TAI-SAW TECHNOLOGY CO., LTD. SMD 7.0x5.0 100MHz VCXO MODEL NO.: TX0171A REV. NO.: 2.0 Revise: Rev. Rev. Page Rev. Account Date 1 2 N/A P3 Initial release 01/04/11’ N/A 08/12/11’ 1.0 Frequency Stability Change TAI-SAW TECHNOLOGY CO., LTD. Ref. No. Reviser Quinton Lo Ginger Huang TST DCC Release document 2 TAI-SAW TECHNOLOGY CO., LTD. No. 3, Industrial 2nd Rd., Ping-Chen Industrial District, Taoyuan, 324, Taiwan, R.O.C. TEL: 886-3-4690038 FAX: 886-3-4697532 E-mail: [email protected] Web: www.taisaw.com 7.0x5.0 VCXO 100 MHz MODEL NO.: TX0171A REV. NO.:2.0 Features: RoHS Compliant Lead free 1. 3.3V Operation / Complementary PECL Output Lead-free soldering 2. Enable / Disable Tristate Function (6-Pad) 3. Main application: WLAN, SONET/SDH/DWDM, Gigabite Ethernet, Storage Area Network, Digital Video 4. Surface mount 5.0mmx7.0mm crystal oscillator unit Electrical Specifications: Measurement shall be made under room temperature and humidity at below conditions. Temperature: 25+/-3 ℃ Humidity: Below 70% RH Operating Temperature: 0 °C to +70 °C Storage Temperature: -40 °C to +85 °C Characteristics Units Minimum Typical Maximum MHz ppm VDC VDC mA ppm % -25 0.3 +/-150 - 100 3.3+/-5% 1.65 10% 25 3.0 60 - Load ohm - 15 - “0” Level ( Output Logic Low) VDC - - Vdd-1.62 “1” Level ( Output Logic High) VDC Vdd-1.025 - - % 40% - 60% Rise Time (10%->90% VDD) nSec - - 0.6 Fall Time (90%->10% VDD) nSec - - 0.6 Center Frequency Frequency Stability Input Voltage (Operating Vdd) Control Voltage (Vt) Current Consumption Frequency Pullability Linearity Output Duty Cycle Enable/Disable Function PIN#2: High or Open , PIN#4: Enable PIN#2: Low , PIN#4: Disable Package size SMD7.0x5.0x1.8mm #Note1:referred to 25 degC over temperature ranger. TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 3 Mechanical Dimensions (mm): Marking: Line 1 : Frequency (100.00) Line 2 : T XDA (TST logo + Product Code + Data Code + TST Internal Code) 100.00 T XDA Product Code Table Year 2008 2012 2009 2013 2010 2014 2011 2015 Product Code x X x X Date Code Table WK01 WK02 WK03 WK04 WK05 WK06 WK07 WK08 WK09 WK10 WK11 WK12 WK13 A B C D E F G H I J K L M WK14 WK15 WK16 WK17 WK18 WK19 WK20 WK21 WK22 WK23 WK24 WK25 WK26 N O P Q R S T U V W X Y Z WK27 WK28 WK29 WK30 WK31 WK32 WK33 WK34 WK35 WK36 WK37 WK38 WK39 a b c d e f g h i j k l m WK40 WK41 WK42 WK43 WK44 WK45 WK46 WK47 WK48 WK49 WK50 WK51 WK52 n o p q r s t u v TAI-SAW TECHNOLOGY CO., LTD. w x y z TST DCC Release document 4 Tape & Reel: Packing Quantity: 1k /Reel Reel dimension (unit: mm) Tape dimension (unit: mm) Packing direction TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 5 Packing Quantity/Packing: 1K pcs maximum per reel Reflow Profile: Note: 1.Max peak temperature: 260+/-5 deg C; Time: 10+/-2 sec 2. Temperature: 217+/-5 deg C; Time: 90~100 sec TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 6 Reliability Specifications Test name Reference standard Test process / method Mechanical characteristics resistance to Soldering heat (IR reflow) Temp./ Duration : 260°C /10sec ×2 times Total time : 4min.(IR-reflow) Vibration Total peak amplitude : 1.5mm Vibration frequency : 10 to 55 Hz Sweep period : 1.0 minute Vibration directions : 3 mutually perpendicular Duration : 2 hr / direc. directions : 3 impacts per axis Acceleration : 3000g's, +20/-0 % Duration : 0.3 ms (total 18 shocks) Waveform : Half-sine Solder Temperature:265±5°C Duration time: 5±0.5 seconds. Mechanical Shock Solderability EIAJED-4701 -300(301)M(II) MIL-STD 202F method 201A MIL-STD 202F method 213C MIL-STD 883G method 2003 Environmental characteristics Thermal Shock Humidity test Dry heat ( Aging test ) PCT test Heat cycle conditions -55 ℃ (30min) ←→ * cycle time : 10 times 125 ℃ (30min) Temperature : 70 ± 2 °C Relative humidity : 90~95% Duration : 96 hours Temperature : 125 ± 2 °C Duration : 168 hours 2 MIL-STD 883G method 1010.7 MIL-STD 202F method 103B 5 Pressure: 2.06kg/cm (2.03*10 pa) Temperature : 121 ± 2 °C Relative humidity : 100% Duration : 24 hours TAI-SAW TECHNOLOGY CO., LTD. MIL-STD 883G method 1008.2 condition C EIAJED-4701-3 B-123A TST DCC Release document 7