CDMV Series Thick Film Chip Resistor Dividers Save Space and Simplify Designs in High-Voltage Applications

Product Group: Vishay Resistors, Thick Film / May 2016
Author: Ray Lehman
Tel: +1 402-563-6332
E-mail: [email protected]
New CDMV Series Thick Film Chip Resistor
Dividers Save Space and Simplify Designs in
High-Voltage Applications
Product Benefits:
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Working voltages up to 1.4 kV
Two resistors integrated into a single 2512 case size
Wide resistance range from 10 kΩ to 75 MΩ
Maximum resistance ratios to 700:1
Tolerances down to ± 0.5 %
Available with solderable, epoxy-bondable, and wirebondable terminations
3-sided wraparound or top-only flip chip configurations
Solder-coated nickel barrier terminations standard
• Gold, palladium silver, platinum gold, platinum silver,
and platinum palladium gold terminations available
RoHS-compliant
Halogen-free
Market Applications:
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Voltage division applications in high-voltage industrial and alternative energy equipment
The News:
Vishay Intertechnology introduces the new Vishay Techno CDMV series of thick film chip dividers
designed to reduce space requirements, simplify manufacturing designs, and increase design
flexibility in high-voltage industrial and alternative energy equipment.
• Available in a wide range of termination styles, materials, and configurations
• Provide a single-component replacement for multiple discrete resistors
The Key Specifications:
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Case size: 2512
Maximum working voltage: 1415 V
Resistance range: 10 kΩ to 75 MΩ
Maximum resistance ratio: 200:1 to 700:1 (depending on value)
Tolerance: 0.5 %, 1 %, 2 %, 5 %, 10 %
Temperature coefficient: ± 100 ppm/°C (-55 °C to +155 °C)
TCR tracking: ± 50 ppm/°C (typical)
Product Group: Vishay Resistors, Thick Film / May 2016
Availability:
Samples and production quantities of the CDMV series devices are available now, with lead times of
12 weeks for large orders.
To access the product datasheet on the Vishay website, go to
http://www.vishay.com/ppg?68040 (CDMV)
Contact Information:
THE AMERICAS
EUROPE
ASIA/PACIFIC
Ray Lehman
[email protected]
Richard Steel
[email protected]
Victor Goh
[email protected]