WLCSP pbfree25

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package:
Total Device Weight
Die
% of Total
Pkg. Wt.
71.43%
BSP
3.69%
November, 2011
Solder ball
RDL
Copper
21.05%
2.82%
1.07%
Weight (g)
25 WLCSP
0.00714
Grams
% of Total
Pkg. Wt.
Weight (g)
0.005100
with SnAgCu Solder Balls
MSL: 1
Peak Reflow Temp: 260°C
Substance
CAS #
Silicon chip
7440-21-3
Die size: 2.49 x 2.55 mm
Notes / Assumptions:
0.000263
2.36%
0.89%
0.18%
0.18%
0.07%
0.000169
0.000063
0.000013
0.000013
0.000005
Polyethylene terephthalate
Silica
Epoxy resin
Acrylic polymer
Carbon black
25038-59-9
60676-86-0
1333-86-4
50-80% - LSC uses 64% in our calculations
20-30% - LSC uses 24% in our calculations
1-10% - LSC uses 5% in our calculations
1-10% - LSC uses 5% in our calculations
0.1-5% - LSC uses 2% in our calculations
20.74%
0.21%
0.11%
0.001481
0.000015
0.000008
SAC105
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
Sn (98.5%)
Ag (1.0%)
Cu(0.5%)
0.99%
1.41%
0.11%
0.31%
0.000070
0.000101
0.000008
0.000022
Polyamide
Gamma-butyrolactone
Propylene Glycol Monomethyl Ether Acetate
Proprietary ingredients
96-48-0
108-65-6
-
30-40% - LSC uses 35% in our calculations
40-60% - LSC uses 48% in our calculations
1-10% - LSC uses 4% in our calculations
3-25% - LSC uses 13% in our calculations
Copper (Cu)
7440-50-8
0.001503
0.000201
0.000077
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. A