The following document contains information on Cypress products. FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-26009-1E F2MC-8FX Family LQFP-100P (0.5 mm pitch) HEADER BOARD MB2146-250 OPERATION MANUAL PREFACE Thank you for purchasing the LQFP-100P (0.5 mm pitch) * 1 header board (Model number : MB2146-250) for the F2MC *2 -8FX family. MB2146-250 is a header board used to connect the MCU board (Model number : MB2146-301, MB2146-303) which mounted F2MC-8FX family evaluation MCU to a user system. This manual explains the handling of the MB2146-250 for the F2MC-8FX family. Before using MB2146-250, be sure to read this manual. Consult the Sales representatives or the Support representatives of Fujitsu Limited for mass-produced MCUs and evaluation MCUs which correspond on MB2146-250. *1 : The lead pitch of package (FPT-100P-M05) is 0.5 mm and the body size is 14 mm × 14 mm. *2 : F2MC is the abbreviation used for FUJITSU Flexible Microcontroller. ■ Caution of the products described in this document The following precautions apply to the product described in this manual. CAUTION The wrong use of a device will give an injury and may cause malfunction on customers system. Cuts This product has parts with sharp points that are exposed. Do not touch edge of the product with your bare hands. Damage When connect the header board to the user system, correctly position the index mark (▲) on the NQPACK mounted on the user system with the 1 pin direction(1) on the header board, otherwise the MCU board and user system might be damaged. Damage When mounting a mass production MCU, correctly position pin 1, otherwise the mass production MCU and user system might be damaged. i • The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. • The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of FUJITSU semiconductor device; FUJITSU does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating the device based on such information, you must assume any responsibility arising out of such use of the information. FUJITSU assumes no liability for any damages whatsoever arising out of the use of the information. • Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU or any third party or does FUJITSU warrant non-infringement of any third-party’s intellectual property right or other right by using such information. FUJITSU assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would result from the use of information contained herein. • The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite). Please note that FUJITSU will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. • Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. • If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be required for export of those products from Japan. ©2006 FUJITSU LIMITED Printed in Japan ii 1. Product Outline ■ Product outline This product is a header board (referred to as header board) used to connect the MCU board (Model number : MB2146-301, MB2146-303) which mounted an evaluation MCU in the F2MC-8FX family of Fujitsu 8-bit microcontrollers to a user system. To build an F2MC-8FX evaluation environment, combine three products as shown in Figure 1: the header board, MCU board, and BGM adapter (Model number : MB2146-09). 㪤㪙㪉㪈㪋㪍㪄㪇㪐 MCU board BGM adapter Header board Figure 1 System configuration ■ Product configuration Table 1 lists the product configuration in the header board, and Table 2 lists options. Table 1 Product cofiguration Name Description Remarks F2MC-8FX LQFP-100P (0.5 mm pitch) header board [Model number : MB2146-250] Connector/LQFP100pin (0.5 mm pitch) Package conversion [Model number : YQPACK100SD] (Tokyo Eletech Corporation) I/F between header board and NQPACK Accessory (Finishing connection) [Model number : NQPACK100SD] (Tokyo Eletech Corporation) User system mounting Accessory [Model number : HQPACK100SD] (Tokyo Eletech Corporation) It is used at the time of mass-production MCU Accessory mounting to NQPACK. ⎯ Table 2 Option Name Description BGM adapter [Model number : MB2146-09] ICE unit for F2MC-8FX MCU board [Model number : MB2146-301, MB2146-303] Built-in MB95FV100B-101, MB95FV100B-103 Remarks ⎯ Built-in F2MC-8FX evaluation MCU * * : Several types of evaluation MCUs are available depending on their applications. Purchase the one that satisfies the service conditions. 1 2. Checking the Delivered Product Before using the MB2146-250, confirm that the following components are included in the box: :1 • LQFP-100P (0.5 mm pitch) Header board *1 • Screws for securing Header board (M2 × 10 mm, 0.4 mm pitch) :4 2 :1 • NQPACK100SD * :1 • HQPACK100SD *3 • Operation manual (English version, this manual) :1 *1 : Referred to as “header board”. Header board is mounted on YQPACK100SD (Tokyo Eletech Corporation) , referred to as “YQPACK”. *2 : IC socket manufactured by Tokyo Eletech Corporation, referred to as “NQPACK”, and supplied with a special screwdriver and 2 guide pins. A socket offering higher reliability, NQPACK100SD-SL (Tokyo Eletech Corporation, sold separately) , can be used by making an IC socket mounting hole on the user system board. For more information, contact Tokyo Eletech Corporation. *3 : IC socket cover manufactured by Tokyo Eletech Corporation, referred to as “HQPACK”, with 4 screws for securing HQPACK (M2 × 6 mm, 0.4 mm pitch) . 3. Handling Precautions The header board is precision-manufactured to improve dimensional accuracy and to ensure reliable contact. The header is therefore sensitive to mechanical shock. To ensure correct use of the header in the proper environment, observe the following points regarding its insertion and removal: • To avoid placing stress on the NQPACK mounted on the user system board during connecting the header board. 2 4. Notes on Designing ■ Notes on designing PC board for the user system When the header board is connected to the user system, the parts mounted around the NQPACK in the user system may be touched the header board if the height of the parts is tall. To prevent this, design the printed circuit board for the user system such that the components do not exceed the height shown in Figure 2. Figure 2 shows dimension of the header board. 13.0 mm PCW-1-1PW :MAC EIGHT 40.0 mm 㪈㪇㪇 WR-120SB-VF-N1 : JAE *2 㪉㪍 㪉㪌 㪈㪈㪐 㪈㪈㪐 㪈㪉㪇 1.6 mm 4.85 mm 㪚㪥㪈 㪌㪇 㪬㪈 㪈 Approximately 15.85 mm *1 㪌㪈 㪈㪉㪇 㪚㪥㪉 40.0 mm 㪎㪌 㪎㪍 㪈 㪉 㪈 㪉 㪚㪥㪊 18.0 mm 30.0 mm 4-R5.0 WR-120SB-VF-N1 : JAE *2 YQSOCKET100SDF :Tokyo Eletech Corporation YQPACK100SD :Tokyo Eletech Corporation NQPACK100SD :Tokyo Eletech Corporation User system U1 : User system I/F connector CN3 : Incorrect insertion prevention socket CN1/CN2 : MCU board I/F connector *1 : The height differs slightly depending on how the YQPACK and NQPACK are engaged. *2 : Japan Aviation Electronics Industry, Limited Figure 2 Header board dimensions 3 ■ MCU footprint design notes 0.5 mm 0.25 mm 2.0 mm Figure 3 shows the recommended footprint dimensions of the NQPACK mounted on the printed circuit board for the user system. Take the footprint in Figure3 into consideration as well as the footprint of the mass production MCU when designing the printed circuit board for the user system. To follow updated information, be sure to contact Tokyo Eletech Corporation whenever designing the PC board. 2.0 mm Figure 3 Recommended footprint dimensions footprint for mounting the NQPACK 4 17.0 mm 13.0 mm No.1 Pin 5. Procedure for Connecting to the User System ■ Connecting Please mount the supplied NQPACK on the user system before using the LQFP-100P (0.5 mm pitch) header board. 26 100 1 75 51 25 50 76 1. To connect the header board to the user system, match pin 1 indicated by the index mark (▲) on the NQPACK mounted on the user system with pin 1 indicated by the index mark (angle cut linearly at one place only in slik screen) on the header board and then insert it (See Figure 4) . The pin of YQPACK is thin and easy to bend. Insert NQPACK after confirm that the pin of YQPACK is not bent. NQPACK index mark Header board index mark Figure 4 Index Position 2. Insert each screw for securing header board in each of the four drilled holes on the header board, and then tighten the screws diagonally. The center screw hole is not used. To tighten the screws, use the special screwdriver supplied with the NQPACK to finally tighten the four screws in sequence. Tightening the screws too tight might result in a defective contact. 3. Connect the MCU board to the header board while being careful not to excessively force the NQPACK. The MCU board can be connected to the header board only in the correct orientation as they have an incorrect insertion header socket to prevent reverse connection. Figure 5 illustrates how the MCU board, header board, NQPACK, and user system are connected together. 5 MCU board Evaluation MCU MCU board Screws for securing Header board Header board YQSOCKET Connection at the time of shipment YQPACK NQPACK User system Figure 5 Connecting MCU board/header board to user system ■ Disconnection 1. Remove the MCU board from the header board. Detach the four corners slowly in sequence not to excessively force the junction with the NQPACK. 2. Remove all of the four screws from the header board. Pull out the header board vertically from the NQPACK. Remove the header board slowly not to excessively force the junction with the NQPACK. 6 6. Mounting Mass Production MCUs ■ Mounting To mount a mass production MCU on the user system, use the supplied HQPACK (IC socket cover) (See Figure 6) . 1. To mount a mass production MCU on the user system, match the index mark (▲) on the NQPACK mounted on the user system with the index mark (●) on the mass production MCU. 2. Confirm that the mass production MCU is correctly mounted on the NQPACK. Next, match the index mark of HQPACK with the index mark of NQPACK and insert it (angle cut linearly at one place only) . The pin of HQPACK is thin and easy to bend. Insert NQPACK after confirm that the pin of HQPACK is not bent. 3. Insert each screw for securing HQPACK in each of four drilled holes on the HQPACK, and then tighten the screws diagonally. To tighten the screws, use the special screwdriver supplied with the NQPACK to finally tighten the four screws in sequence. Tightening the screws too tight might result in a defective contact. Screws for securing HQPACK HQPACK Mass production MCU NQPACK User system Figure 6 Mounting a mass production MCU ■ Disconnection To remove the HQPACK, remove all of the four screws and pull out the HQPACK vertically from the NQPACK. When you take out the mass production MCU, the mass production MCU is handled by using a vacum pick-up tool. Do not attempt to remove the mass production MCU forcibly, for example, using a screwdriver as doing so can bend the pins of the mass production MCU or break the NQPACK. 7 7. Product specification ■ General specification Table 3 lists the general specifications of the header board. Table 3 General specification Item Description Operating temperature and storage temperature 5 °C to 35 °C (operation) , 0 °C to 40 °C (storage) Operating humidity and storage humidity 20 % to 80 % (operation) , 20 % to 80 % (storage) Dimensions Approximately 40 mm × 40 mm × 16 mm (Height contains YQPACK and NQPACK) ■ Main part The main part of a header board is shown in Table 4. Table 4 Main part Part Description MCU board I/F connector 120 pins, 0.5 mm pitch, 2-piece connector (straight) × 2 [Model number : WR-120SB-VF-N1 (Japan Aviation Electronics Industry, Limited) ] Incorrect insertion prevention socket 2 pins, 2.54 mm pitch, 1-piece socket (Straight) [Model number : PCW-3-1-1PW (MAC EIGHT) ] User target system I/F connector Socket 100 pins, 0.5 mm pitch [Model number : YQSOCKET100SDF (Tokyo Eletech Corporation) ] ■ Functional block diagram A header board performs socket conversion between the MCU board I/F connector and YQPACK. The header board does not contain any ICs or other internal components. A Figure 7 shows the block diagram. MCU board I/F connector User target system I/F connector (Package correspondence socket) Figure 7 Functional block diagram 8 ■ MCU board I/F connector(CN1/CN2/CN3) CN1 and CN2 are MCU board I/F connectors. CN3 is the incorrect insertion prevention socket of a MCU board. The pin assignment of the MCU board I/F connector CN1 is shown in Table 5, and the pin assignment of the MCU board I/F connector CN2 is shown in Table 6. Table 5 Pin assignment of the MCU board I/F connector CN1 Connector Evaluation MCU Pin Pin Numbers Numbers 1 A9 2 B9 Signal name Connector Evaluation MCU Pin Pin Numbers Numbers Signal name Connector Evaluation MCU Pin Pin Numbers Numbers Signal name PC4 41 E2 LVR3 81 P3 BSOUT PC1 42 E1 LVSS 82 P4 BDBMX 3 C9 PC2 43 F4 LVDREXT 83 R1 P83 4 D9 PC3 44 F3 LVDBGR 84 R2 BRSTX 5 A8 PC0 45 F2 LVDENX 85 R3 X0A 6 B8 PB4 46 F1 P22A 86 R4 RSTX 7 C8 PB5 47 ⎯ GND 87 T1 ROMS1 8 D8 PB6 48 ⎯ GND 88 T2 BSIN 9 A7 PB7 49 G4 P20A 89 T3 Vss 10 B7 PB2 50 G3 NC1 90 T4 X0 11 C7 PB0 51 G2 P21A 91 U1 BEXCK 12 D7 PB1 52 G1 P23A 92 U2 X1 13 A6 PB3 53 H4 P24A 93 U3 MOD 14 B6 PA2 54 H3 P25A 94 U4 PF2 15 C6 P95 55 H2 P26A 95 V1 X1A 16 D6 PA0 56 H1 P27A 96 V2 Vcc53 17 A5 PA3 57 J4 P24B 97 ⎯ GND 18 B5 P94 58 J3 P50 98 ⎯ GND 19 C5 P90 59 J2 P23B 99 V3 PINT0 20 D5 P91 60 J1 P51 100 V4 PSEL_EXT 21 A4 PA1 61 K1 P52 101 R5 PF1 22 A3 P93 62 K2 P55 102 T5 PF0 23 ⎯ GND 63 K3 P54 103 U5 NC2 24 ⎯ GND 64 K4 P53 104 V5 PENABLE 25 A2 CSVENX 65 L1 P70 105 R6 APBENX 26 A1 Vss 66 L2 P74 106 T6 PINT1 27 B4 P92 67 L3 P73 107 U6 PCLK 28 B3 TCLK 68 L4 P72 108 V6 PADDR0 29 B2 LVCC 69 M1 P71 109 R7 PACTIVE 30 B1 LVDIN 70 M2 P76 110 T7 PLOCK 31 C4 Cpin 71 M3 P80 111 U7 PWRITE 32 C3 Vcc51 72 M4 P77 112 V7 PADDR1 33 C2 LVDENX2 73 ⎯ GND 113 R8 PADDR2 34 C1 LVR4 74 ⎯ GND 114 T8 PADDR3 35 D4 TESTO 75 N1 P75 115 U8 PADDR4 36 D3 LVDOUT 76 N2 P82 116 V8 PADDR5 37 D2 LVR2 77 N3 PG0 117 R9 PADDR7 38 D1 BGOENX 78 N4 P84 118 T9 PRDATA0 39 E4 LVR1 79 P1 P81 119 U9 PADDR6 40 E3 LVR0 80 P2 ROMS0 120 V9 PRDATA1 9 Table 6 Pin assignment of the MCU board I/F connector CN2 Connector Evaluation MCU Pin Pin Numbers Numbers 1 A10 10 Signal name Connector Evaluation MCU Pin Pin Numbers Numbers Signal name Connector Evaluation MCU Pin Pin Numbers Numbers Signal name PC5 41 E17 NC4 81 P16 P34 2 B10 PD0 42 E18 SEL0 82 P15 P35 3 C10 PC6 43 F15 SEL3 83 R18 P44 4 D10 PC7 44 F16 SEL4 84 R17 P36 5 A11 PD1 45 F17 SEL1 85 R16 P31 6 B11 PD2 46 F18 P04C 86 R15 AVcc3 7 C11 PD3 47 − GND 87 T18 P40 8 D11 PD4 48 − GND 88 T17 P32 9 A12 PD5 49 G15 P06C 89 T16 AVss 10 B12 PD7 50 G16 P07C 90 T15 AVR 11 C12 P61 51 G17 P05C 91 U18 P33 12 D12 P60 52 G18 P00C 92 U17 P30 13 A13 PD6 53 H15 P01C 93 U16 AVR3 14 B13 P64 54 H16 P02C 94 U15 P15 15 C13 P66 55 H17 P03C 95 V18 AVcc 16 D13 P65 56 H18 P07A 96 V17 DA0 17 A14 P62 57 J15 P04A 97 − GND 18 B14 PE0A 58 J16 P05A 98 − GND 19 C14 PE3A 59 J17 P06A 99 V16 P14 20 D14 PE2A 60 J18 P03A 100 V15 P10 21 A15 P63 61 K18 P02A 101 R14 P16 22 A16 P67 62 K17 P07B 102 T14 DA1 23 − GND 63 K16 P01A 103 U14 P13 24 − GND 64 K15 P00A 104 V14 PWDATA7 25 A17 PE4A 65 L18 P06B 105 R13 P11 26 A18 Vcc54 66 L17 P05B 106 T13 P12 27 B15 PE1A 67 L16 P04B 107 U13 NC3 28 B16 PE5A 68 L15 P03B 108 V13 PWDATA3 29 B17 PE7A 69 M18 P02B 109 R12 PWDATA5 30 B18 PE3B 70 M17 P00B 110 T12 PWDATA6 31 C15 PE6A 71 M16 P46 111 U12 PWDATA4 32 C16 Vss 72 M15 P47 112 V12 PRDATA7 33 C17 PE2B 73 − GND 113 R11 PWDATA0 34 C18 PE7B 74 − GND 114 T11 PWDATA1 35 D15 PE1B 75 N18 P01B 115 U11 PWDATA2 36 D16 PE0B 76 N17 P43 116 V11 PRDATA6 37 D17 PE6B 77 N16 P41 117 R10 PRDATA3 38 D18 SEL2 78 N15 P42 118 T10 PRDATA4 39 E15 PE5B 79 P18 P45 119 U10 PRDATA5 40 E16 PE4B 80 P17 P37 120 V10 PRDATA2 ■ User system I/F YQPACK (U1) The pin assignment of user system I/F YQPACK in a header board is shown in Table 7. Table 7 Pin assignment of the user system I/F YQPACK in header board Connector Pin Numbers Signal name Connector Pin Numbers Signal name Connector Pin Numbers Signal name 1 VSS 35 P40/AN08 69 PD3/S19 2 PG0 (C pin) 36 P41/AN09 70 PD2/S18 3 P00/INT00/HC00 37 P42/AN10 71 PD1/S17 4 P01/INT01/HC01 38 P43/AN11 72 PD0/S16 5 P02/INT02/HC02 39 P53/TRG1 73 PC7/S15 6 P03/INT03/HC03 40 P70/TO0 74 PC6/S14 7 P04/INT04/HC04 41 P71/TI0 75 PC5/S13 8 P05/INT05/HC05 42 P67/S39/SIN 76 VCC 9 P06/INT06/HC06 43 P66/S38/SOT 77 PC4/S12 10 P07/INT07/HC07 44 P65/S37/SCK 78 PC3/S11 11 P10/UI0 45 P64/S36/EC1 79 PC2/S10 12 P11/UO0 46 P63/S35/TO11 80 PC1/S09 13 P12/UCK0 47 P62/S34/TO10 81 PC0/S08 14 P13/TARG0/ADTG 48 RSTX/FTEST 82 PB7/S07 15 P14/PPG0 49 X0A 83 PB6/S06 16 P20/PPG00 50 X1A 84 PB5/S05 17 P21/TO00 51 VSS 85 PB4/S04 18 P22/TO00 52 X1 86 PB3/S03 19 P23/TO01 53 X0 87 PB2/S02 20 P24/EC0 54 MOD 88 PB1/S01 21 P50/SCL0 55 P61/S33/PPG11 89 PB0/S00 22 P51/SDA0 56 P60/S32/PPG10 90 PA3/COM3 23 P52/PPG1 57 PE7/S31/INT13 91 PA2/COM2 24 AVR 58 PE6/S30/INT12 92 PA1/COM1 25 AVCC 59 PE5/S29/INT11 93 PA0/COM0 26 AVSS 60 PE4/S28/INT10 94 P95/C1 27 P30/AN00 61 PE3/S27 95 P94/C0 28 P31/AN01 62 PE2/S26 96 P93/V0 29 P32/AN02 63 PE1/S25 97 P92/V1 30 P33/AN03 64 PE0/S24 98 P91/V2 31 P34/AN04 65 PD7/S23 99 P90/V3 32 P35/AN05 66 PD6/S22 100 VCC 33 P36/AN06 67 PD5/S21 34 P37/AN07 68 PD4/S20 11 SS01-26009-1E FUJITSU SEMICONDUCTOR • SUPPORT SYSTEM F2MC-8FX Family LQFP-100P (0.5 mm pitch) HEADER BOARD MB2146-250 OPERATION MANUAL February 2006 the first edition Published FUJITSU LIMITED Electronic Devices Edited Business Promotion Dept.