Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: 44 TQFP (1.4mm) with matte Sn Plating Total Device Weight 0.34 Grams August, 2008 % of Total Pkg. Wt. Weight (g) Die 1.55% 0.005 Mold 77.04% 0.262 D/A Epoxy 0.19% % of Total Weight (g) Pkg. Wt. MSL: 3 Peak Reflow Temp: 260°C Substance CAS # Notes / Assumptions: Silicon chip 7440-21-3 Die size: 2.10 x 3.00 mm 65.49% 3.85% 3.85% 0.77% 0.46% 2.62% 0.223 0.013 0.013 0.0026 0.0016 0.009 Silica Fused Epoxy Resin Phenol Resin Antimony Trioxide Carbon black Other (trade secret) 60676-86-0 1309-64-4 1333-86-4 - Mold Compound Density between 1.7 and 2.1 grams/cc 80 to 90% Silica Fused (LSC uses 85% in our calculation) 5 to 10% Epoxy Resin (LSC uses 5% in our calculation). 5 to 10% Phenol Resin (LSC uses 5% in our calculation). 0.1% to 1% Antimony Trioxide (LSC uses 1% in our calculation) 0.1 to 1% Carbon black (LSC uses 0.6% in our calculation) 1 to 4% Other (LSC uses 3.4% in our calculation) 0.15% 0.04% 0.0005 0.0001 Silver (Ag) other 7440-22-4 - (silver content: 70-90%; LSC uses 80% in our calculation) Die attach epoxy Density: 4 grams/cc 0.0006 Wire 0.38% 0.0013 Gold (Au) 7440-57-5 0.8 to 1.0 mil diameter; 1 wire per package lead; wire length 3 mm Lead Plating 2.08% 0.007 Tin (Sn) 7440-31-5 Plating is 100% Sn; thickness is 0.015mm Leadframe 18.76% 0.064 Copper (Cu) Silicon (Si) Zinc (Zn) Tin (Sn) Chromium (Cr) Nickel (Ni) Magnesium (Mg) 7440-50-8 7440-21-3 7440-66-6 7440-31-5 7440-47-3 7440-02-0 7439-95-4 Leadframe thickness is nominal (per Case Outline) Cu (LSC uses 97.5% in our calculation) 0 to 0.65% Si (LSC uses 0.4% in our calculation) 0 to 0.2% Zn (LSC uses 0.1% in our calculation) 0 to 0.25% Sn (LSC uses 0.2% in our calculation) 0 to 0.3% Cr (LSC uses 0.2% in our calculation) 0 to 3% Ni (LSC uses 1.5% in our calculation) 0 to 0.15% Mg (LSC uses 0.1% in our calculation) Copper area is fixed at 55% package area 18.29% 0.08% 0.02% 0.04% 0.04% 0.28% 0.02% 0.0622 0.00026 0.0001 0.00013 0.0001 0.0010 0.00006 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. E1