Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: Total Device Weight August, 2012 % of Total Pkg. Wt. Weight (g) Die 7.09% 0.0021 Mold 45.07% 0.0135 D/A Epoxy 1.14% 1.85% 0.0006 Solder Balls 15.36% 0.0046 Foil 20.35% 9.13% % of Total Weight (g) Pkg. Wt. with SnPb Solder Balls Copper Bond Wire Version MSL: 3 - Peak Reflow Temp: 240°C Substance CAS # Silicon chip 7440-21-3 Notes / Assumptions: Die size: 1.7 x 1.91 mm 38.31% 2.70% 2.70% 0.68% 0.09% 0.0115 0.0008 0.0008 0.0002 0.00003 Silica Epoxy Resin Phenol Resin Metal Hydroxide Carbon Black 60676-86-0 1333-86-4 0.92% 0.23% 0.00027 0.00007 Silver (Ag) Organic esters & resins 7440-22-4 - Mold Compound composition: 75 to 95% Fused silica filler (LSC uses 87% in our calculation) 2 to 10% Epoxy resin (LSC uses 5% in our calculation) 2 to 10% Phenol resin (LSC uses 5% in our calculation) 0.5 to 5% Metal hydroxide (LSC uses 2.75% in our calculation) 0.1 to 0.5% Carbon Black (LSC uses 0.25% in our calculation) Mold Compound Density ranges between 1.9 and 2.1 grams/cc Die attach epoxy Density: 4 grams/cc 60 to 100% Silver (LSC uses 80% in our calculation) 0 to 40% Organic Esters and Resins (LSC uses 20% in our calculation) Copper (Cu) 7440-50-8 0.80 mil diameter; 1 wire per solder ball 0.00034 Wire Substrate 64 ucBGA 0.03 Grams 9.68% 5.68% 0.00290 0.00171 Tin (Sn) Lead (Pb) 7440-31-5 7439-92-1 Solder ball composition Sn63/Pb37% 13.84% 6.51% 0.0042 0.0020 Glass fiber BT Resins 65997-17-3 - 60 to 75% glass fiber (LSC uses 68% in our calculation) Copper (Cu) 7440-50-8 0.0061 0.0027 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. J