The following document contains information on Cypress products. FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-26025-1E F2MC-8FX Family SSOP-30P (0.65mm pitch) HEADER BOARD MB2146-271 OPERATION MANUAL PREFACE Thank you for purchasing the SSOP-30P (0.65mm pitch)*1 header board (model number: MB2146271) for the F2MC*2-8FX family. The MB2146-271 is a header board that is used to connect an MCU board (model number: MB2146301A/303A) that is fitted with a F2MC-8FX family evaluation MCU to a user system. This manual explains how to handle the MB2146-271 header board. Read this manual thoroughly before using the MB2146-271 header board. Consult the Sales representatives or the Support representatives of Fujitsu Limited for details on the mass-produced MCUs and evaluation MCUs that are supported by this product. *1 : The lead pitch of the package (FPT-30P-M02) is 0.65mm and the body size is 5.6mm × 9.7mm. *2 : F2MC is the abbreviation of FUJITSU Flexible Microcontroller. ■ Caution of the products described in this document The following precautions apply to the product described in this manual. CAUTION The wrong use of a device will give an injury and may cause malfunction on customers system. Cuts This product has parts with sharp points that are exposed. Take care when handling the product as there is a risk of injury if the exposed sharp edges are touched. Damage When connect the header board to the user system, correctly position the index mark (▲) on the conversion board mounted on the user system with the 1 pin direction (1) on the header board, otherwise the MCU board and user system might be damaged. Damage When mounting a mass production MCU, correctly position pin 1, otherwise the mass production MCU and user system might be damaged. i • The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. • The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of FUJITSU semiconductor device; FUJITSU does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating the device based on such information, you must assume any responsibility arising out of such use of the information. FUJITSU assumes no liability for any damages whatsoever arising out of the use of the information. • Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU or any third party or does FUJITSU warrant non-infringement of any third-party’s intellectual property right or other right by using such information. FUJITSU assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would result from the use of information contained herein. • The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite). Please note that FUJITSU will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. • Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. • If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be required for export of those products from Japan. Copyright ©2007 FUJITSU LIMITED All rights reserved ii 1. Product Outline ■ Product outline This product consists of a header board (referred to as the “header board”) that is used to connect an MCU board (model number: MB2146-301A/303A) that has an evaluation MCU of Fujitsu 8-bit microcontrollers F2MC-8FX family mounted on it to a user system, and a package product signal line conversion board (referred to as the “conversion board”) for connecting to a target board. An F2MC8FX evaluation environment can be constructed by combining four products shown in Figure 1: the header board, conversion board, MCU board, and BGM adapter (model number: MB2146-09). MCU board BGM adapter Header board, Conversion board Figure 1 System configuration ■ Product configuration Table 1 lists the product configuration of the header board, and Table 2 lists the optional parts. Table 1 Product configuration Name Description Remarks Header board for the A board that converts the signal lines of a SSOP-30P (0.65mm pitch) package product from an MCU board package Conversion board for the Capable of purchasing as option individually A package signal line conversion connector SSOP-30P (0.65mm pitch) Model number: SSA-30BK1-M02 for mounting on the user system package (from Tokyo Eletech Corporation.) Table 2 Optional parts Name BGM adapter (Model number: MB2146-09) Description Remarks ICE unit for F2MC-8FX MCU board Built-in MB95FV100D-101/103 (Model number: MB2146-301A/303A) Built-in F2MC-8FX evaluation MCU* * : Several types of evaluation MCUs are available depending on the application and the power supply voltage. Purchase the one that satisfies the service conditions. 1 2. Checking the Delivered Product Before using the MB2146-271, confirm that the following components are included in the box: :1 • SSOP-30P (0.65mm pitch) header board*1 2 :1 • Signal line conversion board for SSOP-30P (0.65mm pitch)* • Operation manual (English version, this manual) :1 • Operation manual (Japanese version) :1 *1 : Referred to as the “header board”. *2 : Referred to as the “conversion board”. The footprint of a mass-produced MCU is prepared on a user's target board, and it mounts there directly. 3. Procedure for Connecting to a User System ■ Connecting 1. Mount the conversion board on the user system. The location of pin 1 of the device is indicated by the cut-away corner of the conversion board. 2. Connect the header board to the user system on which the conversion board is mounted (The connector shape prevents incorrect connections) (See Figure 2). CN3 2 2 1 CN2 1 CN1 CN2 CN1 Conversion board 120 119 120 119 Header board Figure 2 Connection position (Top view) ■ Disconnection When removing the conversion board from the header board, do not apply excessive force to avoid stripping the conversion board from the target board. 2 4. Notes 4.1 Handling precautions Please take note of the following points to ensure that the header board and conversion board are always used correctly in a suitable environment. • Do not apply excessive force to the conversion board mounted on the user system when the header board and conversion board are connected. • Take care not to apply excessive force to the conversion board mounted on the user system when connecting or disconnecting the header board and conversion board. 4.2 Notes on designing ■ Notes on designing the printed circuit board for the user system When the header board is connected to the user system, parts mounted around the conversion board on the user system may come into contact with the header board if the heights of the parts are too large. To prevent this, design the printed circuit board for the user system such that the components do not exceed the height shown in Figure 3. Figure 3 shows the dimensions of the header board and conversion board. 40.0mm 8.2mm CN3 1 40.0mm CN2 20 CN1 CN2 CN1 2 119 120 20 120 17.5mm 2 1 2 2 Conversion board 119 Header board Approx. 11.0mm Engaged diagram CN3 : Incorrect insertion prevention socket CN1/CN2 : MCU board I/F connector Figure 3 Header board and conversion board dimensions 3 ■ MCU footprint design precautions Figure 4 shows the recommended footprint dimensions for the conversion board mounted on the printed circuit board of the user system. Take the footprint in Figure 4 into consideration as well as the footprint of the mass-produced MCU when designing the printed circuit board for the user system. 0.65mm × 14 = 9.1± 0.1mm 9.2 ± 0.1mm 5.6 ± 0.1mm 0.65 ± 0.05mm Pin 1 Figure 4 Recommended footprint dimensions for mounting conversion board ■ Notes on mounting mass-produced MCUs Unlike previous header boards, this product does not use the YQPACK manufactured by Tokyo Eletech Corporation. As a result, you cannot perform evaluation by mounting a mass-produced MCU on the conversion board. 4 5. Specifications ■ General specifications Table 3 lists the general specifications of the header board. Table 3 General specifications Item Description Operating temperature and storage temperature Remarks Operation: +10 °C to +35 °C Storage: -10 °C to +50 °C Operating humidity and stor- Operation: 35% to 85% age humidity Storage: 35% to 85% External dimensions No condensation Header board Approximately: 40.0mm × 40.0mm × 8.0mm (The height includes the connector) Conversion board Approximately: 17.5mm × 8.2mm × 8.0mm (The height includes the connector) ■ Main parts Table 4 lists the main parts of the header board and conversion connector. Table 4 Main parts Part Description MCU board I/F connector (Header board side) 120 pins, 0.5mm pitch, 2-piece connector (Straight) × 2 Model number: WR-120SB-VF-N1 (from Japan Aviation Electronics Industry, Ltd.) Incorrect insertion prevention socket (Header board side) 2 pins, 2.54mm pitch, 1-piece socket (Straight) Model number: PCW-3-1-1PW (from Mac Eight Co. Ltd.) Socket I/F connector between header board and 20 pins, 0.5mm pitch × 1 each conversion board Model number: AXK5S20535 (Header board side, conversion board side) (from Matsushita Electric Works Ltd.) Socket I/F connector between header board and 20 pins, 0.5mm pitch × 1 each conversion board Model number: AXK5S20330 (Header board side, conversion board side) (from Matsushita Electric Works Ltd.) 5 ■ Function block diagram The header board connects to the mass-produced MCU's pin signals via the MCU board I/F connector and the conversion board connected to the target board. The header board does not contain any ICs or other internal components. Figure 5 shows the block diagram. MCU board I/F connector (from Japan Aviation Electronics Industry, Ltd.) Header board I/F connector (from Japan Aviation Electronics Industry, Ltd.) Header board Conversion board I/F connector (from Matsushita Electric Works Ltd.) Conversion board I/F connector (from Matsushita Electric Works Ltd.) Conversion board User target system (Footprint for package) Figure 5 Function block diagram 6 ■ MCU board I/F connectors (CN1/CN2/CN3) CN1 and CN2 are MCU board I/F connectors. CN3 is the incorrect insertion prevention socket of the MCU board. The pin assignment of the MCU board I/F connector CN1 is shown in Table 5, and the pin assignment of the MCU board I/F connector CN2 is shown in Table 6. Table 5 Pin assignment of the MCU board I/F connector CN1 Connector Evaluation Connector Evaluation Connector Evaluation Signal Signal Signal MCU pin pin MCU pin pin MCU pin pin name name name number number number number number number 1 A9 PC4 41 E2 LVR3 81 P3 BSOUT 2 B9 PC1 42 E1 LVSS 82 P4 BDBMX 3 C9 PC2 43 F4 LVDREXT 83 R1 P83 4 D9 PC3 44 F3 LVDBGR 84 R2 BRSTX 5 A8 PC0 45 F2 LVDENX 85 R3 X0A 6 B8 PB4 46 F1 P22A 86 R4 RSTX 7 C8 PB5 47 ⎯ GND 87 T1 ROMS1 8 D8 PB6 48 ⎯ GND 88 T2 BSIN 9 A7 PB7 49 G4 P20A 89 T3 Vss 10 B7 PB2 50 G3 NC1 90 T4 X0 11 C7 PB0 51 G2 P21A 91 U1 BEXCK 12 D7 PB1 52 G1 P23A 92 U2 X1 13 A6 PB3 53 H4 P24A 93 U3 MOD 14 B6 PA2 54 H3 P25A 94 U4 PF2 15 C6 P95 55 H2 P26A 95 V1 X1A 16 D6 PA0 56 H1 P27A 96 V2 Vcc53 17 A5 PA3 57 J4 P24B 97 ⎯ GND 18 B5 P94 58 J3 P50 98 ⎯ GND 19 C5 P90 59 J2 P23B 99 V3 PINT0 20 D5 P91 60 J1 P51 100 V4 PSEL_EXT 21 A4 PA1 61 K1 P52 101 R5 PF1 22 A3 P93 62 K2 P55 102 T5 PF0 23 ⎯ GND 63 K3 P54 103 U5 NC2 24 ⎯ GND 64 K4 P53 104 V5 PENABLE 25 A2 CSVENX 65 L1 P70 105 R6 APBENX 26 A1 Vss 66 L2 P74 106 T6 PINT1 27 B4 P92 67 L3 P73 107 U6 PCLK 28 B3 TCLK 68 L4 P72 108 V6 PADDR0 29 B2 LVCC 69 M1 P71 109 R7 PACTIVE 30 B1 LVDIN 70 M2 P76 110 T7 PLOCK 31 C4 Cpin 71 M3 P80 111 U7 PWRITE 32 C3 Vcc51 72 M4 P77 112 V7 PADDR1 33 C2 LVDENX2 73 ⎯ GND 113 R8 PADDR2 34 C1 LVR4 74 ⎯ GND 114 T8 PADDR3 35 D4 TESTO 75 N1 P75 115 U8 PADDR4 36 D3 LVDOUT 76 N2 P82 116 V8 PADDR5 37 D2 LVR2 77 N3 PG0 117 R9 PADDR7 38 D1 BGOENX 78 N4 P84 118 T9 PRDATA0 39 E4 LVR1 79 P1 P81 119 U9 PADDR6 40 E3 LVR0 80 P2 ROMS0 120 V9 PRDATA1 7 Table 6 Pin assignment of the MCU board I/F connector CN2 Connector Evaluation MCU pin pin number number 1 A10 8 Signal name PC5 Connector Evaluation MCU pin pin number number 41 E17 Signal name NC4 Connector Evaluation MCU pin pin number number 81 Signal name P16 P34 2 B10 PD0 42 E18 SEL0 82 P15 P35 3 C10 PC6 43 F15 SEL3 83 R18 P44 4 D10 PC7 44 F16 SEL4 84 R17 P36 5 A11 PD1 45 F17 SEL1 85 R16 P31 6 B11 PD2 46 F18 P04C 86 R15 AVcc3 7 C11 PD3 47 ⎯ GND 87 T18 P40 8 D11 PD4 48 ⎯ GND 88 T17 P32 9 A12 PD5 49 G15 P06C 89 T16 AVss 10 B12 PD7 50 G16 P07C 90 T15 AVR 11 C12 P61 51 G17 P05C 91 U18 P33 12 D12 P60 52 G18 P00C 92 U17 P30 13 A13 PD6 53 H15 P01C 93 U16 AVR3 14 B13 P64 54 H16 P02C 94 U15 P15 15 C13 P66 55 H17 P03C 95 V18 AVcc 16 D13 P65 56 H18 P07A 96 V17 DA0 17 A14 P62 57 J15 P04A 97 ⎯ GND 18 B14 PE0A 58 J16 P05A 98 ⎯ GND 19 C14 PE3A 59 J17 P06A 99 V16 P14 20 D14 PE2A 60 J18 P03A 100 V15 P10 21 A15 P63 61 K18 P02A 101 R14 P16 22 A16 P67 62 K17 P07B 102 T14 DA1 23 ⎯ GND 63 K16 P01A 103 U14 P13 24 ⎯ GND 64 K15 P00A 104 V14 PWDATA7 25 A17 PE4A 65 L18 P06B 105 R13 P11 26 A18 Vcc54 66 L17 P05B 106 T13 P12 27 B15 PE1A 67 L16 P04B 107 U13 NC3 28 B16 PE5A 68 L15 P03B 108 V13 PWDATA3 29 B17 PE7A 69 M18 P02B 109 R12 PWDATA5 30 B18 PE3B 70 M17 P00B 110 T12 PWDATA6 31 C15 PE6A 71 M16 P46 111 U12 PWDATA4 32 C16 Vss 72 M15 P47 112 V12 PRDATA7 33 C17 PE2B 73 ⎯ GND 113 R11 PWDATA0 34 C18 PE7B 74 ⎯ GND 114 T11 PWDATA1 35 D15 PE1B 75 N18 P01B 115 U11 PWDATA2 36 D16 PE0B 76 N17 P43 116 V11 PRDATA6 37 D17 PE6B 77 N16 P41 117 R10 PRDATA3 38 D18 SEL2 78 N15 P42 118 T10 PRDATA4 39 E15 PE5B 79 P18 P45 119 U10 PRDATA5 40 E16 PE4B 80 P17 P37 120 V10 PRDATA2 ■ Pin assignments for I/F between header board and conversion board (connection table) Table 7 lists the pin assignments for the interface between the header board and conversion board. Table 7 Pin assignments (connection table) Conversion board edge face through hole part Matsushita Electric Works Ltd. connector part (Conversion board/header board) Japan Aviation Electronics Industry Ltd. connector part (Header board) 1 CN1- 2 CN2- 101 2 CN1- 6 CN1- 102 3 CN1- 4 CN1- 101 4 CN1- 1 CN1- 93 5 CN1- 5 CN1- 90 6 CN1- 7 CN1- 92 7 CN1- 3, CN1- 8, CN1- 16, CN2- 8, CN2- 16 CN1- 89 VSS 8 CN2- 19 CN1- 96 VCC 9 CN2- 15 CN1- 77 10 CN2- 13 CN1- 95 11 CN2- 17 CN1- 85 12 CN2- 20 CN1- 86 13 CN2- 14 CN2- 95 14 CN2- 18 CN2- 89 15 CN2- 2 CN2- 70 16 CN2- 6 CN2- 75 17 CN2- 4 CN2- 69 18 CN2- 1 CN2- 68 19 - - 20 CN2- 5 CN2- 67 21 CN2- 7 CN2- 66 22 CN2- 3 CN2- 65 23 CN1- 19 CN2- 62 24 CN1- 15 CN2- 100 25 CN1- 13 CN2- 105 26 - - 27 CN1- 17 CN2- 106 28 CN1- 20 CN2- 103 29 CN1- 14 CN2- 99 30 CN1- 18 CN2- 94 Remarks 9 SS01-26025-1E FUJITSU SEMICONDUCTOR • SUPPORT SYSTEM F2MC-8FX Family SSOP-30P (0.65mm pitch) HEADER BOARD MB2146-271 OPERATION MANUAL August 2007 the first edition Published FUJITSU LIMITED Electronic Devices Edited Business Promotion Dept.