ATS692-L Datasheet

ATS692LSH(RSNBL)
Two-Wire, Differential, Vibration Resistant
Sensor IC with Speed and Direction Output
Description
Features and Benefits
• Two-wire, pulse width output protocol
• Digital output representing target profile
• Speed and direction information of target
• Vibration tolerance
▫ Small signal lockout for small amplitude vibration
▫ Proprietary vibration detection algorithms for large
amplitude vibration
• Air gap independent switch points
• Large operating air gap capability
• Undervoltage lockout
• True zero-speed operation
• Wide operating voltage range
• Single chip sensing IC for high reliability
• Robust test coverage capability with Scan Path and IDDQ
measurement
The ATS692LSH is an optimized Hall-effect integrated circuit
(IC) and rare earth pellet combination that provides a userfriendly solution for direction detection and true zero-speed,
digital gear tooth sensing. The small package can be easily
assembled and used in conjunction with a wide variety of gear
tooth sensing applications.
The IC employs patented algorithms for the special operational
requirements of automotive transmission applications. The
speed and direction of the target are communicated through a
variable pulse width output protocol. The ATS692 is particularly
adept at handling vibration without sacrificing maximum air
gap capability or creating any erroneous direction information.
Even higher angular vibration caused by engine cranking is
completely rejected by the device. The advanced vibration
detection algorithm systematically calibrates the sensor IC
on the initial teeth of true target rotation and not on vibration,
always guaranteeing an accurate signal in running mode.
Package: 4-pin SIP (suffix SH)
Advanced signal processing and innovative algorithms make
the ATS692 an ideal solution for a wide range of speed and
direction sensing needs.
This device is available in a lead (Pb) free 4-pin SIP package
with a 100% matte tin plated leadframe.
Not to scale
Functional Block Diagram
VCC
Regulator
(Analog)
Multiplexed
Test Signals
TEST
Regulator
(Digital)
Hall Amp
Offset
Adjust
AGC
Filter
ADC
Synchronous
Digital Controller
Hall Amp
ATS692LSH2-DS, Rev. 2
Offset
Adjust
AGC
Filter
ADC
GND
Two-Wire, Differential, Vibration Resistant
Sensor IC with Speed and Direction Output
ATS692LSH(RSNBL)
Selection Guide
Part Number
Packing*
Direction Change Function
Vibration Immunity
(Running Mode)
ATS692LSHTN-RSNBL-T
800 pieces per reel
First edge direction
0.12 × TTARGET
*Contact Allegro™ for additional packing options.
Configuration
ATS692LSHTN-
-T
100% matte tin leadframe plating
Vibration Immunity / Direction Change: L – Low vibration immunity, with
immediate direction change detection
Calibration Pulses: B – Blanked, no output during calibration
Reverse Pulse Width: N – Narrow, 90 μs
Number of Pulses: S – Single, one pulse per tooth / valley
Rotation Direction: R – Reverse, target movement forward direction from pin 4 to 1
Allegro Identifier and Device Type: ATS692
Operating Temperature Range: L
Package Designation: SH
Instructions (Packing): TN – Tape and reel, 800 pieces per 13-in. reel
Absolute Maximum Ratings
Characteristic
Symbol
Supply Voltage
VCC
Reverse Supply Voltage
VRCC
Notes
Refer to Power Derating section
Rating
Unit
28
V
–18
V
Operating Ambient Temperature
TA
–40 to 150
ºC
Maximum Junction Temperature
TJ(max)
165
ºC
Tstg
–65 to 170
ºC
Storage Temperature
Pin-out Diagram
1 2 3 4
L temperature range
Terminal List Table
Number
Name
Function
1
VCC
Supply voltage
2
TEST
Test pin: float *
3
TEST
Test pin: float *
4
GND
Ground
*Connection of TEST to VCC and/or GND may cause undesired additional
current consumption in the IC.
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
2
Two-Wire, Differential, Vibration Resistant
Sensor IC with Speed and Direction Output
ATS692LSH(RSNBL)
OPERATING CHARACTERISTICS Valid at throughout full operating and temperature ranges; using Reference Target 60-0;
unless otherwise specified
Characteristic
Symbol
Test Conditions
Min.
Typ.1
Max.
Unit
4.0
–
24
V
General Electrical Characteristics
Supply Voltage2
Under Voltage Lockout
Reverse Supply Current3
Supply Zener Clamp Voltage
Supply Current
VCC
Operating, TJ < TJ(max)
VCC(UV)
VCC 0 → 5 V or 5 → 0 V
–
3.6
3.95
V
VCC = VRCC(max)
–
–
–10
mA
IRCC
VZ(SUPPLY) ICC = ICC(max) + 3 mA, TA = 25ºC
28
–
–
V
ICC(LOW)
Low-current state (Running mode)
5.0
–
8.0
mA
ICC(HIGH)
High-current state (Running mode)
12.0
–
16.0
mA
5.0
–
8.5
mA
1.9
–
–
–
–
6
–
V
7.0
16
–
mA / μs
ICC(SU)(LOW) Startup current level (Power-On mode)
Supply Current Ratio
Test Pins Zener Clamp Voltage4
ICC(HIGH) /
ICC(LOW)
Measured as ratio of high current to low current
VZ(TEST)
Output Stage
Output Slew Rate
SROUT
RL = 100 Ω, CL = 10 pF; ICC(HIGH) → ICC(LOW) ,
ICC(LOW) → ICC(HIGH) , 10% to 90% points
Output Pulse Characteristics5
Pulse Width (Forward Rotation)
tw(FWD)
38
45
52
μs
Pulse Width (Reverse Rotation)
tw(REV)
76
90
104
μs
General Operating Characteristics
Operate Point
BOP
% of peak-to-peak VPROC
–
69
–
%
Release Point
BRP
% of peak-to-peak VPROC
–
31
–
%
Operating Frequency (Forward
Rotation)
fFWD
0
–
12
kHz
Operating Frequency (Reverse
Rotation)6
fREV
0
–
7
kHz
Magnitude valid for both differential magnetic
channels
–60
–
60
G
Using Allegro Reference Target 60-0
0.5
–
2.75
mm
DAC Characteristics
Allowable User-Induced Offset
BOFFSET
Performance Characteristics
Air Gap Range
Vibration Immunity (Startup)
Vibration Immunity (Running Mode)
AG
errVIB(SU)
See figure 1
1.0 ×
TTARGET
–
–
deg.
errVIB
See figure 1
0.12 ×
TTARGET
–
–
deg.
Continued on the next page…
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
3
Two-Wire, Differential, Vibration Resistant
Sensor IC with Speed and Direction Output
ATS692LSH(RSNBL)
OPERATING CHARACTERISTICS (continued) Valid at throughout full operating and temperature ranges; using Reference Target
60-0; unless otherwise specified
Characteristic
Symbol
Min.
Typ.1
Max.
Unit
AG ≥ 0.5 mm
AG < 2.25 mm
–
2×
TTARGET
<3 ×
TTARGET
deg.
AG ≥ 2.25 mm
AG ≤ 2.75 mm
–
2.5 ×
TTARGET
<4 ×
TTARGET
deg.
–
1
–
switch–
point
–
–
1.25 ×
TTARGET
deg.
Test Conditions
Calibration
Amount of target rotation
(constant direction) following
power-on until first electrical
output pulse of either tw(FWD)
or tw(REV) , see figure 1
First Direction Output Pulse7
First Direction Pulse Output Following
Direction Change
NCD
Amount of target rotation (constant direction)
following event until first electrical output pulse
of either tw(FWD) or tw(REV) , see figure 1
First Direction Pulse Output Following
Running Mode Vibration
1Typical
values are at TA = 25°C and VCC = 12 V. Performance may vary for individual units, within the specified maximum and minimum limits.
voltage must be adjusted for power dissipation and junction temperature; see Power Derating section.
3Negative current is defined as conventional current coming out of (sourced from) the specified device terminal.
4Sustained voltages beyond the clamp voltage may cause permanent damage to the IC.
5Load circuit is R = 100 Ω and C = 10 pF. Pulse duration measured at a threshold of (I
L
L
CC(HIGH) + ICC(LOW)) / 2.
6Maximum of Operating Frequency (Reverse Rotation) is determined by satisfactory separation of output pulses: I
CC(LOW) of tw(FWD)(min). If the
customer can resolve lower low-state durations, maximum fREV may be increased.
7Power-on frequency ≤ 200 Hz. Higher power-on frequencies may require more input magnetic cycles until output edges are achieved.
2Maximum
Target
Valley
Tooth
TTARGET
TVPROC
VPROC
VPROC = the processed analog signal of the sinusoidal magnetic input (per channel)
TTARGET = period between successive sensed target mechanical edges of the same
orientation (either both rising or both falling)
Figure 1. Definition of TTARGET
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115 Northeast Cutoff
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4
Two-Wire, Differential, Vibration Resistant
Sensor IC with Speed and Direction Output
ATS692LSH(RSNBL)
Thermal Characteristics may require derating at maximum conditions, see Power Derating section
Characteristic
Symbol
Test Conditions*
Single layer PCB, with copper limited to solder pads
RθJA
Package Thermal Resistance
Single layer PCB, with copper limited to solder pads and 3.57
(23.03 cm2) copper area each side
in.2
Value
Unit
126
ºC/W
84
ºC/W
*Additional thermal information available on the Allegro website
Maximum Allowable VCC (V)
Power Derating Curve
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
VCC(max)
(R θJA = 84 °C/W)
(R θJA = 126 °C/W)
VCC(min)
20
40
60
80
100
120
140
160
180
Temperature (°C)
Power Dissipation, PD (m W)
Power Dissipation versus Ambient Temperature
1900
1800
1700
1600
1500
1400
1300
1200
1100
1000
900
800
700
600
500
400
300
200
100
0
20
RQJA = 84 ºC/W
RQJA = 126 ºC/W
40
60
80
100
120
140
Temperature,TA (°C)
160
180
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115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
5
Two-Wire, Differential, Vibration Resistant
Sensor IC with Speed and Direction Output
ATS692LSH(RSNBL)
Reference Target 60-0 (60 Tooth Target)
Characteristics
Symbol
Test Conditions
Typ.
Units
120
mm
Outside Diameter
Do
Outside diameter of target
Face Width
F
Breadth of tooth, with respect
to branded face
6
mm
Angular Tooth Thickness
t
Length of tooth, with respect
to branded face
3
deg.
Angular Valley Thickness
tv
Length of valley, with respect
to branded face
3
deg.
Tooth Whole Depth
ht
3
mm
–
–
Material
Low Carbon Steel
Symbol Key
t
Do
ht
F
tv
Air Gap
Branded Face of Sensor
Reference Gear Magnetic Gradient Amplitude versus Air Gap
Reference Target 60-0
800
600
500
400
300
Branded Face
of Sensor
200
100
0
0.5
1.0
1.5
2.0
2.5
Reference Target
60-0
3.0
Air Gap (mm)
Reference Gear Magnetic Profile
Two Tooth-to-Valley Transitions
500
Air Gap
400
(mm)
0.50
0.75
1.00
1.25
1.50
1.75
2.00
2.25
2.50
2.75
3.00
300
Differential B* (G)
Peak-to-Peak Differential B (G)
700
200
100
0
-100
-200
3.00 mm AG
-300
0.50 mm AG
-400
-500
0
2
4
6
8
10
12
Gear Rotation (°)
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115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
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Two-Wire, Differential, Vibration Resistant
Sensor IC with Speed and Direction Output
ATS692LSH(RSNBL)
Functional Description
Sensing Technology
The sensor IC contains a single-chip Hall-effect circuit that
supports a trio of Hall elements. These elements are used in
differential pairs to provide electrical signals containing information regarding edge position and direction of target rotation. The
ATS692 is intended for use with ferromagnetic targets.
After proper power is applied to the sensor IC, it is capable of
providing digital information that is representative of the magnetic features of a rotating target. The waveform diagrams in
figure 3 present the automatic translation of the target profiles,
through their induced magnetic profiles, to the digital output
signal of the sensor IC.
Direction Detection
The sensor IC compares the relative phase of its two differential
channels to determine in which direction the target is moving.
The relative switching order is used to determine the direction,
which is communicated through the output protocol.
Data Protocol Description
When a target passes in front of the device (opposite the branded
face of the package case), the ATS692 generates an output pulse
for each tooth of the target. Speed information is provided by the
output pulse rate, while direction of target rotation is provided by
the duration of the output pulses. The sensor IC can sense target
movement in both the forward and reverse directions.
Pin 4
Pin 1
Forward Rotation (see panel A in figure 2) When the target is
rotating such that a tooth near the sensor IC passes from pin 4 to
pin 1, this is referred to as forward rotation. Forward rotation is
indicated on the output by a tw(FWD) (45 μs typical) pulse width.
Reverse Rotation (see panel B in figure 2) When the target is
rotating such that a tooth passes from pin 1 to pin 4, it is referred
to as reverse rotation. Reverse rotation is indicated on the output
by pulse widths of tw(REV) (90 μs typical).
Target
Package Case
Branded Face
Device Orientation to Target
(Top View of
(Pin 4
Package Case)
Side)
Back-Biasing
Rare-Earth Pellet
B Channel
E3
IC
ICE2
E1
(Pin 1
Side)
South Pole
Pole Piece
(Concentrator)
A Channel
North Pole
Mechanical Position (Target moves past device pin 1 to pin 4)
This tooth
sensed later
This tooth
sensed earlier
Target Magnetic Profile
+B
IC Internal Differential Analog Signals, VPROC
BOP
A Channel
Branded Face
of Package
Rotating Target
(Ferromagnetic)
BRP
B Channel
BRP
(A) Forward Rotation
Pin 4
BOP
Detected Channel Switching
Pin 1
A Channel
B Channel
Device Output Signal
Rotating Target
(Ferromagnetic)
Branded Face
of Package
ICC(High)
ICC(Low)
(B) Reverse Rotation
Figure 2. Target rotation
Figure 3. The magnetic profile reflects the features of the target, allowing
the sensor IC to present an accurate digital output.
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115 Northeast Cutoff
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7
ATS692LSH(RSNBL)
Two-Wire, Differential, Vibration Resistant
Sensor IC with Speed and Direction Output
Timing As shown in figure 4, the pulse appears at the output
slightly before the sensed magnetic edge traverses the package
branded face. For targets in forward rotation, this shift, Δfwd,
results in the pulse corresponding to the valley with the sensed
mechanical edge, and for targets in reverse rotation, the shift,
Δrev, results in the pulse corresponding to the tooth with the
sensed edge. The sensed mechanical edge that stimulates output
pulses is kept the same for both forward and reverse rotation by
using only one channel to control output switching.
Direction Validation
Following a direction change in running mode, direction changes
are immediately transmitted to the output. An example of the
waveforms is shown in figure 5.
Forward Rotation
Reverse Rotation
Valley
Tooth
∆fwd
tw(FWD) 45 μs
Output Pulse
(Forward Rotation)
t
∆rev
tw(REV) 90 μs
Output Pulse
(Reverse Rotation)
t
Figure 4. Output protocol
Target Rotation Forward
Valley
Target Rotation Reverse
Tooth
Target
Differential
Magnetic
Profile
IOUT
tW(FWD)
tW(FWD)
tW(REV)
tW(REV)
t
Figure 5. Example of direction change in Running mode
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Two-Wire, Differential, Vibration Resistant
Sensor IC with Speed and Direction Output
ATS692LSH(RSNBL)
Start-Up Detection / Calibration
When power is applied to the ATS692, the sensor IC internally detects the profile of the target. The gain and offset of
the detected signals are adjusted during the calibration period,
normalizing the internal signal amplitude for the air gap range of
the device.
The Automatic Gain Control (AGC) feature ensures that operational characteristics are isolated from the effects of installation
air gap variation.
Automatic Offset Adjustment (AOA) is circuitry that compensates for the effects of chip, magnet, and installation offsets. This
circuitry works with the AGC during calibration to adjust VPROC
in the internal A-to-D range to allow for acquisition of signal
peaks. AOA and AGC function separately on the two differential
signal channels.
Direction information is available after calibration is complete.
The output becomes active at the end of calibration. Figure 6
shows where the first output edges may occur for various starting
target phases.
Vibration Detection
Algorithms embedded in the IC digital controller detect the
presence of target vibration through analysis of the two magnetic
input channels.
The first direction change is immediately transmitted to the output. During any subsequent vibration, the output is blanked and
no output pulses occur for vibrations less than the specified vibration immunity (see figure 7). When constant rotation resumes,
output pulses containing the proper direction information will
resume when direction information is validated on constant
target rotation.
Target Rotation
Valley
Tooth
Target
Differential
Magnetic
Profile
ICC
Opposite
valley
Opposite
rising edge
tW(FWD) or
tW(REV)
tW(FWD) or
tW(REV)
tW(FWD) or
tW(REV)
tW(FWD) or
tW(REV)
tW(FWD) or
tW(REV)
tW(FWD) or
tW(REV)
tW(FWD) or
tW(REV)
Opposite
tooth
Opposite
falling edge
t
Device Location at Power-On
Figure 6. Start-up position effect on first device output switching
t
Normal Target Rotation
Valley
Vibration
Normal Target Rotation
Tooth
Target
Differential
Magnetic
Profile
tW(FWD)
tW(FWD)
[ or tW(REV) ]
[ or tW(REV) ]
tW(REV)
[ or tW(FWD) ]
tW(FWD)
tW(FWD)
[ or tW(REV) ]
[ or tW(REV) ]
t
Figure 7. Output functionality in the presence of Running mode target vibration
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
9
ATS692LSH(RSNBL)
Two-Wire, Differential, Vibration Resistant
Sensor IC with Speed and Direction Output
Application Information
Power Derating
The device must be operated below the maximum junction
temperature of the device, TJ(max). Under certain combinations of
peak conditions, reliable operation may require derating supplied
power or improving the heat dissipation properties of the application. This section presents a procedure for correlating factors
affecting operating TJ. (Thermal data is also available on the
Allegro website.)
The Package Thermal Resistance, RJA, is a figure of merit summarizing the ability of the application and the device to dissipate
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity, K,
of the printed circuit board, including adjacent devices and traces.
Radiation from the die through the device case, RJC, is relatively
small component of RJA. Ambient air temperature, TA, and air
motion are significant external factors, damped by overmolding.
The effect of varying power levels (Power Dissipation, PD), can
be estimated. The following formulas represent the fundamental
relationships used to estimate TJ, at PD.


PD = VIN × IIN
(1)
T = PD × RJA
(2)
TJ = TA + ΔT
(3)
For example, given common conditions such as: TA= 25°C,
VCC = 12 V, ICC = 6.5 mA, and RJA = 126 °C/W, then:
Example: Reliability for VCC at TA = 150°C, package SH, using a
single-layer PCB.
Observe the worst-case ratings for the device, specifically:
RJA = 126 °C/W, TJ(max) = 165°C, VCC(max) = 24 V, and
ICC(mean) = 13 mA. (Note: At maximum target frequency,
ICC(LOW) = 8 mA, ICC(HIGH) = 16 mA, and maximum pulse
widths, the result is a duty cycle of 62.4% and a worst case
ICC(mean) of 13 mA.)
Calculate the maximum allowable power level, PD(max). First,
invert equation 3:
Tmax = TJ(max) – TA = 165 °C – 150 °C = 15 °C
This provides the allowable increase to TJ resulting from internal
power dissipation. Then, invert equation 2:
PD(max) = Tmax ÷ RJA = 15°C ÷ 126 °C/W = 119 mW
Finally, invert equation 1 with respect to voltage:
VCC(est) = PD(max) ÷ ICC(max) = 119 mW ÷ 13 mA = 9.2 V
The result indicates that, at TA, the application and device can
dissipate adequate amounts of heat at voltages ≤ VCC(est).
Compare VCC(est) to VCC(max). If VCC(est) ≤ VCC(max), then
reliable operation between VCC(est) and VCC(max) requires
enhanced RJA. If VCC(est) ≥ VCC(max), then operation between
VCC(est) and VCC(max) is reliable under these conditions.
PD = VCC × ICC = 12 V × 6.5 mA = 78 mW

V CC
T = PD × RJA = 78 mW × 126 °C/W = 9.8°C
TJ = TA + T = 25°C + 9.8°C = 34.8°C
A worst-case estimate, PD(max), represents the maximum allowable power level (VCC(max), ICC(max)), without exceeding
TJ(max), at a selected RJA and TA.
1
VCC
ATS692
TEST 3
2 TEST
0.01 MF
CBYPASS
GND
4
RL
100 7
CL
Figure 8. Typical application circuit
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
10
Two-Wire, Differential, Vibration Resistant
Sensor IC with Speed and Direction Output
ATS692LSH(RSNBL)
Package SH, 4-Pin SIP
F
5.50±0.05
1.75
E
1.75 F
B
8.00±0.05
LLLLLLL
NNN
5.80±0.05
E3
E1
E2
YYWW
Branded
Face
1.70±0.10
5.00±0.10
D
4.00±0.10
1
2
3
4
= Supplier emblem
L = Lot identifier
N = Last three numbers of device part number
Y = Last two digits of year of manufacture
W = Week of manufacture
A
0.60±0.10
Standard Branding Reference View
0.71±0.05
For Reference Only, not for tooling use (reference DWG-9003)
Dimensions in millimeters
A Dambar removal protrusion (16X)
24.65±0.10
B Metallic protrusion, electrically connected to pin 4 and substrate (both sides)
C Thermoplastic Molded Lead Bar for alignment during shipment
+0.06
0.38 –0.04
1.00±0.10
13.10±0.10
D Branding scale and appearance at supplier discretion
E Active Area Depth 0.43 mm REF
F
Hall elements (E1, E2, E3); not to scale
A
1.0 REF
1.60±0.10
C
1.27±0.10
0.71±0.10
0.71±0.10
5.50±0.10
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115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
11
Two-Wire, Differential, Vibration Resistant
Sensor IC with Speed and Direction Output
ATS692LSH(RSNBL)
Revision History
Revision
Rev. 2
Revision Date
August 27, 2013
Description of Revision
Upgrades to select graphics, Tstg, errVIB and errVIB(SU)
update
Copyright ©2010-2013, Allegro MicroSystems, LLC
Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to
permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that
the information being relied upon is current.
Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the
failure of that life support device or system, or to affect the safety or effectiveness of that device or system.
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its
use; nor for any infringement of patents or other rights of third parties which may result from its use.
For the latest version of this document, visit our website:
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115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
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12