Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 USA [email protected] Package: Total Device Weight 328 csBGA 0.31 Grams with SnAgCu Solder Balls Copper Bond Wire version MSL: 3 August, 2012 % of Total Pkg. Wt. Weight (g) Die 4.49% 0.0139 Mold 50.20% 0.1556 D/A Epoxy 0.69% 0.77% 0.0024 Solder Balls 11.11% 0.0344 Foil 20.48% 12.26% Substance CAS # Silicon chip 7440-21-3 Peak Reflow Temp: 260°C Notes / Assumptions: Die size: 4.60 x 5.20 mm 45.18% 3.01% 2.01% 0.10% 0.1400 0.0093 0.0062 0.0003 Silica Epoxy Resin Phenol Resin Carbon Black 60676-86-0 1333-86-4 0.55% 0.14% 0.0017 0.0004 Silver (Ag) Organic esters & resins 7440-22-4 - Mold Compound composition: 86 to 93% Silica Fused or Amorphous (LSC uses 90% in our calculation) 1.5 to 7% Epoxy resin (LSC uses 6% in our calculation) 1 to 6% Phenol resin (LSC uses 4% in our calculation) 0.2% Carbon Black Mold Compound Density ranges between 1.99 and 2.09 grams/cc Die attach epoxy Density: 4 grams/cc 70 to 90% Silver (LSC uses 80% in our calculation) 10 to 30% Organic Esters and Resins (LSC uses 20% in our calculation) Copper (Cu) 7440-50-8 Wire: 0.0114 mm (radius) 0.0021 Wire Substrate % of Total Weight (g) Pkg. Wt. 10.72% 0.33% 0.06% 0.0332 0.0010 0.00017 Tin (Sn) Silver (Ag) Copper (Cu) 7440-31-5 7440-22-4 7440-50-8 Solder ball composition Sn96.5/Ag3/Cu0.5 (SAC305) 13.92% 6.55% 0.0432 0.0203 Glass fiber BT Resins 65997-17-3 - 60 to 75% glass fiber (LSC uses 68% in our calculation) Copper (Cu) 7440-50-8 0.0635 0.0380 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. I