TAI-SAW TECHNOLOGY CO., LTD. SMD 7.0x5.0 32MHz Crystal Oscillator MODEL NO.: TX0460A REV. NO.: 1 Revise: Rev. Rev. Page Rev. Account Date 1 N/A Initial release 08/05/11’ N/A TAI-SAW TECHNOLOGY CO., LTD. Ref. No. Reviser Ann Liu TST DCC Release document 2 TAI-SAW TECHNOLOGY CO., LTD. No. 3, Industrial 2nd Rd., Ping-Chen Industrial District, Taoyuan, 324, Taiwan, R.O.C. TEL: 886-3-4690038 FAX: 886-3-4697532 E-mail: [email protected] Web: www.taisaw.com 7.0x5.0 VCXO 32 MHz MODEL NO.: TX0460A REV. NO.:1 Features: 1. SMD type Voltage Controlled Crystal Oscillator. 2. 3.3V Supply Voltage 3. Optionable stand-by function for output (Tri-state output). Electrical Specifications: Measurement shall be made under room temperature and humidity at below conditions. Temperature: 25+/-3 ℃ Humidity: Below 70% RH Operating Temperature:-20 °C to +90 °C Storage Temperature: -55 °C to +125 °C Characteristics Units Center Frequency Frequency Stability (#note 1) Input Voltage (Operating Vdd) Power Supply Current Control Voltage (Vt) Frequency Pullability MHz ppm VDC mA VDC ppm Frequency stability Vs. Supply Voltage ppm varied 3.3V+/-5% Load Linearity Output Output Level “0” Level “1” Level Symmetry (TW/T*100%) Duty Cycle Rise Time (10%->90% VDD) Fall Time (90%->10% VDD) pF % Minimum Typical Maximum -30 0.15 +/-100 32 3.3+/-5% 1.65 - 30 20 3.15 - - 1.0 2.0 -10% 15 - +10% CMOS VDC VDC % nSec nSec 2.97 - 0.33 - 40% 50% 60% - - 10 10 -115dBc @100Hz Phase Noise dBc/Hz -140dBc @ 1K -155dBc @ 10K Enable/Disable Function Package size PIN#2: High or Open, PIN#4:Enable PIN#2: Low, PIN#4:Disable SMD7.0x5.0x1.8mm TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 3 #Note 1: Frequency stability includes 25℃ tolerance, operating temperature range, aging and voltage or load change. Mechanical Dimensions (mm): Marking: Line 1: Customer Frequency (32.000) Line 2: (pin #1 dot) + TST Logo + Product Code + Date Code 32.000 T xDA ○ Product Code Table Ye a r Pro d u ct Co d e 2008 2009 2010 2011 2012 2013 2014 2015 x X x X Date Code Table WK01 WK02 WK03 WK04 WK05 WK06 WK07 WK08 WK09 WK10 WK11 WK12 A B C D E F G H I J K L WK13 M WK14 WK15 WK16 WK17 WK18 WK19 WK20 WK21 WK22 WK23 WK24 WK25 WK26 N O P Q R S T U V W X Y Z WK27 WK28 WK29 WK30 WK31 WK32 WK33 WK34 WK35 WK36 WK37 WK38 WK39 a b c d e f g h i j k l m WK40 WK41 WK42 WK43 WK44 WK45 WK46 WK47 WK48 WK49 WK50 WK51 WK52 n o p q r s t u v w x y z TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 4 Tape & Reel: Packing Quantity: 1k /Reel REEL DIMENSION (unit: mm) TAPE DIMENSION (unit: mm) 3. PACKING DIRECTION: TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 5 Packing Quantity/Packing: 1K pcs maximum per reel Reflow Profile: Note: 1.Max peak temperature: 260+/-5 deg C; Time: 10+/-2 sec 2. Temperature: 217+/-5 deg C; Time: 90~100 sec TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 6 Reliability Specifications Test name Reference standard Test process / method Mechanical characteristics resistance to Soldering heat (IR reflow) Temp./ Duration : 260°C /10sec ×2 times Total time : 4min.(IR-reflow) Vibration Total peak amplitude : 1.5mm Vibration frequency : 10 to 55 Hz Sweep period : 1.0 minute Vibration directions : 3 mutually perpendicular Duration : 2 hr / direc. directions : 3 impacts per axis Acceleration : 3000g's, +20/-0 % Duration : 0.3 ms (total 18 shocks) Waveform : Half-sine Solder Temperature:265±5°C Duration time: 5±0.5 seconds. Mechanical Shock Solderability EIAJED-4701 -300(301)M(II) MIL-STD 202F method 201A MIL-STD 202F method 213C MIL-STD 883G method 2003 Environmental characteristics Thermal Shock Humidity test Dry heat ( Aging test ) PCT test Heat cycle conditions -55 ℃ (30min) ←→ * cycle time : 10 times 125 ℃ (30min) Temperature : 70 ± 2 °C Relative humidity : 90~95% Duration : 96 hours Temperature : 125 ± 2 °C Duration : 168 hours 2 MIL-STD 883G method 1010.7 MIL-STD 202F method 103B 5 Pressure: 2.06kg/cm (2.03*10 pa) Temperature : 121 ± 2 °C Relative humidity : 100% Duration : 24 hours TAI-SAW TECHNOLOGY CO., LTD. MIL-STD 883G method 1008.2 condition C EIAJED-4701-3 B-123A TST DCC Release document 7