Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: Total Device Weight Die % of Total Pkg. Wt. 71.43% BSP 3.69% November, 2011 Solder ball RDL Copper 21.05% 2.82% 1.07% Weight (g) 25 WLCSP 0.00714 Grams % of Total Pkg. Wt. Weight (g) 0.005100 with SnAgCu Solder Balls MSL: 1 Peak Reflow Temp: 260°C Substance CAS # Silicon chip 7440-21-3 Die size: 2.49 x 2.55 mm Notes / Assumptions: 0.000263 2.36% 0.89% 0.18% 0.18% 0.07% 0.000169 0.000063 0.000013 0.000013 0.000005 Polyethylene terephthalate Silica Epoxy resin Acrylic polymer Carbon black 25038-59-9 60676-86-0 1333-86-4 50-80% - LSC uses 64% in our calculations 20-30% - LSC uses 24% in our calculations 1-10% - LSC uses 5% in our calculations 1-10% - LSC uses 5% in our calculations 0.1-5% - LSC uses 2% in our calculations 20.74% 0.21% 0.11% 0.001481 0.000015 0.000008 SAC105 Tin (Sn) Silver (Ag) Copper (Cu) 7440-31-5 7440-22-4 7440-50-8 Sn (98.5%) Ag (1.0%) Cu(0.5%) 0.99% 1.41% 0.11% 0.31% 0.000070 0.000101 0.000008 0.000022 Polyamide Gamma-butyrolactone Propylene Glycol Monomethyl Ether Acetate Proprietary ingredients 96-48-0 108-65-6 - 30-40% - LSC uses 35% in our calculations 40-60% - LSC uses 48% in our calculations 1-10% - LSC uses 4% in our calculations 3-25% - LSC uses 13% in our calculations Copper (Cu) 7440-50-8 0.001503 0.000201 0.000077 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. A