MachXO Product Brief

THE MOST VERSATILE NON-VOLATILE PLD
TM
MachXO Family
Optimized for Low Density Applications
The MachXO™ family of non-volatile infinitely reconfigurable
Programmable Logic Devices (PLDs) is designed for applications
traditionally implemented using CPLDs or low-density FPGAs.
Combining an optimized look-up table (LUT) architecture with lowcost embedded Flash process technology, the instant-on, easy-touse MachXO devices are the most versatile, non-volatile PLDs for
low-density applications.
The MachXO PLD family offers the benefits of increased system
integration by providing embedded memory, built-in PLLs, flexible
multi-voltage high-performance LVDS I/Os, remote field upgrade
(TransFR™ technology) and low-power sleep mode, all in a single
device.
Designed for a broad range of low-density applications that include
general purpose I/O expansion, control, bus bridging and power-up
management functions, the MachXO PLD family is used in a variety
of end markets such as consumer, automotive, communications,
computing, industrial and medical.
Broad Range of Applications
Key Features and Benefits
Non-Volatile, Infinitely Reconfigurable
• Instant-on, powers up in less than 1mS
• Single-chip, no external configuration memory
• Excellent design security, no bitstream to intercept
Performance to 3.5ns Pin-to-Pin
General Purpose
I/O Expansion
Bus Bridging &
Protocol Translation
MachXO
Power-Up
Management
MachXO Application Example
CPU
Device Select
ASSP
Fan
Control
FPGA
Address & Data Bus
MachXO
Reset
Power
Supply
Flexible I/O Buffer
• Programmable sysIO™ buffer supports wide range of interfaces:
– LVCMOS 3.3/2.5/1.8/1.5/1.2
– LVTTL
– PCI*
– LVDS*, Bus-LVDS*, LVPECL*, RSDS*
sysCLOCK™ PLLs
• Up to two analog PLLs per device
• Clock multiply, divide and phase shifting
GPIO
EPROM
Flexible LUT Architecture
• 256 to 2280 LUT4s
• 73 to 271 I/Os with extensive package options
• Density migration supported
Embedded and Distributed Memory
• Up to 27.6 Kbits sysMEM™ Embedded Block RAM
• Includes dedicated FIFO control logic
• Up to 7.7 Kbits distributed RAM
FPGA/ASIC/ASSP
Configuration
External Interface
TransFR Technology Allows Simple Field Upgrades
Sleep Mode Reduces Standby Power to <100µA
System-Level Support
• IEEE Standard 1149.1 Boundary Scan
• On-board 20MHz oscillator for configuration and user logic
• Devices operate with 3.3V, 2.5V, 1.8V or 1.2V power supply
Broad Device Offering
• Commercial: 0 to 85ºC (TJCOM)
• Industrial: -40 to 100ºC (TJIND)
• AEC-Q100 qualified: -40 to 125ºC (TJAUTO)
* MachXO1200 and 2280 devices only.
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TM
MachXO Architecture
Architecture Overview
MachXO PLDs are designed to offer a low-cost, flexible alternative for applications
traditionally served by CPLDs or low-density FPGAs. Built with an extremely efficient
architecture, MachXO PLDs deliver excellent pin-to-pin performance, support for highspeed I/Os, embedded block RAM, and sysCLOCK PLLs.
PFU Block Diagram
Carry Chain
MachXO Block Diagram
Slice 3
LUT4
FF
LUT4
FF
On-chip Flash Memory offers
instant-on start-up and security
from bitstream snooping
sysCLOCK
PLLs for clock
management
Slice 2
LUT4
Available in
space saving,
RoHS compliant
package options,
MachXO PLDs
can be used in a
broad range of
space constrained
applications.
Flash Memory
FF
LUT4
FF
From
Routing
Slice 1
LUT4
To
Routing
sysMEM Embedded
Block RAM (EBR)
provides 9kbit true
dual port RAM at up
to 275MHz
Flexible
Routing
optimized for
speed,
low-cost, and
routability
FF
LUT4
Programmable
Function Unit
(PFU) with RAM
FF
Slice 0
LUT4
Programmable
Function Unit
without RAM
(PFF)
FF
LUT4
FF
Carry Chain
sysMEM Configuration Options
Single
Port
Dual
Port
PseudoDual Port
FIFO
8192 x 1
8192 x 1
8192 x 1
8192 x 1
4096 x 2
4096 x 2
4096 x 2
4096 x 2
2048 x 4
2048 x 4
2048 x 4
2048 x 4
1024 x 9
1024 x 9
1024 x 9
1024 x 9
512 x 18
512 x 18
512 x 18
512 x 18
256 x 36
–
256 x 36
256 x 36
JTAG
JTAG Port for
configuring Flash and
SRAM memory
MachXO Voltage Options
1.2V
VCC
3.3V
VCCAUX
1.2 to
3.3V
VCCIO
1.8 to
3.3V
VCC
3.3V
VCCAUX
sysIO Buffers support
LVCMOS/LVTTL, LVDS and PCI
sysCLOCK PLL Block Diagram
1.8 to
3.3V
VCCIO
Dynamic Delay
Adjustment
4
LOCK
MachXO
Version E
MachXO
RST
Version C
CLKI
Input
Clock
Divider
Delay
Adjust
Voltage
Controlled
Oscillator
sysIO Buffer Supports HighBandwidth I/O Standards
LVCMOS / LVTTL
– Hotsocketing capable
– Programmable slew rate
– Programmable drive strength
– Programmable pull-up,
pull-down, bus friendly
– Programmable open drain
– Programmable Schmitt element
Post
Scalar
Divider
Phase /
Duty
Select
Feedback
Divider
CLKOS
CLKOP
Secondary
Clock
Divider
CLKOK
CLKFB
(from post scalar divider output,
clock net or external pin)
PCI, LVDS, LVPECL, Bus-LVDS, RSDS
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TM
Easy Field Updates
MachXO Configuration
MachXO PLDs include Lattice's exclusive
Tr a n s p a r e n t F i e l d R e c o n f i g u r a t i o n
(TransFR) technology. TransFR technology
allows logic to be updated in the field
without interrupting system operation.
MachXO PLDs include both Flash and
SRAM technology to provide “instant-on”
capabilities in a single low-cost device. At
power-up, configuration data is transferred
from Flash to SRAM cells in less than
1mS. Both SRAM and Flash memory can
be programmed from a JTAG port. This
combination of SRAM and Flash enables
easy field updates via Lattice's unique
TransFR technology. MachXO PLDs have
a security scheme that prevents readback
and, by using Flash internally, Lattice
eliminates bit stream snooping.
Upgrade
Flash
FLASH
(Configuration 2)
Step 1
Program Flash in
background while
logic functions
Logic – SRAM
(Configuration 1)
Step 2
Precisely control
I/Os and initiate
Flash to SRAM
transfer through
JTAG.
On-chip Flash memory.
MachXO Device
Flash Memory
Control Logic
SRAM Configuration Bits
(Controls Device Operation)
Massively parallel
wide data transfer
provides snoop-proof
SRAM configuration
from Flash.
JTAG
Port
Use JTAG port
(IEEE1532/1149.1)
to configure SRAM
or program Flash.
MachXO Sleep Mode Reduces Power by a Factor of 100X!
FLASH
(Configuration 2)
Upgrade
SRAM
Characteristic
SLEEPN Pin
Logic – SRAM
(Configuration 2)
Static ICC
Normal Mode
Off
Sleep Mode
High
X
Low
Typically <10mA
0
Typically <100µA
Power Supplies
Normal Range
0
Normal Range
Logic Operation
User Defined
Non Operational
Non Operational
I/O Operation
User Defined
Tri-State
(<1mA leakage)
Tri-State
(<10µA leakage)
MachXO Application Examples
Low-cost system integration
Power Up and Control
Boot
PROM
Processor Address and Data Busses
FPGA
Data Path
Bridge Function
Microprocessor
Processor Address and Data Busses
CPLD
Power-up Logic
FPGA Boot Logic
& Bus Decode
MachXO
Data Path
Power-up
Bus Decode
I/O
Expansion
Microcontroller
I2C or
SPI
Power-Up
Control
Register
Bank
LED Control
Boot
PROM
Reset
Power-On
Bridging
ASIC
Memory
LVDS I/O
Backplane
Low power cycling
Non-Volatile
MachXO
(Power Off for
~ 90% of Duty Cycle)
Flexible Multi-Voltage Level shifting
ASSP
1.8V
MachXO
2.5V
LVDS
SRAM FPGA
(Power Off for
~ 10% of Duty Cycle)
3.3V
Microcontroller
ASSP
MachXO
Microprocessor
ASIC
Backplane
0 ms
Configuration
100 ms
200 ms
Time
Operation
3.3V
2.5V
1.8V
Off
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TM
Free, Easy-to-Use Lattice Software
MachXO Mini
development kit
Lattice Diamond ® design tools offer a comprehensive design
environment for the MachXO architecture and other device
families. Featuring design exploration, ease of use, improved
design flow, and numerous other features, Diamond allows you to
complete designs faster, easier, and with better results than ever
before.
Use the MachXO Mini Development Kit
to test I2C, SPI, UART, SRAM interfaces
as well as the 8-bit LatticeMico8™
microcontroller within minutes. Build your
own design in less than an hour using
free reference designs from Lattice.
Learn more at www.latticesemi.
com/machxo-mini.
Evaluation and Development Boards
Lattice offers a number of evaluation and development boards
that provide a complete and easy-to-use platform to evaluate the
performance of the MachXO, or aid in the development of custom
designs.
Reference Design Portfolio
Lattice offers an expanding portfolio of IP cores and reference
designs targeted for low-density applications. Optimized for
the MachXO architecture these include popular protocol and
connectivity standards such as I2C, SPI, UART and PCI. The
reference designs, source codes and documentation can be
downloaded for free from the Lattice website. For more information,
go to www.latticesemi.com/ip.
MachXO Control
Development Kit
Use the MachXO Control
Development Kit to test board
diagnostic functions including
fan speed control based on
temperature monitoring, complete
power supply monitoring and reset
distribution in conjunction with
the Power Manager II POWR1014A
and 8-bit LatticeMico8 microcontroller. Test these functions
within minutes and build your own designs in less than an hour
using the free reference designs from Lattice. Learn more at
www.latticesemi.com/machxo-control-kit.
Device Selection Guide
Parameter
LCMXO256
LCMXO640
LCMXO1200
LCMXO2280
256
640
1200
2280
Distributed RAM (Kbits)
2
6.1
6.4
7.7
Embedded Block RAM – EBR (Kbits)
–
–
9.2
27.6
Number of EBR Blocks
–
–
1
3
VCC Voltage (V) Options
1.2V or 1.8/2.5/3.3V
1.2V or 1.8/2.5/3.3V
1.2V or 1.8/2.5/3.3V
1.2V or 1.8/2.5/3.3V
Number of PLLs
–
–
1
2
Number of I/O Banks
2
4
8
8
Maximum Number of I/Os
78
159
211
271
Maximum Number of LVDS Pairs*
–
–
27
33
LUTs
Packages & I/O Combinations
100-pin TQFP (14 x 14 mm)**
78
144-pin TQFP (20 x 20 mm)
100-ball csBGA (8 x 8 mm)
78
74
73
73
113
113
113
74
132-ball csBGA (8 x 8 mm)
101
101
101
256-ball caBGA (14 x 14 mm)
159
211
211
256-ball ftBGA (17 x 17 mm)
159
211
211
324-ball ftBGA (19 x 19 mm)
271
* Number of LVDS outputs can be increased by emulating with external resistors. ** In the 100-pin TQFP package, designs can not migrate from LCMXO640 to 1200.
Applications Support
1-800-LATTICE (528-8423)
(503) 268-8001
[email protected]
Copyright © 2013 Lattice Semiconductor Corporation. Lattice Semiconductor, L (stylized) Lattice Semiconductor Corp., and Lattice (design), ispLEVER, ispVM, LatticeMico8, MachXO, sysCLOCK, sysIO,
sysMEM, and TransFR are either registered trademarks or trademarks of Lattice Semiconductor Corporation in the United States and/or other countries. Other product names used in this publication are for
identification purposes only and may be trademarks of their respective companies.
January 2013
Order #: I0176H
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