Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 USA [email protected] Package: Total Device Weight 64 csBGA 0.047 Grams December, 2012 % of Total Pkg. Wt. Weight (g) % of Total Weight (g) Pkg. Wt. Die 4.53% 0.0021 Mold 49.16% 0.0231 with SnAgCu Solder Balls Copper Bond Wire version MSL: 3 D/A Epoxy Wire Solder Balls Substrate Foil 0.73% 1.85% 14.33% 20.30% 9.11% Peak Reflow Temp: 260°C Substance CAS # Notes / Assumptions: Silicon chip 7440-21-3 Die size: 1.77 x 1.91 mm 42.77% 2.46% 2.46% 1.35% 0.12% 0.02010 0.00116 0.00116 0.00064 0.00006 Silica fused Epoxy Resin Phenol Resin Metal Hydroxide Carbon Black 60676-86-0 1333-86-4 Mold Compound composition: 75 to 95% Fused silica filler (LSC uses 87% in our calculation) 2 to 10% Epoxy resin (LSC uses 5% in our calculation) 2 to 10% Phenol resin (LSC uses 5% in our calculation) 0.5 to 5% Metal hydroxide (LSC uses 2.75% in our calculation) 0.1 to 0.5% Carbon Black (LSC uses 0.25% in our calculation) 0.58% 0.15% 0.00027 0.00007 Silver (Ag) Organic esters & resins 7440-22-4 - 60 to 90% Silver (LSC uses 80% in our calculation) 0 to 40% Organic Esters and Resins (LSC uses 20% in our calculation) 1.82% 0.03% 0.00085 0.00001 Copper Palladium 7440-50-8 7440-05-3 Pd coated Copper, 0.8 mil diameter 98.5% Cu 1.5% Pd 13.77% 0.43% 0.07% 0.0065 0.0002 0.00003 Tin (Sn) Silver (Ag) Copper (Cu) 7440-31-5 7440-22-4 7440-50-8 Solder ball composition Sn96.5/Ag3/Cu0.5 (SAC305) 13.80% 6.50% 0.0065 0.0031 Glass fiber BT Resins 65997-17-3 - 60 to 75% glass fiber (LSC uses 68% in our calculation) Copper (Cu) 7440-50-8 0.00034 0.0009 0.0067 0.0095 0.0043 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. K