ucBGA Halogenfree Cuwire36

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package:
Total Device Weight
August, 2012
% of Total Pkg.
Wt.
Weight (g)
Die
12.35%
0.0013
Mold
49.96%
0.0053
D/A Tape
Wire
Solder Balls
Substrate
0.60%
0.59%
2.95%
33.55%
0.011
36 ucBGA
Grams
% of Total
Pkg. Wt.
Weight (g)
Halogen Free
with SnAgCu Solder Balls
MSL: 3
Peak Reflow Temp: 260°C
Substance
CAS #
Silicon chip
7440-21-3
Notes / Assumptions:
Die size: 59 x 59 mil
44.96%
2.75%
2.25%
0.0047
0.0003
0.0002
Silica
Epoxy Resin
Phenol Resin
60676-86-0
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Mold Compound: KEG1250 LKDS
75 to 95% Fused silica filler (LSC uses 90% in our calculation)
1 to 10% Epoxy resin (LSC uses 5.5% in our calculation)
2 to 7% Phenol resin (LSC uses 4.5% in our calculation)
0.07%
0.07%
0.04%
0.42%
0.000008
0.000008
0.000004
0.000044
Epoxy Resin
Phenol Resin
SiO2 Filler
(Meta)Acrylic Copolymer
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TAPE FH-900T-25_HR9004
10 to 20% (LSC uses 12% in our calculation)
10 to 20% (LSC uses 12% in our calculation)
1 to 10% (LSC uses 6% in our calculation)
65 to 75% (LSC uses 70% in our calculation)
0.574%
0.016%
0.00006
0.000002
Copper (Cu)
Palladium (Pd)
7440-50-8
7440-05-3
2.91%
0.03%
0.01%
0.00031
0.000003
0.000002
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
15.98%
10.15%
4.79%
2.40%
0.24%
0.00168
0.00107
0.00050
0.00025
0.00003
BT Resin CCL-HL832NX
Copper (Cu)
Soldermask AUS 308
Nickel Plating
Gold Plating
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7440-50-8
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7440-02-0
7440-57-5
0.00006
0.00006
0.7 MIL Pd COATED Cu
97.30%
2.70%
0.00031
0.00352
10 mils Sn98.5 / Ag1.0 / Cu0.5 (SAC105)
CCL-HL832NX(A-HS) / AUS 308
47.62%
30.24%
14.29%
7.14%
0.71%
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. A