m y- d ™ m o v e l e a n SLE 66R01L Intelligent 512 bit EEPROM with Contactless Interface compliant to ISO/IEC 14443 Type A and support of NFC Forum™ Type 2 Tag Operation Sh o rt P ro d u c t I n fo r m a ti o n 2010-05-10 Ch i p C a rd & S e c u r i ty Edition 2010-05-10 Published by Infineon Technologies AG 81726 Munich, Germany © 2011 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. my-d™ move lean SLE 66R01L my-d™ move lean - SLE 66R01L Short Product Information The information in this document is subject to change without notice. Revision History: Current Version 2010-05-10 Previous Release: Page Subjects (major changes since last revision) initial version Trademarks of Infineon Technologies AG BlueMoon™, COMNEON™, C166™, CROSSAVE™, CanPAK™, CIPOS™, CoolMOS™, CoolSET™, CORECONTROL™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, EUPEC™, FCOS™, HITFET™, HybridPACK™, ISOFACE™, I²RF™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PROFET™, PRO-SIL™, PRIMARION™, PrimePACK™, RASIC™, ReverSave™, SatRIC™, SensoNor™, SIEGET™, SINDRION™, SMARTi™, SmartLEWIS™, TEMPFET™, thinQ!™, TriCore™, TRENCHSTOP™, X-GOLD™, XMM™, X-PMU™, XPOSYS™. Other Trademarks Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, PRIMECELL™, REALVIEW™, THUMB™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NFC Forum™ is trademark of Near Field Communication Forum, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Sattelite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited. Short Product Information 3 / 11 2010-05-10 my-d™ move lean SLE 66R01L Features Intelligent 512 bit EEPROM with Contactless Interface compliant to ISO/IEC 14443 Type A and support of NFC Forum™ Type 2 Tag Operation Contactless Interface • • Physical Interface and Anticollision compliant to ISO/IEC 14443 Type A – Contactless transmission of data and supply energy – Operation frequency 13.56 MHz – Data rate 106 kbit/s in both direction Read and Write Distance up to 10 cm (influenced by external circuitry i.e. reader and inlay design) 64 byte EEPROM • • • • • • Organized in 16 blocks of 4 bytes each 48 bytes freely programmable User Memory 16 bytes of Service Area reserved for UID, Configuration, Locking Bytes and OTP Block Data Retention minimum 5 years1) Endurance minimum 10,000 erase/write cycles1) Programming time per block < 4 ms Privacy Features • • • • Double Size UID (7 byte) according to ISO/IEC 14443 Type A 2) One Time Programmable (OTP) memory area2) Locking mechanism for each block2) Block Lock mechanism2) Data Protection • • Data Integrity supported by 16 bit CRC, parity bit, command length check Anti-tearing mechanism for OTP NFC Forum™ Operation • • Compliant to NFC Forum™ Type 2 Tag Operation Support of Static Memory Structure according to NFC Forum™ Type 2 Tag Operation Electrical Characteristics • • • On-Chip capacitance 17pF + 5% ESD protection minimum 2 kV Ambient Temperature -25°C … +70°C (for the chip) 1) Values are temperature dependent 2) Compliant to NFC Forum™ Type 2 Tag operation Short Product Information 4 / 11 2010-05-10 my-d™ move lean SLE 66R01L Ordering and packaging information 1 Ordering and packaging information Table 1 Ordering information Type Package Total Memory / User Memory SLE 66R01L C wafer sawn / unsawn SLE 66R01L NB NiAu Bumped (sawn wafer) 64 / 48 bytes Ordering code on request on request For more ordering information about the form of delivery please contact your local Infineon sales office. Pin description LA my-d™ move lean SLE 66R01L LB Figure 1 Pin configuration die Table 2 Pin description and function Symbol Function LA Antenna Connection LB Antenna Connection Short Product Information 5 / 11 2010-05-10 my-d™ move lean SLE 66R01L Scope of my-d™ move lean 2 Scope of my-d™ move lean The SLE 66R01L is part of the Infineon my-d™ product family and supports Infineon’s transport and ticketing strategy. It is compliant to ISO/IEC 14443 Type A, to ISO/IEC 18092 and to NFC Forum™ Type 2 Tag Operation. The SLE 66R01L is designed for cost optimized transport applications and its implemented command set eases the usage of the SLE 66R01L in existing applications and infrastructures. Typical ticketing transactions can be operated in less than 100 ms. 2.1 Application Description The SLE 66R01L is designed to address the needs of a public transport system for a single fare or limited use ticket. Further applications are event ticketing such as access control to waterparks, leisure parks, football stadiums or concert halls. 2.2 Functional Block Diagram The SLE 66R01L is made up of an EEPROM memory unit, an analog interface for contactless operation, a data transmission path and a control unit. The following diagram shows the main blocks of the SLE 66R01L. LA Memory Unit POWER Analog Contactless Interface CLOCK Antenna Power Circuit Rectifier Clock Extractor Voltage Regulator Power on Reset DATA Parallel Serial IO Command LB Anticollision Memory Access Control Unit Figure 2 Block Diagram of the my-d™ move lean The SLE 66R01L comprises the following three parts: • • • Analog Contactless Interface – The Analog Contactless Interface comprises the voltage rectifier, voltage regulator and system clock to supply the IC with appropriate power. Additionally the data stream is modulated and demodulated. Memory Unit – The Memory Unit consists of 16 user blocks of 4 bytes each. Control Unit – The Control Unit decodes and executes all commands. Additionally the control unit is responsible for the correct anticollision flow. Short Product Information 6 / 11 2010-05-10 my-d™ move lean SLE 66R01L Scope of my-d™ move lean 2.3 Memory Principle The total amount of addressable memory is 64 bytes. It comprises • • 48 bytes of User Area reserved for User Data 16 bytes of Service Area reserved for UID, Configuration, Locking Bytes and OTP Service Area Block Number Byte Number 0 1 2 00H UID 01H UID 02H UID Internal 3 LOCK0 … LOCK1 OTP 03H User Area 04H 05H 06H 07H Data 0 … Data 47 08H ... 0FH Figure 3 my-d™ move lean memory principle Short Product Information 7 / 11 2010-05-10 my-d™ move lean SLE 66R01L Scope of my-d™ move lean 2.4 Memory Principle for NFC Forum™ Type 2 Tag The memory organization of the SLE 66R01L is configured according to the NFC Forum™ Type 2 Tag Operation specification. The following figure illustrates an example of the SLE 66R01L as a NFC Forum™ Type 2 Tag compatible chip and enables the memory access with NFC Forum™ Type 2 Tag commands. Service Area Byte Number 0 1 2 00H UID 01H UID 02H 03H UID Internal 3 LOCK0 … LOCK1 CAPABILITY OTP CONTAINERS 04H User Area NFC Forum™ T2T Static Memory Structure Block Number 05H 06H Data 0 … Data 47 07H 08H ... 0FH Figure 4 my-d™ move lean memory structure for NFC Forum™ Type 2 Tag Short Product Information 8 / 11 2010-05-10 my-d™ move lean SLE 66R01L Scope of my-d™ move lean System Overview 2.5 The system consists of a host system, one or more SLE 66R01L tags or other ISO/IEC 14443 Type A compliant cards and an ISO/IEC 14443 Type A compatible contactless reader. Alternatively, since the SLE 66R01L can be configured to hold a NFC Forum™ Type 2 Tag memory structure, a NFC Forum™ device in card reader/writer mode can be used to operate the chip. Host System PCD Micro Controller Analog Circuitry PICC Energy Identification Terminal ISO/IEC14443 Type A or NFC Forum™ Device Clock Antenna Data my-d™ move lean SLE 66R01L my-dTM move lean Figure 5 my-d™ move lean Contactless System Overview Short Product Information 9 / 11 2010-05-10 my-d™ move lean SLE 66R01L Scope of my-d™ move lean UID Coding 2.6 To identify a SLE 66R01L chip the manufacturer code and a chip family identifier are coded into the UID as described in the Table 3. The chip family identifier can be used to determine the basic command set for the chip. Table 3 UID Coding UID Field Value Description uid0 05H IC Manufacturer Code according to ISO/IEC 7816-6 uid1 7xH Chip Family Identifier Higher Nibble: 0111b identifies SLE 66R01L Lower Nibble: part of the UID number UID PCD size double PICC ’93' ’95' CT uid0 uid1 uid2 BCC ’05H’ uid3 uid4 uid5 uid6 BCC Chip Family ID Figure 6 my-d™ move lean Double Size UID 2.7 Supported Standards the SLE 66R01L supports the following standards: • • • ISO/IEC 14443 Type A Parts 1, 2 and 3 tested according to ISO/IEC 10373-6 (PICC Test & Validation) ISO/IEC 18092 NFC Forum™ Type 2 Tag Operation 2.8 Command Set The IC is compliant to the ISO/IEC 14443 Type A standard. A set of standard ISO/IEC 14443 Type A Part 3 commands is implemented to operate the chip. Additionally NFC Forum™ Type 2 Tag commands and a my-d™ move lean specific command set is implemented. Short Product Information 10 / 11 2010-05-10 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG 11 Doc_Number