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1
05-12-2008 CLG
© by SEMIKRON
SKBa 25
Fig. 3L Power dissipation vs. output current
Fig. 3R Power dissipation vs. case temperature
Fig. 6 Rated overload characteristics vs. time
Fig. 9 Forward characteristics of a diode arm
2
05-12-2008 CLG
© by SEMIKRON
SKBa 25
Dimensions in mm
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This technical information specifies semiconductor devices but promises no characteristics. No warranty or guarantee
expressed or implied is made regarding delivery, performance or suitability.
3
05-12-2008 CLG
© by SEMIKRON