PDIP SNPB20

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
(503) 268-8000
Package:
Total Device Weight
August, 2008
% of Total
Pkg. Wt.
Weight (g)
Die
0.70%
0.009
Mold
69.93%
0.937
D/A Epoxy
0.06%
0.06%
0.001
Lead Plating
2.20%
0.030
27.03%
with SnPb Plating
% of Total
Weight (g)
Pkg. Wt.
Substance
CAS #
Silicon chip
7440-21-3
Die size: 3.0 x 2.7 x 0.50 mm.
0.803
0.056
0.056
0.019
0.003
Silica Fused
Epoxy Resin
Phenol Resin
Epoxy, Cresol Novolac
Carbon black
60676-86-0
29690-82-2
1333-86-4
Mold Compound Density between 1.7 and 1.9 grams/cc
75 to 95% Silica Fused (LSC uses 85.7% in our calculation)
2 to 8% Epoxy Resin (LSC uses 6% in our calculation).
2 to 8% Phenol Resin (LSC uses 6% in our calculation)
1 to 3% Cresol Novolac Epoxy (LSC uses 2% in our calculation).
0.1 to 0.5% Carbon black (LSC uses 0.3% in our calculation)
0.05%
0.01%
0.0007
0.0002
Silver-filled Epoxy
Silver (Ag)
other
7440-22-4
-
Die attach epoxy Density: 4 grams/cc
(silver content: 60-100%; LSC uses 80% in our calculation)
Gold (Au)
7440-57-5
1.2 mil wire diameter; 1 wire for each package lead; wire length 3 mm
1.87%
0.33%
0.025
0.004
Tin (Sn)
Lead (Pb)
7440-31-5
7439-92-1
Nominal: 85% Sn, 15% Pb
Thickness is 0.015mm
26.35%
0.64%
0.03%
0.02%
0.353
0.009
0.0004
0.0003
Copper (Cu)
Iron (Fe)
Zinc (Zn)
Phosphorus (P)
7440-50-8
7439-89-6
7440-66-6
7723-14-0
Leadframe thickness is nominal (per Case Outline).
97.46% Cu
2.35% Fe
0.12% Zn
0.07% P
0.362
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
www.latticesemi.com
Notes / Assumptions:
59.93%
4.20%
4.20%
1.40%
0.21%
0.001
Wire
Leadframe
20 PDIP
1.34
Grams