Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 (503) 268-8000 [email protected] Package: Total Device Weight July, 2009 % of Total Pkg. Wt. Weight (g) Die 3.50% 0.005 Mold 49.24% 0.074 D/A Epoxy 0.61% 48 QFNS 0.15 Grams % of Total Pkg. Wt. with matte Sn Plating MSL: 3 Peak Reflow Temp: 260°C Weight (g) Substance CAS # Notes / Assumptions: Silicon chip 7440-21-3 Die size: 3.0 x 3.0 mm 43.33% 2.46% 2.46% 0.86% 0.12% 0.065 0.0037 0.0037 0.0013 0.0002 Silica (fused) Epoxy Resin Phenol Resin Metal Hydroxide Carbon Black 60676-86-0 1333-86-4 Mold Compound Density ranges between 1.9 and 2.1 grams/cc 75 to 95% Fused silica filler (LSC uses 88% in our calculation) 2 to 10% Epoxy resin (LSC uses 5% in our calculation) 2 to 10% Phenol resin (LSC uses 5% in our calculation) 0.5 to 2.5% Metal hydroxide (LSC uses 1.75% in our calculation) 0.1 to 0.5% Carbon Black (LSC uses 0.25% in our calculation) 0.46% 0.15% 0.0007 0.0002 Silver (Ag) Organic esters and resins 7440-22-4 - Die attach epoxy Density: 4 grams/cc 70 to 80% Silver (LSC uses 75% in our calculation) 20 to 30% Organic Resins, Hardners and Elastomers (LSC uses 25% in our calculation) 0.0009 Wire 0.72% 0.0011 Gold (Au) 7440-57-5 Assume 1 wire per lead Plating 0.34% 0.0005 Tin (Sn) 7440-31-5 Tin plating is 400 to 800 microinches (LSC uses 600 microinches in our calculation) Leadframe 45.60% 0.068 Copper (Cu) 7440-50-8 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. A