A1699 Two-Wire, Differential, Vibration-Resistant Sensor IC with Speed and Direction Output FEATURES AND BENEFITS • Integrated IC and capacitor, single overmolded package to reduce external EMI-protection requirements • Two-wire, pulse-width output protocol • Highly configurable output protocol options • Digital output representing target profile • Speed and direction information of target • Vibration tolerance □□ Small-signal lockout for small amplitude vibration □□ Proprietary vibration detection algorithms for large amplitude vibration • Air-gap-independent switchpoints • Large operating air gap capability • Undervoltage lockout • True zero-speed operation • Wide operating voltage range • AEC-Q100 automotive qualified • Robust test-coverage capability with Scan Path and IDDQ measurement Package: 2-Pin SIP (Suffix UB) DESCRIPTION The A1699 is an optimized Hall-effect integrated circuit (IC) that provides a user-friendly solution for direction detection and true zero-speed, digital ring-magnet sensing. The small package can be easily assembled and used in conjunction with a wide variety of target sensing applications. The IC employs patented algorithms for the special operational requirements of automotive transmission applications. The speed and direction of the target are communicated through a variable pulse-width output protocol. The A1699 is particularly adept at handling vibration without sacrificing maximum air gap capability or creating any erroneous direction information. The advanced vibration detection algorithm will systematically calibrate the sensor IC on the initial magnetic poles of true target rotation and not on vibration, always guaranteeing an accurate signal in running mode. Advanced signal processing and innovative algorithms make the A1699 an ideal solution for a wide range of speed- and direction-sensing needs. The A1699 is provided in a 2-pin miniature SIP package (suffix UB) that is lead (Pb) free, with tin leadframe plating. The UB package includes an IC and capacitor integrated into a single overmolded package to reduce external EMI protection requirements. Not to scale VCC Regulator (Analog) Regulator (Digital) Hall Amp Offset Adjust AGC Filter ADC Synchronous Digital Controller Hall Amp Offset Adjust AGC Filter Output Control ADC GND Functional Block Diagram A1699-DS, Rev. 6 Two-Wire, Differential, Vibration-Resistant Sensor IC with Speed and Direction Output A1699 Complete Part Number Format Configuration A1699 L UB TN -X X X X X -T Allegro Identifier and Device Type Operating Temperature Range Package Designation Instructions (Packing) Leadframe Plating Allegro Identifier and Device Type [A1699] Operating Temperature Range [L] Package Designation [UB] 2-pin plastic SIP Instructions (Packing) [TN] Tape and reel Configuration Rotation Direction [-F] pin 1-to-2 forward or [-R] pin 2-to-1 forward Number of Pulses [S] single, one pulse per magnetic pole pair or [D] dual, one pulse for each north and south pole Reverse Pulse Width [N] 90 µs (narrow) or [W] 180 µs (wide) Calibration Pulses [B] Blanked, no output during Calibration or [P] Pulses during Calibration Vibration Immunity / Direction Change [L] Low vibration immunity with immediate direction change detection or [H] High vibration immunity with non-direction pulses Leadframe Plating [T] Lead (Pb) free For example: A1699LUBTN-RSNPL-T Where a configuration character is unspecified, “x” will be used. For example, -xSNPL applies to both Rotation Direction configuration variants. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 2 Two-Wire, Differential, Vibration-Resistant Sensor IC with Speed and Direction Output A1699 SPECIFICATIONS SELECTION GUIDE Part Number Packing* A1699LUBTN–xxxxx–T 4000 pieces per 13-in. reel *Contact Allegro™ for additional packing options. ABSOLUTE MAXIMUM RATINGS* Characteristic Symbol Supply Voltage VCC Reverse Supply Voltage VRCC Rating Unit 28 V –18 V –40 to 150 ºC TJ(max) 165 ºC Tstg –65 to 170 ºC Value (Typ.) Unit 10000 pF Operating Ambient Temperature TA Maximum Junction Temperature Storage Temperature Notes Refer to Power Derating Section L temperature range INTERNAL DISCRETE CAPACITOR RATINGS Characteristic Symbol Nominal Capacitance CSUPPLY Test Conditions Connected between VCC and GND Terminal List Table 1 Name Number Function VCC 1 Supply Voltage GND 2 Ground 2 Package UB, 2-Pin SIP Pinout Diagram Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 3 Two-Wire, Differential, Vibration-Resistant Sensor IC with Speed and Direction Output A1699 OPERATING CHARACTERISTICS: Valid throughout full operating and temperature ranges, unless otherwise specified Characteristic Symbol Test Conditions Min. Typ.1 Max. Unit ELECTRICAL CHARACTERISTICS Supply Voltage2 Undervoltage Lockout Reverse Supply Current3 Supply Zener Clamp Voltage Supply Current VCC Operating, TJ < TJ(max) 4 – 24 V VCC transitioning from 0 → 5 V or 5 → 0 V – 3.6 3.95 V VCC = VRCC(max) – – –10 mA3 VZSUPPLY ICC = ICC(max) + 3 mA, TA = 25ºC 28 – – V ICC(LOW) Low-current state (running mode) 5 – 8 mA ICC(HIGH) High-current state (running mode) 12 – 16 mA Low-current level (calibration) and Power-on mode 5 – 8.5 mA 1.9 – – – VCC(UV) IRCC ICC(SU) (LOW) Supply Current Ratio ICC(HIGH)/ ICC(LOW) Measured as a ratio of high current to low current OUTPUT Output Rise Time tr ΔI/Δt from 10% to 90% ICC level; Corresponds to measured output slew rate with CSUPPLY – 2 4 μs Output Fall Time tf ΔI/Δt from 90% to 10% ICC; Corresponds to measured output slew rate with CSUPPLY – 2 4 μs OUTPUT PULSE CHARACTERISTICS4 Pulse Width, Forward Rotation Pulse Width, Reverse Rotation Pulse Width, Non-Direction tw(FWD) tw(REV) tw(ND) 38 45 52 μs -xxNxx variant 76 90 104 μs -xxWxx variant 153 180 207 μs -xxNPx and -xxNxH variants 153 180 207 μs -xxWPx and -xxWxH variants 306 360 414 μs Continued on the next page… VS 1 VCC CSUPPLY A1699 2 GND VOUT CL RL Figure 1: Typical Application Circuit Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 4 Two-Wire, Differential, Vibration-Resistant Sensor IC with Speed and Direction Output A1699 OPERATING CHARACTERISTICS (continued): Valid throughout full operating and temperature ranges, unless otherwise specified Characteristic Symbol Test Conditions Min. Typ.1 Max. Unit Operate Point BOP % of peak-to-peak IC-processed magnetic signal – 69 – % Release Point BRP % of peak-to-peak IC-processed magnetic signal – 31 – % -xSxxx variant 0 – 12 kHz -xDxxx variant 0 – 6 kHz -xSNxx variant 0 – 7 kHz -xDNxx variant 0 – 3.5 kHz -xSWxx variant 0 – 4 kHz -xDWxx variant 0 – 2 kHz -xSNxx variant 0 – 4 kHz -xDNxx variant 0 – 2 kHz -xSWxx variant 0 – 2.2 kHz -xDWxx variant 0 – 1.1 kHz Magnitude valid for both differential magnetic channels –300 – 300 G Peak to peak differential signal; valid for each magnetic channel. 30 – 1200 G -xxxxL variant TTARGET – – deg. -xxxxH variant TTARGET – – deg. -xxxxL variant 0.12 × TTARGET – – deg. -xxxxH variant TTARGET – – deg. – –0.2 – %/°C OPERATING CHARACTERISTICS Operating Frequency, Forward Rotation fFWD Operating Frequency, Reverse Rotation5 fREV Operating Frquency, Non-Direction Pulses5 fND DAC CHARACTERISTICS Allowable User-Induced Offset PERFORMANCE CHARACTERISTICS Operational Magnetic Range BIN Vibration Immunity (Startup) ErrVIB(SU) See Figure 2 Vibration Immunity (Running Mode) ErrVIB See Figure 2 Magnetic Temperature Coefficient TCMAG Optimized value, for ring magnet 1 Typical values are at TA = 25°C and VCC = 12 V. Performance may vary for individual units, within the specified maximum and minimum limits. voltage must be adjusted for power dissipation and junction temperature; see representative discussions in Power Derating section. 3 Negative current is defined as conventional current coming out of (sourced from) the specified device terminal. 4 Load circuit is RL = 100 Ω and CL = 10 pF. Pulse duration measured at threshold of ( (I CC(HIGH) + ICC(LOW)) /2). 5 Maximum Operating Frequency is determined by satisfactory separation of output pulses: I CC(LOW) of tw(FWD)(MIN). If the customer can resolve shorter low-state durations, maximum fREV and fND may be increased. 2 Maximum Target S N S 360º (degrees prime) N VSP T TARGET VPROC VPROC(BOP) TVPROC VPROC(pk-pk) VPROC = the processed analog signal of the sinusoidal magnetic input (per channel) TTARGET = the period between successive sensed target magnetic edges of the same polarity (either both north-to-south or both south-to-north) (BOP) (BRP) VPROC(BRP) VSP VSP(sep) = VSP VPROC(pk-pk) Figure 2: Definition of TTARGET Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 5 Two-Wire, Differential, Vibration-Resistant Sensor IC with Speed and Direction Output A1699 OPERATING CHARACTERISTICS (continued): Valid throughout full operating and temperature ranges, unless otherwise specified Characteristic Symbol Test Conditions Min. Typ.1 Max. Unit INPUT MAGNETIC CHARACTERISTICS Allowable Differential Sequential Signal Variation BSEQ(n+1) / BSEQ(n) Signal cycle-to-cycle variation (see Figure 3) 0.6 – – – BSEQ(n+i) / BSEQ(n) Overall signal variation (see Figure 3) 0.4 – – – BIN > 60 GPP BIN ≤ 1200 GPP – 2× TTARGET <3 × TTARGET degrees 30 GPP ≤ BIN BIN ≤ 60 GPP – 2.5 × TTARGET <4 × TTARGET degrees -xxxxL variant – 1 – switchpoint -xxxxH variant 1× TTARGET 2× TTARGET 3× TTARGET degrees -xxxxL variant – – 1.25 × TTARGET degrees -xxxxH variant 1× TTARGET 2× TTARGET 3× TTARGET degrees 20 – – % pk-pk CALIBRATION First Direction Output Amount of target rotation (constant direction) following power-on until first electrical output pulse of either tw(FWD) or tw(REV). See Figure 2 Pulse6 First Direction Pulse Output Following Direction Change NCD Amount of target rotation (constant direction) following event until first electrical output pulse of either tw(FWD) or tw(REV). See Figure 2 First Direction Pulse Output Following Running Mode Vibration Switch Point Separation 6 Power-up Amount of target rotation (constant direction) following event until first electrical output pulse of either tw(FWD) or tw(REV). VSP(sep) ≥ 35. See Figure 2 VSP(sep) Minimum separation between channels as a percentage of signal amplitude at each switching point. See Figure 2 frequencies ≤ 200 Hz. Higher power-on frequencies may require more input magnetic cycles until output edges are achieved. BSEQ(n) BSEQ(n + 1) BSEQ(n+1), i ≥ 2 Figure 3: Differential Signal Variation Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 6 Two-Wire, Differential, Vibration-Resistant Sensor IC with Speed and Direction Output A1699 THERMAL CHARACTERISTICS Characteristic Package Thermal Resistance Symbol Test Conditions* RθJA Single-layer PCB with copper limited to solder pads Value Unit 213 ºC/W *Additional thermal information is available on the Allegro website. Power Derating Curve 26 VCC(max) Maximum Allowable VCC (V) 24 22 20 18 16 RθJA = 213 °C/W 14 12 10 8 6 VCC(min) 4 2 0 20 40 60 80 100 120 140 160 Ambient Temperature, TA (ºC) Power Dissipation versus Ambient Temperature 1000 Power Dissipation, PD (mW) 900 800 700 600 500 RθJA = 213 °C/W 400 300 200 100 0 20 40 60 80 100 120 140 160 Ambient Temperature, TA (ºC) Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 7 Two-Wire, Differential, Vibration-Resistant Sensor IC with Speed and Direction Output A1699 CHARACTERISTIC PERFORMANCE Supply Current 18 18 VCC = 4 V TA = +25ºC 16 16 ICC HIGH 14 SUPPLY CURRENT (mA) SUPPLY CURRENT (mA) ICC HIGH 12 10 8 14 12 10 8 6 6 ICC LOW 4 ICC LOW 4 -50 -25 0 25 50 75 100 125 0 150 5 AMBIENT TEMPERATURE (ºC) 10 15 18 25 18 VCC = 24 V TA = +150ºC 16 16 ICC HIGH ICC HIGH 14 SUPPLY CURRENT (mA) SUPPLY CURRENT (mA) 20 SUPPLY VOLTAGE (V) 12 10 8 14 12 10 8 ICC LOW 6 6 4 ICC LOW 4 -50 -25 0 25 50 75 AMBIENT TEMPERATURE (ºC) 100 125 150 0 5 10 15 20 25 SUPPLY VOLTAGE (V) Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 8 Two-Wire, Differential, Vibration-Resistant Sensor IC with Speed and Direction Output A1699 Supply Current Ratio 5 Vcc = 4 V 4.5 4.5 4 4 3.5 3.5 SUPPLY CURRENT RATIO SUPPLY CURRENT RATIO 5 3 2.5 ICC RATIO 2 1.5 3 ICC RATIO 2.5 2 1.5 1 1 0.5 0.5 0 TA = +25°C 0 -50 -25 0 25 50 75 100 125 150 0 5 AMBIENT TEMPERATURE (°C) 15 5 Vcc = 24 V 4.5 4.5 4 4 SUPPLY CURRENT IN MILLIAMPERE SUPPLY CURRENT IN MILLIAMPERE 5 3.5 3 2.5 10 20 25 SUPPLY VOLTAGE (V) ICC RATIO 2 1.5 TA = +150°C 3.5 3 ICC RATIO 2.5 2 1.5 1 1 0.5 0.5 0 0 -50 -25 0 25 50 75 AMBIENT TEMPERATURE (°C) 100 125 150 0 5 10 15 20 25 SUPPLY VOLTAGE (V) Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 9 Two-Wire, Differential, Vibration-Resistant Sensor IC with Speed and Direction Output A1699 Pulse Width 500 500 Vcc = 4 V NON DIRECTION (-xxWPx and -xxWxH variants) 400 NON DIRECTION (-xxWPx and -xxWxH variants) 400 350 PULSE WIDTH (µs) 350 PULSE WIDTH (µs) TA = +25°C 450 450 300 250 REVERSE ( -xxWxx variant ) 200 150 250 REVERSE ( -xxNxx variant ) 100 FORWARD 50 REVERSE ( -xxWxx variant ) 200 150 REVERSE ( -xxNxx variant ) 100 300 FORWARD 50 0 0 -50 -25 0 25 50 75 100 125 0 150 5 500 450 20 25 TA = +150°C 450 NON DIRECTION (-xxWPx and -xxWxH variants) NON DIRECTION (-xxWPx and -xxWxH variants) 400 350 350 PULSE WIDTH (µs) PULSE WIDTH (µs) 15 500 Vcc = 24 V 400 10 SUPPLY VOLTAGE (V) AMBIENT TEMPERATURE (°C) 300 250 REVERSE ( -xxWxx variant ) 200 150 250 REVERSE ( -xxWxx variant ) 200 150 REVERSE ( -xxNxx variant ) 100 300 REVERSE ( -xxNxx variant ) 100 FORWARD 50 0 -50 -25 0 25 50 FORWARD 50 75 AMBIENT TEMPERATURE (°C) 100 125 150 0 0 5 10 15 20 25 SUPPLY VOLTAGE (V) Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 10 Two-Wire, Differential, Vibration-Resistant Sensor IC with Speed and Direction Output A1699 FUNCTIONAL DESCRIPTION Sensing Technology Direction Detection The sensor IC contains a single-chip Hall-effect circuit that supports a trio of Hall elements. These elements are used in differential pairs to provide electrical signals containing information regarding edge position and direction of target rotation. The A1699 is intended for use with ring magnet and gear targets. The sensor IC compares the relative phase of its two differential channels to determine which direction the target is moving. The relative switching order is used to determine the direction, which is communicated through the output protocol. After proper power is applied to the sensor IC, it is capable of providing digital information that is representative of the magnetic features of a rotating target. The waveform diagrams in Figure 4 present the automatic translation of the target profiles to the digital output signal of the sensor IC Data Protocol Description When a target passes in front of the device (opposite the branded face of the package case), the A1699 generates an output pulse(s) for each pair of magnetic poles of the target. Speed information is provided by the output pulse rate, while direction of target rotation is provided by the duration of the output pulses. The sensor IC can sense target movement in both the forward and reverse directions. Target N Device Orientation to Target (Pin 2 Side) (Top View of Package Case) E3 Package Case Branded Face E2 IC Channel B Element Pitch E1 Channel A Element Pitch Mechanical Position (Target moves past device pin 1 to pin 2) Target (Radial Ring Magnet) This pole sensed earlier N This pole sensed later (Top View of (Pin 2 Package Case) Side) Back-Biasing Rare-Earth Pellet B Channel Target Magnetic Profile Channel Element Pitch +B E3 IC ICE2 E1 (Pin 1 Side) South Pole Pole Piece (Concentrator) A Channel North Pole Mechanical Position (Target moves past device pin 1 to pin 2) N S Package Case Branded Face Device Orientation to Target (Pin 1 Side) This tooth sensed later This tooth sensed earlier Target Magnetic Profile Channel Element Pitch +B –B IC Internal Differential Analog Signals, VPROC BOP BOP A Channel BOP IC Internal Differential Analog Signals, VPROC BOP A Channel BRP BOP B Channel BRP Detected Channel Switching A Channel B Channel BRP Detected Channel Switching A Channel B Channel B Channel Device Output Signal Device Output Signal I ICC(High) I ICC(Low) CC(High) CC(Low) BRP Figure 4: The magnetic profile reflects the features of the target, allowing the sensor IC to present an accurate digital output (-xSxxx variant shown). Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 11 Two-Wire, Differential, Vibration-Resistant Sensor IC with Speed and Direction Output A1699 Forward Rotation (see Figure 5) When the target is rotating such that a magnetic pole near the sensor IC (of -Fxxxx variant) passes from pin 1 to pin 2, this is referred to as forward rotation. This direction is opposite for the -Rxxxx variant. Forward rotation is indicated by output pulse widths of tw(FWD) (45 μs typical). Reverse Rotation (see Figure 5) When the target is rotating such that a magnetic pole passes from pin 2 to pin 1, it is referred to as reverse rotation for the -Fxxxx variant. This direction is opposite for the -Rxxxx variant. Reverse rotation is indicated by output pulse widths of tw(REV) (90 μs typical for -xxNxx variant, or 180 μs typical for -xxWxx variant). Timing As shown in Figure 6, the pulse appears at the output slightly before the sensed magnetic edge traverses the package branded face. For targets rotating from pin 2 to 1, this shift (Δfwd with R variants, with south pole of backbiasing pellet toward IC) results in the pulse corresponding to the valley with the sensed mechanical edge; for targets rotating from pin 1 to 2, the shift (Δrev) results in the pulse corresponding to the tooth with the sensed edge. Figure 7 shows pulse timing for F variants. The sensed mechanical edge that stimulates output pulses is kept the same for both forward and reverse rotation by using only one channel to control output switching. Direction Validation For the -xxxxL variant, following a direction change in running mode, direction changes are immediately transmitted to the output. For the -xxxxH variant, following a direction change in running mode, output pulses have a width of tw(ND) until direction information is validated. Pin 2 to 1 Rotation Pin 1 to 2 Rotation N S N S N S N S N Output Pulse (Pin 2 to 1 Rotation) S Δrev tw(REV) Pin 1 Pin 2 Branded Face of Sensor Rotating Target S N S N S N S N t Output Pulse (Pin 1 to 2 Rotation) (A) Forward Rotation N Tooth Δfwd tw(FWD) Branded Face of Sensor Rotating Target Valley Figure 6: Output Protocol (-RSxxx variant) Δrev tw(REV) S Pin 1 Pin 2 (B) Reverse Rotation Output Pulse (Pin 2 to 1 Rotation) Δfwd tw(FWD) Figure 5: Target Rotation for -Fxxxx Variant. -Rxxxx variant inverts detected direction of rotation. t Output Pulse (Pin 1 to 2 Rotation) Figure 7: Output Protocol (-FDxxx variant) Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 12 Two-Wire, Differential, Vibration-Resistant Sensor IC with Speed and Direction Output A1699 Target Rotation Forward N S N S Target Rotation Reverse S N S N Target Differential Magnetic Profile tw(REV) tw(FWD) tw(FWD) IOUT tw(REV) t Figure 8: Example Running Mode Direction Change (-FSxxL variant) Target Rotation Forward N S N S Target Rotation Reverse S N S N Target Differential Magnetic Profile IOUT tw(FWD) tw(FWD) tw(ND) tw(REV) t Figure 9: Example Running Mode Direction Change (-FSxxH variant) Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 13 Two-Wire, Differential, Vibration-Resistant Sensor IC with Speed and Direction Output A1699 Startup Detection/Calibration When power is applied to the A1699, the sensor IC internally detects the profile of the target. The gain and offset of the detected signals are adjusted during the calibration period, normalizing the internal signal amplitude for the air gap range of the device. The Automatic Gain Control (AGC) feature ensures that operational characteristics are isolated from the effects of installation air gap variation. Automatic Offset Adjustment (AOA) is circuitry that compensates for the effects of chip, magnet, and installation offsets. This circuitry works with the AGC during calibration to adjust VPROC in the internal A-to-D range to allow for acquisition of signal peaks. AOA and AGC function separately on the two differential signal channels. Direction information is available after calibration is complete. For the -xxxBx variant, the output becomes active at the end of calibration. Figure 10 shows where the first output edges may occur for various starting target phases. For the -xxxPx variant, output pulses of tw(ND) are supplied during calibration. Figure 11 shows where the first output edges may occur for various starting target phases. Target Rotation N S N N S S Target Differential Magnetic Profile ICC Opposite north pole Opposite N→S boundary N S N tW(FWD) or tW(REV) tW(FWD) or tW(REV) tW(FWD) or tW(REV) tW(FWD) or tW(REV) tW(FWD) or tW(REV) tW(FWD) or tW(REV) tW(FWD) or tW(REV) Opposite south pole Opposite S→N boundary t Device Location at Power-On Figure 10: Startup Position Effect on First Device Output Switching (-xxxBx variant) Target Rotation N S N N S Target Differential Magnetic Profile ICC Opposite north pole Opposite N→S boundary N S S N tW(ND) tW(ND) tW(FWD) or tW(REV) tW(FWD) or tW(REV) tW(ND) tW(ND) tW(FWD) or tW(REV) tW(FWD) or tW(REV) tW(ND) tW(ND) tW(FWD) or tW(REV) tW(ND) tW(ND) tW(FWD) or tW(REV) tW(FWD) or tW(REV) Opposite south pole Opposite S→N boundary t Device Location at Power-On Figure 11: Startup Position Effect on First Device Output Switching (-xxxPx variant) Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 14 Two-Wire, Differential, Vibration-Resistant Sensor IC with Speed and Direction Output A1699 Vibration Detection Algorithms embedded in the IC’s digital controller detect the presence of target vibration through analysis of the two magnetic input channels. For the -xxxxL variant, the first direction change is immediately transmitted to the output. During any subsequent vibration, the output is blanked and no output pulses will occur for vibrations less than the specified vibration immunity. Output pulses containNormal Target Rotation N S N Vibration S ing the proper direction information will resume when direction information is validated on constant target rotation. For the -xxxxH variant, in the presence of vibration, output pulses of tw(ND) may occur or no pulses may occur, depending on the amplitude and phase of the vibration. Output pulses have a width of tw(ND) until direction information is validated on constant target rotation. Normal Target Rotation S N S N Target Differential Magnetic Profile t W (FWD) t W (FWD) [or t W (REV)] [or t W (REV)] t W (REV) t W (FWD) t W (FWD) [or t W (REV)] [or t W (REV)] [or t W (FWD)] t Figure 12: Output Functionality in the Presence of Running Mode Target Vibration (-xxxxL variant) Normal Target Rotation N S N Vibration S Normal Target Rotation S N S N Target Differential Magnetic Profile t W (FWD) t W (FWD) [or t W (REV)] [or t W (REV)] t W (FWD) t W (FWD) [or t W (REV)] [or t W (REV)] t W (ND) t W (ND) t W (FWD) [or t W (REV)] t W (ND) t W (ND) t W (ND) t W (FWD) [or t W (REV)] t Figure 13: Output Functionality in the Presence of Running Mode Target Vibration (-xxxxH variant) Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 15 Two-Wire, Differential, Vibration-Resistant Sensor IC with Speed and Direction Output A1699 POWER DERATING The device must be operated below the maximum junction temperature of the device, TJ(max). Under certain combinations of peak conditions, reliable operation may require derating supplied power or improving the heat dissipation properties of the application. This section presents a procedure for correlating factors affecting operating TJ. (Thermal data is also available on the Allegro MicroSystems website.) The Package Thermal Resistance, RθJA, is a figure of merit summarizing the ability of the application and the device to dissipate heat from the junction (die), through all paths to the ambient air. Its primary component is the Effective Thermal Conductivity, UB, of the printed circuit board, including adjacent devices and traces. Radiation from the die through the device case, RθJC, is relatively small component of RθJA. Ambient air temperature, TA, and air motion are significant external factors, damped by overmolding. The effect of varying power levels (Power Dissipation, PD), can be estimated. The following formulas represent the fundamental relationships used to estimate TJ, at PD. PD = VIN × IIN (1) ∆T = PD × RθJA (2) TJ = TA + ∆T (3) For example, given common conditions such as: TA= 25°C, VCC = 12 V, RθJA = 213 °C/W, and Icc = 6.5 mA, then: PD = VCC × ICC = 12 V × 6.5 mA = 78 mW ∆T = PD × RθJA = 78 mW × 213 °C/W = 16.6°C TJ = TA + ∆T = 25°C + 16.6°C = 41.6°C A worst-case estimate, PD(max), represents the maximum allowable power level (VCC(max), ICC(max)), without exceeding TJ(max), at a selected RθJA and TA. Example: Reliability for VCC at TA = 150°C. Observe the worst-case ratings for the device, specifically: RθJA = 213°C/W, TJ(max) = 165°C, VCC(max) = 24 V, and ICC(mean) = 14.8 mA. (Note: For variant -xxWPx, at maximum target frequency, ICC(LOW) = 8 mA, ICC(HIGH) = 16 mA, and maximum pulse widths, the result is a duty cycle of 84% and thus a worstcase mean ICC of 14.8 mA.) Calculate the maximum allowable power level, PD(max). First, invert equation 3: ∆Tmax = TJ(max) – TA = 165 °C – 150 °C = 15 °C This provides the allowable increase to TJ resulting from internal power dissipation. Then, invert equation 2: PD(max) = ∆Tmax ÷ RθJA = 15°C ÷ 213 °C/W (estimated) = 70.4 mW Finally, invert equation 1 with respect to voltage: VCC(est) = PD(max) ÷ ICC(max) = 70.4 mW ÷ 14.8 mA = 4.7 V The result indicates at TA, the application and device can dissipate adequate amounts of heat at voltages ≤ VCC(est). Compare VCC(est) to VCC(max). If VCC(est) ≤ VCC(max), then reliable operation between VCC(est) and VCC(max) requires enhanced RθJA. If VCC(est) ≥ VCC(max), then operation between VCC(est) and VCC(max) is reliable under these conditions. Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 16 Two-Wire, Differential, Vibration-Resistant Sensor IC with Speed and Direction Output A1699 PACKAGE OUTLINE DRAWING For Reference Only – Not for Tooling Use (Reference DWG-9070) Dimensions in millimeters – NOT TO SCALE Dimensions exclusive of mold flash, gate burs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown 4.00 ±0.05 B 4X10° E 1.45 1.50 ±0.10 1.45 E C 0.55 E 1.41 E 4.00 ±0.05 E E1 Mold Ejector Pin Indent E3 E E2 E A 4 X 2.50 REF 0.25 REF 0.30 REF 45° Branded Face NNN YYWW LLLL 0.85 ±0.05 0.42 ±0.10 2.54 REF 4 X 0.85 REF D Standard Branding Reference View 1 N Y W L 2 1.00 ±0.10 = Supplier emblem = Last three digits of device part number = Last 2 digits of year of manufacture = Week of manufacture = Lot number 12.20 ±0.10 4 X 7.37 REF +0.05 0.25 –0.03 1.80 REF A Dambar removal protrusion (8×) B Gate and tie burr area C Active Area Depth, 0.38 mm REF 0.38 REF D Branding scale and appearance at supplier discretion 0.25 REF 4 X 0.85 REF E Hall elements (E1, E2, and E3); not to scale 0.85 ±0.05 F Molded Lead Bar for preventing damage to leads during shipment 1.80 ±0.05 F 4.00 ±0.05 1.50 ±0.10 Figure 14: Package UB, 2-Pin SIP Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 17 Two-Wire, Differential, Vibration-Resistant Sensor IC with Speed and Direction Output A1699 Revision History Revision Revision Date – March 1, 2014 1 October 7, 2014 2 December 12, 2014 3 March 24, 2015 4 September 23, 2015 5 March 1, 2016 6 April 7, 2016 Description of Revision Initial release Updated Package Outline Drawing and reformatted document Revised CSUPPLY, tr, and tf Updated branding on Package Outline Drawing Updated Hall element number and positions in top outline of Package Outline Drawing; updated Figures 6 and 7 and associated text on page 12; updated Pulse Width Characteristic Performance plots on page 10; removed bulk offering on page 2-3; additional editorial changes Updated Package Outline Drawing molded lead bar footnote and Internal Discrete Capacitor Ratings table. Corrected Figure 6 and 7 captions. Copyright ©2016, Allegro MicroSystems, LLC Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. Allegro’s products are not to be used in any devices or systems, including but not limited to life support devices or systems, in which a failure of Allegro’s product can reasonably be expected to cause bodily harm. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its use; nor for any infringement of patents or other rights of third parties which may result from its use. For the latest version of this document, visit our website: www.allegromicro.com Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com 18