Product Brief SLE 97 SOLID FLASH™ Family High Performance for your NFC SIM Card The SLE 97 SOLID FLASH™ Family is the Infineon’s state-of-the-art 32-bit product generation, for high performance security chip cards. It comes in various form factors, addressing besides SIM/UICC NFC secure elements also embedded secure elements. 25% More Performance than Standard SC300™ Products The SLE 97 products are the first products to benefit from the collaboration between Infineon and ARM® in the field of controllers for chipcard and security applications. They implement a unique 32-bit CPU based on the ARM® SecurCore™ SC300™ enhanced by Infineon’s cache and security technology. 1.5MB Storage for your NFC SIM/UICC Thanks to the code density offered by the ARM® architecture, it provides easily more than 1MB for the NFC applications, and supports in long term the wide deployment of NFC in the market field. Available in Mini-SIM and Micro-SIM With their optimized footprint, the SLE 97 products are able to support smallest SIM form factors, such as 3FF and 4FF, using the Infineon’s FlipChip Technology (FCOS™). Applications NFC SIM/UICC Embedded SIM with NFC support USB SIM cards with NFC support CIPURSE™ for mobile NFC-Tuned Features ARM® SecurCore™ SC300™ enhanced by Infineon’s cache and security technology Up to 1.5MB SOLID FLASH™ allowing fast prototyping and short time-to-market Very high endurance NVM (500K) for best quality products Crypto processor for RSA and elliptic curves calculations Crypto processor for AES, (3)DES calculations True random number generator ISO 7816 up to 1.25MBaud Inter-chip / full speed USB up to 12Mbit/s NFC-Tuned Features Single Wire Protocol (SWP) interface up to 1.7Mbit/s Mifare compatible interface CIPURSE™ NFC battery-off mode Certification CC EAL 5+ high EMVCo www.infineon.com/ccs Product Brief SLE 97 SOLID FLASH™ Family High Performance for your NFC SIM Card Product Table Summary Sales Code SOLID FLASH™ [kB] SLE 97CNFX1M50PE 1544 SLE 97CNFX1M30PE 1280 SLE 97CNFX1M00PE 1024 SLE 97CNFX8000PE 800 SLE 97CUNFX1M50PE 1544 SLE 97CUNFX1M30PE 1280 SLE 97CUNFX1M00PE 1024 SLE 97CUNFX8000PE 800 Interfaces Typical Applications ISO 7816, SWP NFC SIM/UICC ISO 7816, SWP, USB Available in wafer, bare die, flip chip and wire bonded modules. Wafer (Die) Published by Infineon Technologies AG 85579 Neubiberg, Germany © 2014 Infineon Technologies AG. All Rights Reserved. Visit us: www.infineon.com Order Number: B180-I0049-V1-7600-EU-EC Date: 11 / 2014 M4.8 MFC5.8 MFC5.4/MFC5.6 Attention please! The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/ or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). MFC1.6 Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.