TNPV e3 www.vishay.com Vishay Draloric High Voltage Thin Film Flat Chip Resistors FEATURES • High operating voltage Umax. up to 1000 V • Low voltage coefficient < 1 ppm/V • Excellent overall stability at different environmental conditions ≤ 0.05 % (1000 h rated power at 70 °C) • Superior moisture resistivity (85 °C; 85 % RH) • AEC-Q200 qualification under preparation • Sulfur resistance verified according to ASTM B 809 • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 TNPV e3 precision thin film flat chip resistors are the perfect choice for most fields of modern electronics where the highest reliability and stability at high operating voltages are of major concern. Typical applications include industrial and automotive inverters, voltage measurement systems as implemented in battery management systems, and test and measuring equipment. APPLICATIONS • Industrial and automotive inverters • Battery management system • Test and measuring equipment TECHNICAL SPECIFICATIONS DESCRIPTION TNPV1206 e3 TNPV1210 e3 1206 1210 (1) Metric size code RR3216M RR3225M (1) Resistance range 160 k to 2 M 121 k to 3.01 M Imperial size Resistance tolerance ± 1 %; ± 0.5 %; ± 0.1 % Temperature coefficient ± 50 ppm/K; ± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K Voltage coefficient |c| Rated dissipation, P70 < 1 ppm/V (2) Maximum operating voltage, Umax. ACRMS or DC (3) Permissible film temperature, F max. (2) Operating temperature range 0.25 W 0.33 W 700 V 1000 V 155 °C -55 °C to 125 °C (155 °C) Notes (1) Size not specified in EN 140401-801. (2) Please refer to APPLICATION INFORMATION below. (3) Application-specific safety requirements may set limitations to the applicability of the specified voltage. APPLICATION INFORMATION The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the printed circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain the reliability of the assembly. These resistors do not feature a lifetime limitation when operated within the limits of rated dissipation, permissible operating voltage, and permissible film temperature. However, the resistance typically increases due to the resistor's film temperature over operating time, generally known as drift. The drift may exceed the stability requirements of an individual application circuit and thereby limits the functional lifetime. The designer may estimate the performance of the particular resistor application or set certain load and temperature limits in order to maintain a desired stability. Revision: 24-Apr-15 Document Number: 28881 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TNPV e3 www.vishay.com Vishay Draloric MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION OPERATION MODE STANDARD Rated dissipation, P70 TNPV1206 e3 0.25 W TNPV1210 e3 0.33 W TNPV1206 e3 160 k to 2 M TNPV1210 e3 121 k to 3.01 M Applied maximum film temperature, F max. 125 °C Max. resistance change at P70 for resistance range R/R, after: 1000 h 0.05 % 8000 h 0.10 % 225 000 h 0.30 % TEMPERATURE COEFFICIENT AND RESISTANCE RANGE TYPE/SIZE TCR TOLERANCE ± 50 ppm/K ±1% E24; E96 ± 0.1 % ± 15 ppm/K ± 0.1 % ± 10 ppm/K ± 0.1 % ± 50 ppm/K 160 k to 2.0 M ±1% E24; E192 E24; E96 121 k to 3.01 M ± 0.5 % ± 25 ppm/K TNPV1210 e3 E-SERIES ± 0.5 % ± 25 ppm/K TNPV1206 e3 RESISTANCE ± 0.1 % ± 15 ppm/K ± 0.1 % ± 10 ppm/K ± 0.1 % E24; E192 121 k to 2.13 M PACKAGING TYPE/SIZE TNPV1206 e3 TNPV1210 e3 CODE QUANTITY PACKAGING STYLE WIDTH PITCH E52 = EN 1000 (1) ET1 = EA 5000 8 mm 4 mm ET6 = EC 20 000 Paper tape acc. IEC 60286-3 Type 1a REEL DIAMETER 180 mm / 7" 330 mm / 13" Note (1) 1000 pieces packaging is available only for precision resistors with tolerance ± 0.1 %. PART NUMBER AND PRODUCT DESCRIPTION Part Number: TNPV12061M24DEEA T N P V 1 2 0 6 1 M 2 4 D E E A TYPE/SIZE RESISTANCE TOLERANCE TCR PACKAGING SPECIAL TNPV1206 TNPV1210 R = decimal K = thousand M = million (4 digits) B = ± 0.1 % D = ± 0.5 % F = ± 1.0 % H = ± 50 ppm/K E = ± 25 ppm/K X = ± 15 ppm/K Y = ± 10 ppm/K EA EC EN Up to 2 digits Blank = standard Product Description: TNPV1206 1M24 0.5 % T-9 ET1 e3 TNPV1206 1M24 0.5 % T-9 ET1 e3 TYPE/SIZE RESISTANCE TOLERANCE TCR PACKAGING LEAD (Pb)-FREE TNPV1206 TNPV1210 Examples: 1M24 = 1.24 M 560K = 560 k ± 0.1 % ± 0.5 % ± 1.0 % T-2 = ± 50 ppm/K T-9 = ± 25 ppm/K T-10 = ± 15 ppm/K T-13 = ± 10 ppm/K ET1 ET6 E52 e3 = pure tin termination finish Note • Products can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION. Revision: 24-Apr-15 Document Number: 28881 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TNPV e3 www.vishay.com Vishay Draloric DESCRIPTION ASSEMBLY Production is strictly controlled and follows an extensive set of instructions established for reproducibility. A homogeneous film of special metal alloy is deposited on a high grade ceramic substrate (AI2O3) and conditioned to achieve the desired temperature coefficient. Specially designed inner contacts are deposited on both sides. A special laser is used to achieve the target value by smoothly cutting a meander groove in the resistive layer without damaging the ceramics. The resistor elements are covered by a unique protective coating designed for electrical, mechanical and climatic protection. The terminations receive a final pure tin on nickel plating. The resistors are suitable for processing on automatic SMD assembly systems. They are suitable for automatic soldering using wave, reflow or vapor phase as shown in IEC 61760-1 (1). The encapsulation is resistant to all cleaning solvents commonly used in the electronics industry, including alcohols, esters and aqueous solutions. The suitability of conformal coatings, potting compounds, and their processes, if applied, shall be qualified by appropriate means to ensure the long-term stability of the whole system. The result of the determined production is verified by an extensive testing procedure and optical inspection performed on 100 % of the individual chip resistors. This includes full screening for the elimination of products with a potential risk of early life failures according to EN 140401-801, 2.1.2.2. Only accepted products are laid directly into the paper tape in accordance with IEC 60286-3 (1). The resistors are RoHS-compliant, the pure tin plating provides compatibility with lead (Pb)-free and lead-containing soldering processes. The immunity of the plating against tin whisker growth has been proven under extensive testing. All products comply with the IEC 62474, Material Declaration for Products of and for the Electrotechnical Industry. The dedicated database (2), that lists declarable substances, ensures full compliance with the following directives: • 2000/53/EC End of Vehicle life Directive (ELV) and Annex II (ELV II) • 2011/65/EU Restriction of the use of Hazardous Substances directive (RoHS) • 2012/19/EU Waste Electrical and Electronic Equipment Directive (WEEE) The resistors are halogen-free according to JEDEC® JS709A definition. Solderability is specified for 2 years after production or re-qualification. The permitted storage time is 20 years. RELATED PRODUCTS For products with ultra precision specification see the datasheet: • TNPU e3 - Ultra Precision Thin Film Flat Chip Resistors (www.vishay.com/doc?28779) For products with high stability specification see the datasheet: • TNPW e3 - High Stability Thin Film Flat Chip Resistors (www.vishay.com/doc?28758) Note (1) The quoted IEC standards are also released as EN standards with the same number and identical contents. (2) IEC 62474 database can be found at http://std.iec.ch/iec62474 Revision: 24-Apr-15 Document Number: 28881 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TNPV e3 www.vishay.com Vishay Draloric Rated Power in % FUNCTIONAL PERFORMANCE 120 100 80 60 40 20 EN 0 -55 -25 0 25 50 75 70 100 125 150 175 Ambient Temperature in °C Derating 1200 1000 800 600 400 0 100K TNPV1210 e3 160K 200 121K Permissible Operating Voltage in V Note • The solid line is based on IEC/EN reference test conditions which is considered as standard mode. However, above that the maximum permissible film temperature is 155 °C (dashed line). TNPV1206 e3 1M 10M Resistance Value in Ω Nominal Operating Voltage Note • The permissible operating voltage Umax. equals the rated voltage P 70 x R . For ambient temperatures above 70 °C power derating must be considered. Revision: 24-Apr-15 Document Number: 28881 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TNPV e3 Permissible Pulse Power P i, max. in W www.vishay.com Vishay Draloric TNPV 1210 e3 TNPV 1206 e3 10 1 Conditions: P 0, n < 1000 and Ui < Ui, max. 0.1 10μ 100μ 1m 10m 100m 1 10 Pulse Duration ti in s Permissible Pulse Voltage Ui, max. in V Maximum Pulse Load Pi, max. Single Pulses 1000 TNPV 1210 e3 TNPV 1206 e3 Conditions: Pi < Pi, max. 100 10μ 100μ 1m 10m 100m 1 10 Pulse Duration ti in s Maximum Pulse Voltage Ui, max. Revision: 24-Apr-15 Document Number: 28881 5 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TNPV e3 www.vishay.com Vishay Draloric TEST AND REQUIREMENTS All tests are carried out in accordance with the following specifications: EN 60115-1, generic specification EN 60115-8 (successor of EN 140400), sectional specification EN 140401-801, detail specification IEC 60068-2-xx, test methods The parameters stated in the Test Procedures and Requirements table are based on the required tests and permitted limits of EN 140401-801. The table presents only the most important tests, for the full test schedule refer to the documents listed above. However, some additional tests and a number of improvements against those minimum requirements have been included. The testing also covers most of the requirements specified by EIA / ECA-703 and JIS-C-5201-1. The tests are carried out under standard atmospheric conditions in accordance with IEC 60068-1, 4.3, where upon the following values are applied: Temperature: 15 °C to 35 °C Relative humidity: 45 % to 75 % Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar) A climatic category LCT / UCT / 56 is applied, defined by the lower category temperature (LCT), the upper category temperature (UCT), and the duration of exposure in the damp heat, steady state test (56 days). The components are mounted for testing on printed circuit boards in accordance with EN 60115-8, 2.4.2, unless otherwise specified. TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60068-2 (1) TEST METHOD TEST PROCEDURE REQUIREMENTS PERMISSIBLE CHANGE (R) Stability for product type: TNPV1206 e3 TNPV1210 e3 4.5 - Resistance - ± 1 %; ± 0.5 %; ± 0.1 % 4.8.4.2 - Temperature coefficient At (20 / -55 / 20) °C and (20 / 125 / 20) °C ± 50 ppm/K; ± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K 4.25.1 - Endurance at 70 °C U = Umax.; 1.5 h on; 0.5 h off; 70 °C; 1000 h ± (0.05 % R) 70 °C; 8000 h ± (0.1 % R) 125 °C; 1000 h ± (0.05 % R) 155 °C; 1000 h ± (0.1 % R) - Endurance at upper category temperature 78 (Cab) Damp heat, steady state (40 ± 2) °C; 56 days; (93 ± 3) % RH; U = 0.1 x Umax. ± (0.1 % R) 4.19 14 (Na) Rapid change of temperature 30 min at LCT and 30 min at UCT; LCT = -55 °C; UCT = 125 °C; 1000 cycles ± (0.1 % R) 4.13 - Short time overload U = 2 x Umax.; 5s ± (0.05 % R) 4.27 - Single pulse high voltage overload Severity no. 4: U = 2 x Umax.; 10 pulses 10 μs/700 μs ± (0.1 % R) 4.39 - Periodic electric overload U = 2 x Umax.; 0.1 s on; 2.5 s off; 1000 cycles ± (0.1 % R) Vibration Endurance by sweeping; 10 Hz to 2000 Hz; no resonance; amplitude 1.5 mm or 200 m/s2; 7.5 h ± (0.05 % R) 4.25.3 4.24 4.22 Revision: 24-Apr-15 6 (Fc) Document Number: 28881 6 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TNPV e3 www.vishay.com Vishay Draloric TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60068-2 (1) TEST METHOD TEST PROCEDURE REQUIREMENTS PERMISSIBLE CHANGE (R) Stability for product type: TNPV1206 e3 TNPV1210 e3 4.38 - Electrostatic discharge (Human Body Model) IEC 61340-3-1 (1); 3 pos. + 3 neg. discharges TNPV1206e3: 6 kV TNPV1210e3: 8 kV Solder bath method; SnPb40; non-activated flux (215 ± 3) °C; (3 ± 0.3) s 4.17.2 58 (Td) Solderability Solder bath method; SnAg3Cu0.5 or SnAg3.5; non-activated flux (235 ± 3) °C; (2 ± 0.2) s ± (0.5 % R) Good tinning ( 95 % covered); no visible damage Solder bath method; (260 ± 5) °C; (10 ± 1) s 4.18.2 58 (Td) Resistance to soldering heat 4.29 45 (XA) Component solvent resistance Isopropyl alcohol; 50 °C; method 2 No visible damage 4.30 45 (XA) Solvent resistance of marking Isopropyl alcohol; 50 °C; method 1, toothbrush No visible damage 4.32 21 (Ue3) Shear (adhesion) 45 N No visible damage 4.33 21 (Ue1) Substrate bending Depth 2 mm, 3 times ± (0.05 % R) no visible damage, no open circuit in bent position 4.35 - Flammability IEC 60695-11-5 (1), needle flame test; 10 s No burning after 30 s 67 (Cy) Damp heat, steady state, accelerated (85 ± 2) °C; (85 ± 5) % RH; U = 0.3 x Umax.; 1000 h ± (0.25 % R) 4.37 Reflow method 2 (IR/forced gas convection); (260 ± 5) °C; (10 ± 1) s ± (0.02 % R) Note (1) The quoted IEC standards are also released as EN standards with the same number and identical contents. Revision: 24-Apr-15 Document Number: 28881 7 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 TNPV e3 www.vishay.com Vishay Draloric DIMENSIONS L Tt W H Tb DIMENSIONS AND MASS H (mm) L (mm) W (mm) Tt/Tb(mm) MASS (mg) TNPV1206 e3 0.55 ± 0.10 3.2 ± 0.15 1.6 ± 0.15 0.5 ± 0.25 10 TNPV1210 e3 0.60 ± 0.15 3.2 ± 0.15 2.45 ± 0.15 0.5 ± 0.25 16 TYPE SOLDER PAD DIMENSIONS G X Y RECOMMENDED SOLDER PAD DIMENSIONS REFLOW SOLDERING TYPE WAVE SOLDERING Y (mm) X (mm) G (mm) Y (mm) X (mm) G (mm) TNPV1206 e3 0.9 1.7 2.0 1.1 1.7 2.3 TNPV1210 e3 0.9 2.5 2.0 1.1 2.5 2.3 Note • Utilization of the full specified operating voltage may require special considerations on the creepage and clearance distance between conductors at different potential levels. Revision: 24-Apr-15 Document Number: 28881 8 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000