Average ramp up rate (25°C to TP) Preheat Range, TSmin - TSmax Preheat time, tS Liquidus Temp, TL Time above liquidus temp, tL Peak temp, TP SnPb Eutectic Lead-free 3°C/sec max 100° to 150°C 60-120 secs 183°C 60-150 secs 240° +0/-5°C 3°C/sec max 150 to 200 C 60-180 secs 217°C 60-150 secs 260° +0/-5°C 10-30 secs 20-40 secs Time within 5C of the actual peak temp, tP 6°C/sec max 6°C/sec max Ramp down rate 6 mins max 8 mins max Time to peak temp, t25°C to Peak Table 1: Typical Reflow Profile Conditions Used for Package MSL Determination Notes: 1. All temperatures refer to the topside of the package, measured on package body surface. 2. This profile is used for internal qualification of packages and only shows the times and temperatures our packages are guaranteed to withstand. This should not be construed as a recommended profile for board mounting of our parts. Customers should optimize their board mounting reflow profiles per their board design, solder paste and flux selection etc. Table 1: Schematic of the Reflow Profile (Source: IPC/JEDEC J-STD-020C)