LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only TAPE AND BOX TYPE LED LAMPS LHRF4843/TBF-22 DATA SHEET DOC. NO : QW0905-LHRF4843/TBF-22 REV. : A DATE : 24 - Nov. - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHRF4843/TBF-22 Page 1/5 Package Dimensions △H P2 H2 W2 H1 H L W0 W1 P1 F D P T Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 3.8 LHRF4843 3.0 3.8 1.5MAX 25.0MIN. □0.5TYP 1.0MIN. 2.54TYP. + - W3 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHRF4843/TBF-22 Page 2/5 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT HRF Forward Current IF 30 mA Peak Forward Current Duty 1/10@10KHz IFP 90 mA Power Dissipation PD 75 mW Ir 10 μA Electrostatic Discharge( * ) ESD 2000 V Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 ℃ Soldering Temperature Tsol Reverse Current @5V Max 260 ℃ for 5 sec Max (2mm from body) Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic * glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO COLOR MATERIAL Emitted LHRF4843/TBF-22 AlGaInP Red Forward Luminous Dominant Spectral Viewing voltage intensity angle wave halfwidth @20mA(V) @20mA(mcd) length 2 θ 1/2 △λ nm λDnm (deg) Min. Max. Min. Typ. Lens Water Clear 630 20 1.5 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ± 15% testing tolerance. 2.4 90 160 142 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHRF4843/TBF-22 Page 3/5 •Dimension Symbol Information SPECIFICATIONS OPTION SYMBOL CODE SYMBOL ITEMS Minimum Maximum mm inch mm inch Tape Feed Hole Diameter ------- D 3.8 0.15 4.2 0.17 Component Lead Pitch ------- F 4.8 0.19 5.8 0.23 Front-To-Rear Deflection ------- △H ------- ------- 2.0 0.08 Height Of Seating Plane ------- H 15.5 0.61 16.5 0.65 TBF-22 H1 22.0 0.87 23.0 0.91 Feed Hole To Overall Component Height ------- H2 ------- 36 1.42 Lead Length After Component Height ------- L 11 0.43 Feed Hole Pitch ------- P 12.4 0.49 13 0.51 Lead Location ------- P1 3.15 0.12 4.55 0.18 Center Of Component Location ------- P2 5.1 0.2 7.7 0.3 Overall Taped Package Thickness ------- T ------- ------- 1.42 0.06 Feed Hole Location ------- W0 8.5 0.33 9.75 0.38 Adhesive Tape Width ------- W1 14.5 0.57 15.5 0.61 Adhesive Tape Position ------- W2 0 0 4.0 0.16 Tape Width ------- W3 17.5 0.69 19 0.75 Feed Hole To Bottom Of Component ------- W0 REMARK:TBS=Tape And Box Straight Leads • Dimensions Symbol Information • Package Dimensions Specification Description Symbol minimum maxmum W mm inch mm inch Overall Length L 330 13.0 340 13.4 Overall Width W 265 10.4 275 10.8 Overall Thickness H 50 1.97 60 2.4 Quantity/Box 2500PCS L H LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page4/5 PART NO. LHRF4843/TBF-22 Typical Electro-Optical Characteristics Curve HRF CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.5 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 3.0 2.5 2.0 1.5 1.0 0.5 0 0.1 1.0 2.0 1.5 2.5 3.0 1.0 10 1000 Forward Current(mA) Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 3.0 Relative Intensity@20mA Normalize@25℃ 1.2 Forward Voltage@20mA Normalize @25℃ 100 1.1 1.0 0.9 0.8 -40 -20 -0 20 40 60 80 2.5 2.0 1.5 1.0 0.5 0 100 -40 -20 -0 20 40 60 80 100 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity@20mA Fig.5 Relative Intensity vs. Wavelength 0° 1.0 -30° 30° -60° 0.5 0 550 600 650 Wavelength (nm) 700 100% 75% 50% 25% 60° 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHRF4843/TBF-22 Page 5/5 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. Thermal Shock Test 1.Ta=105 ℃±5 ℃&-40 ℃±5 ℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11