HFA1105 ® Data Sheet June 6, 2006 330MHz, Low Power, Current Feedback Video Operational Amplifier The HFA1105 is a high speed, low power current feedback amplifier built with Intersil’s proprietary complementary bipolar UHF-1 process. This amplifier features an excellent combination of low power dissipation (58mW) and high performance. The slew rate, bandwidth, and low output impedance (0.08Ω) make this amplifier a good choice for driving Flash ADCs. Component and composite video systems also benefit from this op amp’s excellent gain flatness, and good differential gain and phase specifications. The HFA1105 is ideal for interfacing to Intersil’s line of video crosspoint switches (HA4201, HA4600, HA4314, HA4404, HA4344), to create high performance, low power switchers and routers. The HFA1105 is a low power, high performance upgrade for the CLC406. For a comparable amplifier with output disable or output limiting functions, please see the data sheets for the HFA1145 and HFA1135 respectively. For Military grade product, please refer to the HFA1145/883 data sheet. PART TEMP. MARKING RANGE (°C) PACKAGE PKG. DWG. # HFA1105IB 1105IB M8.15 HFA1105IB96 1105IB HFA1105IBZ (Note 1) 1105IBZ HFA1105IBZ96 1105IBZ (Note 1) -40 to 85 8 Ld SOIC 8 Ld SOIC Tape and Reel -40 to 85 Features • Low Supply Current . . . . . . . . . . . . . . . . . . . . . . . . 5.8mA • High Input Impedance . . . . . . . . . . . . . . . . . . . . . . . 1MΩ • Wide -3dB Bandwidth. . . . . . . . . . . . . . . . . . . . . . 330MHz • Very Fast Slew Rate. . . . . . . . . . . . . . . . . . . . . . 1000V/µs • Gain Flatness (to 75MHz) . . . . . . . . . . . . . . . . . . . ±0.1dB • Differential Gain . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.02% • Differential Phase . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.03° • Pin Compatible Upgrade for CLC406 • Pb-Free Plus Anneal Available (RoHS Compliant) Applications • Flash A/D Drivers • Video Switching and Routing • Professional Video Processing • Video Digitizing Boards/Systems • Multimedia Systems • RGB Preamps Ordering Information PART NUMBER FN3395.8 8 Ld SOIC (Pb-free) M8.15 • Medical Imaging • Hand Held and Miniaturized RF Equipment • Battery Powered Communications Pinout HFA1105 (SOIC) TOP VIEW 8 Ld SOIC Tape and Reel (Pb-free) HFA11XXEVAL DIP Evaluation Board for High Speed (Note 2) Op Amps NOTES: 1. Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. NC 1 -IN 2 +IN 3 V- 4 + 8 NC 7 V+ 6 OUT 5 NC 2. Requires a SOIC-to-DIP adapter. See “Evaluation Board” section inside. 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2003, 2006. All Rights Reserved All other trademarks mentioned are the property of their respective owners. HFA1105 Absolute Maximum Ratings Thermal Information Supply Voltage (V+ to V-). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11V DC Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSUPPLY Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8V Output Current (Note 3) . . . . . . . . . . . . . . . . . Short Circuit Protected 30mA Continuous 60mA ≤ 50% Duty Cycle ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>600V Thermal Resistance (Typical, Note 4) θJA (°C/W) SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165 Maximum Junction Temperature (Die) . . . . . . . . . . . . . . . . . . . . 175°C Maximum Junction Temperature (Plastic Package) . . . . . . . . 150°C Maximum Storage Temperature Range . . . . . . . . . . -65°C to 150°C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300°C (Lead Tips Only) Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to 85°C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 3. Output is short circuit protected to ground. Brief short circuits to ground will not degrade reliability, however continuous (100% duty cycle) output current must not exceed 30mA for maximum reliability. 4. θJA is measured with the component mounted on an evaluation PC board in free air. Electrical Specifications VSUPPLY = ±5V, AV = +1, RF = 510W, RL = 100W, Unless Otherwise Specified PARAMETER (NOTE 5) TEST LEVEL TEMP. (°C) MIN TYP MAX UNITS A 25 - 2 5 mV A Full - 3 8 mV B Full - 1 10 µV/°C ∆VCM = ±1.8V A 25 47 50 - dB ∆VCM = ±1.8V A 85 45 48 - dB ∆VCM = ±1.2V A -40 45 48 - dB ∆VPS = ±1.8V A 25 50 54 - dB ∆VPS = ±1.8V A 85 47 50 - dB ∆VPS = ±1.2V A -40 47 50 - dB A 25 - 6 15 µA A Full - 10 25 µA B Full - 5 60 nA/°C ∆VPS = ±1.8V A 25 - 0.5 1 µA/V ∆VPS = ±1.8V A 85 - 0.8 3 µA/V ∆VPS = ±1.2V A -40 - 0.8 3 µA/V ∆VCM = ±1.8V A 25 0.8 1.2 - MΩ ∆VCM = ±1.8V A 85 0.5 0.8 - MΩ TEST CONDITIONS INPUT CHARACTERISTICS Input Offset Voltage Average Input Offset Voltage Drift Input Offset Voltage Common-Mode Rejection Ratio Input Offset Voltage Power Supply Rejection Ratio Non-Inverting Input Bias Current Non-Inverting Input Bias Current Drift Non-Inverting Input Bias Current Power Supply Sensitivity Non-Inverting Input Resistance ∆VCM = ±1.2V A -40 0.5 0.8 - MΩ A 25 - 2 7.5 µA A Full - 5 15 µA B Full - 60 200 nA/°C ∆VCM = ±1.8V A 25 - 3 6 µA/V ∆VCM = ±1.8V A 85 - 4 8 µA/V ∆VCM = ±1.2V A -40 - 4 8 µA/V ∆VPS = ±1.8V A 25 - 2 5 µA/V Inverting Input Bias Current Inverting Input Bias Current Drift Inverting Input Bias Current Common-Mode Sensitivity Inverting Input Bias Current Power Supply Sensitivity 2 ∆VPS = ±1.8V A 85 - 4 8 µA/V ∆VPS = ±1.2V A -40 - 4 8 µA/V FN3395.8 June 6, 2006 HFA1105 Electrical Specifications VSUPPLY = ±5V, AV = +1, RF = 510W, RL = 100W, Unless Otherwise Specified (Continued) (NOTE 5) TEST LEVEL TEMP. (°C) MIN TYP MAX UNITS Inverting Input Resistance C 25 - 60 - Ω Input Capacitance C 25 - 1.6 - pF Input Voltage Common Mode Range (Implied by VIO CMRR, +RIN, and -IBIAS CMS Tests) A 25, 85 ±1.8 ±2.4 - V PARAMETER TEST CONDITIONS A -40 ±1.2 ±1.7 - V Input Noise Voltage Density (Note 8) f = 100kHz B 25 - 3.5 - nV/√Hz Non-Inverting Input Noise Current Density (Note 8) f = 100kHz B 25 - 2.5 - pA/√Hz Inverting Input Noise Current Density (Note 8) f = 100kHz B 25 - 20 - pA/√Hz AV = -1 C 25 - 500 - kΩ AV = +1, +RS = 510Ω B 25 - 270 - MHz B Full - 240 - MHz AV = -1, RF = 425Ω B 25 - 300 - MHz AV = +2 B 25 - 330 - MHz B Full - 260 - MHz TRANSFER CHARACTERISTICS Open Loop Transimpedance Gain AC CHARACTERISTICS RF = 510Ω, Unless Otherwise Specified -3dB Bandwidth (VOUT = 0.2VP-P, Note 8) AV = +10, RF = 180Ω Full Power Bandwidth (VOUT = 5VP-P at AV = +2/-1, 4VP-P at AV = +1, Note 8) Gain Flatness (AV = +2, VOUT = 0.2VP-P, Note 8) Gain Flatness (AV = +1, +RS = 510Ω, VOUT = 0.2VP-P, Note 8) B 25 - 130 - MHz B Full - 90 - MHz AV = +1, +RS = 510Ω B 25 - 135 - MHz AV = -1 B 25 - 140 - MHz AV = +2 B 25 - 115 - MHz To 25MHz B 25 - ±0.03 - dB B Full - ±0.04 - dB To 75MHz B 25 - ±0.11 - dB B Full - ±0.22 - dB To 25MHz B 25 - ±0.03 - dB To 75MHz B 25 - ±0.09 - dB A Full - 1 - V/V A 25 ±3 ±3.4 - V A Full ±2.8 ±3 - V A 25, 85 50 60 - mA A -40 28 42 - mA B 25 - 90 - mA Minimum Stable gain OUTPUT CHARACTERISTICS AV = +2, RF = 510Ω, Unless Otherwise Specified AV = -1, RL = 100Ω Output Voltage Swing (Note 8) Output Current (Note 8) AV = -1, RL = 50Ω Output Short Circuit Current Closed Loop Output Impedance (Note 8) DC B 25 - 0.08 - W Second Harmonic Distortion (VOUT = 2VP-P, Note 8) 10MHz B 25 - -48 - dBc 20MHz B 25 - -44 - dBc Third Harmonic Distortion (VOUT = 2VP-P, Note 8) 10MHz B 25 - -50 - dBc 20MHz B 25 - -45 - dBc Reverse Isolation (S12, Note 8) 30MHz B 25 - -55 - dB 3 FN3395.8 June 6, 2006 HFA1105 Electrical Specifications VSUPPLY = ±5V, AV = +1, RF = 510W, RL = 100W, Unless Otherwise Specified (Continued) PARAMETER TRANSIENT CHARACTERISTICS TEST CONDITIONS (NOTE 5) TEST LEVEL TEMP. (°C) MIN TYP MAX UNITS B 25 - 1.1 - ns B Full - 1.4 - ns AV = +2, RF = 510Ω, Unless Otherwise Specified VOUT = 0.5VP-P Rise and Fall Times Overshoot (Note 6) (VOUT = 0 to 0.5V, VIN tRISE = 1ns) +OS B 25 - 3 - % -OS B 25 - 5 - % Overshoot (Note 6) (VOUT = 0.5VP-P, VIN tRISE = 1ns) +OS B 25 - 3 - % -OS B 25 - 11 - % Slew Rate (VOUT = 4VP-P, AV = +1, +RS = 510Ω) +SR B 25 - 1000 - V/µs B Full - 975 - V/µs B 25 - 650 - V/µs B Full - 580 - V/µs -SR (Note 7) +SR Slew Rate (VOUT = 5VP-P, AV = +2) -SR (Note 7) +SR Slew Rate (VOUT = 5VP-P, AV = -1) -SR (Note 7) B 25 - 1400 - V/µs B Full - 1200 - V/µs B 25 - 800 - V/µs B Full - 700 - V/µs B 25 - 2100 - V/µs B Full - 1900 - V/µs B 25 - 1000 - V/µs B Full - 900 - V/µs To 0.1% B 25 - 15 - ns To 0.05% B 25 - 23 - ns To 0.02% B 25 - 30 - ns VIN = ±2V B 25 - 8.5 - ns RL = 150Ω B 25 - 0.02 - % RL = 75Ω B 25 - 0.03 - % RL = 150Ω B 25 - 0.03 - ° RL = 75Ω B 25 - 0.05 - ° Power Supply Range C 25 ±4.5 - ±5.5 V Power Supply Current (Note 8) A 25 - 5.8 6.1 mA A Full - 5.9 6.3 mA Settling Time (VOUT = +2V to 0V step, Note 8) Overdrive Recovery Time VIDEO CHARACTERISTICS AV = +2, RF = 510Ω, Unless Otherwise Specified Differential Gain (f = 3.58MHz) Differential Phase (f = 3.58MHz) POWER SUPPLY CHARACTERISTICS NOTES: 5. Test Level: A. Production Tested; B. Typical or Guaranteed Limit Based on Characterization; C. Design Typical for Information Only. 6. Undershoot dominates for output signal swings below GND (e.g., 0.5VP-P), yielding a higher overshoot limit compared to the VOUT = 0 to 0.5V condition. See the “Application Information” section for details. 7. Slew rates are asymmetrical if the output swings below GND (e.g. a bipolar signal). Positive unipolar output signals have symmetric positive and negative slew rates comparable to the +SR specification. See the “Application Information” section, and the pulse response graphs for details. 8. See Typical Performance Curves for more information. 4 FN3395.8 June 6, 2006 HFA1105 Application Information negative slew rate. Positive only signals have symmetrical slew rates as illustrated in the large signal positive pulse response graphs (See Figures 4, 7, and 10). Optimum Feedback Resistor Although a current feedback amplifier’s bandwidth dependency on closed loop gain isn’t as severe as that of a voltage feedback amplifier, there can be an appreciable decrease in bandwidth at higher gains. This decrease may be minimized by taking advantage of the current feedback amplifier’s unique relationship between bandwidth and RF. All current feedback amplifiers require a feedback resistor, even for unity gain applications, and RF, in conjunction with the internal compensation capacitor, sets the dominant pole of the frequency response. Thus, the amplifier’s bandwidth is inversely proportional to RF. The HFA1105 design is optimized for RF = 510Ω at a gain of +2. Decreasing RF decreases stability, resulting in excessive peaking and overshoot (Note: Capacitive feedback will cause the same problems due to the feedback impedance decrease at higher frequencies). At higher gains, however, the amplifier is more stable so RF can be decreased in a trade-off of stability for bandwidth. The table below lists recommended RF values for various gains, and the expected bandwidth. For a gain of +1, a resistor (+RS) in series with +IN is required to reduce gain peaking and increase stability. PC Board Layout The amplifier’s frequency response depends greatly on the care taken in designing the PC board. The use of low inductance components such as chip resistors and chip capacitors is strongly recommended, while a solid ground plane is a must! Attention should be given to decoupling the power supplies. A large value (10µF) tantalum in parallel with a small value (0.1µF) chip capacitor works well in most cases. Terminated microstrip signal lines are recommended at the device’s input and output connections. Capacitance, parasitic or planned, connected to the output must be minimized, or isolated as discussed in the next section. Care must also be taken to minimize the capacitance to ground at the amplifier’s inverting input (-IN), as this capacitance causes gain peaking, pulse overshoot, and if large enough, instability. To reduce this capacitance, the designer should remove the ground plane under traces connected to -IN, and keep connections to -IN as short as possible. An example of a good high frequency layout is the Evaluation Board shown in Figure 2. GAIN (ACL) RF (Ω) BANDWIDTH (MHz) -1 425 300 Driving Capacitive Loads +1 510 (+RS = 510Ω) 270 +2 510 330 +5 200 300 +10 180 130 Capacitive loads, such as an A/D input, or an improperly terminated transmission line will degrade the amplifier’s phase margin resulting in frequency response peaking and possible oscillations. In most cases, the oscillation can be avoided by placing a resistor (RS) in series with the output prior to the capacitance. Non-Inverting Input Source Impedance For best operation, the DC source impedance seen by the non-inverting input should be ≥50Ω. This is especially important in inverting gain configurations where the noninverting input would normally be connected directly to GND. Pulse Undershoot and Asymmetrical Slew Rates The HFA1105 utilizes a quasi-complementary output stage to achieve high output current while minimizing quiescent supply current. In this approach, a composite device replaces the traditional PNP pulldown transistor. The composite device switches modes after crossing 0V, resulting in added distortion for signals swinging below ground, and an increased undershoot on the negative portion of the output waveform (See Figures 5, 8, and 11). This undershoot isn’t present for small bipolar signals, or large positive signals. Another artifact of the composite device is asymmetrical slew rates for output signals with a negative voltage component. The slew rate degrades as the output signal crosses through 0V (See Figures 5, 8, and 11), resulting in a slower overall 5 Figure 1 details starting points for the selection of this resistor. The points on the curve indicate the RS and CL combinations for the optimum bandwidth, stability, and settling time, but experimental fine tuning is recommended. Picking a point above or to the right of the curve yields an overdamped response, while points below or left of the curve indicate areas of underdamped performance. RS and CL form a low pass network at the output, thus limiting system bandwidth well below the amplifier bandwidth of 270MHz (for AV = +1). By decreasing RS as CL increases (as illustrated in the curves), the maximum bandwidth is obtained without sacrificing stability. In spite of this, the bandwidth decreases as the load capacitance increases. For example, at AV = +1, RS = 62Ω, CL = 40pF, the overall bandwidth is limited to 180MHz, and bandwidth drops to 75MHz at AV = +1, RS = 8Ω, CL = 400pF. FN3395.8 June 6, 2006 HFA1105 SERIES OUTPUT RESISTANCE (Ω) 50 VH 40 1 30 +IN 20 OUT AV = +1 VL AV = +2 GND 10 0 0 50 100 150 V+ V- 200 250 300 350 400 FIGURE 2A. TOP LAYOUT LOAD CAPACITANCE (pF) FIGURE 1. RECOMMENDED SERIES OUTPUT RESISTOR vs LOAD CAPACITANCE Evaluation Board The performance of the HFA1105 may be evaluated using the HFA11XX Evaluation Board and a SOIC to DIP adaptor like the Aries Electronics Part Number 14-350000-10. The layout and schematic of the board are shown in Figure 2. To order evaluation boards (part number HFA11XXEVAL), please contact your local sales office. FIGURE 2B. BOTTOM LAYOUT 510 510 VH R1 50Ω IN 10µF 0.1µF 1 8 2 7 3 6 4 5 -5V GND 10µF 0.1µF +5V 50Ω OUT GND VL FIGURE 2C. SCHEMATIC FIGURE 2. EVALUATION BOARD SCHEMATIC AND LAYOUT 6 FN3395.8 June 6, 2006 HFA1105 Typical Performance Curves 200 3.0 AV = +1 +RS = 510Ω 2.5 100 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (mV) 150 VSUPPLY = ±5V, RF = 510Ω, TA = 25°C, RL = 100Ω, Unless Otherwise Specified 50 0 -50 -100 AV = +1 +RS = 510Ω 2.0 1.5 1.0 0.5 0 -0.5 -150 -1.0 -200 TIME (5ns/DIV) TIME (5ns/DIV) FIGURE 3. SMALL SIGNAL PULSE RESPONSE 2.0 200 AV = +1 +RS = 510Ω AV = +2 150 1.0 OUTPUT VOLTAGE (mV) OUTPUT VOLTAGE (V) 1.5 FIGURE 4. LARGE SIGNAL POSITIVE PULSE RESPONSE 0.5 0 -0.5 -1.0 -1.5 100 50 0 -50 -100 -150 -2.0 -200 TIME (5ns/DIV) TIME (5ns/DIV) FIGURE 5. LARGE SIGNAL BIPOLAR PULSE RESPONSE FIGURE 6. SMALL SIGNAL PULSE RESPONSE 3.0 2.0 AV = +2 2.5 1.5 2.0 1.0 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) AV = +2 1.5 1.0 0.5 0 -0.5 0.5 0 -0.5 -1.0 -1.5 -1.0 -2.0 TIME (5ns/DIV) FIGURE 7. LARGE SIGNAL POSITIVE PULSE RESPONSE 7 TIME (5ns/DIV) FIGURE 8. LARGE SIGNAL BIPOLAR PULSE RESPONSE FN3395.8 June 6, 2006 HFA1105 Typical Performance Curves VSUPPLY = ±5V, RF = 510Ω, TA = 25°C, RL = 100Ω, Unless Otherwise Specified (Continued) 200 3.0 AV = +10 RF = 180Ω 2.5 100 2.0 OUTPUT VOLTAGE (V) 50 0 -50 -100 1.5 1.0 0.5 0 -0.5 -150 -1.0 -200 TIME (5ns/DIV) TIME (5ns/DIV) FIGURE 9. SMALL SIGNAL PULSE RESPONSE FIGURE 10. LARGE SIGNAL POSITIVE PULSE RESPONSE 2.0 1.0 3 0 VOUT = 200mVP-P +RS = 510Ω (+1) +RS = 0Ω (-1) AV = +1 AV = -1 -3 0.5 0 90 -1.0 180 -1.5 AV = +1 -2.0 0.3 1 TIME (5ns/DIV) FIGURE 11. LARGE SIGNAL BIPOLAR PULSE RESPONSE NORMALIZED GAIN (dB) 3 AV = +2 0 AV = +10 -3 AV = +5 AV = +2 VOUT = 200mVP-P RF = 510Ω (+2) RF = 200Ω (+5) RF = 180Ω (+10) 0.3 1 90 180 AV = +10 100 FIGURE 13. FREQUENCY RESPONSE 8 AV = +2 500 0 VOUT = 1.5VP-P -3 VOUT = 5VP-P VOUT = 200mVP-P 0 90 VOUT = 1.5VP-P 270 500 100 VOUT = 200mVP-P 3 0 AV = +5 10 FREQUENCY (MHz) 10 FREQUENCY (MHz) 270 FIGURE 12. FREQUENCY RESPONSE PHASE (°) NORMALIZED GAIN (dB) 0 AV = -1 -0.5 NORMALIZED PHASE (°) OUTPUT VOLTAGE (V) 1.5 GAIN (dB) AV = +10 RF = 180Ω 180 270 VOUT = 5VP-P 0.3 1 10 100 PHASE (°) OUTPUT VOLTAGE (mV) 150 AV = +10 RF = 180Ω 500 FREQUENCY (MHz) FIGURE 14. FREQUENCY RESPONSE FOR VARIOUS OUTPUT VOLTAGES FN3395.8 June 6, 2006 HFA1105 VSUPPLY = ±5V, RF = 510Ω, TA = 25°C, RL = 100Ω, Unless Otherwise Specified (Continued) AV = -1 0 VOUT = 4VP-P (+1) VOUT = 5VP-P (-1, +2) +RS = 510Ω (+1) -3 AV = +1 AV = +2 VOUT = 200mVP-P 3 AV = +2 RL = 1kΩ RL = 500Ω 0 RL = 50Ω -3 RL = 100Ω RL = 50Ω RL = 100Ω 0 90 RL = 1kΩ RL = 500Ω 180 PHASE (°) 3 NORMALIZED GAIN (dB) NORMALIZED GAIN (dB) Typical Performance Curves 270 1 10 FREQUENCY (MHz) 100 0.3 200 FIGURE 15. FULL POWER BANDWIDTH RF = 180Ω (+10) NORMALIZED GAIN (dB) BANDWIDTH (MHz) 0.25 +RS = 510Ω (+1) AV = +1 300 200 AV = +10 100 500 VOUT = 200mVP-P +RS = 510Ω (+1) VOUT = 200mVP-P 400 100 FIGURE 16. FREQUENCY RESPONSE FOR VARIOUS LOAD RESISTORS 500 AV = +2 10 FREQUENCY (MHz) 1 0.20 0.15 0.10 AV = +2 0.05 0 AV = +1 -0.05 -0.10 0 -100 -50 0 50 100 150 1 10 FREQUENCY (MHz) TEMPERATURE (°C) FIGURE 18. GAIN FLATNESS -40 AV = +2 VOUT = 2VP-P AV = +1, +2 OUTPUT IMPEDANCE (Ω) REVERSE ISOLATION (dB) FIGURE 17. -3dB BANDWIDTH vs TEMPERATURE -50 -60 AV = -1 -70 -80 -90 0.3 1 75 10 FREQUENCY (MHz) FIGURE 19. REVERSE ISOLATION 9 100 1K 100 10 1 0.1 0.01 0.3 1 10 100 FREQUENCY (MHz) 1000 FIGURE 20. OUTPUT IMPEDANCE FN3395.8 June 6, 2006 HFA1105 Typical Performance Curves VSUPPLY = ±5V, RF = 510Ω, TA = 25°C, RL = 100Ω, Unless Otherwise Specified (Continued) -30 AV = +2 0.8 AV = +2 VOUT = 2V -40 DISTORTION (dBc) SETTLING ERROR (%) 0.6 0.4 0.2 0.1 0 -0.2 -0.4 10MHz -50 20MHz -60 -0.6 -0.8 -70 3 8 13 18 23 28 TIME (ns) 33 38 43 -5 48 3.6 AV = +2 OUTPUT VOLTAGE (V) 3.5 -40 Hz -50 Hz 10M -60 +VOUT (RL= 100Ω) 3.4 3.3 3.2 3.1 +VOUT (RL= 50Ω) 3.0 2.9 |-VOUT| (RL= 50Ω) 2.7 2.6 -50 -70 0 5 OUTPUT POWER (dBm) 10 15 -25 0 25 50 75 100 125 TEMPERATURE (°C) FIGURE 23. THIRD HARMONIC DISTORTION vs POUT 100 FIGURE 24. OUTPUT VOLTAGE vs TEMPERATURE 100 10 10 ENI I NI+ POWER SUPPLY CURRENT (mA) INI- 6.1 NOISE CURRENT (pA/√Hz) NOISE VOLTAGE (nV/√Hz) 15 |-VOUT| (RL= 100Ω) AV = -1 2.8 -5 10 FIGURE 22. SECOND HARMONIC DISTORTION vs POUT -30 DISTORTION (dBc) 5 OUTPUT POWER (dBm) FIGURE 21. SETTLING RESPONSE 20M 0 6.0 5.9 5.8 5.7 5.6 1 0.1 1 10 1 100 FREQUENCY (kHz) FIGURE 25. INPUT NOISE CHARACTERISTICS 10 3.5 4 4.5 5 5.5 6 6.5 7 7.5 POWER SUPPLY VOLTAGE (±V) FIGURE 26. SUPPLY CURRENT vs SUPPLY VOLTAGE FN3395.8 June 6, 2006 HFA1105 Die Characteristics PASSIVATION: Type: Nitride Thickness: 4kÅ ±0.5kÅ DIE DIMENSIONS: 59 mils x 59 mils x 19 mils 1500µm x 1500µm x 483µm TRANSISTOR COUNT: 75 METALLIZATION: SUBSTRATE POTENTIAL (POWERED UP): Type: Metal 1: AICu(2%)/TiW Thickness: Metal 1: 8kÅ ±0.4kÅ Type: Metal 2: AICu(2%) Thickness: Metal 2: 16kÅ ±0.8kÅ Floating (Recommend Connection to V-) Metallization Mask Layout HFA1105 NC -IN V+ OUT +IN V- 11 NC FN3395.8 June 6, 2006 HFA1105 Small Outline Plastic Packages (SOIC) M8.15 (JEDEC MS-012-AA ISSUE C) N 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B- 1 2 3 L SEATING PLANE -A- A D h x 45° -C- e A1 B 0.25(0.010) M C 0.10(0.004) C A M MIN MAX MIN MAX NOTES A 0.0532 0.0688 1.35 1.75 - A1 0.0040 0.0098 0.10 0.25 - B 0.013 0.020 0.33 0.51 9 C 0.0075 0.0098 0.19 0.25 - D 0.1890 0.1968 4.80 5.00 3 E 0.1497 0.1574 3.80 4.00 4 e α B S 0.050 BSC 1.27 BSC - H 0.2284 0.2440 5.80 6.20 - h 0.0099 0.0196 0.25 0.50 5 L 0.016 0.050 0.40 1.27 6 N α NOTES: MILLIMETERS 8 0° 8 8° 0° 7 8° 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. Rev. 1 6/05 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 12 FN3395.8 June 6, 2006