August 1, 2011 Revision History PCN# Issue Date 06A-11 May 2, 2011 06B-11 May 2, 2011 06C-11 August 1, 2011 Subject: Description Initial release. Exhibit B “Affected Device List” has been updated to include the M5-320/160 and M5-384/160 products. Withdrawal of all previous versions of this PCN Withdrawal of PCN# 06B-11 Dear Lattice Customers: Lattice is withdrawing this Notification effective immediately. The original intent of this Notice was to establish alternate Bills of Materials to expand our manufacturing capacity in light of the material shortages that were feared as a result of the Japan earthquake of March 2011. Material shortages have been resolved and steps have been taken to assure supply going forward. As a result, Lattice is no longer planning to go forward with the Alternate Qualified Material Sets identified in this Notice. Sincerely, Lattice Semiconductor PCN Administration PCN#06B-11, #07B-11 and ACN#03C-11 also issued on May 2, 2011 will supersede ACN#03B-11, issued on April 5, 2011. May 2, 2011 Revision History 06A-11 May 2, 2011 06B-11 May 2, 2011 Subject: Description N Issue Date Initial release. Exhibit B “Affected Device List” has been updated to include the M5-320/160 and M5-384/160 products. D R AW PCN# PCN# 06B-11, Notification of Intent to Utilize an Alternate Qualified Material Set for Select Thin Quad Flat Pack and Plastic Quad Flat Pack Packages Dear Lattice Customers: Lattice is providing this Notification of our intent to utilize an alternate qualified material set for select devices in Thin Quad Flat Pack (TQFP) and Plastic Quad Flat Pack (PQFP) packages. In an effort to diversify our source of supply, and reduce risk of supply interruption, Lattice will now maintain alternate qualified Bills of Material (BOMs) for select TQFP and PQFP packages. Alternate BOMs will be qualified at ASE Malaysia* and at UTAC Singapore*. Both ASE Malaysia and UTAC H Singapore utilize industry standard raw materials, assembly and test processes. These material sets meet all external package dimensions and package footprints remain the same and are published on W IT the Lattice web site (www.latticesemi.com). Lattice is taking this action in response to the major Japan earthquake of March 11, 2011. This urgent response to the risk of supply interruption creates a need for immediate qualification of these alternate BOMs. Lattice will provide a limited set of package samples using the alternate BOMs for select die / package combinations to assist customer conversions. Sample availability plans are shown in Exhibit A. *Note: At this time, no changes are planned to TQFP/PQFP BOMs used at Amkor Philippines, Amkor Korea, ASE Taiwan, or Unisem Indonesia. Lattice Semiconductor Home Page: http://www.latticesemi.com Applications & Literature Hotline: 1-800-LATTICE Copyright 2011 Lattice Semiconductor Corporation. Lattice Semiconductor, L(stylized) Lattice Semiconductor Corporation, Lattice (design), ispLSI, LatticeEC, LatticeECP, LatticeECP2, ispGDX, ispPAC, Platform Manager, ispMACH, MachXO, MachXO2, LatticeXP, LatticeXP2, ispXPLD and ORCA are either registered trademarks or trademarks of Lattice Semiconductor Corporation in the United States and/or other countries. Other product names used in this publications are for identification purposes only and may be the trademarks of their respective companies. Page 2 AFFECTED DEVICES AND APPLICABLE CHANGES The affected devices and applicable changes are summarized in Exhibit B. This PCN also affects any custom devices (i.e. factory programmed, customer specific Pb-free packages, special test, tape & reel, etc.), which are derived from any of the devices listed. ALTERNATE QUALIFIED MATERIAL SET DEVICE MARKING AND IDENTIFICATION N The complete material set used for each package type is described in Exhibit C. Lattice does not plan to change the device marking or identification for the alternate materials. Our D R AW assembly subcontractors will use the existing and alternate BOMs as required to meet production demand. The current topside Date Code Mark provides complete traceability to the assembly vendor and BOM used for all products. Due to the critical nature of this situation, Lattice is not able to accommodate specific BOM requests. The existing and alternate BOMs will be qualified and available for use interchangeably. QUALIFICATION AND CHARACTERIZATION DATA Reliability testing for the qualification of these ASE Malaysia and UTAC Singapore manufactured TQFP and PQFP packages is in progress. The Qualification Plan and Timing are shown in Exhibit D. An updated PCN will be posted to the Lattice web site when qualification milestones are completed. H Product Performance Characterization of the qualification vehicle devices for these ASE Malaysia and UTAC Singapore manufactured TQFP and PQFP packages is in progress. The characterization plan is shown in Exhibit E. Characterization data will be reported with the qualification milestone W IT updates. DATA SHEET SPECIFICATIONS This PCN has no impact on any data sheet specifications. CONVERSION TIMING Use of the Alternate BOMs will begin no sooner than October 3, 2011 (Note: this schedule may change in the event of further supply chain interruption). Any significant changes to the Qualification and Characterization schedule, or changes in material availability, will be reported in an updated PCN. Lattice recommends expedited approval of this PCN to ensure continued supply of product. Page 3 CONVERSION TIMING – Summary ACN Issue Date: April 5, 2011 PCN Issue Date: May 2, 2011 Early Qualification and Characterization Date: Late June, 2011 Final Qualification and Characterization Date: Late July, 2011 PCN Expiration Date: October 3, 2011 RESPONSE N In accordance with JESD46-C, this change is deemed accepted by the customer if no D R AW acknowledgement is received within 30 days from this Notice. Lattice PCNs are available on the Lattice website. Please sign up to receive e-mail PCN alerts by registering here. If you already have a Lattice web account and wish to receive PCN alerts, you can do so by logging into your account and making edits to your subscription options. CONTACT If you have any questions or require additional information, please contact [email protected]. Sincerely, W IT H Lattice Semiconductor PCN Administration Page 4 EXHIBIT “A” – PCN Evaluation Sample Availability1 Vendor Die Attach Mold Compound Pb-Free 100-TQFP TN100 UTAC Singapore Yes Yes LCMXO1200C Pb-Free 100-TQFP TN100 ASE Malaysia Yes Yes LFXP2-8E Pb-Free 144-TQFP TN144 UTAC Singapore No Yes LFE2-12E Pb-Free 144-TQFP TN144 ASE Malaysia Yes Yes LC4032ZC Pb-Free 48-TQFP TN48 ASE Malaysia Yes Yes LC4032V Pb-Free 48-TQFP TN48 ASE Malaysia Yes Yes LC4032V Pb-Free 44-TQFP TN44 ASE Malaysia Yes Yes LC4064V Pb-Free-100-TQFP TN100 ASE Malaysia Yes Yes LC4064V Pb-Free 48-TQFP TN48 ASE Malaysia Yes Yes LC4128V Pb-Free-100-TQFP TN100 ASE Malaysia Yes Yes M4A3-128 Pb-Free-100-TQFP VN ASE Malaysia Yes Yes LCMXO256C D R AW Package Type N Package Designator Product W IT H 1. Sample availability targeted for end of July EXHIBIT “B” – PCN Device Listing and Applicable Changes ispLSI 1048E ispLSI 1000EA ispLSI 1016EA ispLSI 1024EA ispLSI 1032EA ispLSI 1048EA ispLSI 2032A ispLSI 2064A ispLSI 2000A ispLSI 2096A ispLSI 2128A ispLSI 2032E ispLSI 2064E ispLSI 2096E ispLSI 2128E ispLSI 2032VE ispLSI 2064VE ispLSI 2000VE 44-TQFP 100-TQFP 120-PQFP 128-PQFP 44-TQFP 100-TQFP 128-TQFP 128-PQFP 44-TQFP 100-TQFP 100-TQFP 128-TQFP 128-PQFP 44-TQFP 48-TQFP 100-TQFP 128-TQFP 128-PQFP 176-TQFP 160-PQFP 44-TQFP 48-TQFP 100-TQFP 128-TQFP 128-PQFP 176-TQFP 44-TQFP 48-TQFP 100-TQFP 44-TQFP 128-TQFP 100-TQFP 176-TQFP 160-PQFP 128-TQFP T44 T Q Q T44 T T Q T44 T100 T100 T128 Q128 T44 T48 T100 T128 Q128 T176 Q160 T44 T48 T100 T128 Q128 T176 T44 T48 T100 T44 T128 T100 T176 Q160 T128 IT H ispLSI 2000E Pb ispLSI 2096VE W ispLSI 2128VE ispLSI 2192VE Package Code Pb-Free Halogen-Free ASE Malaysia UTAC Singapore P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P AW N ispLSI 1000E ispLSI 10161 ispLSI 10321 ispLSI 10481 ispLSI 1048C1 ispLSI 1016E ispLSI 1032E Package Type TN44 TN TN QN TN44 TN48 TN100 TN128 QN128 TN176 QN160 R ispLSI ® 1000 Product Line D Product Family TN44 TN48 TN100 TN44 TN128 TN100 TN176 TN128 Note: This PCN affects all speed and temperature grades for the device families listed above. Please refer to the device family data sheets on the Lattice web site at http://www.latticesemi.com for the complete list of OPNs. This PCN also affects any custom devices (i.e. factory programmed, customer specific Pb-free packages, special test, tape and reel, non-standard speed grade, etc.), which are derived from any of the devices listed above. 1. Devices have been discontinued via PCN#13A-10. Last Time Buy orders may be sourced with alternate material sets. Page 6 EXHIBIT “B” – PCN Device Listing and Applicable Changes (Cont’d) ispXPLD® LFEC1E LatticeEC™ LFEC3E LFEC6E LFEC10E LatticeECP ™ LFECP6E LFECP10E LFE2-6E/SE LatticeECP2 ispGDX® LFE2-20E/SE ispGDX160V ispGDX80VA ispGDX160VA ispPAC-CLK5304S ispPAC-CLK5308S ispPAC-CLK5312S ispPAC-CLK5316S ispPAC-CLK5320S ispPAC-CLK5510V ispPAC-CLK5520V ispPAC-CLK5610AV ispPAC-CLK5610V ispPAC-CLK5620AV ispPAC-CLK5620V W ispPAC®-CLK LFE2-12E/SE IT H ™ 208-PQFP 208-PQFP 208-PQFP 128-TQFP 100-TQFP 128-TQFP 208-PQFP 100-TQFP 144-TQFP 208-PQFP 100-TQFP 144-TQFP 208-PQFP 144-TQFP 208-PQFP 208-PQFP 144-TQFP 208-PQFP 208-PQFP 144-TQFP 144-TQFP 208-PQFP 208-PQFP 208-PQFP 100-TQFP 208-PQFP 48-TQFP 48-TQFP 48-TQFP 64-TQFP 64-TQFP 48-TQFP 100-TQFP 48-TQFP 48-TQFP 100-TQFP 100-TQFP Pb Q208 Q208 Q208 T128 T100 T128 Q208 T100 T144 Q208 T100 T144 Q208 T144 Q208 Q208 T144 Q208 Q208 T144 T144 Q208 Q208 Q208 T100 Q208 T48 T48 T48 T64 T64 T48 T100 T48 T48 T100 T100 Package Code Pb-Free Halogen-Free ASE Malaysia P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P UTAC Singapore AW N ispLSI 5000VE ispLSI 5256VA ispLSI 5384VA ispLSI 5512VA ispLSI 5128VE ispLSI 5256VE ispLSI 5256VE LC5512MV Package Type QN208 TN100 TN144 QN208 TN100 TN144 QN208 TN144 QN208 QN208 TN144 QN208 QN208 TN144 TN144 QN208 QN208 R ispLSI 5000VA Product Line D Product Family TN100 TN48 TN48 TN48 TN64 TN64 TN48 TN100 TN48 TN48 TN100 TN100 P P Note: This PCN affects all speed and temperature grades for the device families listed above. Please refer to the device family data sheets on the Lattice web site at http://www.latticesemi.com for the complete list of OPNs. This PCN also affects any custom devices (i.e. factory programmed, customer specific Pb-free packages, special test, tape and reel, non-standard speed grade, etc.), which are derived from any of the devices listed above. Page 7 EXHIBIT “B” – PCN Device Listing and Applicable Changes (Cont’d) LC4032V/B/C LC4064V/B/C LC4128V ispMACH® 4000 LC4128V/B/C LC4256V LC4256V/B/C LC4384V/B/C LC4512V/B/C LC4032ZC LC4064ZC LC4128ZC IT H ispMACH 4000ZC LC4256ZC LC4032ZE LC4064ZE ispMACH 4000ZE 48-TQFP 48-TQFP 100-TQFP 48-TQFP 48-TQFP 44-TQFP 48-TQFP 100-TQFP 44-TQFP 48-TQFP 144-TQFP 100-TQFP 128-TQFP 144-TQFP 100-TQFP 176-TQFP 176-TQFP 176-TQFP 48-TQFP 100-TQFP 48-TQFP 100-TQFP 100-TQFP 176-TQFP 48-TQFP 100-TQFP 48-TQFP 100-TQFP 144-TQFP 100-TQFP 144-TQFP LC4128ZE W LC4256ZE Pb T48 T48 T100 Package Code Pb-Free TN48 TN48 TN100 TN48 TN48 TN44 TN48 TN100 TN44 TN48 TN144 TN100 TN128 TN144 TN100 TN176 TN176 TN176 TN48 TN100 TN48 TN100 TN100 TN176 TN48 TN100 TN48 TN100 TN144 TN100 TN144 Halogen-Free ASE Malaysia AW N ispPAC-POWR ispPAC-POWR1014 ispPAC-POWR1014A ispPAC-POWR1220AT8 LA-ispPAC-POWR1014 LA-ispPAC-POWR1014A Package Type T44 T48 T100 T44 T48 T144 T100 T128 T144 T100 T176 T176 T176 T48 T100 T48 T100 T100 T176 R Product Line D Product Family P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P UTAC Singapore P P P P P Note: This PCN affects all speed and temperature grades for the device families listed above. Please refer to the device family data sheets on the Lattice web site at http://www.latticesemi.com for the complete list of OPNs. This PCN also affects any custom devices (i.e. factory programmed, customer specific Pb-free packages, special test, tape and reel, non-standard speed grade, etc.), which are derived from any of the devices listed above. Page 8 EXHIBIT “B” – PCN Device Listing and Applicable Changes (Cont’d) M4A3-64/32 M4A3-64/64 M4A3-96/48 ispMACH 4A3 M4A3-128/64 M4A3-192/96 M4A3-256/128 M4A3-256/160 M4A3-384/160 M4A3-512/160 M4A5-32/32 M4A5-64/32 ispMACH 4A5 M4A5-96/48 M4A5-128/64 IT H M4A5-192/96 M4A5-256/128 LCMXO256C/E LCMXO640C/E ™ MachXO LCMXO1200C/E LCMXO2280C/E MachXO2™ LCMXO2-1200HC/ZE LFXP3C/E W LatticeXP ™ 44-TQFP 48-TQFP 44-TQFP 48-TQFP 100-TQFP 100-TQFP 100-TQFP 100-PQFP 144-TQFP 208-PQFP 208-PQFP 208-PQFP 208-PQFP 44-TQFP 48-TQFP 44-TQFP 48-TQFP 100-TQFP 100-TQFP 100-PQFP 144-TQFP 208-PQFP 100-TQFP 100-TQFP 144-TQFP 100-TQFP 144-TQFP 100-TQFP 144-TQFP 100-TQFP 144-TQFP 100-TQFP 144-TQFP 208-PQFP 144-TQFP 208-PQFP LFXP6C/E Pb V V48 V V48 V V V Y V Y Y Y Y V V48 V V48 V V Y V Y T100 T100 T144 T100 T144 T100 T144 Package Code Pb-Free VN VN48 VN VN48 VN Halogen-Free ASE Malaysia P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P UTAC Singapore AW N M4A3-32/32 Package Type VN VN YN YN VN VN48 VN VN48 VN VN YN VN YN TN100 TN100 TN144 TN100 TN144 TN100 TN144 R Product Line D Product Family T100 T144 Q208 T144 Q208 TN100 TN144 QN208 TN144 QN208 TG100 TG144 P P P P P P P P P P P P P P Note: This PCN affects all speed and temperature grades for the device families listed above. Please refer to the device family data sheets on the Lattice web site at http://www.latticesemi.com for the complete list of OPNs. This PCN also affects any custom devices (i.e. factory programmed, customer specific Pb-free packages, special test, tape and reel, non-standard speed grade, etc.), which are derived from any of the devices listed above. Page 9 EXHIBIT “B” – PCN Device Listing and Applicable Changes (Cont’d) LatticeXP2™ ™ ORCA 2 Series ORCA 3 Series LFXP2-8E LFXP2-17E OR2T15A2 OR2T26A2 OR3T30 OR3T55 M5-128/68 W Mach 5LV IT H Mach® 5 M5-128/120 M5-192/120 M5-192/68 M5-256/120 M5-256/160 M5-256/68 M5-320/160 M5-384/160 M5LV-128/104 M5LV-128/120 M5LV-128/68 M5LV-128/74 M5LV-256/104 M5LV-256/120 M5LV-256/160 M5LV-256/68 M5LV-256/74 M5LV-320/120 M5LV-320/160 M5LV-384/120 M5LV-384/160 M5LV-512/120 M5LV-512/160 144-TQFP 208-PQFP 144-TQFP 208-PQFP 208-PQFP 208-PQFP 208-PQFP 208-PQFP 208-PQFP 100-TQFP 100-PQFP 160-PQFP 160-PQFP 100-TQFP 160-PQFP 208-PQFP 100-TQFP 208-PQFP 208-PQFP 144-TQFP 160-PQFP 100-TQFP 100-TQFP 144-TQFP 160-PQFP 208-PQFP 100-PQFP 100-TQFP 160-PQFP 208-PQFP 160-PQFP 208-PQFP 160-PQFP 208-PQFP Pb Package Code Pb-Free TN144 QN208 TN144 QN208 QN208 Halogen-Free ASE Malaysia AW N LFXP2-5E Package Type S208 S208 S208 S208 V Y Y Y V Y Y V Y Y V Y V V V Y Y Y V Y Y Y Y Y Y R Product Line D Product Family P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P UTAC Singapore P P Note: This PCN affects all speed and temperature grades for the device families listed above. Please refer to the device family data sheets on the Lattice web site at http://www.latticesemi.com for the complete list of OPNs. This PCN also affects any custom devices (i.e. factory programmed, customer specific Pb-free packages, special test, tape and reel, non-standard speed grade, etc.), which are derived from any of the devices listed above. 2. Select speed grade devices have been discontinued per PCN#09I-10. Page 10 EXHIBIT “C” – Current and Future Qualified Assembly Sites and Material Sets TQFP UTAC Singapore Ablebond 3230 PQFP ASE Malaysia Ablebond 8361J Hitachi CEL9510HF Series Sumitomo G700LY Alternate Qualified Material Set Assembly Site Die Attach Mold Compound AW N Package Type Current Material Set Assembly Site Die Attach Mold Compound Ablebond 3230 Hitachi CEL9510HF Series1 ASE Malaysia Ablebond 8361J Hitachi CEL9220HF Series2 Hitachi CEL9510HF Series3 Wire Au ASE Malaysia Au UTAC Singapore Au ASE Malaysia Yizbond 8143 Sumitomo G631SH Ablebond 3230 Yizbond 8143 Sumitomo G631SH Sumitomo G631SH Wire Au Au Au R 1. CEL9510HF used for the LatticeECP2/M and LatticeXP2 product families 2. CEL9220HF used for all other product families 3. CEL9510HF used exclusively for the LatticeXP2 product family. W IT H D Note: Above table summarizes the current qualified material set and alternate qualified material set at ASE Malaysia and UTAC Singapore. The highlighted cells in the “Alternate Qualified” section identify the changes associated with this PCN. Page 11 EXHIBIT “D” – Alternate Materials Qualification Plan TQFP/PQFP ASEM SMPC 3 135 ASEM TC 3 ASEM HTSL ASEM Lattice Semi Jedec Standard J-STD-020D.1 & JESD-A113F Condition MSL3 30C/60% RH & 260C peak reflow temp Vcc (V) N/A N/A 45 JESD22-A104C Cond B (-55C/+125C) N/A 200 Cycles 3 45 JESD22-A103D 150C dry bake N/A 168 Hrs UHAST 3 45 JESD22-A118 Cond A (130C/85%RH) N/A N/A 96 Hours BHAST 3 45 JESD22-A110B Cond A (130C/85%RH) 1.2 / 3.3 N/A 96 Hours Units / Lot Stress UTAC SMPC UTAC TC UTAC HTSL Now CEL9510HF Series # Lot s Units / Lot 3 135 3 Early Release Target Date Late June Qual Complete After 3x reflow 1000 Cycles 1000 Hours Early Release Target Date Vcc (V) Early Release Point N/A N/A Cond B (-55C/+125C) N/A 200 Cycles JESD22-A103D 150C dry bake N/A 168 Hrs 45 JESD22-A118 Cond A (130C/85%RH) N/A N/A 96 Hours 45 JESD22-A110B LQ - Cond A (130C/85%RH) 1.2 / 3.3 N/A 96 Hours Condition MSL3a 60C/60% RH & 260C peak reflow temp 45 JESD22-A104C 3 45 UHAST 3 BHAST 3 W Jedec Standard J-STD-020D.1 & JESD-A113F Qual Complete Target Date Late July Peak Reflow Temp 260C Alternate Sumitomo G631SH IT H Reliability Stress at Lattice Semi 260C Early Release Point UTAC Alternate BOM Qualification TQFP/PQFP UTAC Sumitomo G631SH R Stress Alternate D Reliability Stress at # Lot s Now CEL9510HF Series CEL9220HF Series AW N ASEM Alternate BOM Qualification Peak Reflow Temp Qual Complete After 3x reflow Qual Complete Target Date 1000 Cycles Late June 1000 Hours Late July Page 12 EXHIBIT “E” – Alternate Materials Characterization Plan Pkg Split Mold Compound LFXP2-8E 144-TQFP Current CEL9510HF Series 1 300 90C LFXP2-8E 144-TQFP Alternate Sumitomo G631SH 3 300 90C Product Pkg Split Mold Compound LFE2-12E 144-TQFP Current CEL9510HF Series 1 300 90C LFE2-12E 144-TQFP Alternate Sumitomo G631SH 3 300 90C UTAC Subcon # Units/ Lot Lots Product W IT H D R ASEM Temperature AW N Subcon # Units/ Lot Lots Temperature