from High - 5.3 - ns Output Disable Delay, tPLZ Disable from Low - 6.7 - ns - 50 - ps Analog Power Supply Range, VCCA 4.75 5.0 5.25 V Digital Power Supply Range, VCCD 4.75 5.0 5.25 V Output Power Supply Range, VCCO 4.75 5.0 5.25 V Total Supply Current - 65 75 mA Supply Current, ICCA - 30 - mA Supply Current, ICCD - 26 - mA Supply Current, ICCO - 9 - mA Power Dissipation - 325 375 mW Aperture Jitter, tAJ POWER SUPPLY CHARACTERISTICS NOTES: 1. Dissipation rating assumes device is mounted with all leads soldered to printed circuit board. 2. The supply voltages VCCA and VCCD may have any value between -0.3V and +6V as long as the difference VCCA - VCCD lies between -0.3V and +0.3V. 3. In addition to a good layout of the digital and analog ground, it is recommended that the rise and fall times of the clock not be less than 1ns. 4. Analog input voltages producing code 00 up to and including FF. VOB (Bottom Offset Voltage) is the difference between the analog input which produces data equal to 00 and the Bottom Reference Voltage (VRB). VOBTC (Bottom Offset Voltage Temperature Coefficient) is the variation of VOB with temperature. VOT (Top Offset Voltage) is the difference between the Top Reference Voltage (VRT) and the analog input which produces data output equal to FF. VOTTC (Top Offset Voltage Temperature Coefficient) is the variation of VOT with temperature. 5. Input is standard 5 step video test signal. A 12-bit R reconstruct DAC and VM700 are used for measurement. 6. Full scale sinewave, fIN = 4.43MHz. 7. fCLK = 75MHz, fIN = 4.43MHz, VIN = ±8 LSB at code 128, 50% Clock duty cycle. 8. Parameter is guaranteed by design, not production tested. 5 HI5714 Timing Waveforms tCPL tCPH CLOCK INPUT 1.4V SAMPLE N SAMPLE N + 1 SAMPLE N + 2 ANALOG INPUT tDS tHD DATA (D0-D7) DN - 2 OUTPUTS DN - 1 DN 2.4V 1.4V 0.4V DN + 1 tD FIGURE 1. INPUT-TO-OUTPUT TIMING 4V OE INPUT 1.4V 1.4V 0V tPLZ tPZL 3.5V DIGITAL OUTPUT VOL tPHZ tPZH 0.3V 0.3V VOH DIGITAL OUTPUT 0V FIGURE 2. THREE-STATE TIMING CIRCUIT 6 HI5714 Typical Performance Curves 0 70 -0.1 -0.2 60 -0.3 -0.4 LSB mA 50 40 -0.5 -0.6 30 -0.7 20 -0.8 -0.9 10 0 -40 -30 -20 -10 0 10 20 30 40 TEMPERATURE (oC) 50 60 70 -1.0 -40 -30 -20 -10 80 FIGURE 3. TOTAL ICC vs TEMPERATURE 0 10 20 30 40 50 TEMPERATURE (oC) 60 70 80 90 FIGURE 4. INTEGRAL LINEARITY ERROR vs TEMPERATURE 0 280 -0.1 270 -0.2 260 -0.3 250 OHMS LSB -0.4 -0.5 -0.6 240 230 -0.7 220 -0.8 210 -0.9 -1.0 -40 -30 -20 -10 0 10 20 30 40 50 60 70 200 -40 -30 -20 -10 80 90 0 TEMPERATURE (oC) 10 20 30 40 50 60 70 80 TEMPERATURE (oC) FIGURE 5. DIFFERENTIAL LINEARITY ERROR vs TEMPERATURE FIGURE 6. REFERENCE RESISTANCE vs TEMPERATURE 260 -220 -230 250 -240 -250 240 mV mV -260 -270 230 -280 -290 220 -300 -310 -320 -40 -30 -20 -10 0 10 20 30 40 50 60 70 210 -40 -30 -20 -10 80 0 10 20 30 40 50 TEMPERATURE (oC) TEMPERATURE (oC) FIGURE 7. VOT vs TEMPERATURE FIGURE 8. VOB vs TEMPERATURE 7 60 70 80 HI5714 Pin Descriptions PIN NUMBER SYMBOL DESCRIPTION 1, 2, 12-15, 23, 24 D0 to D7 4 VRB 6 AGND Analog Ground. 7 VCCA Analog +5V. 8 VIN Analog Input. 9 VRT Top Reference Voltage Input. Range: 3.5V to 3.9V. 11 O/UF Underflow/Overflow Digital Output. Goes high if the analog input goes above or below the reference (VRB , VRT) minus the offset. 16 CLK Clock Input. 17 DGND Digital GND. 18 VCCD Digital +5V. 19, 21 VCCO1, VCCO2 20 OGND 22 OE Digital Outputs, D0 (LSB) to D7 (MSB). Bottom Reference Voltage Input. Range: 1.2V to 1.6V. Digital +5V for Digital Output Stage. Digital Ground for Digital Output Stage. Output Enable High: Digital outputs are three-stated. Low: Digital outputs are active. TABLE 1. A/D CODE TABLE CODE DESCRIPTION (NOTE 1) INPUT VOLTAGE VRT = 3.6V VRB = 1.3V Underflow BINARY OUTPUT CODE O/UF D7 D6 D5 D4 D3 D2 D1 D0 <1.555V 1 0 0 0 0 0 0 0 0 0 1.555V 0 0 0 0 0 0 0 0 0 1 - 0 - - - - - - - - - - 0 - - - - - - - - - - 0 - - - - - - - - 254 - 0 1 1 1 1 1 1 1 0 255 3.300V 0 1 1 1 1 1 1 1 1 Overflow >3.300V 1 1 1 1 1 1 1 1 1 NOTE: 1. The voltages listed above represent the ideal transition of each output code shown as a function of the reference voltage, including the typical reference offset voltages. TABLE 2. MODE SELECTION OE D7 to D0 O/UF 1 High Impedance High Impedance 0 Active: Binary Active 8 HI5714 Detailed Description The analog input is relatively high impedance (10kΩ) but should be driven from a low impedance source. The input capacitance is low (14pF) and there is little kickback from the input, so a series resistance is not necessary but it may help to prevent the driving amplifier from oscillating. Theory of Operation The HI5714 design utilizes a folding and interpolating architecture. This architecture reduces the number of comparators, reference taps, and latches, thereby reducing power requirements, die size and cost. The input bandwidth is typically 18MHz. Exceeding 18MHz will result in sparkle at the digital outputs. The bandwidth remains constant at clock rates up to 75MHz. A folding A/D converter operates basically like a 2 step subranging converter by using 2 lower resolution converters to do a course and subranged fine conversion. A more complete description is given in the application note “Using the HI5714 Evaluation Module” (AN9517). Supply and Ground Considerations In order to keep digital noise out of the analog signal path, the HI5714 has separate analog and digital supply and ground pins. The part should be mounted on a board that provides separate low impedance connections for the analog and digital supplies and grounds. Reference Input, VRT and VRB The HI5714 requires an external reference to be connected to pins 4 and 9, VRB and VRT. The analog and digital grounds should be tied together at one point near the HI5714. The grounds can be connected directly, through an inductor (ferrite bead), or a low valued resistor. DGND and AGND can be tied together. To help minimize noise, tie pin 5 (NC) to AGND and pins 3 (NC) and 10 (NC) to DGND. It is recommended that adequate high frequency decoupling be provided at the reference input pin in order to minimize overall converter noise. A 0.1µF and a 1nF capacitor as close as possible to the reference pins work well. VRT must be kept within the range of 3.5V to 3.9V and VRB within 1.2V to 1.6V. If the reference voltages go outside their respective ranges, the input folding amplifiers may saturate giving erroneous digital data. The range for (VRT - VRB) is 1.9V to 2.7V, which defines the analog input range. For best performance, the supplies to the HI5714 should be driven by clean, linear regulated supplies. The board should also have good high frequency leaded decoupling capacitors mounted as close as possible to the converter. Capacitor leads must be kept as short as possible (less than 1/2 inch total length). A 0.1µF and a 1nF capacitor as close as possible to the pin works well. Chip capacitors will provide better high frequency decoupling but leaded capacitors appear to be adequate. Digital Control and Clock Requirements The HI5714 provides a standard high-speed interface to external TTL logic families. The outputs can be three-stated by setting the OE input (pin 22) high. If the part is to be powered by a single supply, then the analog supply pins should be isolated by ferrite beads from the digital supply pins. This should help minimize noise on the analog power pins. The clock input operates at standard TTL levels as well as a low level sine wave around the threshold level. The HI5714 can operate with clock frequencies from DC to 75MHz. The clock duty cycle should be 50% ±10% to ensure rated performance. Duty cycle variation, within the specified range, has little effect on performance. Due to the clock speed it is important to remember that clock jitter will affect the quality of the digital output data. Refer to Application Note AN9214, “Using Intersil High Speed A/D Converters”, for additional considerations when using high speed converters. Increased Accuracy The clock can be stopped at any time and restarted at a later time. Once restarted the digital data will be valid at the second rising edge of the clock plus the data delay time. Further calibration of the ADC can be done to increase absolute level accuracy. First, a precision voltage equal to the ideal VIN-FS + 0.5 LSB is applied at VIN . Adjust VRB until the 0 to 1 transition occurs on the digital output. Next, a voltage equal to the ideal VIN+FS - 1.5 LSB is applied at VIN . VRT is then adjusted until the 254 to 255 transition occurs on the digital output. Digital Outputs and O/UF Output The digital outputs are standard TTL type outputs. The HI5714 can drive 1 to 3 TTL inputs depending on the input current requirements. Should the analog input exceed the top or bottom reference the over/underflow output (pin 11) will go high. Should the analog input exceed the top reference voltage, VRT , the digital outputs will remain at all 1s until the analog input goes below VRT . Also, should the analog input go below the bottom reference voltage, VRB , the digital outputs will remain at all 0s until the analog input goes above VRT . Applications Figures 3 and 4 show two possible circuit configurations, AC coupled with a DC restore circuit and DC coupled with a DC offset amplifier. Due to the high clock rate, FCT (TTL/CMOS) or FAST (TTL) glue logic should be used. FCT logic will tend to have large overshoots if not loaded. Long traces (>2 or 3 inches) should be terminated to maintain signal integrity. Analog Input The analog input will accept a voltage within the reference voltage levels, VRB and VRT , minus some offset. The offset is specified in the Electrical Specifications table. 9 HI5714 +5VA 3.6V + 16 CLOCK - 0.1 + 9 4 1.3V - 0.1 22 D0 CLK D1 D2 VRT D3 D4 VRB D5 D6 OE HI5714 VIN 8 DC RESTORE SAMPLE PULSE 7 +5VA 10 0.1 D7 O/UF 2 1 24 23 15 14 13 12 11 19 VCCO 21 VCCO 18 VCCD VIN VCCA OGND NC DGND NC 5 NC 6 AGND 10 +5VD 0.1 20 3 17 10 FIGURE 9. TYPICAL AC COUPLED INPUT WITH DC RESTORE +5VA 16 CLOCK 3.6V + - 0.1 + 9 4 1.3V - 0.1 22 D0 CLK D1 D2 VRT D3 D4 VRB D5 D6 OE HI5714 VIN 8 + - D7 O/UF +5VA OFFSET 10 0.1 1 24 23 15 14 13 12 11 19 VCCO 21 VCCO 18 VCCD VIN +5VA 7 2 VCCA OGND NC DGND NC 5 NC 6 AGND +5VD 10 0.1 20 3 17 10 FIGURE 10. TYPICAL DC COUPLED INPUT ICL8069 REFERENCE DSP/µP AMP A/D HA5020 (Single) HA5022 (Dual) HA5024 (Quad) HA5013 (Triple) HFA1105 (Single) HFA1205 (Dual) HFA1405 (Quad) HI5714 (8-Bit) HSP9501 HSP48410 HSP48908 HSP48901 HSP48212 HSP43881 HSP43168 D/A HI1171 (8-Bit) CA3338 (8-Bit) HI5721 (10-Bit) HI3050 (10-Bit) AMP HA5020 (Single) HA2842 (Single) HFA1115 (Single) HFA1212 (Dual) HFA1412 (Quad) HSP9501: Programmable Data Buffer HSP48410: Histogrammer/accumulating Buffer, 10-Bit Pixel Resolution, 4K x 4K Frame Size HSP48908: 2-D Convolver, 3 x 3 Kernal Convolution, 8-Bit HSP48901: 3 x 3 Image Filter, 30MHz, 8-Bit HSP48212: Video Mixer HSP43881: Digital Filter, 30MHz, 1-D and 2-D Fir Filters HSP43168: Dual Fir Filter, 10-Bit, 33/45MHz CMOS Logic Available in FCT FIGURE 11. 8-BIT VIDEO COMPONENTS 10 HI5714 Timing Definitions Dynamic Performance Definitions Aperture Delay: Aperture delay is the time delay between the external sample command (the rising edge of the clock) and the time at which the signal is actually sampled. This delay is due to internal clock path propagation delays. Fast Fourier Transform (FFT) techniques are used to evaluate the dynamic performance of the HI5714. A low distortion sine wave is applied to the input, it is sampled, and the output is stored in RAM. The data is then transformed into the frequency domain with a 2048 point FFT and analyzed to evaluate the dynamic performance of the A/D. The sine wave input to the part is 0.5dB down from full scale for these tests. The distortion numbers are quoted in dBc (decibels with respect to carrier) and DO NOT include any correction factors for normalizing to full scale. Aperture Jitter: This is the RMS variation in the aperture delay due to variation of internal clock path delays. Data Latency After the analog sample is taken, the data on the bus is output at the next rising edge of the clock. This is due to the output latch of the converter. This delay is specified as the data latency. After the data latency time, the data representing each succeeding sample is output at the following clock pulse. The digital data lags the analog input by 1 cycle. Signal-to-Noise Ratio (SNR) SNR is the measured RMS signal to RMS noise at a specified input and sampling frequency. The noise is the RMS sum of all of the spectral components except the fundamental and the first five harmonics. Static Performance Definitions Signal-to-Noise + Distortion Ratio (SINAD) Offset Error and Full-Scale Error use a measured value of the external voltage reference to determine the ideal plus and minus full-scale values. The results are all displayed in LSBs. SINAD is the measured RMS signal to RMS sum of all other spectral components below the Nyquist frequency excluding DC. Bottom Offset Voltage (VOB) Effective Number Of Bits (ENOB) The first code transition should occur at a level 0.5 LSB above the negative full-scale. Bottom offset voltage is defined as the deviation of the actual code transition from this point. The effective number of bits (ENOB) is derived from the SINAD data. ENOB is calculated from: ENOB = (SINAD - 1.76) / 6.02 2nd and 3rd Harmonic Distortion Top Offset Voltage (VOT) This is the ratio of the RMS value of the 2nd and 3rd harmonic component respectively to the RMS value of the measured input signal. The last code transition should occur for a analog input that is 1.5 LSBs below positive full-scale. Top Offset Voltage is defined as the deviation of the actual code transition from this point. Full Power Input Bandwidth Full power bandwidth is the frequency at which the amplitude of the digitally reconstructed output has decreased 3dB below the amplitude of the input sine wave. The input sine wave has a peak-to-peak amplitude equal to the difference between the top reference voltage input and the bottom reference voltage input. The bandwidth given is measured at the specified sampling frequency. Differential Linearity Error (DNL) DNL is the worst case deviation of a code width from the ideal value of 1 LSB. The converter is guaranteed to have no missing codes. Integral Linearity Error (INL) INL is the worst case deviation of a code center from a best fit straight line calculated from the measured data. 11 HI5714 Die Characteristics DIE DIMENSIONS: WORST CASE CURRENT DENSITY: 1.6 x 104 A/cm2 134 mils x 134 mils x 19 mils ±1 mil METALLIZATION: TRANSISTOR COUNT: Type: AlSiCu Thickness: M1 - 8kÅ, M2 - 17kÅ 3714 DIE ATTACH: SUBSTRATE POTENTIAL (Powered Up): Silver Filled Epoxy GND (0.0V) PASSIVATION: Type: Sandwich Passivation* Undoped Silicon Glass (USG) + Nitride Thickness: USG - 8kÅ, Nitride - 4.2kÅ Total 12.2kÅ + 2kÅ Metallization Mask Layout HI5714 DO D1 D2 D3 OE VCC02 VRB OGND AGND VCC01 VCCA VCCD VIN DGND VRT CLK O/UF D7 D6 D5 12 D4 HI5714 Small Outline Plastic Packages (SOIC) M24.3 (JEDEC MS-013-AD ISSUE C) 24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E -B1 2 3 L SEATING PLANE -A- h x 45o A D -C- e A1 B 0.25(0.010) M C 0.10(0.004) C A M SYMBOL MIN MAX MIN MAX NOTES A 0.0926 0.1043 2.35 2.65 - A1 0.0040 0.0118 0.10 0.30 - B 0.013 0.020 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 - D 0.5985 0.6141 15.20 15.60 3 E 0.2914 0.2992 7.40 7.60 4 e α B S 0.05 BSC 1.27 BSC - H 0.394 0.419 10.00 10.65 - h 0.010 0.029 0.25 0.75 5 L 0.016 0.050 0.40 1.27 6 N NOTES: 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact MILLIMETERS α 24 0o 24 8o 0o 7 8o Rev. 0 12/93 All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com 13