Freescale Semiconductor, Inc. Data Sheet: Technical Data FXLN83xxQ Rev 2.0, 7/2014 Xtrinsic FXLN83xxQ 3-Axis LowPower Analog-Output Accelerometer FXLN83xxQ FXLN83xxQ is a family of 3-axis, low-power, low-g, analogoutput accelerometers that consist of an acceleration sensor along with a CMOS signal conditioning and control ASIC in a 3x3x1mm QFN package. The analog outputs for the X, Y, and Z axes are internally compensated for zero-g offset and sensitivity, and then buffered to the output pads. The outputs have a fixed zero-g offset of 0.75V, irrespective of the VDD supply voltage. The bandwidth of the output signal for each axis may be independently adjusted using external capacitors. The host can place the FXLN83xxQ into a low-current shutdown mode to conserve power. Features • Supply voltage (VDD) from 1.71 V to 3.6 V • Accelerometer operating ranges selectable • ±2 g or ±8 g (FXLN83x1Q) • ±4 g or ±16 g (FXLN83x2Q) • Low current consumption of 180 μA (typical) • Output Bandwidth Options • High bandwidth, 2.7 kHz (XY axes), 600 Hz (Z axis), (FXLN837XQ) • Low bandwidth, 1.1 kHz (XY axes), 600 Hz (Z axis), (FXLN836XQ) • 3 x 3 x 1 mm, 12-pin QFN package (0.65 mm lead pitch) • Robust design with high shock survivability (10,000 g) • Operating temperature from –40 °C to +105 °C • MSL 1 compliant Typical Applications • Tamper detection • White goods: tilt, vibration, and shake detection • Motion sensing in robotics applications • Inclinometer, vibrometer • Activity monitoring in sports and medical devices Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. © 2014 Freescale Semiconductor, Inc. All rights reserved. 12-pin QFN 3 mm x 3 mm x 1 mm Case 2300-01 Top View NC NC 12 11 BYP 1 10 XOUT VDD 2 9 YOUT ST 3 8 ZOUT EN 4 7 GND 5 6 g-Select GND Pin Connections Ordering Information Part Number Operating Range Bandwidth Temperature Range Package Description Shipping FXLN8361QR1 ±2/8 g Low –40 °C to +105 °C QFN-12 Tape and reel (1 k) FXLN8362QR1 ±4/16 g Low –40 °C to +105 °C QFN-12 Tape and reel (1 k) FXLN8371QR1 ±2/8 g High –40 °C to +105 °C QFN-12 Tape and reel (1 k) FXLN8372QR1 ±4/16 g High –40 °C to +105 °C QFN-12 Tape and reel (1 k) Related Documentation The FXLN83xxQ device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the Freescale homepage at freescale.com. 2. In the Keyword search box at the top of the page, enter the device number FXLN83xxQ. 3. In the Refine Your Result pane on the left, click on the Documentation link. 2 Freescale Semiconductor, Inc. Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0, 7/2014. Table of Contents 1 General Description......................................................................... 4 1.1 Block Diagram.........................................................................4 1.2 Pin Descriptions.......................................................................4 1.3 Typical Application Circuit..................................................... 6 1.4 Sensing Direction and Output Response................................. 6 2 Device Characteristics..................................................................... 8 2.1 Absolute Maximum Ratings.................................................... 8 2.2 Mechanical Specifications ...................................................... 9 2.3 Electrical Specifications ......................................................... 10 3 Printed Circuit Board Layout and Device Mounting.......................11 3.1 Printed Circuit Board Layout...................................................11 3.2 Overview of Soldering Considerations....................................12 3.3 Halogen Content...................................................................... 13 4 Package Information........................................................................ 13 4.1 Device Marking....................................................................... 13 4.2 Tape and Reel Information...................................................... 13 4.3 Package Description................................................................ 14 5 Revision History.............................................................................. 17 Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0, 7/2014. 3 Freescale Semiconductor, Inc. General Description 1 General Description 1.1 Block Diagram BYP XOUT D2SAAF VDD aX,aY,aZ 10 KΩ Z+ Y+ X+ G-cell MUX C2V Gain YOUT MUX D2SAAF 10 KΩ ST X- Z- Y- ZOUT D2SAAF 10 KΩ EN References Self Test Clock Digital Logic and Control g-Select Figure 1. FXLN83xxQ block diagram 4 Freescale Semiconductor, Inc. Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0, 7/2014. General Description 1.2 Pin Descriptions NC NC 12 11 BYP 1 10 XOUT VDD 2 9 YOUT ST 3 8 ZOUT EN 4 7 GND 5 6 g-Select GND Figure 2. Pin locations Table 1. Pin descriptions Pin Name Description I/O 1 BYP Internal voltage regulator output capacitor connection Output 2 VDD Supply voltage Power 3 ST1 Self-Test • When ST pin is logic high, the accelerometer is put into self-test mode. • When ST pin is logic low, the accelerometer is put into normal operating mode. Input 4 EN Power enable pin • When the EN pin is logic low, the accelerometer is shut down, minimizing current consumption. • When the EN pin is logic high, the accelerometer is fully functional. Input 5 g-Select Full Scale Range selection: For part numbers FXLN8361QR1 & FXLN8371QR1: • When the g-select pin is logic low, the accelerometer is in ±8 g mode • When the g-select pin is logic high, the accelerometer is in ±2 g mode Input For part numbers FXLN8362QR1 & FXLN8372QR1: • When the g-select pin is logic low, the accelerometer is in ±16 g mode • When the g-select pin is logic high, the accelerometer is in ±4 g mode 6 GND Ground Ground 7 GND Ground Ground 8 ZOUT Z-axis analog output Output 9 YOUT Y-axis analog output Output 10 XOUT X-axis analog output Output 11 NC No internal connection, may be left floating or connected to GND — 12 NC No internal connection, may be left floating or connected to GND — EP DNC Center pads should not be soldered, refer to Printed Circuit Board Layout and Device Mounting — Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0, 7/2014. 5 Freescale Semiconductor, Inc. General Description 1. The Self-Test function verifies the correct functioning of the sensor and signal path without the need to apply a mechanical stimulus. When Self-Test is activated, an electrostatic actuation force is applied to the sensor, simulating a small acceleration. 1.3 Typical Application Circuit XOUT 12 11 C6 1 2 3 C3 0.1μF 4 XOUT VDD YOUT ST EN ZOUT GND 10 9 YOUT 8 7 C5 5 6 C2 4.7μF BYP g-Select GND VDD NC NC C1 0.1μF ZOUT FXLN83xxQ C4 SELF-TEST ENABLE RANGE SELECT Notes: 1. Position the decoupling capacitors (C2, C3) as near as possible to the VDD pin (common practice to filter out undesired noise from the power supply). 2. C1 is required to stabilize the output of the internal voltage regulator. 3. Connecting the EN pin to the VDD pin is not a supported configuration and may prevent the part from starting up. Do not set the EN pin high until VDD > 1.71 V. Recommended Minimum Capacitance Specifications Part Number FXLN8361Q FXLN8362Q FXLN8371Q FXLN8372Q Bandwidth C4 (pF) C5 (pF) Low Low High High 9100 9100 8200 8200 9100 9100 3300 3300 C6 (pF) 9100 9100 3300 3300 Figure 3. Electrical Connections 6 Freescale Semiconductor, Inc. Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0, 7/2014. General Description 1.4 Sensing Direction and Output Response Side View Top View BACK Pin 1 Xout @ 0 g Yout @ 0 g Zout @ –1 g FRONT 263 P3XX ALYM Xout @ 0 g Yout @ –1 g Zout @ 0 g Xout @ 0 g Yout @ 0 g Zout @ 1 g Earth Gravity Z 263 P3XX ALYM Xout @ –1 g Yout @ 0 g Zout @ 0 g Xout @ 1 g Yout @ 0 g Zout @ 0 g X Xout @ 0 g Yout @ 1 g Zout @ 0 g Y Top View Part Number Mode FXLN8361Q, FXLN8371Q FXLN8362Q, FXLN8372Q XYZ Output Voltage –1 g 0g +1 g ±2 g ±8 g 0.521 0.693 0.750 0.750 0.979 0.807 ±4 g ±16 g 0.636 0.722 0.750 0.750 0.865 0.779 Figure 4. Sensitive Axes Orientation and Response to Gravity Stimulus Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0, 7/2014. 7 Freescale Semiconductor, Inc. Device Characteristics 2 Device Characteristics 2.1 Absolute Maximum Ratings Absolute maximum ratings are the limits the device can be exposed to without permanently damaging it. Absolute maximum ratings are stress ratings only; functional operation at these ratings is not guaranteed. Exposure to absolute maximum ratings conditions for extended periods may affect reliability. This device contains circuitry to protect against damage due to high static voltage or electrical fields. It is advised, however, that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. Table 2. Absolute maximum ratings Rating Symbol Value Unit Supply voltage VDD –0.3 to +3.6 V Drop-test height, component Ddrop 1.8 m Operating temperature range TOP –40 to +105 °C Storage temperature range TSTG –40 to +125 °C Table 3. ESD and latch-up protection characteristics Rating Symbol Value Unit VHBM ±2000 V Machine model (MM) VMM ±200 V Charge device model (CDM) VCDM ±500 V Latch-up current at T = 85 °C ILU ±100 mA Human body model (HBM) Caution This device is sensitive to mechanical shock, improper handling can cause permanent damage to the part. Caution This is an ESD sensitive device, improper handling can cause permanent damage to the part. 8 Freescale Semiconductor, Inc. Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0, 7/2014. Device Characteristics 2.2 Mechanical Specifications Table 4. Mechanical characteristics Parameter Symbol Full scale range (FXLN83X1) FSR Full scale range (FXLN83X2) Nominal sensitivity SEN Test Conditions Min Typ Max ±2 g mode — ±2 — ±8 g mode — ±8 — ±4 g mode — ±4 — ±16 g mode — ±16 — ±2 g range — 229.0 — ±4g range — 114.5 — ±8 g range — 57.25 — ±16 g range — 28.62 — Unit g mV/g ±2 g Calibrated sensitivity SENCAL ±4 g VBYP/(3.276*gRange) ±8 g V/g ±16 g Calibrated sensitivity error SENERR ±2 g range –5 — +5 ±4 g range –6 — +6 % Sensitivity change vs. temperature1 TCS — –0.07 — +0.07 %/°C Cross-axis sensitivity1 CAS — –4.2 — +4.2 % STOC — 35(XY) 300(Z) — — mg ±2 g range 0.705 0.75 0.795 0.7125 0.75 0.7875 ±2 g range –1.2 — +1.2 ±4 g range –2.0 — +2.0 1 mm (overall thickness), 2-layer, FR4-based PCB –200 — +200 mg FXLN8371QR1, FXLN8372QR1 — 200(XY) 280(Z) — µg/√Hz FXLN8361QR1, FXLN8362QR1 — 130(XY) 200(Z) — µg/√Hz — –40 — +105 °C Self-test output change1 Zero-g level offset VOFF ±4 g range ±8 g range V ±16 g range Zero-g level change vs. temperature1 Zero-g level offset, post board mount1 Noise Density1, 2 Operating temperature range1 TCO OFFPBM ND TOP mg/°C Notes: Test conditions (unless otherwise noted): • VDD = 2.8 V, unless otherwise noted • T = 25 °C, ±2 g range (for ±2/8 g product), ±4 g range (for ±4/16 g product) Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0, 7/2014. 9 Freescale Semiconductor, Inc. Device Characteristics Table 4. Mechanical characteristics • Analog acceleration output pin loading = 3.3 nF capacitors on X and Y axes, with 8.2 nF capacitor on Z axis (HBW configuration) • Analog acceleration output pin loading = 9.1 nF capacitors on X, Y and Z axes (LBW configuration) • No analog acceleration output pin loading other than external BW setting capacitor • No BYP pin loading other than bypass capacitor and 150 μA DC current draw through resistive divider. 1. Limits verified by characterization only. 2. High and Low Bandwidth modes are configured in non-volatile Memory (NVM) at the factory 2.3 Electrical Specifications Table 5. Electrical characteristics Parameter Symbol Test Conditions Min Typ Max Unit Supply voltage1 VDD — 1.71 2.8 3.6 V Active supply current IDD — — 180 — µA IDD–SD — — 30 — nA VBYP IBYP ≤ 150 µA 1.45 1.5 1.55 V RO — 8 10 12 kΩ High BW device — 2700(XY) 600(Z) — Low BW device — 1100(XY) 600(Z) — Shutdown supply current Voltage supplied at BYP pin1 Output impedance (XYZ outputs)1 Bandwidth1, 2, 3 BW Hz BYP output capacitor value CBYP External capacitor 70 100 500 nF Logic high input level on EN, gSelect, ST pins1 VIH — 0.75 * VDD — VDD V Logic low input level on EN, gSelect, ST pins1 VIL — 0 — 0.3 * VDD V Turn-on time1, 2, 4 TON — 660 — µs — 340 — µs –40 — +105 °C g-Select transition delay3 Operating temperature range1 Tg-Select TOP — Notes: Test conditions (unless otherwise noted): • VDD = 2.8 V • Output load = 3.3 nF capacitors on X and Y axes, with 8.2 nF capacitor on Z axis (HBW configuration) • Output load = 9.1 nF capacitors on X, Y and Z axes (LBW configuration) • Output loading other than external capacitor: high impedance • No electrical loading on BYP pin other than output capacitor and 150 μA (max) • DC output current for ADC reference input • T = 25°C, ±2 g range (for ±2/8 g product), ±4 g range (for ±4/16 g product) 1. Limits verified by characterization only. 2. Apply VDD first. Then, Turn-on time is defined by the delay between when the EN pin is set to high and the time at which a pin's output value reaches 90% of its final value. 3. g-Select pin transition from high to low. Time for output value to reach 90% of final value. 10 Freescale Semiconductor, Inc. Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0, 7/2014. Printed Circuit Board Layout and Device Mounting 4. BYP pin is not connected 3 Printed Circuit Board Layout and Device Mounting Printed Circuit Board (PCB) layout and device mounting are critical to the overall performance of the design. The footprint for the surface mount packages must be the correct size as a base for a proper solder connection between the PCB and the package. This, along with the recommended soldering materials and techniques, will optimize assembly and minimize the stress on the package after board mounting. Freescale application note AN1902, "Assembly Guidelines for QFN and DFN Packages" discusses the QFN package used by the FXLN83xxQ. 3.1 Printed Circuit Board Layout The following recommendations are a guide to an effective PCB layout. See Figure 5 for footprint dimensions. • The PCB land should be designed with Non-Solder Mask Defined (NSMD) as shown in Figure 5. • No additional via pattern underneath package. • No components or vias should be placed at a distance less than 2 mm from the package land area. This may cause additional package stress if it is too close to the package land area. • Signal traces connected to pads should be as symmetric as possible. Put dummy traces on the NC pads in order to have same length of exposed trace for all pads. • No copper traces should be on the top layer of the PCB under the package. This will cause planarity issues with board mount. Freescale QFN sensors are compliant with Restrictions on Hazardous Substances (RoHS), having halide-free molding compound (green) and lead-free terminations. These terminations are compatible with tin-lead (Sn-Pb) as well as tin-silver-copper (Sn-Ag-Cu) solder paste soldering processes. Reflow profiles applicable to those processes can be used successfully for soldering the devices. Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0, 7/2014. 11 Freescale Semiconductor, Inc. Printed Circuit Board Layout and Device Mounting 12X 0.330 3 5 12X 0.5 0.3 12X 0.686 12X 0.35 0.25 6 12X 0.3105 7 4 8X 0.325 8X 0.325 3 1 10 24 4X 0.650 4X 0.650 20 Package footprint Package PCB land pad 12X 0.533 12X 0.305 12X 0.889 12X 0.635 Package footprint 12X 0.4121 8X 0.325 8X 0.325 otprint aste stencil sk opening 4X 0.650 4X 0.650 Package footprint Solder stencil opening Solder mask opening Figure 5. Footprint 3.2 Overview of Soldering Considerations The information provided here is based on experiments executed on QFN devices. These experiments cannot represent exact conditions present at a customer site. Therefore, information herein should be used for guidance purposes only. Process and design optimizations are recommended to develop an application-specific solution. With the proper PCB footprint and solder stencil designs, the package will self-align during the solder reflow process. • Stencil thickness should be 100 or 125 µm. • The PCB should be rated for the multiple lead-free reflow condition with a maximum 260 °C temperature. 12 Freescale Semiconductor, Inc. Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0, 7/2014. Package Information • Use a standard pick-and-place process and equipment. Do not use a hand soldering process. • Do not use a screw-down or stacking to mount the PCB into an enclosure. These methods could bend the PCB, which would put stress on the package. 3.3 Halogen Content This package is designed to be Halogen Free, exceeding most industry and customer standards. Halogen Free means that no homogeneous material within the assembly package shall contain chlorine (Cl) in excess of 700 ppm or 0.07% weight/weight or bromine (Br) in excess of 900 ppm or 0.09% weight/weight. 4 Package Information The FXLN83xxQ device uses a 12-lead QFN package, case number 2300-01. 4.1 Device Marking Top View Freescale code 263 P3XX ALYW Traceability date code Assembly site Lot code Work week Part number P3XX 71, 72, 61, or 62 P = Prototype, 8 = Production Figure 6. Device Marking Description Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0, 7/2014. 13 Freescale Semiconductor, Inc. Package Information 4.2 Tape and Reel Information Figure 7. Tape dimensions Pin 1 Direction to unreel Barcode label side of reel Figure 8. Tape and reel orientation 14 Freescale Semiconductor, Inc. Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0, 7/2014. Package Information 4.3 Package Description Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0, 7/2014. 15 Freescale Semiconductor, Inc. Package Information This drawing is located at freescale.com. 16 Freescale Semiconductor, Inc. Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0, 7/2014. Revision History 5 Revision History Revision number Revision date 1.0 11/2013 Initial release. 1.1 7/2014 Revised to match current Freescale standard 2.0 7/2014 Description Figure 3, added note #3 Changed document type from Advance Information to Technical Data Xtrinsic FXLN83xxQ 3-Axis Low-Power Analog-Output Accelerometer, Rev2.0, 7/2014. 17 Freescale Semiconductor, Inc. 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All operating parameters, including “typicals,” must be validated for each customer application by customer's technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/SalesTermsandConditions. Freescale, the Freescale logo, Xtrinsic, and the Energy Efficient Solutions logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. © 2014 Freescale Semiconductor, Inc. Document Number FXLN83xxQ Revision 2.0, 7/2014