CML IC Product Solder Profiles

Profile for Pb Free 260ºC Reflow
300
Peak Temp 260 °C -5 +0
250
Time over 217°C 60 - 150 secs
Pre-heat 150°C +/- 25°C 60 - 180 secs
150
Average Ramp down rate
6°C/Sec Max
100
Average Ramp-up rate 3°C/Sec Max
50
Time 25°C to Peak, 8 mins Max
Time Secs
400
380
360
340
320
300
280
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
Temperature °C
200
Time within 5°C of peak 10 - 40 secs
Profile for SnPb Reflow
250
Peak Temp 225°C-5 +0
Time within 5°C of peak 10- 30 secs
Temperature °C
200
150
100
Pre-heat 125°C +/- 25°C 60 -120 secs
Time over 183°C 60- 150 secs
Average Ramp up rate
3°C/Sec Max
50
Time 25°C to Peak, 6 mins max
0
Time Secs
CML Microcircuits: Publication D/SoldProf/2 June 2005
Average Ramp down
rate 6°C/Sec Max