328_csbga_Pb-free_Cu wire_j

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124 USA
[email protected]
Package:
Total Device Weight
328 csBGA
0.31
Grams
with SnAgCu Solder Balls
Copper Bond Wire version
MSL: 3
August, 2012
% of Total Pkg.
Wt.
Weight (g)
Die
4.49%
0.0139
Mold
50.20%
0.1556
D/A Epoxy
0.69%
0.77%
0.0024
Solder Balls
11.11%
0.0344
Foil
20.48%
12.26%
Substance
CAS #
Silicon chip
7440-21-3
Peak Reflow Temp: 260°C
Notes / Assumptions:
Die size: 4.60 x 5.20 mm
45.18%
3.01%
2.01%
0.10%
0.1400
0.0093
0.0062
0.0003
Silica
Epoxy Resin
Phenol Resin
Carbon Black
60676-86-0
1333-86-4
0.55%
0.14%
0.0017
0.0004
Silver (Ag)
Organic esters & resins
7440-22-4
-
Mold Compound composition:
86 to 93% Silica Fused or Amorphous (LSC uses 90% in our calculation)
1.5 to 7% Epoxy resin (LSC uses 6% in our calculation)
1 to 6% Phenol resin (LSC uses 4% in our calculation)
0.2% Carbon Black
Mold Compound Density ranges between 1.99 and 2.09 grams/cc
Die attach epoxy Density: 4 grams/cc
70 to 90% Silver (LSC uses 80% in our calculation)
10 to 30% Organic Esters and Resins (LSC uses 20% in our calculation)
Copper (Cu)
7440-50-8
Wire: 0.0114 mm (radius)
0.0021
Wire
Substrate
% of Total
Weight (g)
Pkg. Wt.
10.72%
0.33%
0.06%
0.0332
0.0010
0.00017
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
Solder ball composition Sn96.5/Ag3/Cu0.5 (SAC305)
13.92%
6.55%
0.0432
0.0203
Glass fiber
BT Resins
65997-17-3
-
60 to 75% glass fiber (LSC uses 68% in our calculation)
Copper (Cu)
7440-50-8
0.0635
0.0380
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
www.latticesemi.com
Rev. I