Product Brief 650V CoolMOS™ C7 Gold in TO-Leadless

Product Brief
650 V CoolMOS™ C7 Gold in TOLL package
A new SMD package using Kelvin source concept
Infineon Technologies introduces the new 650 V CoolMOS™ C7 Gold technology in latest
surface mount device (SMD) TO-Leadless (TOLL) package.
The CoolMOS™ C7 Gold series (G7) for the first time brings together the benefits of the
improved 650 V CoolMOS™ C7 Gold technology, 4pin Kelvin source capability and the
improved thermal properties of the TOLL package to enable an SMD solution for high
current hard switching topologies such as power factor correction (PFC) up to 3 kW.
Benefits to the customer:
››Higher efficiency due to the improved CoolMOS™ C7 Gold technology, and faster
switching due to the package low parasitic source inductance and the 4pin Kelvin
source concept
››Improved power density due to low RDS(on) in small footprint by either replacing
TO packages (height restrictions) or paralleling SMD packages due to thermal or RDS(on)
requirements
Production
cost reduction by moving to SMD through quicker assembly times
››
Key features
››CoolMOS™ C7 Gold
––Gives best-in-class FOM RDS(on) x Eoss
and RDS(on) x QG
––Enables best-in-class RDS(on) in
smallest footprint
TOLL
package
››
––Inbuilt 4th pin Kelvin source
configuration and low parasitic
source inductance (~1 nH)
–– Is MSL1 compliant, total Pb-free, has
easy visual inspection grooved leads
––Enables improved thermal
performance Rth
Key benefits
››FOM R
Improved CoolMOS™ C7 Gold technology
Parameter
Package
RDS(on) (max)
[mΩ]
QG (typ)
[nC]
Coss (typ)
[pF]
Competitor A 650 V
D²PAK
95
71
74
650 V CoolMOS™ C7 Gold (G7)
TOLL
105
35
26
Comparison
30% footprint
reduction
Similar RDS(on) for
comparison
51% lower than
competitor
65% lower than
competitor
TOLL package versus D²PAK
Parameter
Footprint
[mm²]
RDS(on) (max)
[mΩ]
Source inductance
[nH]
Kelvin source
feature
D²PAK
150
63*
5
No
TOLL
115
33
1
Yes
Comparison
30% footprint
reduction
48% lower RDS(on)
80% lower
inductance
Benefits in
Kelvin source for
efficiency and
ease-of-use
* Best competitor
www.infineon.com/c7-gold-toll
x QG is 14% better than
previous 650 V CoolMOS™ C7
enabling faster switching leading to
higher efficiency
DS(on)
››Power density through BIC 33 mΩ in
115 mm² TOLL footprint
››Reducing parasitic source inductance
by Kelvin source improves efficiency
switching and ease-of-use
››TOLL package is easy to use and has
the highest quality standards
››Improved thermals enable SMD TOLL
package to be used in higher current
designs than has been previously
possible
Product Brief
Benefits in efficiency TOLL versus TO-247
CoolMOS™ C7 Gold close to GaN performance in
hard switching topologies
Efficiency difference low line
IPT65R033G7
IPW65R045C7
0.6
6
0.5
5
0.4
0.3
0.6%
0.2
0.1
0
300
400
500
600
700
800
900
1000 1100 1200 1300 1400 1500 1600
Stored energy Eoss [µJ]
Difference [%]
0.7
IPP60R199CP
IPT65R195G7
IPP65R190C7
GaN HEMT
C7 Gold
further
reduction
50%
reduction
CP > C7
4
3
2
1
0
0
100
200
300
400
Drain-source voltage VDS [V]
Pout [W]
Performance gain of 0.6 percent full load efficiency gain TOLL
versus TO-247 due to lower RDS(on) from TOLL and 4pin Kelvin
source capability.
CoolMOS™ C7 Gold technology improves again over previous best
650 V CoolMOS™ C7 to get even closer in performance in Eoss,
a key value in hard switching topologies such as PFC.
Benefits in temperature due to higher efficiency TOLL versus TO-247
Four in Kelvin source capability
MOS temperature curve low line
VDRV
85
IPT65R033G7
Drain
IPW65R045C7
80
PWMin
5°C
Temperature [°C]
Gate
VDRV
75
70
VLS
65
Source
LSource
SGND
60
55
VGS
300
400
500
600
700
800
900
1000 1100 1200 1300 1400 1500 1600
››Separate pin “source-sense” delivers undisturbed signal to driver
››Higher efficiency at full load
Pout [W]
5°C lower temperature seen for TOLL as higher efficiency means
less thermal losses produced.
TO-Leadless package versus D²PAK
2.3 mm
4.4 mm
Product portfolio
RDS(on) (max)
[mΩ]
TO-Leadless (TOLL)
195
IPT65R195G7
105
IPT65R105G7
33
IPT65R033G7
Published by
Infineon Technologies Austria AG
9500 Villach, Austria
© 2016 Infineon Technologies AG.
All Rights Reserved.
9.9 mm
10.0 mm
››30 percent footprint reduction
››50 percent height reduction
››60 percent space reduction
Please note!
THIS DOCUMENT IS FOR INFORMATION PURPOSES ONLY AND
ANY INFORMATION GIVEN HEREIN SHALL IN NO EVENT BE
REGARDED AS A WARRANTY, GUARANTEE OR DESCRIPTION OF
ANY FUNCTIONALITY, CONDITIONS AND/OR QUALITY OF OUR
PRODUCTS OR ANY SUITABILITY FOR A PARTICULAR PURPOSE.
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PRODUCT DATA SHEETS PROVIDED BY US. OUR CUSTOMERS AND
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APPLICATION.
WE RESERVE THE RIGHT TO CHANGE THIS DOCUMENT AND/OR
THE INFORMATION GIVEN HEREIN AT ANY TIME.
Order Number: B152-I0276-V1-7600-EU-EC-P
Date: 05 / 2016
11.7 mm
15.0 mm
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