Tire Pressure Monitoring System User’s Guide © 2006 Microchip Technology Inc. DS51624B Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2006, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS51624B-page ii © 2006 Microchip Technology Inc. TIRE PRESSURE MONITORING SYSTEM USER’S GUIDE Table of Contents Preface ........................................................................................................................... 1 Introduction............................................................................................................ 1 Document Layout .................................................................................................. 1 Conventions Used in this Guide ............................................................................ 2 Recommended Reading........................................................................................ 3 The Microchip Web Site ........................................................................................ 3 Customer Support ................................................................................................. 4 Document Revision History ................................................................................... 4 Chapter 1. Quick Start Instructions ............................................................................. 5 1.1 Introduction ..................................................................................................... 5 Chapter 2. System Overview ........................................................................................ 9 2.1 System Technical Specifications .................................................................... 9 2.2 Operation Overview ........................................................................................ 9 2.3 Network Setup Overview .............................................................................. 10 Chapter 3. Hardware Overview .................................................................................. 11 3.1 Introduction ................................................................................................... 11 3.2 Base Station Module Overview .................................................................... 11 3.3 Low Frequency Initiator Module ................................................................... 13 3.4 Transponder Sensor Module ........................................................................ 14 3.5 Analog Sensor Calibration ............................................................................ 19 3.6 Sensor Calibration ........................................................................................ 19 Appendix A. Schematic and Layouts ........................................................................ 23 A.1 Introduction .................................................................................................. 23 A.2 Base Station Module Schematic (Page 1) ................................................ 24 A.3 Base Station Module Schematic (Page 2) ................................................. 25 A.4 Base Station Wiring Harness - Schematic ............................................... 26 A.5 Base Station Module - Top Layer and Silk Screen .................................... 27 A.6 Base Station Module - Bottom Layer ......................................................... 27 A.7 Low Frequency Initiator Module - Schematic ........................................... 28 A.8 Low Frequency Initiator Module - Top Layer and Silk Screen ..................... 29 A.9 Low Frequency Initiator Module - Bottom Layer ........................................ 29 A.10 Transponder Sensor Module - Schematic ................................................ 30 A.11 Transponder Sensor Module - Top Layer and Silk Screen ...................... 31 A.12 Transponder Sensor Module - Bottom Layer ........................................... 31 A.13 Circuit Block Figure .................................................................................. 32 © 2006 Microchip Technology Inc. DS51624B-page iii Tire Pressure Monitoring System User’s Guide Appendix B. Bill Of Materials (BOM) ..........................................................................33 Worldwide Sales and Service .....................................................................................38 DS51624B-page iv © 2006 Microchip Technology Inc. TIRE PRESSURE MONITORING SYSTEM USER’S GUIDE Preface NOTICE TO CUSTOMERS All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our web site (www.microchip.com) to obtain the latest documentation available. Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is “DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the document. INTRODUCTION This chapter contains general information that will be useful to know before using the Tire Pressure Monitor System. Items discussed in this chapter include: • • • • • • Document Layout Conventions Used in this Guide Recommended Reading The Microchip Web Site Customer Support Document Revision History DOCUMENT LAYOUT This document describes how to use the Tire Pressure Monitor System as a development tool. The manual layout is as follows: • Chapter 1. “Quick Start Instructions” – includes instructions on how to connect the system together. • Chapter 2. “System Overview” – shows an overview of the Tire Pressure Monitor System. • Chapter 3. “Hardware Overview” – shows and overview of the hardware used in the Tire Pressure Monitor System. • Appendix A. “Schematic and Layouts” – shows the schematic and board layout diagrams for the Tire Pressure Monitor System. • Appendix B. “Bill Of Materials (BOM)” – lists the parts used to build the Tire Pressure Monitor System boards. © 2006 Microchip Technology Inc. DS51624B-page 1 Tire Pressure Monitoring System User’s Guide CONVENTIONS USED IN THIS GUIDE This manual uses the following documentation conventions: DOCUMENTATION CONVENTIONS Description Arial font: Italic characters Initial caps Quotes Underlined, italic text with right angle bracket Bold characters N‘Rnnnn Text in angle brackets < > Courier New font: Plain Courier New Represents Referenced books Emphasized text A window A dialog A menu selection A field name in a window or dialog A menu path MPLAB® IDE User’s Guide ...is the only compiler... the Output window the Settings dialog select Enable Programmer “Save project before build” A dialog button A tab A number in verilog format, where N is the total number of digits, R is the radix and n is a digit. A key on the keyboard Click OK Click the Power tab 4‘b0010, 2‘hF1 Italic Courier New Sample source code Filenames File paths Keywords Command-line options Bit values Constants A variable argument Square brackets [ ] Optional arguments Curly brackets and pipe character: { | } Ellipses... Choice of mutually exclusive arguments; an OR selection Replaces repeated text Represents code supplied by user DS51624B-page 2 Examples File>Save Press <Enter>, <F1> #define START autoexec.bat c:\mcc18\h _asm, _endasm, static -Opa+, -Opa0, 1 0xFF, ‘A’ file.o, where file can be any valid filename mcc18 [options] file [options] errorlevel {0|1} var_name [, var_name...] void main (void) { ... } © 2006 Microchip Technology Inc. Preface RECOMMENDED READING This user's guide describes how to use Tire Pressure Monitor System. The following Microchip documents are available and recommended as supplemental reference resources. MCP201 Data Sheet, “LIN Transceiver with Voltage Regulator” (DS21730) MCP2030 Data Sheet, “Three-Channel Analog Front-End Device“ (DS21981) HCS365 Data Sheet “KEELOQ® Code Hopping Encoder“ (DS41109) MCP3550/1/3 Data Sheet, “Low-Power Single Channel 22-Bit Delta Sigma ADCs“ (DS21950) TC4421/22 Data Sheet, “9A High-Speed Mosfet Drivers” (DS21420) AN232, "Low Frequency Magnetic Transmitter Design" (DS00232) AN617, “Fixed Point Routines“ (DS00617) AN695, “Interfacing Pressure Sensors to Microchip's Analog Peripherals“ (DS00695) AN990, “Analog Sensor Conditioning Circuits - An Overview“ (DS00990) AN1009, “LIN 2.0 Compliant Driver Using the PIC18XXXX” (DS01009) Passive Keyless Entry (PKE) Reference Design User’s Manual (21986) LIN Specification Package, Revision 1.3 (http://www.lin-subbus.org) THE MICROCHIP WEB SITE Microchip provides online support via our web site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives © 2006 Microchip Technology Inc. DS51624B-page 3 Tire Pressure Monitoring System User’s Guide CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com DOCUMENT REVISION HISTORY Revision A (August 2006) • Initial Release of this Document. DS51624B-page 4 © 2006 Microchip Technology Inc. TIRE PRESSURE MONITORING SYSTEM USER’S GUIDE Chapter 1. Quick Start Instructions 1.1 INTRODUCTION This section provides the user a quick step-by-step instruction guide on how to get the Tire Pressure Monitor System operational. 1. Connect the Base Station module (J2) with the Low Frequency (LF) Initiator module (J4) with the connector cable provided with the kit to establish the Local Interconnect Network (LIN) physical connections. Note: © 2006 Microchip Technology Inc. This reference design provides only the typical calibration values used during development. Therefore, the accuracy of the measurements is not guaranteed. The user is responsible for performing the calibration routine for their applications. Please contact sensor manufacturing for additional information regarding this topic. DS51624B-page 5 Tire Pressure Monitoring System User’s Guide 2. Apply power to the Sensor module by inserting a 3V NiHM (CR2320) battery. The LED will light to indicate that the power is supplied. DS51624B-page 6 © 2006 Microchip Technology Inc. Quick Start Instructions 3. Supply power to either the Base Station module or the LF Initiator module with a 9V - 18V supply. Only one power source is needed if the power is shared on the LIN network. The LEDs will light to indicate that the power is connected. 4. The LCD module should be powered at this time. The pressure and temperature data is displayed on the LCD for each Sensor module connected to the LIN network. Check power and connection if no information is shown. © 2006 Microchip Technology Inc. DS51624B-page 7 Tire Pressure Monitoring System User’s Guide NOTES: DS51624B-page 8 © 2006 Microchip Technology Inc. TIRE PRESSURE MONITORING SYSTEM USER’S GUIDE Chapter 2. System Overview 2.1 SYSTEM TECHNICAL SPECIFICATIONS UHF Communication Frequency: LF Communication Frequency: Network Connectivity: Modulation Format: Encoding Method: 2.2 433.92 MHz 125 kHz LIN or CAN, LIN is used in the design ASK PWM OPERATION OVERVIEW The Base Station wakes up the Sensor modules in each tire through the Low Frequency Initiator to poll the pressure, temperature data and checks the battery level in a sequential manner. The Base Station communicates to the LF initiator via the LIN network. The LF initiator transmits a wake up challenge via a 125 kHz ASK modulated signal to the Tire sensor module after a command has been received from the Base Station. The 3-axis Analog Front End (MCP2030) of the Tire Sensor module validates the incoming challenge and wakes up the microcontroller from sleep only if the preambles match. The Tire Sensor module will then measure the pressure and the temperature, check the battery level and transmits the data to the Base Station via a 433.9 MHz signal. The Base Station will display the information on the LCD after receiving the data. The Base Station module contains a PIC18F4680. It is also implemented with a MCP201 LIN Transceiver and MCP2551 CAN Transceiver for communications via LIN or CAN. The LF Initiator module contains a PIC18F2680. The module also contains a MCP201 and MCP2551 for LIN or CAN communication. The Tire Sensor module contains a PIC16F684 with a MCP2030, a three-axis Analog Front-End (AFE). The analog pressure sensor used is the MS5407-AM from Intersema. © 2006 Microchip Technology Inc. DS51624B-page 9 Tire Pressure Monitoring System User’s Guide FIGURE 2-1: COMPLETE TIRE PRESSURE MONITORING SYSTEM Front Driver Side Front Passenger Side Inside Snr/TX Tire Inside Wheel well Snr/TX Inside Tire LF Inside Wheel well LF Optional for Spare Tire Inside Wheel well LF Inside Wheel well Inside Tire Base Station LF Snr/TX LF Inside Snr/TX Tire Inside Wheel well Snr/TX Inside Tire Rear Driver Side 2.3 Inside Vehicle Rear Passenger Side NETWORK SETUP OVERVIEW The reference kit provides one wiring harness for LIN connectivity between the Base Station Module and one Low Frequency Initiator Module. Refer to A.4 “Base Station Wiring Harness - Schematic” in Appendix A. “Schematic and Layouts” for the wiring harness schematic. The user must provide or modify the wiring harness in order to build a complete TPMS network via LIN. Refer to Figure 2-2 for more information. FIGURE 2-2: WIRING HARNESS FOR COMPLETE TPMS NETWORK LF Initiator J4 Power Source Base Station LF Initiator J4 +12V DC LIN GND J2 J4 LF Initiator DS51624B-page 10 J4 LF Initiator © 2006 Microchip Technology Inc. TIRE PRESSURE MONITORING SYSTEM USER’S GUIDE Chapter 3. Hardware Overview 3.1 INTRODUCTION The following section provides and overview of the hardware used in the Tire Pressure Monitoring System. 3.2 BASE STATION MODULE OVERVIEW 3.2.1 Technical Specifications UHF Receiving Frequency: 433.92 MHz Normal Operating Voltage: 9 - 18V Normal Operating Current: ~ 64 mA Communication Protocols: CAN and LIN Liquid Crystal Display (LCD): 2x16 3.2.2 Microcontroller The microcontroller implemented is a PIC18F4680 for this module based on the number of features offered by this device. The PIC18F4680 has both a CAN controller and a LIN compatible EUSART to interface to in-vehicle networks. 3.2.3 UHF Receiver The RF input is an AM super-regenerative compact hybrid module, that is used to capture decoded data from an AM Transmitter. The receiver has very high frequency stability over a wide operating temperature and tolerant of mechanical vibrations or manual handling. A laser trimmed on board inductor, removes the need for any adjustable components. 3.2.4 LCD A standard 16 pin 2x16 monochromes LCD is used to display the tire pressure and temperature data 3.2.5 Connectivity A MCP201 LIN transceiver and a MCP2551 CAN transceiver are provided on board to provide a way of connecting to LIN or CAN networks. This reference design uses the LIN to communicate between the Base Station and the LF Initiator(s) that is/are connected to the LIN network. The capacitor between the LIN bus pin and ground should have its value adjusted for the particular network topology. A large pull-up resistor on the nFault/SLPS pin ensures that the device resets to a standard slope control profile. Refer to the MCP201 Data Sheet, “LIN Transceiver with Voltage Regulator” (DS21730) for more information. Refer to Appendix A. “Schematic and Layouts”. © 2006 Microchip Technology Inc. DS51624B-page 11 Tire Pressure Monitoring System User’s Guide 3.2.6 Operation Overview The Base Station schedules when each tire is polled. The Base Station transmits the command to wake up the Transponder Sensor module to each LF Initiators individually on the LIN network. The command issued to LF Initiator contains a unique ID that was pre-assigned to each Initiator. This command will be issued maximum of three times if the previous attempt failed. The LF Initiator transmits a wake up command containing the two bytes of data from the base station to the Transponder Sensor module. The Base Station will then wait for an incoming RF data message stream from the Transponder Sensor module which will also contain the LF Initiator ID to distinguish the tire position. FIGURE 3-1: LIN MESSAGE COMMAND Message Frame Header Synch Break Synch Field Data Ident Field inter-frame space or BREAK Position Mode Checksum ID ID Field in-frame response space When the Learn Button (S1) is pressed, the Base Station places a Learn Mode ID in the second data byte of the message. The Base Station then issues the learn command sequentially to each LF initiator which in turn, transmits the command to the Transponder Sensor module. The Base Station waits for the Transponder Sensor to transmit back a message via UHF (the number of LF Initiators on the LIN network will determine how many messages to be expected by the Base Station and this must be defined by the user in the firmware). After a predetermined time has expired, an error message is displayed on the LCD if all the expected messages are not received. DS51624B-page 12 © 2006 Microchip Technology Inc. Hardware Overview 3.3 LOW FREQUENCY INITIATOR MODULE 3.3.1 Technical Specifications LF Transmitting Frequency: Connectivity: 3.3.2 125 kHz LIN or CAN, LIN is used for this design System Overview The LF Transmitter is derived from the design described in Application Note AN232, "Low Frequency Magnetic Transmitter Design" (DS00232). The hardware design of the LF Initiator module is identical to the LF module used in Microchip PKE reference design (APGRD001). Refer to Chapter 2 of the “PKE Reference Design User Guide” for more information on this module. Refer to Appendix A. “Schematic and Layouts”. 3.3.3 Operation Overview LF Initiator is connected to Base Station Module through the LIN network. Each LF Initiator is assigned a unique ID which is also used by the system to distinguish the tire location during normal operation. Once a command from the Base Station has been received, the LF Initiator transmits a wake-up challenge to the Transponder Sensor module via a 125 kHz modulated signal. The format of the signal is user configurable and also depends on the configurations of the AFE output filter on the Transponder Sensor module. Refer to 3.4.3.3 “LF Message Overview” for detail description of the LF message formatting. 3.3.4 Reference Material Refer to Recommended Reading in the Preface section. © 2006 Microchip Technology Inc. DS51624B-page 13 Tire Pressure Monitoring System User’s Guide 3.4 TRANSPONDER SENSOR MODULE 3.4.1 Technical Specifications Modulation Format: Encoding Method: Operating Voltage: Low Voltage Alert Threshold: Stand By Current With 3 LF Input Channels Enabled (PIC & AFE): UHF Transmitting Frequency: UHF Transmission Baud Rate (TE): UHF Range: LF Frequency: LF Input Sensitivity: LF Range: Pressure Sensor Type: Pressure Sensor Range: Pressure Sensor Temperature Range: 3.4.2 Hardware Overview 3.4.2.1 MICROCONTROLLER ASK PWM 2.3 - 3.3V 2.3V ~12 μA 433.92 MHz 100, 200, 400, 800 μs selectable, system default is 400 μs ~ 10 Meters 125 kHz ~3 mVPP Up to 3 Meters Analog 1-7 bars absolute -40 - 125°C The microcontroller used is the PIC16F684. The internal 10-bit ADC is used for pressure, temperature and battery measurements. It also interfaces with the MCP2030 for configuration and LF communications. Other PICmicro MCUs can be selected based on design requirement. 3.4.2.2 LF RECEIVER (125 kHZ) The LF signal processing is handled with the Microchip's three-channel Analog Front End (MCP2030). The MCP2030 has a user-configurable input filter to process the incoming LF challenges. 3.4.2.3 HF TRANSMITTER (433.9 MHZ) The HF transmitter is used for transmitting data to the base station module. A surface mounted SAW resonator is used to generate the carrier frequency which is controlled by the output pin of the microcontroller. 3.4.2.4 PRESSURE SENSOR The sensor implemented in this design is an analog pressure sensor (MS5407-AM) from Intersema. The two output of the sensor, V+ and V-, will output voltages levels that correspond to the changes in pressure. The sensor is powered by RA1 pin of the microcontroller and is in the off state when not taking measurement. 3.4.2.5 SENSOR SIGNAL AMPLIFICATION The two outputs of the pressure sensors are connected to the differential gain circuitry using the MCP6273. The output of the differential gain signal is amplified by 10 and then passed into the 10-bit ADC module in the microcontroller for conversion. The gain of the signal is controlled by the values of R9, R10, R11 and R12. Refer to A.13 “Circuit Block Figure”. DS51624B-page 14 © 2006 Microchip Technology Inc. Hardware Overview 3.4.2.6 POWER The module is powered by a standard Lithium 3V coin cell battery. To reduce power consumption, the LED used for indication should be removed to reduce the standby current consumption. The typical standby current without the LED is about 25 μA (the sum of the power down current of the microcontroller and the active current of three-channel analog front end). In addition, the LF Receiver has all three channels enabled and powered on all the time for incoming signal detection. One or two channels can be disabled or a periodic detection method can be implemented to further reduce the overall standby current usage. Refer to Appendix A. “Schematic and Layouts”. 3.4.3 Operation Overview When the Transponder Sensor module receives a LF (125 kHz) wake up challenge message, the Analog Front End validates the incoming challenge. Only after a valid message has been received, the microcontroller is awakened from sleep mode. The action taken by the module is determined by the received commands. Normal request measures the tire pressure and temperature. Learn Mode request assigns a new ID to the sensor module for future operations prior to the measurements. The Transponder Sensor module then transmits the data to the base station via UHF (433.9 MHz) and returns to Sleep mode if no other interrupts were detected. To reduce power consumption, the pressure sensor and the op-amp for signal amplifications are normally powered off. These two devices are powered on only during measurements. © 2006 Microchip Technology Inc. DS51624B-page 15 Tire Pressure Monitoring System User’s Guide FIGURE 3-2: SENSOR MODULE FLOW CHART Module Initialization Any Incoming LF Challenge Command? Yes Valid Challenge Command? Yes Wake Up PIC From Sleep Mode Read Incoming Messages Learn Mode Command Recv? No Yes Save New ID No Measure Battery Level Battery Level Okay? Yes No No LF INT Clear Vlow Flag Measure Pressure Set Vlow Flag Measure Temperature Perform Compensation Routine Transmit Data to BaseStation Enter Sleep Mode DS51624B-page 16 © 2006 Microchip Technology Inc. Hardware Overview 3.4.3.1 LEARN MODE OVERVIEW When a Learn Mode ID is received, the module will save the new Tire Location ID and use it as its default ID for all future normal transmissions until another Learn Mode ID is received. This feature can be used to "re-learn" the tires after tire rotations or if a new Transponder Sensor module has been installed. Note: 3.4.3.2 Due to the possibility that one LF Initiator can wake up multiple Transponder Sensor modules in a full system setup (4 LF Initiators with 4 Sensor Modules) during development due to the close proximity, either the transmitting power of the LF Initiators should be reduced or the distance between the module sets (1 set = 1 LF Initiator + 1 Transponder Sensor) should be kept at a maximum where they will not cause interference with each other. Refer to Application Note AN232 for more details on the LF Transmitter. ANALOG FRONT END OVERVIEW The user configurable output filter of the MCP2030 is utilized to prevent the microcontroller from being awakened unnecessarily by either noise or LF signals from other unknown sources. The data is outputted to the microcontroller only when the preamble of the incoming message matches the pre-configured filter settings. The MCP2030 can be configured via SPI by writing to the seven configuration registers through the microcontroller. The number of channels enabled can also be controlled through these configuration registers. Refer to the MCP2030 data sheet (DS21981) for more information. 3.4.3.3 LF MESSAGE OVERVIEW The incoming LF message from the LF Initiator Module consists of the following in a 125 kHz modulated format: • • • • • A required minimum of 4 ms ON time for AGC stabilization A 500 μs OFF delay A 2 ms ON time for the output filter (user configurable in AFE) A 2 ms OFF for the output filter time (user configurable in AFE) Two bytes of data (maximum of 8 bytes) - Tire Location ID (user defined) - System Mode ID (user defined) FIGURE 3-3: LF MESSAGE FORMAT LOGIC ‘0’ LOGIC ‘1’ Bit Period 125 kHz Base Frequency Mode ID (1 byte) Tire Location ID (1 byte 2 ms 2 ms 500 μs Wake-Up 125 kHz Preamble Data 4 ms Transmission Direction LSb First © 2006 Microchip Technology Inc. DS51624B-page 17 Tire Pressure Monitoring System User’s Guide 3.4.3.4 RF MESSAGE OVERVIEW The transmitted message follows the HCS365 PWM format via a 433 MHz carrier signal, which consists of: • A preamble (31 TE, 50% duty cycle) for baud rate calculation on the receive side • A header (4 or 10 Te, user selectable) • Data bytes: - Tire Location ID (1 Byte, user defined) - Sensor ID (2 Bytes, user defined) - Pressure Data (2 Bytes) - Temperature Data (2 Bytes) - Battery Low Flag (1 Bit) - Dummy Bits (7 Bits) Refer to the HCS365 data sheet (DS41109) for more information. FIGURE 3-4: RF MESSAGE FORMAT TE TE TE LOGIC "0" LOGIC "1" Transmission Direction LSb First 1 TBP 16 31xTe 50% Preamble 4-10 xTE Data Bytes Header Note: 3.4.3.5 For the next three sections, refer to A.13 Circuit Block Figure in Appendix A. “Schematic and Layouts” for circuit block diagram. PRESSURE MEASUREMENT • Drive pin RC0 and RA1 high to power up the sensor and the Op-Amp (MCP6273) that is used for signal amplification • Enable the Op-Amp with pin RA5 • Pin RC2 is set up as the analog input to the internal ADC for pressure measurement 3.4.3.6 TEMPERATURE MEASUREMENT • Drive pin RC0 pin high to power up the sensor and the op-amp used for signal amplification. This also pulls the sensor bridge high through R5. The R5 and the sensor bridge form a resistive divider which is monitored by the internal ADC through pin RA1. Since the sensor internal bridge resistance is temperature dependent, the voltage on the resistor divider will change accordingly. • Pin RC0 is configured as the analog input of the internal ADC. Vref for the ADC is selected as internal which is equal to the battery voltage minus the diode drop. • The recommended serial resistor (R5) value should be 10 kOhm or greater to minimize the influence of the parasitic of the microcontroller pins (about 200 Ohm). DS51624B-page 18 © 2006 Microchip Technology Inc. Hardware Overview Note: 3.4.3.7 This method of the temperature measurement is not the most accurate way to monitor the temperature. An external temperature sensor should be used, if high accuracy is desired. BATTERY MEASUREMENT • The battery measurement is implemented by comparing the difference between the constant forward voltage drop of a diode (D3) with the battery voltage level using the internal ADC in the microcontroller. Pin RC1 is set up as the input to ADC for battery measurement. A threshold value of 2.3V is selected to ensure the proper operation of the internal ADC. The Battery Low flag will be set if the battery falls below the threshold value. Note: 3.5 The internal ADC minimum required Vref voltage is 2.2V. In order to achieve the 1LSB accuracy, Vref voltage value of 2.7V or higher is required. ANALOG SENSOR CALIBRATION The calibration method recommended by Intersema for the optimal sensor performance is the 4-point calibration routine using the simple linear sensor model described in the Intersema application note (AN402). Total of four independent measurements performed at two different temperatures and pressures are used to calculate and compensate for the variations in the performance of the sensor due to process variations. Refer to Application Note AN402 from Intersema for more details regarding analog sensor calibration methods. Note: 3.6 This reference design provides only the typical calibration values used during development and the calibration values will vary from unit to unit. Therefore, the accuracy of the measurements is not guaranteed. The user is responsible for performing the calibration routine for their applications. Please contact sensor manufacturing for additional information regarding this topic. SENSOR CALIBRATION The multiplication and division subroutines used in the sensor calibration/compensation routine are derived from the math subroutines described in Microchip’s Application Note AN617, “Fixed Point Routines”. Refer to this application note for more descriptions on the 16x16 bits multiplication and 32/16 bits division routines. The flow charts for the addition routine (Figure 3-6) and subtraction routine (Figure 3-7) are included for references. © 2006 Microchip Technology Inc. DS51624B-page 19 Tire Pressure Monitoring System User’s Guide FIGURE 3-5: 4 POINTS SENSOR CALIBRATION ROUTINE (INTERSEMA) At Temp 1 At Pressure 1 Measure Pressure Measure Temperature Data Saved: Pressure = T1P1 Temperature = T1 Save Pressure and Temperature Data to EEPROM At Temp 1 At Pressure 2 Measure Pressure Measure Temperature Data Saved: Pressure = T1P2 Temperature = T1 Save Pressure and Temperature Data to EEPROM Change Temperature at this point Measure Pressure At Temp 2 At Pressure 1 Measure Temperature Save Pressure and Temperature Data to EEPROM Measure Pressure Data Saved: Pressure = T2P1 Temperature = T2 At Temp 2 At Pressure 2 Measure Temperature Save Pressure and Temperature Data to EEPROM DS51624B-page 20 Data Saved: Pressure = T2P2 Temperature = T2 © 2006 Microchip Technology Inc. Hardware Overview FIGURE 3-6: SENSOR_TX ADD FLOWCHART Sflag Set? Yes No data1L + data2H data1H > data2H? Is there a Carry? No Yes Set Aflag Yes No data1H =data1H +1 Call Subtraction Routine data1H =data1H + data2H Aflag Set? Yes No Clear Sflag Clear Aflag Return © 2006 Microchip Technology Inc. DS51624B-page 21 Tire Pressure Monitoring System User’s Guide FIGURE 3-7: SENSOR_TX SUB FLOWCHART Byte1H – Byte2H Result = 0? Yes No Set Zflag A borrow ocurred? No Yes Set Nflag Byte1H = 2's compliment of Byte1H +1 Byte1L – Byte2L Nflag AND borrow both = 0? No Nflag = 1? No Yes Set Sflag Zflag =1? Borrow = 1? No No Yes Byte1H = Byte1H - 1 Yes Yes Byte1L = 2's compliment of Byte1L + 1 Return 3.6.1 Reference Documents PROVIDE LATER DS51624B-page 22 © 2006 Microchip Technology Inc. TIRE PRESSURE MONITORING SYSTEM USER’S GUIDE Appendix A. Schematic and Layouts A.1 INTRODUCTION This appendix contains the schematic and PCB layout for the Tire Pressure Monitoring System. Diagrams included: • • • • • • • • • • • Base Station Module Schematic (Page 1) Base Station Module Schematic (Page 2) Base Station Wiring Harness Schematic Base Station Module - Top Layer (with silk screen) Base Station Module - Bottom Layer Low Frequency Initiator Module Schematic Low Frequency Initiator Module - Top Layer (with silk screen) Low Frequency Initiator Module - Bottom Layer Transponder Sensor Module Schematic Transponder Sensor Module - Top Layer (with silk screen) Transponder Sensor Module - Bottom Layer © 2006 Microchip Technology Inc. DS51624B-page 23 Tire Pressure Monitoring System User’s Guide BASE STATION MODULE SCHEMATIC (PAGE 1) A.2 DS51624B-page 24 © 2006 Microchip Technology Inc. Schematic and Layouts BASE STATION MODULE SCHEMATIC (PAGE 2) A.3 © 2006 Microchip Technology Inc. DS51624B-page 25 DS51624B-page 26 A B 5 4 5 6 2 Thursday, July 06, 2006 1 1.0 A 1 of 1 Drawn by Chuck Simmers Size Sheet Rev SCHEMATIC1 Gauge TPMS RefDes LIN Wiring Harness Microchip Technology, Inc. AMAD Automotive Products Group 2355 West Chandler Blvd. Chandler, Arizona 85224 AMP 172168-1 APG000014 1 2 3 AMP 172168-1 3 APG 4 5 6 APG000001 1 2 3 4 +12VDC LIN GND J1 1 A B C J2 2 C 3 D 4 A.4 D 5 Tire Pressure Monitoring System User’s Guide BASE STATION WIRING HARNESS - SCHEMATIC © 2006 Microchip Technology Inc. Schematic and Layouts A.5 BASE STATION MODULE - TOP LAYER AND SILK SCREEN A.6 BASE STATION MODULE - BOTTOM LAYER © 2006 Microchip Technology Inc. DS51624B-page 27 A B C D J1 VCC J2 5 PWM C7 0.1uF R7 1 2 3 4 5 6 1 30K IN C4 C3 D6 TC4422 OUT U4 IN 5 Y1 20.0MHz +12VDC 20pF 20pF 1 C1 10uF 1N4148WX VCC 10MQ100N D1 6 +12VDC 3 VDD GND 2 GND VDD 4 4 R5 3 DO5022P L2 10-00189 L1 4 YEL LED2 C2 10uF LED1 TP1 10nF 400V P3476-ND C8 High Voltage 0.200LS C9 RC0/T1OSO/T1CKI RC1/T1OSI RC2/CCP1 RC3/SCK/SCL RC4/SDI/SDA RC5/SDO RC6/TX/CK RC7/RX/DT 3 C10 3 0.200LS 11 12 13 14 15 16 17 18 21 22 23 24 25 26 27 28 GRN VCC R1 1K RB0/INT0 RB1/INT1 RB2/CANTX RB3/CANRX RB4 RB5 PIC18F2680 RB6 RB7 RA0/AN0 RA1/AN1 RA2/AN2/VrefRA3/AN3/Vref+ RA4/T0CLI RA5/AN4/SS/LVDIN OSC2/CLKOUT OSC1/CLKIN MCLR/Vpp U1 1K OUT Not populated 2 3 4 5 6 7 10 9 1 VCC 2 GND VR1 LM2937ET-5.0 1 PWM R6 REF RS C6 1.0uF MCP201 2 Thursday, February 02, 2006 U3 CS/WAKE TX LIN RX FAULT/SLPS GND 5 6 5 8 6 7 R3 R2 R4 CANL CANH VCC VCC MCP2551 GND VCC RXD TXD U2 15K 25K 15K 25K APG 2 4 1 8 C5 1.0uF VCC 2 3 4 1 D2-2 BAV99DW D2-1 BAV99DW 1 1N4148WX D8 D9 2 4 6 2 4 6 R10 1N4750 CON6A 1 3 5 J4 CON6A 1 3 5 J3 120 Sheet 1 of Size A 1 APG000001-01 LF Initiator 1 2.0 Drawn by Chuck Simmers Rev 03-01889 Low Frequency Magnetic Initiator Microchip Technology, Inc. Automotive Products Group AMAD 2355 West Chandler Blvd. Chandler, Arizona USA 1K 10MQ100N D7 R9 4.7K R8 +12VDC To input a +5-to-0 signal, Remove R3 or R6, Replace R2 or R4 with 1K, and put a 10K pull-up resistor from RB0 or RB1 to VCC These two input circuits are set-up for +12-to-GND signals. 2 3 VDD DS51624B-page 28 PICkit 2 7 A B C D A.7 VBAT 5 Tire Pressure Monitoring System User’s Guide LOW FREQUENCY INITIATOR MODULE - SCHEMATIC © 2006 Microchip Technology Inc. Schematic and Layouts A.8 LOW FREQUENCY INITIATOR MODULE - TOP LAYER AND SILK SCREEN A.9 LOW FREQUENCY INITIATOR MODULE - BOTTOM LAYER © 2006 Microchip Technology Inc. DS51624B-page 29 Tire Pressure Monitoring System User’s Guide 3 4 A.10 TRANSPONDER SENSOR MODULE - SCHEMATIC 6 1 5 2 DS51624B-page 30 © 2006 Microchip Technology Inc. Schematic and Layouts A.11 TRANSPONDER SENSOR MODULE - TOP LAYER AND SILK SCREEN A.12 TRANSPONDER SENSOR MODULE - BOTTOM LAYER © 2006 Microchip Technology Inc. DS51624B-page 31 Tire Pressure Monitoring System User’s Guide A.13 CIRCUIT BLOCK FIGURE RC0 (Power) R8 RC1 (Battery) R5 RA1 (temperature) D3 Pressure Sensor R11 R9 R10 VDD CS PIC RC2 (pressure) RA5 (op_cs) R12 DS51624B-page 32 © 2006 Microchip Technology Inc. TIRE PRESSURE MONITORING SYSTEM USER’S GUIDE Appendix B. Bill Of Materials (BOM) TABLE B-1: Qty BASE STATION MODULE BILL OF MATERIALS (BOM) Reference Description Manufacturer Part Number 1 J2 AMP770969 1 ANT1 ANT_WIRE 1-770969-0-ND 3 C1,C2,C3 CAP0805 0.1uF PCC1828CT-ND 2 C4,C5 CAP0805 1uF PCC1849CT-ND 2 C6,C7 CAP0805 18pF 311-1102-1-ND 2 C8,C9 CAP_VS_B 10uf 493-2099-1-ND 1 J5 CONN_PJ-007 1 Y1 CRY_CITIZEN_HCM49 20MHz X1076-ND 0 J1 DB9M DO NOT ASSEMBLE 1 D1 DIO-1N4148WS 1N4148WS-FDICT-ND 1 D7 DIODE-DO214 S2G S2G-TPMSCT-ND 2 D5, D6 DIODE-DO214 SMB5819-TP SK14-TPMSCT-ND 2 D2,D3 DIODE-SMA 10MQ100NTRPBF 10MQ100NPBFCT-ND 1 D4 DIODE_ZENER_SMA 1SMA5935BT3G 1SMA5935BT3GOSCT-ND 1 Q1 FET-BSS84-SOT23 NUD3112 1 J4 HDR2X4 CP-102B-ND NUD3112LT1G NUD3112LT1GOS-ND HTSW-104-07-F-D 0 LCD2 LCD_CU16025ECPB CU16025ECPB DO NOT ASSEMBLE 1 LCD1 LCD_SO1602_16X2 LCM-SO1602DTR/M 67-1781-ND 1 xLCD1 16p Header 2 LED1, LED2 LED_0805 1 U6 LM2940T 1 U2 MCP201 1 U1 MCP2551-I_SN 1 U4 PIC18F4680-44TQFP PIC18F4680 Microchip Supplied 1 R13 POT-3352E 3352T-1-103 3352T-1-103LF-ND 1 R6 RES0603 100KΩ 311-100KARCT-ND HTSW-116-07-F-S 160-1179-1-ND LM2937ET-5.0 LM2937ET-5.0-ND/NOPB Microchip Supplied Microchip Supplied 3 R5,R10,R11 RES0805 1KΩ 311-1.0KARCT-ND 2 R2,R7 RES0805 4.7KΩ 311-4.7KARCT-ND 1 R4 RES0805 14.9KΩ 311-15.0KCRCT-ND 1 R3 RES0805 24.9KΩ 28K1086 1 R12 RES0805 47KΩ 311-47KARCT-ND 1 R1 RES0805 120Ω 311-120ARCT-ND 1 R8 RES0805 470Ω 0 R9 RES0806 1 U3 RF-MODULE-RR3 1 J3 SIP_6 Note 1: 311-470ARCT-ND DO NOT ASSEMBLE AMRRQ3-433 PICKIT2 HTSW-106-07-G-S-RA The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. © 2006 Microchip Technology Inc. DS51624B-page 33 Tire Pressure Monitoring System User’s Guide TABLE B-1: Qty BASE STATION MODULE BILL OF MATERIALS (BOM) (CONTINUED) Reference Description Manufacturer Part Number 4 J6,J7,J8,J9 SIP_11_.05_PITCH HMTMS-111-01-G-S-230 1 S1 SW-B3F1000 SW404-ND 1 Bag 10N298 1 PCB REV 1 4 Feet Note 1: 2 Anti static bag 3M SJ-67A11 The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. TABLE B-2: Qty Newark-In-One BASE STATION WIRING HARNESS BILL OF MATERIALS (BOM) Reference J1,J2 Description Manufacturer Part Number AMP 172168-1 6 A25573-ND AMP 171639-1 1 18-gauge RED stranded wire 6" in Length 1 18-gauge BLK stranded wire 6" in Length 1 18-gauge BLU stranded wire 6" in Length Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. TABLE B-3: Qty LOW FREQUENCY INITIATOR MODULE BILL OF MATERIALS Reference Description Manufacturer Part Number 1 C1 100uF P10323-ND 1 C2 10uF P966-ND 2 C3,C4 20pF 311-1153-1-ND 2 C5,C6 1.0uF 495-1935-1-ND 1 C7 0.1uF 311-1179-1-ND 1 C8 10nF 495-1225-ND 2 C9,C10 .200LS not assembled 2 D1,D7 10MQ100N 10MQ100NPBFCT-ND 1 D2 BAV99DW BAV99DW-FDICT-ND 1 D6,D8 1N4148WX-TP 1N4148WXTPMSCT-ND 1 D9 1N4750 27V 1N4750ADICT-ND 1 J1 POWERPLUG CP-102B-ND 1 J5 6pinCON Rt Angle TSW-106-08-G-S-RA 2 J3,J4 CON6AP 1-770969-0-ND 1 LED1 Green LED 160-1179-1-ND 1 LED2 Yellow LED 160-1175-1-ND 1 L1 Primary MCD-L160UH MCD-L160UH 0 L1 10-00189 Ask for Lead Free 1 L2 DO5022P not assembled 1 R11 3 R1, R5, R9 1K 28K0916 2 R2,R4 25K 28K1086 2 R3,R6 15K 28K0996 Note 1: not assembled The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. DS51624B-page 34 © 2006 Microchip Technology Inc. Bill Of Materials (BOM) TABLE B-3: Qty LOW FREQUENCY INITIATOR MODULE BILL OF MATERIALS (CONTINUED) Reference Description Manufacturer Part Number 1 R7 30K 28K1124 1 R8 4.7K 28K1196 1 R10 120 28K0956 1 TP1 TEST POINT not assembled 1 U1 PIC18F2680 1 U2 MCP2551 1 U3 MCP201 1 U4 TC4422 1 VR1 LM2937IMP-5.0 LM2937IMP-5.0CT-ND 1 Y1 20.0MHz X1076-ND 1 Bag 10N298 Newark-In-One 1 PCB REV 2.4 1 HV Shield Drawing Supplied 4 Feet Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. TABLE B-4: Qty Bumpon™ TRANSPONDER SENSOR MODULE BILL OF MATERIALS (BOM) Reference Description Manufacturer Part Number 2 J7, J8 2phdr SAMTEC TSW-102-08-G-S 1 BT1 3003 Keystone 3003K-ND 1 xBT1 CR2032 Enerqizer N189-ND 3 C7, C8, C10 0.1uF Panasonic PCC1762CT-ND 1 CCOM 1uF Murata 490-1807-1-ND 2 C4,C5, C6 220pF RHOM 511-1146-1-ND 1 C2 0.5pF RHOM 511-1086-1-ND 1 C3 5pF RHOM 511-1103-1-ND 1 C1 470pF RHOM 511-1154-1-ND 2 D1, D3 1N4148WXTP Micro Comercial Co 1N4148WXTPMSCT-ND 1 D2 MA2S784 Panasonic MA2S78400LCT-ND 2 D4, D5 SD103CWS-TP Micro Comercial Co SD103CWSTPMSCT-ND 1 D6 UDZSTE-175.6B RHOM UDZSTE-175.6BCT-ND 2 LY, LZ 7.15mH Coilcraft 5315TC-715XGLB 1 D7 Grn LED Lite-ON 160-1183-1-ND 1 LX 7.6mH Mc Davis Custom Inductor 1 U3 MCP2030-I/ST Microchip supplied Microchip supplied 1 U8 MCP6273T-E/CH Microchip supplied Microchip supplied 1 U2 PIC16F684-I/ST Microchip supplied Microchip supplied 1 U5 Dip Socket Assman AR14-HZL-TT-R 1 U4 MS5407-AM NTERSEMA 1 S1 EVQ-PJS04K Panasonic 8048SCT-ND 2 J5, C11 NOT POPULATED NOT POPULATED NOT POPULATED 2 R4, R13 NOT POPULATED NOT POPULATED NOT POPULATED Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. © 2006 Microchip Technology Inc. DS51624B-page 35 Tire Pressure Monitoring System User’s Guide TABLE B-4: Qty TRANSPONDER SENSOR MODULE BILL OF MATERIALS (BOM) (CONTINUED) Reference Description Manufacturer Part Number 1 R14 1K RHOM RHM1.0KGCT-ND 1 R7 1M RHOM RHM1.0MGCT-ND 4 R5, R8, R9, R10 10K RHOM RHM10.0KHCT-ND 3 R6, R11, R12 100K RHOM RHM100KHCT-ND 1 RCOM 10M YAGEO 311-10MERCT-ND 1 R1 47 YAGEO 311-47.0HRCT-ND 1 R2 47K YAGEO 311-47.0KHRCT-ND 1 R3 220 YAGEO 311-220HRCT-ND 1 U1 433.92MHz YAGEO XC998CT-ND 1 J3 PICKIT2 SAMTEC TSW-106-08-G-S 1 Q1 NE94433B NEC NE94433B-ACT-ND 1 Metal Out bag SPC 10N298 1 PCB Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. DS51624B-page 36 © 2006 Microchip Technology Inc. Bill Of Materials (BOM) NOTES: © 2006 Microchip Technology Inc. DS51624B-page 37 WORLDWIDE SALES AND SERVICE AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Habour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 India - Bangalore Tel: 91-80-4182-8400 Fax: 91-80-4182-8422 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 Austria - Wels Tel: 43-7242-2244-3910 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Atlanta Alpharetta, GA Tel: 770-640-0034 Fax: 770-640-0307 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 Korea - Gumi Tel: 82-54-473-4301 Fax: 82-54-473-4302 China - Fuzhou Tel: 86-591-8750-3506 Fax: 86-591-8750-3521 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 Malaysia - Penang Tel: 60-4-646-8870 Fax: 60-4-646-5086 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 Taiwan - Hsin Chu Tel: 886-3-572-9526 Fax: 886-3-572-6459 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 China - Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 China - Xian Tel: 86-29-8833-7250 Fax: 86-29-8833-7256 08/29/06 DS51624B-page 38 © 2006 Microchip Technology Inc.