AOS Semiconductor Product Reliability Report AOD454/AOD454L, rev C Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc 495 Mercury Drive Sunnyvale, CA 94085 U.S. Tel: (408) 830-9742 www.aosmd.com Feb 10, 2006 1 This AOS product reliability report summarizes the qualification result for AOD454. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOD454 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. V. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation Quality Assurance Information I. Product Description: The AOD454 uses advanced trench technology and design to provide excellent RDS(ON) with low gate charge. This device is suitable for use in PWM, load switching and general purpose applications. Standard product AOD454 is Pb-free (meet ROHS & Sony 259 specifications). AOD454L is a Green Product ordering option. AOD454 and AOD454L are electrically identical. Absolute Maximum Ratings TA=25°C unless otherwise noted Parameter Symbol Maximum Units Drain-Source Voltage VDS 40 V Gate-Source Voltage VGS ±20 V TA=25°C Continuous Drain Current G TA=100°C Pulsed Drain Current C Avalanche Current C Power Dissipation B TA=25°C Power Dissipation A TA=100°C TA=25°C TA=100°C Junction and Storage Temperature Range Thermal Characteristics Parameter Maximum Junction-toAmbient Maximum Junction-toAmbient Maximum Junction-to-Lead 12 ID 12 IDM 30 IAR 12 A 20 PD W 10 2 PDSM W 1.3 TJ, TSTG -55 to 175 Symbol T ≤ 10s SteadyState SteadyState A RθJA RθJL °C Typ Max Units 17.4 30 °C/W 50 60 °C/W 4 7.5 °C/W 2 II. Die / Package Information: Process Package Type Lead Frame Die Attach Bond wire Mold Material Filler % (Spherical/Flake) Flammability Rating Backside Metallization Moisture Level AOD454 Standard sub-micron low voltage N channel process 3 leads TO252 Copper with Ag pad Soft solder Au 2mils Epoxy resin with silica filler 50/50 UL-94 V-0 Ti / Ni / Ag Up to Level 1 * AOD454L (Green Compound) Standard sub-micron low voltage N channel process 3 leads TO252 Copper with Ag pad Soft solder Au 2mils Epoxy resin with silica filler 100/0 UL-94 V-0 Ti / Ni / Ag Up to Level 1* Note * based on info provided by assembler and mold compound supplier III. Result of Reliability Stress for AOD454 (Standard) & AOD454L (Green) Test Item Test Condition Time Point Lot Attribution Total Sample size Solder Reflow Precondition Normal: 1hr PCT+3 cycle IR reflow@260 °c (168hrs 85°c /85%RH +Reflow@260°c for Green) Temp = 150° C, Vgs=100% of Vgsmax 0hr Normal: 20 lots Green: 2 lots 3190pcs HTGB HTRB HAST Pressure Pot Temperature Cycle Temp = 150° C, Vds=80% of Vdsmax 130 +/- 2° C, 85%RH, 33.3 psi, Vgs = 80% of Vgs max 121° C, 15+/-1 PSIG, RH=100% -65 to 150 ° C, air to air, 0.5hr per cycle 168 / 500 hrs Normal: 1 lot 1000 hrs (Note A*) 168 / 500 hrs Normal: 1 lot 1000 hrs (Note A*) 100 hrs Normal: 16 lots Green: 1 lots 96 hrs 250 / 500 cycles (Note B**) Normal: 20 lots Green: 1 lots (Note B**) Normal: 18 lots Green: 2 lots (Note B**) 82pcs Number of Failures 0 0 77+5 pcs / lot 82pcs 0 77+5 pcs / lot 935pcs 0 50+5 pcs / lot 1155pcs 0 50+5 pcs / lot 1100pcs 0 50+5 pcs / lot 3 III. Result of Reliability Stress for AOD454 (Standard) & AOD454L (Green) Continues DPA Internal Vision Cross-section X-ray CSAM NA 5 5 5 5 5 5 0 NA 5 5 0 Bond Integrity Room Temp 150°C bake 150°C bake 0hr 250hr 500hr 40 40 40 40 wires 40 wires 40 wires 0 Solderability 230°C 5 sec 15 15 leads 0 Die shear 150°C 0hr 10 10 0 Note A: The HTGB and HTRB reliability data presents total of available AOD454 and AOD454L burn-in data up to the published date. Note B: The pressure pot, temperature cycle and HAST reliability data for AOD454L comes from the AOS generic green compound package qualification data. IV. Reliability Evaluation FIT rate (per billion): 128 MTTF = 891years In general, 500 hrs of HTGB, 150 deg C accelerated stress testing is equivalent to 15 years of lifetime at 55 deg C operating conditions (by applying the Arrhenius equation with an activation energy of 0.7eV and 60% of upper confidence level on the failure rate calculation). AOS reliability group also routinely monitors the product reliability up to 1000 hr at and performs the necessary failure analysis on the units failed for reliability test(s). The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AOD454). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. Failure Rate = Chi2 x 109 / [2 (N) (H) (Af)] = 1.83 x 109 / [2 (164) (168) (258)] = 128 MTTF = 109 / FIT =7.8x 106hrs =891 years Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55C) Acceleration Factor [Af] = Exp [Ea / k ( 1/Tj u – 1/Tj s )] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 258 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltznan’s constant, 8.617164 X 10 E-5V / K 4 V. Quality Assurance Information Acceptable Quality Level for outgoing inspection: 0.1% for electrical and visual. Guaranteed Outgoing Defect Rate: < 25 ppm Quality Sample Plan: conform to Mil-Std-105D 5