Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: 128 TQFP (1.4mm) 0.66 Total Device Weight Grams Die % of Total Pkg. Wt. 5.34% Mold 70.91% August, 2008 D/A Epoxy 0.65% Weight (g) % of Total Pkg. Wt. with matte Sn Plating Weight (g) 0.035 MSL: 3 Peak Reflow Temp: 240°C Substance CAS # Silicon chip 7440-21-3 Die size: 5.84 x 7.19 mm Notes / Assumptions: 60.27% 3.55% 3.55% 0.71% 0.43% 2.41% 0.398 0.023 0.023 0.005 0.003 0.016 Silica Fused Epoxy Resin Phenol Resin Antimony Trioxide Carbon Black Other 60676-86-0 1309-64-4 1333-86-4 - Mold Compound Density between 1.7 and 2.1 grams/cc 80 to 90% Silica Fused (LSC uses 85% in our calculation) 5 to 10% Epoxy Resin (LSC uses 5% in our calculation). 5 to 10% Phenol Resin (LSC uses 5% in our calculation). 0.1% to 1% Antimony Trioxide (LSC uses 1% in our calculation) 0.1 to 1% Carbon black (LSC uses 0.6% in our calculation) 1 to 4% Other (LSC uses 3.4% in our calculation) 0.52% 0.13% 0.003 0.001 Silver (Ag) other 7440-22-4 - Die attach epoxy Density: 4 grams/cc (silver content: 70-90%; LSC uses 80% in our calculation) 0.468 0.004 Wire 0.57% 0.004 Gold (Au) 7440-57-5 0.8 to 1.2 mil diameter; 1 wire per package lead; wire length 3 mm Lead Plating 1.88% 0.012 Tin (Sn) 7440-31-5 Plating is 100% Sn; thickness is 0.015mm Leadframe 20.66% 0.136 Copper (Cu) Silicon (Si) Zinc (Zn) Tin (Sn) Chromium (Cr) Nickel (Ni) Magnesium (Mg) 7440-50-8 7440-21-3 7440-66-6 7440-31-5 7440-47-3 7440-02-0 7439-95-4 Leadframe thickness is nominal (per Case Outline) Cu (LSC uses 97.5% in our calculation) 0 to 0.65% Si (LSC uses 0.4% in our calculation) 0 to 0.2% Zn (LSC uses 0.1% in our calculation) 0 to 0.25% Sn (LSC uses 0.2% in our calculation) 0 to 0.3% Cr (LSC uses 0.2% in our calculation) 0 to 3% Ni (LSC uses 1.5% in our calculation) 0 to 0.15% Mg (LSC uses 0.1% in our calculation) 20.15% 0.08% 0.02% 0.04% 0.04% 0.31% 0.02% 0.1330 0.00055 0.00014 0.00027 0.00027 0.0020 0.00014 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. D1