PDIP pbfree20

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
(503) 268-8000
Package:
Total Device Weight
August, 2008
% of Total
Pkg. Wt.
Weight (g)
Die
0.61%
0.009
Mold
74.16%
1.149
D/A Epoxy
0.05%
20 PDIP
1.55
Grams
with Matte Sn Plating
% of Total
Weight (g)
Pkg. Wt.
Substance
CAS #
Notes / Assumptions:
Silicon chip
7440-21-3
Die size: 3.0 x 2.7 x 0.50 mm
63.55%
4.45%
4.45%
1.48%
0.22%
0.985
0.069
0.069
0.023
0.003
Silica Fused
Epoxy Resin
Phenol Resin
Epoxy, Cresol Novolac
Carbon black
60676-86-0
29690-82-2
1333-86-4
Mold Compound Density between 1.7 and 2.1 grams/cc
75 to 95% Silica Fused (LSC uses 85.7% in our calculation)
2 to 8% Epoxy Resin (LSC uses 6% in our calculation).
2 to 8% Phenol Resin (LSC uses 6% in our calculation)
1 to 3% Cresol Novolac Epoxy (LSC uses 2% in our calculation).
0.1 to 0.5% Carbon black (LSC uses 0.3% in our calculation)
0.03%
0.02%
0.0005
0.0003
Silver-filled epoxy
Silver (Ag)
other
7440-22-4
-
Die attach epoxy Density: 4 grams/cc
(silver content: 60-100%; LSC uses 80% in our calculation)
0.0008
Wire
0.04%
0.0006
Gold (Au)
7440-57-5
1.00 mil diameter; 1 wire per package lead; wire length 3 mm
Lead Plating
1.77%
0.027
Tin (Sn)
7440-31-5
Plating is 100% Sn; thickness is >10.2 um
Leadframe
23.37%
0.362
Copper (Cu)
Iron (Fe)
Zinc (Zn)
Phosphorus (P)
7440-50-8
7439-89-6
7440-66-6
7723-14-0
Leadframe thickness is nominal (per Case Outline)
97.46% Cu
2.35% Fe
0.12% Zn
0.07% P
22.78%
0.55%
0.03%
0.02%
0.353
0.009
0.0004
0.0003
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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