BGS12AL7-4 SPDT RF Switch Data Sheet Revision 1.3, 2009-06-24 Preliminary Industrial & Multimarket Edition 2009-06-24 Published by Infineon Technologies AG 81726 Munich, Germany © 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGS12AL7-4 SPDT RF Switch BGS12AL7-4 SPDT RF Switch Revision History: 2009-06-24, Revision 1.3 Previous Revision: 2008-10-08, V1.2 Page Subjects (major changes since last revision) Converted to the new IFX Template. 9 Extended Supply Voltage Range 10 Pin Description Pin 7 11 Electrical Specifications @ 100 MHz 12 Correct Return Loss and Isolation axis label 14 Update Board Pad (SMD) & Apertures, Tape and Reel Info Trademarks of Infineon Technologies AG APOXI™, BlueMoon™, COMNEON™, CONVERGATE™, COSIC™, C166™, CROSSAVE™, CanPAK™, CIPOS™, CoolMOS™, CoolSET™, CORECONTROL™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, EUPEC™, FCOS™, FALC™, GEMINAX™, GOLDMOS™, HITFET™, HybridPACK™, ISAC™, ISOFACE™, IsoPACK™, my-d™, MIPAQ™, ModSTACK™, NovalithIC™, OmniTune™, OmniVia™, OPTIVERSE™, OptiMOS™, ORIGA™, PROFET™, PRO-SIL™, PrimePACK™, RASIC™, ReverSave™, SCEPTRE™, SEROCCO™, SICOFI™, SMARTi™, SMINT™, SOCRATES™, SatRIC™, SensoNor™, SINDRION™, SmartLEWIS™, SIEGET™, TrueNTRY™, TEMPFET™, TriCore™, thinQ!™, TRENCHSTOP™, VINAX™, VINETIC™, X-GOLD™, XMM™, X-PMU™, XPOSYS™, XWAY™. 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Last Trademarks Update 2009-05-27 Preliminary Data Sheet 3 Revision 1.3, 2009-06-24 BGS12AL7-4 SPDT RF Switch Table of Contents Table of Contents Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 5 Measurement Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Preliminary Data Sheet 4 Revision 1.3, 2009-06-24 BGS12AL7-4 SPDT RF Switch List of Figures List of Figures Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Figure 8 Functional Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Pin Configuration (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Measurement Results (@ T = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Application Board: No External Components Necessary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Deembedding Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Package TSLP7-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Board Pad (SMD) & Apertures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Tape and Reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Preliminary Data Sheet 5 Revision 1.3, 2009-06-24 BGS12AL7-4 SPDT RF Switch List of Tables List of Tables Table 1 Table 2 Table 3 Table 4 Table 5 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Operation Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Truth Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Preliminary Data Sheet 6 Revision 1.3, 2009-06-24 SPDT RF Switch 1 BGS12AL7-4 Features Main features: • • • • • • • • • 6 Low insertion loss High port-to-port-isolation Low harmonic generation On-chip control logic High ESD robustness No external components required General purpose switch for applications up to 3 GHz Small leadless package TSLP-7-6 Lead and halogen free package (RoHS and WEEE compliant) 5 4 7 1 2 3 Description The BGS12AL7-4 General Purpose RF MOS switch is designed to cover a broad range of applications from 30 MHz to 3 GHz. The symmetric design of its single pole double throw configuration, as shown in Figure 1 offers high design flexibility. This single supply chip integrates on-chip CMOS logic driven by a simple, single-pin CMOS or TTL compatible control input signal. The 0.1 dB compression point exceeds the switch’s maximum input power level of 21 dBm, resulting in linear performance at all signal levels. The RF switch has a very low insertion loss of 0.4 dB in the 1 GHz and 0.5 dB in the 2 GHz range. Unlike GaAs technology, external DC blocking capacitors at the RF ports are only required if DC voltage is applied externally. Product Name Package Chip Marking BGS12AL7-4 TSLP7-4 M4781 12 Preliminary Data Sheet 7 Revision 1.3, 2009-06-24 BGS12AL7-4 SPDT RF Switch Features The BGS12AL7-4 RF switch is manufactured in Infineon’s patented MOS technology, offering the performance of GaAs with the economy and integration of conventional CMOS including the inherent higher ESD robustness. 5)LQ 5) 5) *1' 'HFRGHU (6' 9GG &WUO %*6$/B)XQFWLRQDOB'LDJUDPPYVG Figure 1 Functional Diagram Preliminary Data Sheet 8 Revision 1.3, 2009-06-24 BGS12AL7-4 SPDT RF Switch Maximum Ratings 2 Maximum Ratings Table 1 Maximum Ratings Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition Storage temperature range Tstg -65 – 150 °C – DC Voltage at all pins to GND VDC – – 5 V – RF power max. at all RF ports PIN – – 24 dBm – VESD – – 1000 V – – – 100 V – Unit Note / Test Condition ESD Capability Human Body Model IEC61340-3-1 Machine Model IEC61340-3-2 Table 2 Operation Ranges Parameter Symbol Values Min. Typ. Max. Ambient temperature TA -30 – 85 °C – RF Frequency f 0.03 – 3 GHz – Control voltage low VCtrL -0.3 – 0.3 V – Control voltage high VCtrlH 1.4 – Vdd V – Supply voltage Vdd 2.4 – 3.6 V – Current consumption Vdd Pin (over temperature) IVdd 80 – 350 μA – Current Consumption Vctrl Pin ICtrl – – 30 μA – Power Range Pin – – – dBm – (VSWR ∞: 1) – – 15 – (VSWR 3: 1) – – 18 – (VSWR 1: 1) – – 21 – 1) 1) Supply voltage must be connected before Control Voltage Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. Preliminary Data Sheet 9 Revision 1.3, 2009-06-24 BGS12AL7-4 SPDT RF Switch Pin Description 3 Pin Description Table 3 Pin Description Pin No. Name Pin Type Buffer Type 1 RF2 I/O RF Port 2 Out 2 GND GND Ground 3 RF1 I/O RF Port 1 Out 4 Vdd PWR Supply Voltage 5 RFIN I/O RF Port In 6 CTRL I Control Pin 7 NC NC It is recommended to connect Pin 7 to Ground Ctrl RFin Vdd 6 5 4 Function 7 Gnd 1 2 3 RF2 GND RF1 Figure 2 Pin Configuration (top view) Table 4 Truth Table TSLP7- 4.vsd Ctrl 1 RF 1 RF 2 0 1 0 1 0 1 Preliminary Data Sheet 10 Revision 1.3, 2009-06-24 BGS12AL7-4 SPDT RF Switch Electrical Specifications 4 Electrical Specifications Test Conditions: • • • • • Termination port impedance: Z0 = 50 Ω Temperature range: TA = -30 °C...+85 °C Supply Voltage: Vdd = 2.8 V Pin = 15 dBm Across operating range of control voltages: VCtrH = 1.4...2.8 V Table 5 Electrical Characteristics Parameter Symbol Values Min. Insertion Loss IL Isolation RFin - RF1 Isolation RFin - RF2 Isolation RF1 - RF2 Isolation RF ports - Vdd, Vctrl RL ISORFin-RF1 ISORFin-RF2 ISORF1-RF2 ISORF-DC On Switching Time (10-90%) RF ton – dB f = 0.1 GHz TX, 0.4 1) – dB f = 1 GHz TX, – 0.5 1) – dB f = 2 GHz TX, – 302) – dB f = 0.1 GHz 15 22 – dB f = 1 GHz 13 22 – dB f = 2 GHz – dB f = 0.1 GHz – dB f = 1 GHz – dB f = 2 GHz – dB f = 0.1 GHz – dB f = 1 GHz – dB f = 2 GHz – dB f = 0.1 GHz – dB f = 1 GHz – 50 22 32 18 25 – 50 22 32 18 25 – 50 24 32 18 25 25 2) 2) – dB f = 2 GHz 30 2) – dB f = 1 GHz 20 2) – dB f = 2 GHz -75 -50 dBm f = 1 GHz – -80 2) -50 dBm f = 2 GHz – 32) 5 μs f = 1 GHz 5 μs f = 1 GHz 120 – μA – – – dBm f = 1 GHz – toff – Current Consumption at Vdd Pin Idd – P0.1dB 2) 2) Off Switching Time (10-90%) RF Input 0.1 dB compression Max. 0.3 – 15 Harmonic Generation up to 12.75 GHz PHarm Note / Test Condition 1)2) – Return Loss Typ. Unit 21 0.5 2) 2) 1) @TA= 25 °C 2) Not measured in production, verified by design Preliminary Data Sheet 11 Revision 1.3, 2009-06-24 BGS12AL7-4 SPDT RF Switch Measurement Results 5 Measurement Results Insertion Loss RFin to RF1 / RFin to RF2 Return Loss RFin Port 0 -0.2 -5 -0.4 -10 -0.6 -15 Return Loss (dB) Insertion Loss (dB) 0.0 -0.8 -1.0 -1.2 -1.4 RF1 mode RF2 mode -1.6 -1.8 0.5 1.0 1.5 2.0 2.5 -25 -30 -35 RF1 mode RF2 mode -40 -45 -2.0 0.0 -20 3.0 3.5 -50 4.0 0.0 0.5 1.0 1.5 freq, GHz Return Loss RF1 Port / RF2 Port 2.5 3.0 3.5 4.0 3.5 4.0 Isolation RFin to RF2 / RFin to RF1 0 0 -5 -5 -10 -10 -15 -15 Isolation (dB) Return Loss (dB) 2.0 freq, GHz -20 -25 -30 -35 RF1 mode RF2 mode -40 -45 -20 -25 -30 -35 RF1 mode RF2 mode -40 -45 -50 -50 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0.0 0.5 1.0 1.5 freq, GHz 2.0 2.5 3.0 freq, GHz Isolation RF1 to RF2 / RF2 to RF1 Pin versus Pout (0.1dB Compression Point) 0 30 no compression observed up to 24dBm -5 -10 25 -20 Pout (dBm) Isolation (dB) -15 -25 -30 -35 RF1 mode RF2 mode -40 -45 -50 0.0 15 RF1/RF2 mode 10 5 0.5 1.0 1.5 2.0 freq, GHz Figure 3 20 2.5 3.0 3.5 4.0 8 10 12 14 BGS 12AL 7-4_ measurement_results_ V3.vsd 16 18 20 22 24 26 28 30 Pin (dBm) Measurement Results (@ T = 25°C) Preliminary Data Sheet 12 Revision 1.3, 2009-06-24 BGS12AL7-4 SPDT RF Switch Measurement Results Application Board BGS12 AL7-4 _application_ board .vsd Figure 4 Application Board: No External Components Necessary BGS 12AL 7-4_application _deem bedding _board .vsd Figure 5 Deembedding Board Preliminary Data Sheet 13 Revision 1.3, 2009-06-24 BGS12AL7-4 SPDT RF Switch Package Outlines 6 Package Outlines Package TSLP7- 4.vsd Figure 6 Package TSLP7-4 SMD NSMD TSLP 7-4_board _ pad _and_ apertures.vsd Figure 7 Board Pad (SMD) & Apertures 0.5 BGS 12AL 7-4_Tape _and _Reel.vsd Figure 8 Tape and Reel Dimensions in mm You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products. Preliminary Data Sheet 14 Revision 1.3, 2009-06-24 w w w . i n f i n e o n . c o m Published by Infineon Technologies AG