BUK754R0-40C N-channel TrenchMOS standard level FET Rev. 02 — 20 July 2010 Product data sheet 1. Product profile 1.1 General description Standard level gate drive N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using advanced TrenchMOS technology. This product has been designed and qualified to the appropriate AEC standard for use in high performance automotive applications. 1.2 Features and benefits AEC Q101 compliant Suitable for standard level gate drive Avalanche robust Suitable for thermally demanding environment up to 175°C rating 1.3 Applications 12V Motor, lamp and solenoid loads High performance automotive power systems High performance Pulse Width Modulation (PWM) applications 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VDS drain-source voltage Tj ≥ 25 °C; Tj ≤ 175 °C ID drain current VGS = 10 V; Tmb = 25 °C; see Figure 1; see Figure 3 - - 40 V - - 100 A Ptot total power dissipation Tmb = 25 °C; see Figure 2 - - 203 W VGS = 10 V; ID = 25 A; Tj = 25 °C; see Figure 11; see Figure 12 - 3.4 4 mΩ [1] Static characteristics RDSon drain-source on-state resistance BUK754R0-40C NXP Semiconductors N-channel TrenchMOS standard level FET Table 1. Symbol Quick reference data …continued Parameter Conditions Min Typ Max Unit ID = 100 A; Vsup ≤ 40 V; RGS = 50 Ω; VGS = 10 V; Tj(init) = 25 °C; unclamped - - 292 mJ VGS = 10 V; ID = 25 A; VDS = 32 V; Tj = 25 °C; see Figure 14; see Figure 13 - 35 - nC Avalanche ruggedness EDS(AL)S non-repetitive drain-source avalanche energy Dynamic characteristics QGD [1] gate-drain charge Continuous current is limited by package. 2. Pinning information Table 2. Pinning information Pin Symbol Description 1 G gate 2 D drain Simplified outline Graphic symbol D mb 3 S source mb D mounting base; connected to drain G mbb076 S 1 2 3 SOT78 (TO-220AB) 3. Ordering information Table 3. Ordering information Type number BUK754R0-40C BUK754R0-40C Product data sheet Package Name Description Version TO-220AB plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB SOT78 All information provided in this document is subject to legal disclaimers. Rev. 02 — 20 July 2010 © NXP B.V. 2010. All rights reserved. 2 of 14 BUK754R0-40C NXP Semiconductors N-channel TrenchMOS standard level FET 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDS drain-source voltage Tj ≥ 25 °C; Tj ≤ 175 °C - 40 V VDGR drain-gate voltage RGS = 20 kΩ VGS gate-source voltage ID drain current - 40 V [1] -20 20 V Tmb = 25 °C; VGS = 10 V; see Figure 1; see Figure 3 [2] - 159 A Tmb = 100 °C; VGS = 10 V; see Figure 1 [3] - 100 A Tmb = 25 °C; VGS = 10 V; see Figure 1; see Figure 3 [3] - 100 A - 636 A IDM peak drain current Tmb = 25 °C; tp ≤ 10 µs; pulsed; see Figure 3 Ptot total power dissipation Tmb = 25 °C; see Figure 2 - 203 W Tstg storage temperature -55 175 °C Tj junction temperature -55 175 °C [3] - 100 A [2] - 159 A tp ≤ 10 µs; pulsed; Tmb = 25 °C - 636 A ID = 100 A; Vsup ≤ 40 V; RGS = 50 Ω; VGS = 10 V; Tj(init) = 25 °C; unclamped - 292 mJ Source-drain diode source current IS Tmb = 25 °C peak source current ISM Avalanche ruggedness EDS(AL)S [1] non-repetitive drain-source avalanche energy -20V accumulated duration not to exceed 168 hrs [2] Current is limited by power dissipation chip rating. [3] Continuous current is limited by package. BUK754R0-40C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 20 July 2010 © NXP B.V. 2010. All rights reserved. 3 of 14 BUK754R0-40C NXP Semiconductors N-channel TrenchMOS standard level FET 003aac893 200 ID (A) 03na19 120 Pder (%) 150 80 Capped at 100A due to package 100 40 50 0 0 25 Fig 1. 75 125 Tmb (°C) 175 Normalized continuous drain current as a function of mounting base temperature. 0 50 100 150 200 Tmb (°C) Fig 2. Normalized total power dissipation as a function of mounting base temperature 003aac581 103 Limit RDSon = V DS / ID I D (A) tp = 10 μs 102 100 μs 10 DC 1 ms 10 ms 1 100 ms 10-1 10-1 Fig 3. 1 10 VDS (V) 102 Safe operating area; continuous and peak drain currents as a function of drain-source voltage. BUK754R0-40C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 20 July 2010 © NXP B.V. 2010. All rights reserved. 4 of 14 BUK754R0-40C NXP Semiconductors N-channel TrenchMOS standard level FET 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-mb) thermal resistance from junction to mounting base see Figure 4 - - 0.74 K/W Rth(j-a) thermal resistance from junction to ambient vertical in still air - - 60 K/W 003aac590 1 Zth (j-mb) (K/W) δ = 0.5 0.2 10-1 0.1 0.05 0.02 10 δ= P -2 single pulse tp T t tp T 10-3 10-6 Fig 4. 10-5 10-4 10-3 10-2 10-1 tp (s) 1 Transient thermal impedance from junction to mounting base as a function of pulse duration BUK754R0-40C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 20 July 2010 © NXP B.V. 2010. All rights reserved. 5 of 14 BUK754R0-40C NXP Semiconductors N-channel TrenchMOS standard level FET 6. Characteristics Table 6. Characteristics Symbol Parameter Conditions Min Typ Max Unit V Static characteristics V(BR)DSS drain-source breakdown voltage ID = 0.25 mA; VGS = 0 V; Tj = 25 °C 40 - - ID = 0.25 mA; VGS = 0 V; Tj = -55 °C 36 - - V VGS(th) gate-source threshold voltage ID = 1 mA; VDS = VGS; Tj = 25 °C; see Figure 10 2 3 4 V ID = 1 mA; VDS = VGS; Tj = 175 °C; see Figure 10 1 - - V ID = 1 mA; VDS = VGS; Tj = -55 °C; see Figure 10 - - 4.4 V - - 500 µA IDSS drain leakage current VDS = 40 V; VGS = 0 V; Tj = 175 °C VDS = 40 V; VGS = 0 V; Tj = 25 °C - 0.02 1 µA IGSS gate leakage current VDS = 0 V; VGS = 20 V; Tj = 25 °C - 2 100 nA VDS = 0 V; VGS = -20 V; Tj = 25 °C - 2 100 nA VGS = 10 V; ID = 25 A; Tj = 175 °C; see Figure 11 - - 8 mΩ VGS = 10 V; ID = 25 A; Tj = 25 °C; see Figure 11; see Figure 12 - 3.4 4 mΩ ID = 25 A; VDS = 32 V; VGS = 10 V; Tj = 25 °C; see Figure 13; see Figure 14 - 97 - nC - 21 - nC RDSon drain-source on-state resistance Dynamic characteristics QG(tot) total gate charge QGS gate-source charge QGD gate-drain charge ID = 25 A; VDS = 32 V; VGS = 10 V; Tj = 25 °C; see Figure 14; see Figure 13 - 35 - nC Ciss input capacitance - 4391 5708 pF Coss output capacitance VGS = 0 V; VDS = 25 V; f = 1 MHz; Tj = 25 °C; see Figure 15 - 800 1040 pF Crss reverse transfer capacitance - 535 696 pF td(on) turn-on delay time - 40 - ns tr rise time - 95 - ns td(off) turn-off delay time - 129 - ns tf fall time LD internal drain inductance LS VDS = 30 V; RL = 1.2 Ω; VGS = 10 V; RG(ext) = 10 Ω; Tj = 25 °C internal source inductance - 92 - ns from drain lead 6 mm from package to centre of die ; Tj = 25 °C - 4.5 - nH from contact screw on mounting base to centre of die ; Tj = 25 °C - 3.5 - nH from source lead to source bond pad ; Tj = 25 °C - 7.5 - nH Source-drain diode VSD source-drain voltage IS = 25 A; VGS = 0 V; Tj = 25 °C; see Figure 16 - 0.83 1.2 V trr reverse recovery time - 44 - ns Qr recovered charge IS = 20 A; dIS/dt = -100 A/µs; VGS = -10 V; VDS = 30 V; Tj = 25 °C - 57 - nC BUK754R0-40C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 20 July 2010 © NXP B.V. 2010. All rights reserved. 6 of 14 BUK754R0-40C NXP Semiconductors N-channel TrenchMOS standard level FET 003aac578 8 RDSon (mΩ) 003aac583 120 gfs (S) 7 90 6 60 5 30 4 0 3 4 Fig 5. 8 12 0 16 V (V) 20 GS Drain-source on-state resistance as a function of gate voltage; typical values 003aac584 150 Fig 6. 30 45 ID (A) 60 Forward transconductance as a function of drain current; typical values 03aa35 10−1 ID (A) ID (A) 120 10−2 90 10−3 min typ max 10−4 60 Tj = 175 °C 25 °C 10−5 30 10−6 0 0 Fig 7. 15 2 4 6 VGS (V) Product data sheet 2 4 6 VGS (V) Transfer characteristics: drain current as a function of gate-source voltage; typical values BUK754R0-40C 0 8 Fig 8. Sub-threshold drain current as a function of gate-source voltage All information provided in this document is subject to legal disclaimers. Rev. 02 — 20 July 2010 © NXP B.V. 2010. All rights reserved. 7 of 14 BUK754R0-40C NXP Semiconductors N-channel TrenchMOS standard level FET 003aac576 200 VGS (V) = 6.5 20 10 ID (A) 03aa32 5 VGS(th) (V) 6 4 max 150 5.75 3 typ 5.5 100 2 5.25 min 50 1 5 0 0 Fig 9. 1.5 3 4.5 VDS (V) 6 Output characteristics: drain current as a function of drain-source voltage; typical values 0 −60 0 60 120 Fig 10. Gate-source threshold voltage as a function of junction temperature 03ne89 2 003aac579 22 VGS (V) = 4.5 RDSon (mΩ ) a 180 Tj (°C) 1.5 17 1 12 0.5 7 5 5.25 5.5 5.75 6 6.5 10 0 -60 20 0 60 120 Tj (°C) 180 Fig 11. Normalized drain-source on-state resistance factor as a function of junction temperature BUK754R0-40C Product data sheet 2 0 60 120 I D (A) 180 Fig 12. Drain-source on-state resistance as a function of drain current; typical values All information provided in this document is subject to legal disclaimers. Rev. 02 — 20 July 2010 © NXP B.V. 2010. All rights reserved. 8 of 14 BUK754R0-40C NXP Semiconductors N-channel TrenchMOS standard level FET 003aac586 10 VDS ID = 25 A Tj = 25 °C VGS (V) ID 8 VGS(pl) VDS = 14V 6 VGS(th) 32V VGS 4 QGS1 QGS2 QGS QGD QG(tot) 2 003aaa508 0 0 Fig 13. Gate charge waveform definitions C (pF) 50 75 Q (nC) 100 G Fig 14. Gate-source voltage as a function of gate charge; typical values 003aac585 104 25 003aac587 120 IS (A) Ciss 90 103 60 Coss Crss 175 °C Tj = 25 °C 30 102 0 10-1 1 10 2 VDS (V) 10 Fig 15. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values BUK754R0-40C Product data sheet 0 0.5 1 VSD (V) 1.5 Fig 16. Source (diode forward) current as a function of source-drain (diode forward) voltage; typical values All information provided in this document is subject to legal disclaimers. Rev. 02 — 20 July 2010 © NXP B.V. 2010. All rights reserved. 9 of 14 BUK754R0-40C NXP Semiconductors N-channel TrenchMOS standard level FET 7. Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB SOT78 E A A1 p q mounting base D1 D L1(1) L2(1) Q L b1(2) (3×) b2(2) (2×) 1 2 3 b(3×) e c e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 b b1(2) b2(2) c D D1 E e L L1(1) L2(1) max. p q Q mm 4.7 4.1 1.40 1.25 0.9 0.6 1.6 1.0 1.3 1.0 0.7 0.4 16.0 15.2 6.6 5.9 10.3 9.7 2.54 15.0 12.8 3.30 2.79 3.0 3.8 3.5 3.0 2.7 2.6 2.2 Notes 1. Lead shoulder designs may vary. 2. Dimension includes excess dambar. OUTLINE VERSION SOT78 REFERENCES IEC JEDEC JEITA 3-lead TO-220AB SC-46 EUROPEAN PROJECTION ISSUE DATE 08-04-23 08-06-13 Fig 17. Package outline SOT78 (TO-220AB) BUK754R0-40C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 20 July 2010 © NXP B.V. 2010. All rights reserved. 10 of 14 BUK754R0-40C NXP Semiconductors N-channel TrenchMOS standard level FET 8. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes BUK754R0-40C v.2 20100720 Product data sheet - BUK754R0-40C v.1 - - Modifications: BUK754R0-40C v.1 BUK754R0-40C Product data sheet • • Status changed from preliminary to product. Various changes to content. 20090114 Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 20 July 2010 © NXP B.V. 2010. All rights reserved. 11 of 14 BUK754R0-40C NXP Semiconductors N-channel TrenchMOS standard level FET 9. Legal information 9.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 9.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 9.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. BUK754R0-40C Product data sheet Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. The product is not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customer’s third party customer(s) (hereinafter both referred to as “Application”). It is customer’s sole responsibility to check whether the NXP Semiconductors product is suitable and fit for the Application planned. Customer has to do all necessary testing for the Application in order to avoid a default of the Application and the product. NXP Semiconductors does not accept any liability in this respect. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 02 — 20 July 2010 © NXP B.V. 2010. All rights reserved. 12 of 14 BUK754R0-40C NXP Semiconductors N-channel TrenchMOS standard level FET Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V. HD Radio and HD Radio logo — are trademarks of iBiquity Digital Corporation. 10. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BUK754R0-40C Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 02 — 20 July 2010 © NXP B.V. 2010. All rights reserved. 13 of 14 BUK754R0-40C NXP Semiconductors N-channel TrenchMOS standard level FET 11. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 9.1 9.2 9.3 9.4 10 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 General description . . . . . . . . . . . . . . . . . . . . . .1 Features and benefits . . . . . . . . . . . . . . . . . . . . .1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Quick reference data . . . . . . . . . . . . . . . . . . . . .1 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2 Ordering information . . . . . . . . . . . . . . . . . . . . . .2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3 Thermal characteristics . . . . . . . . . . . . . . . . . . .5 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . .10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . .12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Contact information. . . . . . . . . . . . . . . . . . . . . .13 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 20 July 2010 Document identifier: BUK754R0-40C