February 5, 2010 Subject: PCN# 01A-10, Notification of Intent to Convert the Ceramic Flip Chip BGA to the Organic Flip Chip BGA and the Discontinuance of the Ceramic Flip Chip BGA for the LatticeSC/SCM Families of FPGAs Dear Lattice Customers: In accordance with our Product Change Notification (PCN) policy, Lattice is providing this notification of our intent to convert the 1152-ball and 1704-ball Ceramic Flip Chip Ball Grid Array (fcBGA) packages for the LatticeSC™ and LatticeSCM™ families assembled at Fujitsu Japan to the Organic Flip Chip Ball Grid Array assembled at Advanced Semiconductor Engineering (ASE) Kaohsiung, Taiwan. Additionally, we plan to discontinue the Ceramic fcBGA packages for the LatticeSC and LatticeSCM families. AFFECTED DEVICES The Ordering Part Numbers (OPNs) affected by this PCN are listed in the Exhibit A. PACKAGE COMPARISON The package characteristics comparison between the Ceramic fcBGA and Organic fcBGA packages are provided in Exhibit B. Package Outline Drawings of these packages are shown in Exhibit C and material set details are described in Exhibit D. DATA SHEET SPECIFICATIONS The new 1152-ball and 1704-ball Organic fcBGA devices meet all data sheet performance specifications. The new version of the product data sheet will include the new / replacement OPNs; LatticeSC/M Family Data Sheet (DS1004 Version 02.3, January 2010). QUALIFICATION DATA The new 1152-ball and 1704-ball Organic fcBGA have passed all Lattice package qualification requirements. A summary of the qualification data is available here. Lattice Semiconductor Home Page: http://www.latticesemi.com Applications & Literature Hotline: 1-800-LATTICE Copyright 2010 Lattice Semiconductor Corporation. Lattice Semiconductor, L(stylized) Lattice Semiconductor Corporation, Lattice (design), LatticeSC and LatticeSCM are either registered trademarks or trademarks of Lattice Semiconductor Corporation in the United States and/or other countries. Other product names used in this publications are for identification purposes only and may be the trademarks of their respective companies. CONVERSION / DISCONTINUANCE TIMING Conversion timing for this PCN is 90 days from the date of this Notice. Should samples be required to complete evaluation of those new packages, such sample requests must be received no later than March 5, 2010 (30 days after the date of this Notice). Customers will have 4.5 months to place last time buy (LTB) orders for the 1152-ball and 1704ball Ceramic fcBGA devices (if needed). All LTB orders for these Ceramic fcBGA devices will be non-cancelable and non-returnable. All LTB orders must be placed no later than June 18, 2010 (4.5 months after the date of this notice) with all deliveries taken no later than December 18, 2010 (10 months after the date of this notice). Orders for the Ceramic fcBGA devices received after June 18, 2010 will only be accepted based upon available inventory. CONVERSION / DISCONTINUANCE TIMING – Summary Sample Request Cut-off Date: March 5, 2010 Requested Conversion Date: May 5, 2010 Ceramic fcBGA Last Time Buy Order Date: Ceramic fcBGA Last Shipment Date: December 18, 2010 June 18, 2010 RESPONSE In accordance with JESD46-C, this change is deemed accepted by the customer if no acknowledgement is received within 30 days from this Notice. Note: Be sure to sign up for PCN “Web Alerts” (See PCN#13A-09 for details) and receive all future Lattice PCNs via e-mail! CONTACT If you have any questions or require additional information, please contact [email protected]. Sincerely, Lattice Semiconductor PCN Administration Lattice Semiconductor Home Page: http://www.latticesemi.com Applications & Literature Hotline: 1-800-LATTICE Copyright 2010 Lattice Semiconductor Corporation. Lattice Semiconductor, L(stylized) Lattice Semiconductor Corporation, Lattice (design), LatticeSC and LatticeSCM are either registered trademarks or trademarks of Lattice Semiconductor Corporation in the United States and/or other countries. Other product names used in this publications are for identification purposes only and may be the trademarks of their respective companies. EXHIBIT “A” – Ceramic Flip Chip BGA to Organic Flip Chip BGA Conversion Device SC40 SCM40 SC80 Discontinued Part Number LFSC3GA40E-7FC1152C LFSC3GA40E-6FC1152C LFSC3GA40E-5FC1152C LFSC3GA40E-6FC1152I LFSC3GA40E-5FC1152I LFSC3GA40E-7FCN1152C LFSC3GA40E-6FCN1152C LFSC3GA40E-5FCN1152C LFSC3GA40E-6FCN1152I LFSC3GA40E-5FCN1152I LFSCM3GA40EP1-7FC1152C LFSCM3GA40EP1-6FC1152C LFSCM3GA40EP1-5FC1152C LFSCM3GA40EP1-6FC1152I LFSCM3GA40EP1-5FC1152I LFSCM3GA40EP1-7FCN1152C LFSCM3GA40EP1-6FCN1152C LFSCM3GA40EP1-5FCN1152C LFSCM3GA40EP1-6FCN1152I LFSCM3GA40EP1-5FCN1152I LFSC3GA80E-7FC1152C LFSC3GA80E-6FC1152C LFSC3GA80E-5FC1152C LFSC3GA80E-6FC1152I LFSC3GA80E-5FC1152I LFSC3GA80E-7FCN1152C LFSC3GA80E-6FCN1152C LFSC3GA80E-5FCN1152C LFSC3GA80E-6FCN1152I LFSC3GA80E-5FCN1152I LFSC3GA80E-7FC1704C LFSC3GA80E-6FC1704C LFSC3GA80E-5FC1704C LFSC3GA80E-6FC1704I LFSC3GA80E-5FC1704I LFSC3GA80E-7FCN1704C LFSC3GA80E-6FCN1704C LFSC3GA80E-5FCN1704C LFSC3GA80E-6FCN1704I LFSC3GA80E-5FCN1704I Discontinued Package Ceramic 1152-fcBGA Pb-Free Ceramic 1152-fcBGA Ceramic 1152-fcBGA Pb-Free Ceramic 1152-fcBGA Ceramic 1152-fcBGA Pb-Free Ceramic 1152-fcBGA Ceramic 1704-fcBGA Pb-Free Ceramic 1704-fcBGA New / Replacement Part Number LFSC3GA40E-7FF1152C LFSC3GA40E-6FF1152C LFSC3GA40E-5FF1152C LFSC3GA40E-6FF1152I LFSC3GA40E-5FF1152I LFSC3GA40E-7FFN1152C LFSC3GA40E-6FFN1152C LFSC3GA40E-5FFN1152C LFSC3GA40E-6FFN1152I LFSC3GA40E-5FFN1152I LFSCM3GA40EP1-7FF1152C LFSCM3GA40EP1-6FF1152C LFSCM3GA40EP1-5FF1152C LFSCM3GA40EP1-6FF1152I LFSCM3GA40EP1-5FF1152I LFSCM3GA40EP1-7FFN1152C LFSCM3GA40EP1-6FFN1152C LFSCM3GA40EP1-5FFN1152C LFSCM3GA40EP1-6FFN1152I LFSCM3GA40EP1-5FFN1152I LFSC3GA80E-7FF1152C LFSC3GA80E-6FF1152C LFSC3GA80E-5FF1152C LFSC3GA80E-6FF1152I LFSC3GA80E-5FF1152I LFSC3GA80E-7FFN1152C LFSC3GA80E-6FFN1152C LFSC3GA80E-5FFN1152C LFSC3GA80E-6FFN1152I LFSC3GA80E-5FFN1152I LFSC3GA80E-7FF1704C LFSC3GA80E-6FF1704C LFSC3GA80E-5FF1704C LFSC3GA80E-6FF1704I LFSC3GA80E-5FF1704I LFSC3GA80E-7FFN1704C LFSC3GA80E-6FFN1704C LFSC3GA80E-5FFN1704C LFSC3GA80E-6FFN1704I LFSC3GA80E-5FFN1704I New / Replacement Package Organic 1152-fcBGA Pb-Free Organic 1152-fcBGA Organic 1152-fcBGA Pb-Free Organic 1152-fcBGA Organic 1152-fcBGA Pb-Free Organic 1152-fcBGA Organic 1704-fcBGA Pb-Free Organic 1704-fcBGA Note: This PCN also affects any custom devices (i.e. factory programmed, special test, etc.), which are derived from any of the devices listed above. EXHIBIT “A” – Ceramic Flip Chip BGA to Organic Flip Chip BGA Conversion (Cont’d) Device SCM80 SC115 Discontinued Part Number LFSCM3GA80EP1-7FC1152C LFSCM3GA80EP1-6FC1152C LFSCM3GA80EP1-5FC1152C LFSCM3GA80EP1-6FC1152I LFSCM3GA80EP1-5FC1152I LFSCM3GA80EP1-7FCN1152C LFSCM3GA80EP1-6FCN1152C LFSCM3GA80EP1-5FCN1152C LFSCM3GA80EP1-6FCN1152I LFSCM3GA80EP1-5FCN1152I LFSCM3GA80EP1-7FC1704C LFSCM3GA80EP1-6FC1704C LFSCM3GA80EP1-5FC1704C LFSCM3GA80EP1-6FC1704I LFSCM3GA80EP1-5FC1704I LFSCM3GA80EP1-7FCN1704C LFSCM3GA80EP1-6FCN1704C LFSCM3GA80EP1-5FCN1704C LFSCM3GA80EP1-6FCN1704I LFSCM3GA80EP1-5FCN1704I LFSC3GA115E-6FC1152C LFSC3GA115E-5FC1152C LFSC3GA115E-6FC1152I LFSC3GA115E-5FC1152I LFSC3GA115E-6FCN1152C LFSC3GA115E-5FCN1152C LFSC3GA115E-6FCN1152I LFSC3GA115E-5FCN1152I LFSC3GA115E-6FC1704C LFSC3GA115E-5FC1704C LFSC3GA115E-6FC1704I LFSC3GA115E-5FC1704I LFSC3GA115E-6FCN1704C LFSC3GA115E-5FCN1704C LFSC3GA115E-6FCN1704I LFSC3GA115E-5FCN1704I Discontinued Package Ceramic 1152-fcBGA Pb-Free Ceramic 1152-fcBGA Ceramic 1704-fcBGA Pb-Free Ceramic 1704-fcBGA Ceramic 1152-fcBGA Pb-Free Ceramic 1152-fcBGA Ceramic 1704-fcBGA Pb-Free Ceramic 1704-fcBGA New / Replacement Part Number LFSCM3GA80EP1-7FF1152C LFSCM3GA80EP1-6FF1152C LFSCM3GA80EP1-5FF1152C LFSCM3GA80EP1-6FF1152I LFSCM3GA80EP1-5FF1152I LFSCM3GA80EP1-7FFN1152C LFSCM3GA80EP1-6FFN1152C LFSCM3GA80EP1-5FFN1152C LFSCM3GA80EP1-6FFN1152I LFSCM3GA80EP1-5FFN1152I LFSCM3GA80EP1-7FF1704C LFSCM3GA80EP1-6FF1704C LFSCM3GA80EP1-5FF1704C LFSCM3GA80EP1-6FF1704I LFSCM3GA80EP1-5FF1704I LFSCM3GA80EP1-7FFN1704C LFSCM3GA80EP1-6FFN1704C LFSCM3GA80EP1-5FFN1704C LFSCM3GA80EP1-6FFN1704I LFSCM3GA80EP1-5FFN1704I LFSC3GA115E-6FF1152C LFSC3GA115E-5FF1152C LFSC3GA115E-6FF1152I LFSC3GA115E-5FF1152I LFSC3GA115E-6FFN1152C LFSC3GA115E-5FFN1152C LFSC3GA115E-6FFN1152I LFSC3GA115E-5FFN1152I LFSC3GA115E-6FF1704C LFSC3GA115E-5FF1704C LFSC3GA115E-6FF1704I LFSC3GA115E-5FF1704I LFSC3GA115E-6FFN1704C LFSC3GA115E-5FFN1704C LFSC3GA115E-6FFN1704I LFSC3GA115E-5FFN1704I New / Replacement Package Organic 1152-fcBGA Pb-Free Organic 1152-fcBGA Organic 1704-fcBGA Pb-Free Organic 1704-fcBGA Organic 1152-fcBGA Pb-Free Organic 1152-fcBGA Organic 1704-fcBGA Pb-Free Organic 1704-fcBGA Note: This PCN also affects any custom devices (i.e. factory programmed, special test, etc.), which are derived from any of the devices listed above. EXHIBIT “A” – Ceramic Flip Chip BGA to Organic Flip Chip BGA Conversion (Cont’d) Device Discontinued Part Number SCM115 LFSCM3GA115EP1-6FC1152C LFSCM3GA115EP1-5FC1152C LFSCM3GA115EP1-6FC1152I LFSCM3GA115EP1-5FC1152I LFSCM3GA115EP1-6FCN1152C LFSCM3GA115EP1-5FCN1152C LFSCM3GA115EP1-6FCN1152I LFSCM3GA115EP1-5FCN1152I LFSCM3GA115EP1-6FC1704C LFSCM3GA115EP1-5FC1704C LFSCM3GA115EP1-6FC1704I LFSCM3GA115EP1-5FC1704I LFSCM3GA115EP1-6FCN1704C LFSCM3GA115EP1-5FCN1704C LFSCM3GA115EP1-6FCN1704I LFSCM3GA115EP1-5FCN1704I Discontinued Package Ceramic 1152-fcBGA Pb-Free Ceramic 1152-fcBGA Ceramic 1704-fcBGA Pb-Free Ceramic 1704-fcBGA New / Replacement Part Number LFSCM3GA115EP1-6FF1152C LFSCM3GA115EP1-5FF1152C LFSCM3GA115EP1-6FF1152I LFSCM3GA115EP1-5FF1152I LFSCM3GA115EP1-6FFN1152C LFSCM3GA115EP1-5FFN1152C LFSCM3GA115EP1-6FFN1152I LFSCM3GA115EP1-5FFN1152I LFSCM3GA115EP1-6FF1704C LFSCM3GA115EP1-5FF1704C LFSCM3GA115EP1-6FF1704I LFSCM3GA115EP1-5FF1704I LFSCM3GA115EP1-6FFN1704C LFSCM3GA115EP1-5FFN1704C LFSCM3GA115EP1-6FFN1704I LFSCM3GA115EP1-5FFN1704I New / Replacement Package Organic 1152-fcBGA Pb-Free Organic 1152-fcBGA Organic 1704-fcBGA Pb-Free Organic 1704-fcBGA Note: This PCN also affects any custom devices (i.e. factory programmed, special test, etc.), which are derived from any of the devices listed above. EXHIBIT “B” – Package Characteristics Comparison Package Characteristics 1152-ball Ceramic fcBGA 1152-ball Organic fcBGA 1704-ball Ceramic fcBGA 1704-ball Organic fcBGA θJA 0 LFM (°C/W) Same (9.5) Same (7.7) θJA 200 LFM (°C/W) Same (7.3) Same (5.5) (°C/W) (mm) (mm) (gram) See Exhibit C See Exhibit C Same (0.6) Same (35x35) 4.6 ± 0.60 2.9 ± 0.50 12.7 10.8 Same Same Same (Pb-Free) Same (0.5) Same (42.5x42.5) 4.6 ± 0.60 2.9 ± 0.50 19.0 19.2 Same Same Same (Pb-Free) θJC Body Size Height Weight Foot Print Ball Assignment Die Bump EXHIBIT “C” – Package Outline Drawing (1152-ball Ceramic fcBGA) EXHIBIT “C” – Package Outline Drawing (1152-ball Organic fcBGA) EXHIBIT “C” – Package Outline Drawing (1704-ball Ceramic fcBGA) EXHIBIT “C” – Package Outline Drawing (1704-ball Organic fcBGA) EXHIBIT “D” – ASE Kaohsiung, Taiwan Qualified Material Set Ceramic fcBGA Package Type 1152fcBGA 1704fcBGA Standard Pb-Free Standard Pb-Free Organic fcBGA Material Set Assembly Site Underfill Bump Fujitsu UF-01 Sn97.4Ag2.6 Fujitsu UF-01 Sn97.4Ag2.6 Solder Ball Assembly Site Material Set Underfill Bump Sn96.5Ag3.0Cu0.5 ASE Kaohsiung UA Sn97.4Ag2.6 Sn63Pb37 Sn96.5Ag3.0Cu0.5 ASE Kaohsiung UA Sn97.4Ag2.6 Sn63Pb37 Solder Ball Sn63Pb37 Sn96.5Ag3.0Cu0.5 Sn63Pb37 Sn96.5Ag3.0Cu0.5