RF & Protection Devices Selection Guide www.infineon.com/rfandprotectiondevices 2 Content RF MMIC LNAs 4 RF Pin Diode 10 LTE LNAs 4 Band Switching and RF Attenuation 10 GNSS LNAs 5 Antenna Switch 11 General Purpose LNAs 5 RF Varactor Diode 13 RF Modules 5 VCO and Low Voltage Tuner 13 Navigation Rx Front-End 5 FM Tuner 13 SAT Tuner 13 UHF and VHF Tuner 13 RF Mixer + Detector Schottky Diode 14 RF mmW-MMIC 15 RF Switches 6 Antenna Switch Module 6 Diversity Switches 6 General Purpose Switches 6 Antenna Tuning 6 24GHz Industrial 15 Antenna Aperture Tuning RF Switches 6 Backhaul 15 RF Transistors 7 ESD & EMI Protection and Filters 16 Low Noise Si Transistors up to 2.5GHz 7 Multi-Purpose ESD Devices 16 Low Noise Si Transistors up to 5GHz 7 Low Capacitance ESD Devices 18 Ultra Low Noise SiGe:C Transistors for use up to 12GHz 7 Surge Protection Devices 18 High Linearity Si- and SiGe:C-Transistors for use up to 6GHz 8 Alphanumerical List of the Symbols used 20 Biased Low Noise RF Transistor 8 Package Information 22 RF MOSFET 9 Single Full Biased 9 Single Non Biased 9 Single Semi Biased 9 Dual Semi Biased 9 3 RF MMIC LNAs LTE LNAs Product Type f [MHz] Gain (typ) [dB] F (typ) P1dB (in) [dBm] BGA622L7 2100 16.00 1.10 -16 5.8 – TSLP-7-1 BGA711N7 2100 17.00 1.10 -8 3.6 – TSNP-7-1 BGA713N7 700 15.50 1.10 -7 4.8 – TSNP-7-1 BGA728L7 170–1675 15.75 1.30 -10 0.5 5.8 TSLP-7-1 BGA734L16 800 1900 2100 15.20 16.50 1.20 1.00 1.10 -12 -10 -11 3.5 3.4 – – TSLP-16-1 BGA735N16 900/1900/2100 16.00 1.10 -5 3.4 – TSNP-16-1 BGA748L16 2140 1960 940 880 17.40 16.50 16.20 1.10 1.20 -10 -8 -7 -6 4.4 4.0 3.8 – – – TSLP-16-1 BGA751N7 800 15.80 1.05 -5 3.3 – TSNP-7-1 BGA777N7 2300–2700 15.70 1.20 -10 4.2 – TSNP-7-1 BGA7H1N6 2300–2690 12.50 – -1 4.7 – TSNP-6-2 BGA 7L1N6 728–960 13.30 – -2 4.4 – TSNP-6-2 BGA7M1N6 1805–2200 13.00 – 0 4.4 – TSNP-6-2 BGM7MLLM4L12 700–2100 13.00 0.70 0 4.5 – TSLP-12-4 BGM7LLHM4L12 700–2700 13.00 0.70 0 4.5 – TSLP-12-4 BGM7LMHM4L12 700–2700 13.00 0.70 0 4.5 – TSLP-12-4 www.infineon.com/rfmmics 4 I (typ) [mA] Package GNSS LNAs Product Type Gain (typ) [dB] F (typ) [dB] P1dB (in) [dBm] I (typ) [mA] f [MHz] Package BGA231L7 16.0 0.75 -5.0 4.4 1550–1615 TSLP-7-1 BGA231N7 16.0 0.75 -5.0 4.4 1550–1615 TSNP-7-1 BGA524N6 19.6 0.55 -12.0 2.5 – TSNP-6-2 BGA715N7 20.0 0.75 -15.5 3.3 1550–1615 TSNP-7-1 BGA725L6 20.0 0.65 -16.0 3.6 1550–1615 TSLP-6-2 BGA824N6 17.0 0.55 -6.0 3.9 – TSNP-6-2 BGA825L6S 17.0 0.60 -7.0 4.8 1550–1615 TSLP-6-3 BGA915N7 15.5 0.70 -5.0 4.4 1550–1615 TSNP-7-6 BGA924N6 16.2 0.55 -5.0 4.9 – TSNP-6-2 BGA925L6 15.8 0.65 -5.0 4.9 1550–1615 TSLP-6-2 General Purpose LNAs Product Type Gain (typ) [dB] F (typ) [dB] P1dB (out) [dBm] I (typ) [mA] f [MHz] Package BGA728L7 15.75 1.3 – 0.5 BGB707L7ESD – 0.4 10 2.1 5.8 170–1675 TSLP-7-1 25.0 50–10000 BGB717L7ESD 12.00 1.0 4 TSLP-7-1 3.0 – 50–1000 BGB741L7ESD 19.00 1.0 TSLP-7-1 10 5.5 30.0 30–5000 BGB719N7ESD 13.50 1.2 TSLP-7-1 6 2.8 – 10–1000 TSNP-7-6 Application notes, Data sheets, Simulation data: www.infineon.com/rfmmic.documents RF Modules Navigation Rx Front-End Product Type I (typ) [mA] Gain (typ) [dB] NFmin (typ) [dB] P1dB (in) [dBm] f [MHz] VCC (typ) [V] Package BGM1143N9 3.9 15.5 1.45 -6 1550–1615 BGM1032N7 4.0 14.8 1.65 -6 1570–1615 1.5 3.3 TSNP-9-1 2.7 – BGM1033N7 4.0 14.8 1.65 -6 TSNP-7-10 1570–1615 2.7 – BGM1034N7 3.9 17.0 1.70 TSNP-7-10 -15 1570–1615 1.8 – BGM1043N7 3.9 17.0 1.50 TSNP-7-10 -6 1570–1615 – – TSNP-7-10 Product information: www.infineon.com/rfmodule www.infineon.com/rfmodule 5 RF Switches Antenna Switch Module Product Type Switch Type Control Interface f [GHz] Pmax [dBm] Insertion Loss @ 1GHz [dB] Isolation @ 1GHz [dB] Supply Voltage [V] Package BGSF110GN26 SP10T GPIO 0.1–3.8 36 0.5 37 2.4–3.3 TSNP-26-2 BGSF1717MN26 DP14T MIPI RFFE 0.1–2.7 36 0.5 47 2.4–5.5 TSNP-26-3 Diversity Switches Product Type Switch Type Control Interface f [GHz] Pmax [dBm] Insertion Loss @ 1GHz [dB] Isolation @ 1GHz [dB] Supply Voltage [V] Package BGS14AN16 SP4T GPIO 0.1–3.0 30 0.34 40 2.85–4.7 TSNP-16-6 BGS15AN16 SP5T GPIO 0.1–3.0 32 0.34 35 2.85–4.7 TSNP-16-6 BGS16MN14 SP6T MIPI RFFE 0.1–2.7 32 0.30 – 2.50–5.5 TSNP-14-3 BGS18MN14 SP8T MIPI RFFE 0.1–2.7 32 0.35 – 2.50–5.5 TSNP-14-3 General Purpose Switches Product Type Switch Type Control Interface f [GHz] Pmax [dBm] Insertion Loss @ 1GHz [dB] Isolation @ 1GHz [dB] Supply Voltage [V] Package BGS12AL7-4 SPDT GPIO 0.1–3 24.0 0.40 32 2.4–3.6 TSLP-7-4 BGS12AL7-6 SPDT GPIO 0.1–3 24.0 0.40 32 2.4–3.6 TSLP-7-6 BGS12PL6 SPDT GPIO 0.1–4 35.0 0.40 37 2.4–3.6 TSLP-6-4 BGS12SL6 SPDT GPIO 0.1–6 27.5 0.25 36 2.4–3.6 TSLP-6-4 BGS12SN6 SPDT GPIO 0.1–6 30.0 0.25 40 1.8–3.3 TSNP-6-2 BGS13SL9 SP3T GPIO 0.1–3 30.0 0.35 37 2.4–3.6 TSLP-9-3 BGS22WL10 DPDT GPIO 0.1–3 30.0 0.33 38 2.4–3.6 TSLP-10-1 BGS22W2L10 DPDT GPIO 0.1–3 30.0 0.33 35 2.4–3.6 TSLP-10-1 Application notes, Data sheets, Simulation data: www.infineon.com/rfswitches.documents Antenna Tuning Antenna Aperture Tuning RF Switches Product Type VRF (max) 1000h [V] VRF (max) [V] ESD @ ANT kV RON [Ω] COFF [fF] RON x COFF [fs] H2 @ 25dBm [dBc] H3 @ 25dBm [dBc] Package BGSA12GN10 40 36 8 1.6 120 < 200 -105 -115 TSNP-10-1 BGSA13GN10 40 36 8 0.8 = RF1 1.3 = RF2 1.6 = RF2 240 = RF1 145 = RF2 120 = RF3 < 200 -105 -115 TSNP-10-1 BGSA14GN10 40 36 8 1.6 120 < 200 -105 -115 TSNP-10-1 Product information: www.infineon.com/rfswitches www.infineon.com/rfswitches 6 RF Transistors Low Noise Si Transistors up to 2.5GHz Product Type VCEO (max) [V] IC (max) [mA] NFmin (typ) [dB] Gmax (typ) [dB] OIP3 [dBm] OP1dB [dBm] f T (typ) [GHz] Ptot (max) [mW] Package For Low Frequencies e.g. VHF/UHF BFP181 12 20 0.9 21.0 16.5 -2.0 8.0 175 SOT143 BFR181 12 20 0.9 18.5 18.0 -1.0 8.0 175 SOT23 BFR181W 12 20 0.9 19.0 18.0 -1.0 8.0 175 SOT323 BFP182R 12 35 0.9 22.0 24.0 5.0 8.0 250 SOT143 BFP182W 12 35 0.9 22.0 24.0 5.0 8.0 250 SOT343 BFR182 12 35 0.9 18.0 24.5 5.0 8.0 250 SOT23 BFR182W 12 35 0.9 19.0 25.0 5.0 8.0 250 SOT323 BFP183W 12 65 0.9 22.0 26.5 8.5 8.0 450 SOT343 BFR183 12 65 0.9 17.5 27.0 9.0 8.0 450 SOT23 BFR183W1) 12 65 0.9 18.5 27.0 9.0 8.0 450 SOT323 BFR35AP1) 15 45 1.4 16.0 24.0 9.0 5.0 280 SOT23 BFR92P 15 45 1.4 16.0 24.0 9.0 5.0 280 SOT23 BFR92W1) 15 45 1.4 17.0 24.0 9.0 5.0 280 SOT323 BFS17P 15 25 3.5 – 21.5 10.0 1.4 280 SOT23 BFS17S 15 25 3.0 12.7 22.5 11.0 1.4 280 SOT363 BFS17W 15 25 3.5 12.7 22.5 11.0 1.4 280 SOT323 BFS481 12 20 0.9 20.0 18.0 -1.0 8.0 175 SOT363 BFS4831) 12 65 0.9 19.0 26.5 9.0 8.0 450 SOT363 TSFP-3-1 High Gain up to 2.5GHz, Flatlead TSFP Package Respectively TSLP Package for Modules BFR340F 6 10 1.15 16.5 13.0 -1.0 14.0 60 BFR340L3 6 10 1.15 17.5 12.5 -1.0 14.0 60 TSLP-3-7 BFR360F 6 35 1.00 15.5 24.0 9.0 14.0 210 TSFP-3-1 BFR360L3 6 35 1.00 16.0 24.0 9.0 14.0 210 TSLP-3-1 1) Not for new design Low Noise Si Transistors up to 5GHz Product Type VCEO (max) [V] IC (max) [mA] NFmin (typ) [dB] Gmax (typ) [dB] OIP3 [dBm] OP1dB [dBm] f T (typ) [GHz] Ptot (max) [mW] Package BFP405 4.5 12 1.25 23.0 15.0 5.0 25 55 SOT343 BFP405F 4.5 12 1.25 22.5 14.0 0.0 25 55 TSFP-4-1 BFP410 4.5 40 1.20 21.5 23.5 10.5 25 150 SOT343 BFP420 4.5 35 1.10 21.0 22.0 12.0 25 160 SOT343 BFP420F 4.5 35 1.10 19.5 24.0 10.5 25 160 TSFP-4-1 BFP460 4.5 50 1.10 17.5 27.5 11.5 22 200 SOT343 BFP520 2.5 40 0.95 23.5 25.0 12.0 45 100 SOT343 BFP520F 2.5 40 0.95 22.5 23.5 10.5 45 100 TSFP-4-1 BFP540 4.5 80 0.90 21.5 24.5 11.0 30 250 SOT343 BFP540ESD 4.5 80 0.90 21.5 24.5 11.0 30 250 SOT343 BFP540FESD 4.5 80 0.90 20.0 24.5 11.0 30 250 TSFP-4-1 50 1.10 16.0 27.0 11.5 22 200 TSLP-3-1 For Modules in TSLP Package BFR460L3 4.5 Ultra Low Noise SiGe:C Transistors for use up to 12GHz Product Type VCEO (max) [V] IC (max) [mA] NFmin (typ) [dB] Gmax (typ) [dB] OIP3 [dBm] Package Robust Low Noise Broadband Pre-Matched SiGe:C Transistors BFP843F 2.25 55 0.90 23.5 23.5 TSFP-4-1 BFR843EL3 2.25 55 0.95 24.0 21.0 TSLP-3-9 www.infineon.com/rftransistors 7 RF Transistors Ultra Low Noise SiGe:C Transistors for use up to 12GHz Product Type VCEO (max) IC (max) [V] [mA] Robust Ultra Low Noise SiGe:C Transistors BFP640ESD 4.10 50 BFP640FESD 4.10 50 BFP720ESD 4.20 25 4.20 25 BFP720FESD1) BFP740ESD 4.20 35 BFP740FESD 4.20 35 BFP840ESD 2.25 35 BFP840FESD 2.25 35 BFP842ESD 3.25 40 BFR840L3RHESD 2.25 35 Ultra Low Noise SiGe:C Transistors BFP620 2.30 80 BFP620F 2.30 80 BFP640 4.00 50 BFP640F 4.00 50 BFP720 4.00 20 BFP720F 4.00 20 BFP740 4.00 45 BFP740F 4.00 45 4.00 20 BFR720L3RH1) BFR740L3RH 4.00 30 NFmin (typ) [dB] Gmax (typ) [dB] OIP3 [dBm] OP1dB [dBm] f T (typ) [GHz] Ptot (max) [mW] Package 0.65 0.55 0.60 0.60 0.60 0.60 0.60 0.55 0.40 0.50 25.0 26.5 27.0 27.0 27.0 27.0 27.0 27.5 23.5 26.5 27.0 26.0 22.0 22.0 25.0 24.5 21.0 21.0 24.5 17.0 12.0 11.5 6.5 7.0 10.0 10.0 4.5 4.5 8.0 4.0 46 46 45 45 47 47 80 85 57 75 200 200 100 100 160 160 75 75 120 75 SOT343 TSFP-4-1 SOT343 TSFP-4-1 SOT343 TSFP-4-1 SOT343 TSFP-4-1 SOT343 TSLP-3-9 0.70 0.70 0.65 0.65 0.50 0.50 0.50 0.50 0.50 0.50 21.5 21.0 24.0 23.0 26.0 26.0 27.0 27.5 24.0 24.5 25.5 25.0 26.5 27.5 20.5 20.5 25.0 25.0 20.5 25.0 14.5 14.0 13.0 13.5 6.0 6.0 11.0 11.0 6.0 11.0 65 65 40 40 45 45 42 42 45 42 185 185 200 200 80 80 160 160 80 160 SOT343 TSFP-4-1 SOT343 TSFP-4-1 SOT343 TSFP-4-1 SOT343 TSFP-4-1 TSLP-3-9 TSLP-3-9 1) Not for new design High Linearity Si- and SiGe:C-Transistors for use up to 6GHz Product Type VCEO (max) IC (max) [V] [mA] For Low Frequencies, e.g. VHF/UHF NFmin (typ) [dB] Gmax (typ) [dB] OIP3 [dBm] OP1dB [dBm] f T (typ) [GHz] Ptot (max) [mW] Package BF799 20.0 35 BF799W 20.0 35 BFQ19S 15.0 210 BFR93A 12.0 90 BFR93AW 12.0 90 BFR106 15.0 210 BFP193 12.0 80 BFP193W 12.0 80 BFR193 12.0 80 BFR193F 12.0 80 BFR193W 12.0 80 BFR193L3 12.0 80 BFP196(R) 12.0 150 BFP196W 12.0 150 Si Transistors with High Gain up to 2.5GHz BFR380F 6.0 80 BFR380L3 6.0 80 BFP450 4.5 100 SiGe:C Transistors with High Gain up to 6GHz BFP650 4.0 150 BFP650F 4.0 150 4.0 90 BFP7501) 4.0 90 BFR750L3RH1) BFP760 4.0 70 3.00 3.00 1.80 1.50 1.50 1.80 1.00 1.00 1.00 1.00 1.30 1.00 1.30 1.30 – – 11.5 14.5 15.5 13.0 18.0 20.5 15.0 19.0 16.0 19.0 16.5 19.0 – – 32.0 30.0 30.0 32.0 29.5 29.5 30.0 29.0 30.0 29.0 32.0 32.0 – – 22.0 15.0 15.0 22.0 15.0 15.0 15.0 14.8 15.0 15.0 19.0 19.0 0.8 0.8 5.5 6.0 6.0 5.0 8.0 8.0 8.0 8.0 8.0 8.0 7.5 7.5 280 280 1000 300 300 700 580 580 580 580 580 580 700 700 SOT23 SOT323 SOT89 SOT23 SOT323 SOT23 SOT143 SOT343 SOT23 TSFP-3-1 SOT323 TSLP-3-1 SOT143 SOT343 1.10 1.10 1.25 13.5 13.5 15.5 29.0 29.5 29.0 17.0 16.0 19.0 14.0 14.0 24.0 380 380 450 TSFP-3-1 TSLP-3-1 SOT343 0.80 0.80 0.90 0.60 0.50 21.5 21.5 22.5 21.0 25.0 29.5 31.0 30.0 29.5 31.5 18.0 17.5 16.0 16.5 14.5 37.0 42.0 41.0 37.0 45.0 500 500 360 360 240 SOT343 TSFP-4-1 SOT343 TSLP-3-9 SOT343 1) Not for new design Biased Low Noise RF Transistor Product Type VCEO (max) [V] IC (max) [mA] NFmin (typ) [dB] Gmax (typ) [dB] OIP3 [dBm] OP1dB [dBm] f T (typ) [GHz] Ptot (max) [mW] Package BGR405 BGR420 4.5 4.5 12 25 1.6 1.7 7.0 15.5 14.5 23.0 -0.5 7.4 25 25 50 120 SOT343 SOT343 Application notes, Data sheets, Simulation data: www.infineon.com/rftransistors.documents 8 RF MOSFET Single Full Biased Product Type ID (max) [mA] Ptot (max) [mW] gfs (typ) [ms] Gp (typ) [dB] F (typ) [dB] Cg1ss (typ) [pF] Cdss (typ) [pF] Package BF1005SR 25 200 30 22 1.6 2.4 1.3 SOT143 BF1005R 25 200 24 19 1.6 2.1 1.3 SOT143 Single Non Biased Product Type ID (max) [mA] Ptot (max) [mW] gfs (typ) [ms] Gp (typ) [dB] F (typ) [dB] Cg1ss (typ) [pF] Cdss (typ) [pF] Package BF998 30 200 24 20 1.8 2.1 1.1 SOT143 Single Semi Biased Product Type ID (max) [mA] Ptot (max) [mW] gfs (typ) [mS] Gp (typ) [dB] F (typ) [dB] Cg1ss (typ) [pF] Cdss (typ) [pF] Package BF2030R 40 200 31 23 1.5 2.4 1.3 SOT143 BF2040 40 200 42 23 1.6 2.9 1.6 SOT143 BF2040W 40 200 42 23 1.6 2.9 1.6 SOT343 BF5020 25 200 34 26 1.2 2.4 1.0 SOT143 BF5020R 25 200 34 26 1.2 2.4 1.0 SOT143 BF5030 25 200 41 24 1.3 2.7 1.6 SOT143 BF5030R 25 200 41 24 1.3 2.7 1.6 SOT143 Ptot (max) [mW] gfs (typ) [mS] Gp (typ) [dB] F (typ) [dB] Cg1ss (typ) [pF] Cdss (typ) [pF] Package Dual Semi Biased Product Type ID (max) [mA] BG3130 25 200 33 24 1.3 1.9 1.1 SOT363 BG3130R 25 200 33 24 1.3 1.9 1.1 SOT363 Application notes, Data sheets, Simulation data: www.infineon.com/rfmosfet.documents www.infineon.com/rfmosfet 9 RF Pin Diode Band Switching and RF Attenuation Product Type IF (max) [mA] CT (max) [pF] trr (typ) [ns] Configuration Mounting Package BA592 100 1.4 0.36 120 Single SMT SOD323 BA595 50 0.6 4.50 1600 Single SMT SOD323 BA885 50 0.6 4.50 1600 Single SMT SOT23 BA892-02V 100 1.4 0.36 120 Single SMT SC79 BA895-02V 50 0.6 4.50 1600 Single SMT SC79 BAT18-04 100 1.0 0.40 120 Dual SMT SOT23 BAT18-051) 100 1.0 0.40 120 Dual SMT SOT23 BAR14-1 140 0.5 7.00 1000 Dual SMT SOT23 BAR15-1 140 0.5 7.00 1000 Dual SMT SOT23 BAR16-11) 140 0.5 7.00 1000 Dual SMT SOT23 BAR611) 140 0.5 7.00 1000 Single SMT SOT143 1) Not for new design www.infineon.com/pindiodes 10 rF (typ) [Ω] Antenna Switch Product Type IF (max) [mA] CT (max) [pF] rF (typ) [Ω] trr (typ) [ns] Configuration Mounting Package BAR50-02L1) 100 0.50 3.00 1100 Single SMT TSLP-2-1 BAR50-02V 100 0.50 3.00 1100 Single SMT SC79 BAR50-03W1) 100 0.50 3.00 1100 single – SOD323 BAR63-02L1) 100 0.30 1.00 75 Single SMT TSLP-2-1 BAR63-02V 100 0.30 1.00 75 Single SMT SC79 BAR63-03W 100 0.30 1.00 75 Single SMT SOD323 BAR63-04 100 0.30 1.00 75 Dual SMT SOT23 BAR63-04W 100 0.30 1.00 75 Dual SMT SOT323 BAR63-05 100 0.30 1.00 75 Dual SMT SOT23 BAR63-05W 100 0.30 1.00 75 Dual SMT SOT323 BAR63-06 100 0.30 1.00 75 Dual SMT SOT23 BAR63-06W 100 0.30 1.00 75 Dual SMT SOT323 BAR64-02EL 100 0.35 2.10 1550 Single SMT TSLP-2-19 BAR64-02V 100 0.35 2.10 1550 Single SMT SC79 BAR64-04W 100 0.35 2.10 1550 Dual SMT SOT323 BAR64-05W 100 0.35 2.10 1550 Dual SMT SOT323 BAR64-03W 100 0.35 2.10 1550 Single SMT SOD323 BAR64-04 100 0.35 2.10 1550 Dual SMT SOT23 BAR64-05 100 0.35 2.10 1550 Dual SMT SOT23 BAR64-06 100 0.35 2.10 1550 Dual SMT SOT23 BAR64-06W 100 0.35 2.10 1550 Dual SMT SOT323 BAR65-02V 100 0.90 0.56 80 Single SMT SC79 BAR65-03W 100 0.90 0.56 80 Single SMT SOD323 BAR67-02V 200 0.55 1.00 700 Single SMT SC79 BAR67-04 200 0.90 1.50 700 Dual – SOT23 BAR81W 100 1.00 0.70 80 Single SMT SOT343 2) BAR86-02EL 100 0.15 3.70 3 Single SMT TSLP-2 BAR86-02ELS 100 0.152) 3.702) 32) Single SMT TSSLP-2 BAR88-02LRH1) 100 0.40 0.60 500 Single SMT TSLP-2-7, -17, -21 BAR88-02V 100 0.40 0.60 500 Single SMT SC79 BAR89-02LRH1) 100 0.35 0.80 800 Single SMT TSLP-2-7, -17, -21 BAR90-02EL 100 0.35 0.80 750 Single SMT TSLP-2-19 BAR90-02ELS 100 0.35 0.80 750 Single SMT TSSLP-2-3, -4 BAR90-098LRH3) 100 0.35 0.80 750 Dual SMT TSLP-4-7 2) 2) 1) Not for new design 2) Typical value 3) On request Application notes, Data sheets, Simulation data: www.infineon.com/pindiodes.documents 11 12 RF Varactor Diode VCO and Low Voltage Tuner Product Type Configuration IF (max) [mA] CT1 (typ) [pF] CT2 (typ) [pF] CT/CT rS (typ) [Ω] Mounting Package BBY51-03W Single 20 5.40 4.20 1.75 (1/4V) 0.37 SMT SOD323 BBY52-02L1) Single 20 1.85 1.50 1.60 (1/4V) 0.90 SMT TSLP-2-1 BBY53-02L1) Single 20 5.30 2.40 2.20 (1/3V) 0.47 SMT TSLP-2-1 BBY53-02V Single 20 5.30 2.40 2.20 (1/3V) 0.47 SMT SC79 BBY53-03LRH Single 20 5.30 2.40 2.20 (1/3V) 0.47 SMT TSLP-3-7 BBY53-03W Single 20 5.30 2.40 2.20 (1/3V) 0.47 SMT SOD323 BBY53-05W Dual 20 5.30 2.40 2.20 (1/3V) 0.47 SMT SOT323 BBY55-02V Single 20 18.60 15.00 2.50 (2/10V) 0.15 SMT SC79 BBY55-03W Single 20 18.60 15.00 2.50 (2/10V) 0.15 SMT SOD323 BBY56-03W1) Single 20 5.30 2.40 2.20 (1/3V) 0.47 – SOD323 BBY57-02V Single 20 17.50 8.00 2.45 (1/3V) 0.30 SMT SC79 BBY57-05W Dual 20 17.50 10.00 2.45 (1/3V) 0.30 SMT SOT323 BBY58-02V Single 20 18.30 12.35 2.15 (1/3V) 0.25 SMT SC79 BBY58-03W Single 20 18.30 12.35 2.15 (1/3V) 0.25 SMT SOD323 BBY58-05W Dual 20 18.30 12.35 2.15 (1/3V) 0.25 SMT SOT323 BBY58-06W Dual 20 18.30 12.35 2.15 (1/3V) 0.25 SMT SOT323 BBY65-02V Single 50 20.25 9.80 4.55 (1/3V) 0.60 SMT SC79 BBY66-02V Single 50 68.70 35.40 5.41 (1/4.5V) 0.25 – SC79 BBY66-05W Dual 50 68.70 35.40 5.41 (1/4.5V) 0.25 SMT SOT323 Product Type Configuration IF (max) [mA] CT1 (typ) [pF] CT2 (typ) [pF] CT/CT rS (typ) [Ω] Mounting Package BB804 Dual 50 47.50 27.9 1.71 (2/8V) 0.18 SMT SOT23 BB814 Dual 50 44.75 20.8 2.15 (2/8V) 0.18 SMT SOT23 BB844 Single 50 43.75 11.7 3.80 (2/8V) 0.28 SMT SOT23 BB914 Dual 50 43.75 18.7 2.34 (2/8V) 0.28 SMT SOT23 1) Not for new design FM Tuner SAT Tuner Product Type Configuration IF (max) [mA] CT1 (typ) [pF] CT/CT rS (typ) [Ω] Mounting Package BB833 Single 20 9.3 12.4 (1/28V) 1.8 SMT SOD323 BB837 Single 20 6.6 12.7 (1/28V) 1.5 SMT SOD323 BB857-02V Single 20 6.6 12.7 (1/28V) 1.5 SMT SC79 UHF and VHF Tuner Product Type Configuration IF (max) [mA] CT1 (typ) [pF] CT2 (typ) [pF] CT/CT rS (typ) [Ω] Mounting Package BB439 Single 20 43.0 34.50 6.9 (2/25V) 0.35 SMT SOD323 BB545 Single 20 20.0 14.80 7.2 (2/25V) 0.60 SMT SOD323 BB640 Single 20 69.0 54.50 16.6 (2/25V) 1.15 SMT SOD323 Application notes, Data sheets, Simulation data: www.infineon.com/varactordiodes.documents www.infineon.com/varactordiodes 13 RF Mixer + Detector Schottky Diode Product Type VR (max) [V] IF (max) [mA] CT (typ) [pF] VF (typ) [V] Configuration RO @ VR = 0V [kΩ] Package BAT15-02EL 4 110 0.26 0.230 Single – TSLP-2 BAT15-02ELS 4 110 0.26 0.230 Single – TSSLP-2 BAT15-03W 4 110 0.26 0.230 Single – SOD323 BAT15-04R 4 110 0.26 0.230 Single – SOT23 BAT15-04W 4 110 0.26 0.230 Dual – SOT323 BAT15-05W 4 110 0.26 0.230 Dual – SOT323 BAT15-099 4 110 0.26 0.230 Single – SOT143 BAT17 4 130 0.55 0.340 Single – SOT23 BAT17-04 4 130 0.55 0.340 Dual – SOT23 BAT17-04W 4 130 0.55 0.340 Dual – SOT323 BAT17-05 4 130 0.55 0.340 Dual – SOT23 BAT17-05W 4 130 0.55 0.340 Dual – SOT323 BAT17-06W 4 130 0.55 0.340 Dual – SOT323 BAT17-07 4 130 0.75 0.340 Dual – SOT143 BAT24-02ELS 4 110 0.21 0.230 Single – TSSLP-2-1 RF Mixer RF Signal Detection + Power Leveling BAT62 40 20 0.35 0.580 Dual 225 SOT143 BAT62-02LS 40 20 0.35 0.580 Single 225 TSSLP-2-1 BAT62-02V 40 20 0.35 0.580 Single 225 SC79 BAT62-03W 40 20 0.35 0.580 Single 225 SOD323 BAT62-07W 40 20 0.35 0.580 Dual 225 SOT343 BAT63-02V 3 100 0.65 0.190 Single 30 SC79 BAT63-07W 3 100 0.65 0.190 Dual 30 SOT343 BAT68 8 130 0.75 0.318 Single – SOT23 BAT68-04 8 130 0.75 0.318 Dual – SOT23 BAT68-04W 8 130 0.75 0.318 Dual – SOT323 BAT68-06 8 130 0.75 0.318 Dual – SOT23 BAT68-06W 8 130 0.75 0.318 Dual – SOT323 Application notes, Data sheets, Simulation data: www.infineon.com/schottkydiodes.documents www.infineon.com/schottkydiodes 14 RF mmW-MMIC 24GHz Industrial Product Type f [GHz] ICC (typ) [mA] PTX (typ) [dBm] Gain (typ) [dB] NFmin (typ) [dB] Compression Point P1dB (typ) Frequency Divider Temperatur Sensor Package BGT24MR2 24–24.25 90 – 26 12 -12 no yes VQFN-32-9 BGT24MTR11 24–26.00 150 11 26 12 -12 yes yes VQFN-32-9 BGT24MTR12 24–24.25 210 11 26 12 -12 yes yes VQFN-32-9 Backhaul Product Type f [GHz] Psat (typ) [dBm] Rx Gain (typ) NFDSB (typ) [dB] [dB] ICCRx/Tx PN @ 100kHz (typ) [dBc/Hz] Power Detector Temperatur Sensor Package BGT60 57–64 14 22 7 350/480mA @ 3.3V -81 Integrated Integrated WFWLB-119-1 BGT70 71–76 14 20 8 350/480mA @3.3V -80 Integrated Integrated WFWLB-119-1 BGT80 81–86 10 20 9 350/480mA @ 3.3V -80 Integrated Integrated WFWLB-119-1 Application notes, Data sheets, Simulation data: www.infineon.com/mmWave.documents www.infineon.com/mmWave 15 ESD & EMI Protection and Filters Multi-Purpose ESD Devices Product Type Applications VRWM CL (typ,max) ESD200-B1-CSP0201 keypad, touchscreen, buttons, convenience keys, audio -5.5 5.5 6.5 – -16 16 ESD201-B2-03LRH keypad, touchscreen, buttons, Audio -5.5 5.5 5.0 7.0 -20 20 ESD202-B1-CSP01005 keypad, touchscreen, buttons, Audio -5.5 5.5 5.5 7.0 -12 12 ESD203-B1-02ELS Audio Line, Speaker, Headset, Microphone Protection, Human Interface Devices -12.0 12.0 6.0 – -30 30 ESD203-B1-02EL Audio Line, Speaker, Headset, Microphone Protection, Human Interface Devices -12.0 12.0 6.0 – -30 30 ESD204-B1-02ELS keypad, touchscreen, buttons, convenience keys -8.0 14.0 4.0 7.0 -15 15 ESD204-B1-02EL keypad, touchscreen, buttons, convenience keys -8.0 14.0 4.0 7.0 -15 15 ESD205-B1-02ELS keypad, touchpad, buttons, convenience keys -5.5 5.5 4.0 7.0 -20 20 ESD205-B1-02EL keypad, touchpad, buttons, convenience keys -5.5 5.5 4.0 7.0 -20 20 ESD206-B1-02ELS Audio Line, Speaker, Headset, Microphone Protection, Human Interface Devices -5.5 5.5 13.0 – -30 30 ESD206-B1-02EL Audio Line, Speaker, Headset, Microphone Protection, Human Interface Devices -5.5 5.5 13.0 – -30 30 ESD206-B1-02V Aaudio line, speaker, microphone, human interfaces -5.5 5.5 13.0 – -30 30 ESD207-B1-02ELS keypad, touchpad, buttons, convenience keys -3.3 3.3 14.0 20.0 -30 30 ESD207-B1-02EL keypad, touchpad, buttons, convenience keys -3.3 3.3 14.0 20.0 -30 30 ESD208-B1-02ELS keypad, touchpad, buttons, convenience keys -3.3 3.3 6.0 9.0 -25 25 ESD208-B1-02EL keypad, touchpad, buttons, convenience keys -3.0 3.0 6.0 9.0 -25 25 ESD217-U1-02EL keypad, touchpad, buttons, convenience keys -8.0 14.0 8.5 13.0 -25 25 ESD218-B1-02ELS keypad, touchpad, buttons, convenience keys, USB Vbus -24.0 24.0 2.5 3.5 -18 18 ESD218-B1-02EL keypad, touchpad, buttons, convenience keys, USB Vbus -24.0 24.0 2.5 3.5 -18 18 ESD221-U1-02EL keypad, touchpad, buttons, convenience keys 5.3 – 35.0 40.0 25 – ESD5V0L1B-02V keypad, touchscreen, buttons, Power Lines -5.0 5.0 8.5 13.0 25 – ESD5V0S1U-02V keypad, touchscreen, buttons, Power Lines 5.0 – 35.0 40.0 20 – ESD24VS2U keypad, touchscreen, buttons, 24V Appls. 24.0 – 48.0 52.0 30 – [pF] [V] Application notes, Data sheets, Simulation data: www.infineon.com/esd.documents www.infineon.com/esdprotection 16 VESDmax [kV] RDYN,typ reverse RDYN,typ forward Vcl typ. forward TLP 16A [V] Vcl typ. reverse TLP 30A [V] Vcl typ. forward TLP 30A [V] IR (max) [Ω] Vcl typ. reverse TLP 16A [V] [Ω] 0.2 IEFT Isurge [nA] [A] [A] 0.2 13.0 13.0 – – 100 – 0.37 0.22 12.1 10.2 – – 100 0.20 0.20 13.0 13.0 17.0 17.0 100 0.29 0.29 17.0 18.0 23.0 23.5 0.29 0.29 17.0 18.0 23.0 0.6 0.5 28.0 28.0 0.6 0.5 28.0 28.0 0.22 0.37 10.2 0.22 0.37 0.15 0.15 0.15 Protected Lines Package 3.0 1 WLL-2-1 40 2.5 2 TSLP-3-9 – 3.0 1 WLL-2-2 50 50 5.0 1 TSSLP-2-4 23.5 50 50 5.0 1 TSLP-2-20 35.0 35.0 50 40 1.0 1 TSSLP-2-3 35.0 35.0 50 40 1.0 1 TSLP-2-19 12.1 13.2 17.2 100 40 2.5 1 TSSLP-2-3 10.3 12.2 13.3 17.3 100 40 2.5 1 TSLP-2-19 9.0 9.0 11.0 11.0 100 50 6.0 1 TSSLP-2-3 0.15 9.0 9.0 11.0 11.0 100 50 6.0 1 TSLP-2-19 0.15 0.15 9.0 9.0 11.0 11.0 100 50 6.0 1 SC79 0.13 0.13 7.0 7.0 9.0 9.0 50 40 8.0 1 TSSLP-2-3 0.13 0.13 7.0 7.0 9.0 9.0 50 40 8.0 1 TSLP-2-19 0.2 0.2 8.0 8.0 11.0 11.0 50 80 4.0 1 TSSLP-2-3 0.2 0.2 8.0 8.0 11.0 11.0 50 80 4.0 1 TSLP-2-19 0.3 0.2 28.0 26.0 30.0 27.0 50 40 2.5 1 TSLP-2-19 1.0 1.0 55.0 55.0 – – 50 40 1.0 1 TSSLP-2-4 1.0 1.0 55.0 55.0 – – 50 40 1.0 1 TSLP-2-20 0.27 0.27 7.0 1.2 9.0 2.5 100 50 5.5 1 TSLP-2-20 0.4 0.2 22.0 25.0 26.0 27.0 50 40 2.5 1 SC79 0.2 0.3 10.5 4.3 14.5 7.3 100 50 5.5 1 SC79 0.22 0.11 37.0 2.6 40.0 4.2 10µA 80 5.0 2 SOT23 17 ESD & EMI Protection and Filters Low Capacitance ESD Devices Product Type Applications VRWM CL (typ,max) VESDmax ESD101-B1-02ELS Super high-speed interfaces, RF antennas -5.5 5.5 0.1 0.2 -10 10 ESD101-B1-02EL RF antenna, Super high-speed interfaces such as USB 3.0, HDMI 1.4a, MHL -5.5 5.5 0.1 0.2 -12 12 ESD102-U1-02ELS USB 3.0, 10/100/1000 Ethernet, Firewire, DVI, HDMI, S-ATA, DisplayPort 3.3 – 0.4 0.65 -20 20 ESD102-U2-099EL USB 3.0, 10/100/1000 Ethernet, firewire, DVI, HDMI, S-ATA, display port 3.3 – 0.4 0.65 -20 20 ESD102-U4-05L Protection of high-speed digital interfaces 3.3 – 0.4 0.65 -20 20 ESD103-B1-02ELS Super high-speed interfaces, RF antenna -15.0 15.0 0.1 0.2 -10 10 ESD103-B1-02EL RF antenna, Super high-speed interfaces such as USB 3.0, HDMI 1.4a, MHL -15.0 15.0 0.09 0.2 -10 10 ESD105-B1-02ELS RF antenna, Super high-speed interfaces such as USB 3.0, HDMI 1.4a, MHL -5.5 5.5 0.3 0.45 -25 25 ESD105-B1-02EL RF antenna, Super high-speed interfaces such as USB 3.0, HDMI 1.4a, MHL -5.5 5.5 0.3 0.45 -25 25 ESD108-B1-CSP0201 RF antenna, small signal, NFC -5.5 5.5 0.28 0.38 -25 25 ESD110-B1-02ELS RF antenna, small signal, NFC -18.5 18.5 0.3 0.6 -15 15 ESD110-B1-02EL RF antenna, small signal, NFC -18.5 18.5 0.3 0.6 -15 15 ESD112-B1-02ELS RF antenna, small signal, NFC -5.3 5.3 0.23 0.4 -20 20 ESD112-B1-02EL RF antenna, small signal, NFC -5.3 5.3 0.23 0.4 -20 20 ESD113-B1-02ELS HDMI, USB 2.0, USB 3.0, DisplayPort, DVI -3.6 3.6 0.22 – -20 20 ESD113-B1-02ELS HDMI, USB 2.0, USB 3.0, DisplayPort, DVI -3.6 3.6 0.22 – -20 20 ESD114-U1-02ELS RF antenna, Super high-speed interfaces such as USB 3.0, HDMI 1.4a, MHL 5.3 – 0.4 0.6 20 – ESD114-U1-02EL RF antenna, Super high-speed interfaces such as USB 3.0, HDMI 1.4a, MHL 5.3 – 0.4 0.6 20 – ESD3V3U4ULC USB3.0 3.3 – 0.4 0.65 20 – ESD5V3U2U-03F USB2.0, HDMI, DisplayPort 5.3 – 0.4 0.6 20 – ESD5V3U4U-HDMI USB2.0, HDMI, DisplayPort 5.3 – 0.4 0.6 20 – ESD5V3U4RRS USB2.0 5.3 – 0.4 0.6 15 – ESD5V5U5ULC USB2.0 x 2 (4 I/O + Vcc) 5.5 – 0.45 1.0 25 – ESD0P8RFL RF antenna, small signal, NFC -50.0 50.0 0.8 – 20 – [pF] [V] [kV] Surge Protection Devices Product Type Applications VRWM CL (typ,max) ESD300-B1-02LRH Keypad, touchscreen, buttons, power lines -3.3 3.3 1.2 – -30 30 ESD307-U1-02N VBUS 10.0 – 270.0 350 -30 30 ESD311-U1-02N VBUS 15.0 – – – -30 30 DSL70 DSL 50.0 – 2.5 5 -15 15 TVS3V3L4U Gigabit Ethernet 3.3 – 2.0 3 -30 30 [pF] [V] Application notes, Data sheets, Simulation data: www.infineon.com/esd.documents 18 VESDmax [kV] RDYN,typ reverse RDYN,typ forward Vcl typ. forward TLP 16A [V] Vcl typ. reverse TLP 30A [V] Vcl typ. forward TLP 30A [V] IR (max) [Ω] Vcl typ. reverse TLP 16A [V] [Ω] 1.3 IEFT Isurge Protected Lines Package [nA] [A] [A] 1.3 29 29 – – 50 – – 1.5 1.5 30 30 – – 50 1 TSSLP-2-3 – – 1 0.19 0.23 8 6 11 9 TSLP-2-20 50 50 3 1 TSSLP-2-3 0.19 0.23 8 6 11 0.19 0.23 8 6 11 9 50 50 3 2 TSLP-4-10 9 50 50 3 4 1.8 1.8 48 48 TSLP-5-2 – – 50 – – 1 1.8 1.8 48 TSSLP-2-4 48 – – 50 – – 1 0.38 0.38 TSLP-2-20 13 13 19 19 50 50 5 1 0.38 TSSLP-2-4 0.38 13 13 19 19 50 50 5 1 TSLP-2-20 0.75 0.75 20 20 30 30 100 40 2.5 1 WLL-2-1 0.6 0.6 26 26 35 35 30 – 2 1 TSSLP-2-4 0.6 0.6 26 26 35 35 30 – 2 1 TSLP-2-20 1.0 1.0 29 29 38 38 50 40 3 1 TSSLP-2-4 1.0 1.0 29 29 38 38 50 40 3 1 TSLP-2-20 0.45 0.45 14 12 20 18 50 50 3 1 TSSLP-2-4 0.45 0.45 14 12 20 18 50 50 3 1 TSLP-2-20 0.6 0.5 19 10 28 17 50 50 3 1 TSSLP-2-3 0.6 0.5 19 10 28 17 50 50 3 1 TSLP-2-19 0.19 0.23 8 6 11 9 50 50 3 4 TSLP-9-1 0.6 0.5 19 10 28 17 50 40 3 2 TSFP-3-1 0.6 0.5 19 10 28 17 50 50 3 4 TSLP-9-1 0.62 0.44 20 12 28 17 100 50 3 5 SOT363 0.2 0.3 8.9 5.4 11.5 9.2 100 50 6 5 SC74 – – – – – – 100 40 10 1 TSLP-4-7 RDYN,typ reverse RDYN,typ forward Vcl typ. reverse TLP 30A [V] Vcl typ. forward TLP 30A [V] IEFT Isurge [nA] [A] [A] Protected Lines Package [Ω] Vcl typ. forward TLP 16A [V] IR (max) [Ω] Vcl typ. reverse TLP 16A [V] 0.23 0.23 9.5 9.5 12.5 12.5 100 – 18 1 TSLP-2-21 0.05 – 17.0 – 18.0 – 100 80 34 1 TSNP-2-2 0.07 – 22.0 – 23.0 – 100 80 28 1 TSNP-2-2 0.1 – 2.6 + Vcc – 4.0 + Vcc – 5 80 27 2 SOT143 0.09 0.12 5.8 3.1 7.3 4.4 50 80 20 4 SC74 19 Alphanumerical List of the Symbols used 20 Symbols Terms Symbols Terms ANT Antenna OIP3 Output 3rd-order intercept point Cdss Output capacitance OP1dB Output -1dB compression Cg1ss Gate-1 input capacitance P1dB Power output at -1dB compression point CL Line capacitance Pmax Maximum power COFF Off capacitance Psat Saturation power CT Total diode capacitance Ptot Total power dissipation ESD Electrostatic discharge PTX Transmitter power F Noise factor RDYN,typ forward Forward dynamic resistance f Frequency RDYN,typ reverse Reverse dynamic resistance fT Transition frequency rF Forward resistance of diodes gfs Forward transconductance RO Differential resistance Gmax Max. available gain RON On resistance Gp Power gain rS Series resistance I Current Rx Gain Receiver gain IC Collector current (DC or average value) trr Charge carrier life time ICCTx Transmitter current consumption VCC Collector supply voltage ICCRx Receiver current consumption VCEO Collector-emitter breakdown voltage with open base ID Drain current Vcl typ. forward Forward clamping voltage IEFT Burst current (acc. to IEC61000-4-4) Vcl typ. reverse Reverse clamping voltage IF Forward current VESDmax Voltage of ESD pulse Isurge Surge current (acc. to IEC61000-4-5) VF Forward voltage NFDSB Double-side band noise figure VR Reverse voltage NFmin Mimimum noise figure VRF Maximum RF voltage H2 2nd Harmonic VRWM Reverse working voltage H3 3rd Harmonic 21 Package Information SC74 6 SC79 (SC-79) 2.9 x 2.5 x 1.1 2 1.6 x 0.8 x 0.55 6:1 SOT143 (SC61) 4 2.9 x 2.4 x 1.0 3 2.0 x 2.1 x 0.9 8:1 4 6 8:1 6 8:1 All products are available in green (RoHS compliant). Footprints are recommendations only. For detailed information please refer to our datasheets or www.infineon.com/packages. 22 22 8:1 TSLP-3-1 (SC-101) 3 4 TSLP-5-2 0.75 x 0.75 x 0.31 5 1.3 x 0.8 x 0.39 8:1 8:1 TSLP-7-1 7 8:1 1.0 x 0.6 x 0.4 8:1 TSLP-4-10 1.1 x 0.7 x 0.31 1.2 x 1.2 x 0.55 8:1 TSLP-6-4 1.1 x 0.9 x 0.39 3 1.0 x 0.6 x 0.31 8:1 TSLP-6-3 1.1 x 0.7 x 0.39 2.0 x 2.1 x 0.9 TSFP-3-1, -2 6:1 2 1.2 x 0.8 x 0.39 4.5 x 4.0 x 1.5 4:1 TSLP-2-19, -20 1.0 x 0.6 x 0.39 8:1 TSLP-6-2 6 TSLP-4-7 1.0 x 0.6 x 0.31 4 6:1 8:1 TSLP-3-9 3 2.9 x 2.4 x 1 6:1 2 SOT89 (SC62, SOT-89) SOT363 (SC88, SOT-363) 2.0 x 2.1 x 0.9 8:1 TSLP-3-7 3 TSLP-2-7, -17, -21 1.0 x 0.6 x 0.4 8:1 6 4 6:1 2 1.0 x 0.6 x 0.39 2.5 x 1.25 x 0.9 SOT343 (SC82) TSLP-2-1 1.4 x 1.2 x 0.55 SOT23 (SOT-23) 6:1 SOT323 (SC70, SOT-323) TSFP-4-1, -2 3 2 6:1 6:1 4 SOD323 (SC76) TSLP-7-4 2.0 x 1.3 x 0.4 7 6:1 2.3 x 1.5 x 0.4 6:1 TSLP-7-6 7 TSLP-9-1 1.4 x 1.26 x 0.39 9 2.3 x 1 x 0.31 6:1 2.3 x 2.3 x 0.39 2 9 1.6 x 0.8 x 0.4 26 5:1 32 5.5 x 4.5 x 0.9 119 14 2 1.4 x 1.26 x 0.375 6:1 TSNP-16-1 2.0 x 2.0 x 0.77 16 5:1 TSSLP-2-1, -2 3.2 x 2.8 x 0.77 2 TSSLP-2-3, -4 0.62 x 0.32 x 0.31 2 0.62 x 0.32 x 0.31 20:1 20:1 WLL-2-2 0.58 x 0.21 x 0.15 2.3 x 2.3 x 0.375 5:1 WLL-2-1 6.0 x 6.0 x 0.8 7 6:1 4:1 WFWLB-119-1 TSNP-7-6 2.0 x 1.3 x 0.375 6:1 26 1.9 x 1.1 x 0.39 6:1 TSNP-14-3 1.5 x 1.1 x 0.4 4:1 VQFN-32-9, -15 7 TSNP-26-3 3.4 x 2.6 x 0.73 12 6:1 TSNP-10-1 TSNP-26-2 2.3 x 2.3 x 0.73 1.55 x 1.15 x 0.39 8:1 10 TSLP-12-4 TSNP-7-1 1.1 x 0.7 x 0.375 6:1 TSNP-16-6 16 6 1.5 x 1.1 x 0.77 5:1 10 TSNP-6-2 TSNP-9-1 2.3 x 1.7 x 0.73 1.15 x 1.15 x 0.31 8:1 TSNP-7-10 TSLP-10-1 6:1 TSNP-2-2 5:1 7 9 6:1 TSLP-16-1 16 TSLP-9-3 2 Package (JEITA-code) 0.43 x 0.23 x 0.15 X LxWxH PIN-Count Scale 1:1 3:1 3:1 20:1 20:1 All Dimensions in mm 23 23 SC74 Package Outline 2.9 ±0.2 (2.25) B 1.1 MAX. 4 1 2 3 Pin 1 marking 0.35 +0.1 -0.05 0.2 0.95 M 1.6 ±0.1 5 2.5 ±0.1 6 0.25 ±0.1 0.15 +0.1 -0.06 (0.35) B 6x 0.1 MAX. 0.2 1.9 M A A Foot Print (Reflow) 2.9 1.9 0.5 0.95 SC79 (SC-79) Package Outline 0.2 M A 0.13 +0.05 -0.03 0.8 ±0.1 1.6 ±0.1 Cathode marking 1.2 ±0.1 A 2 0.3 ±0.05 0.55 ±0.04 0.2 ±0.05 1 0.35 1.35 Foot Print 0.35 All dimensions in mm 24 SOD323 (SC76) Package Outline 0.9 +0.2 -0.1 1.25 +0.2 -0.1 0 ±0.05 0.45 ±0.15 2.5 ±0.2 Cathode marking 1 0.3 +0.1 -0.05 1.7 +0.2 -0.1 A 2 +0.05 0.3 -0.2 0.15 +0.1 -0.06 0.25 M A 0.8 1.7 0.8 Foot Print (Reflow) 0.6 All dimensions in mm 25 SOT23 (SOT-23) 2.9 ±0.1 0.15 MIN. Package Outline B 1) 0.25 M BC 0.4 +0.1 -0.05 2 0.2 C 0.95 M 1.3 ±0.1 1 0.1 MAX. 2.4 ±0.15 3 1 ±0.1 0.08...0.1 A 5 A 0...8° 1.9 1) Lead width can be 0.6 max. in dambar area Foot Print (Reflow) 0.8 0.9 1.3 0.9 0.8 1.2 SOT89 (SC62, SOT-89) Package Outline 4.5 ±0.1 45° B 1.5 ±0.1 0.2 MAX. 2 1.6 ±0.2 2.75 +0.1 -0.15 1) 1±0.2 1 0.15 4 ±0.25 1±0.1 1) 2.5±0.1 0.25 ±0.05 3 1.5 0.35 ±0.1 0.45 +0.2 -0.1 3 0.15 M B x3 0.2 B 1) Ejector pin markings possible Foot Print 1.2 1.0 2.5 2.0 0.8 0.8 0.7 All dimensions in mm 26 SOT143 (SC61) 2.9 ±0.1 1.9 B 3 0.1 MAX. 2 1.3 ±0.1 1 1 ±0.1 2.4 ±0.15 4 0.15 MIN. Package Outline 0.2 0.08...0.1 5 0.8 +0.1 -0.05 0.4 +0.1 -0.05 1.7 A 0...8° 0.2 0.25 M B M A Note: Mold flash, protrusions or gate burrs of 0,2 mm max. per side are not included Foot Print (Reflow) 1.2 0.8 0.9 1.1 0.9 0.8 1.2 0.8 0.8 SOT323 (SC70, SOT-323) Package Outline 0.9 ±0.1 2 ±0.2 0.3 +0.1 -0.05 0.1 MAX. 3x 0.1 M 0.1 A 1 2 1.25 ±0.1 0.1 MIN. 2.1 ±0.1 3 0.15 +0.1 -0.05 0.65 0.65 0.2 M A Foot Print (Reflow) 0.8 1.6 0.6 0.65 All dimensions in mm 27 SOT343 (SC82) Package Outline 0.9 ±0.1 2 ±0.2 1.3 0.1 MAX. 0.1 A 1 0.1 MIN. 0.15 1.25 ±0.1 3 2.1 ±0.1 4 2 0.3 +0.1 -0.05 0.15 +0.1 -0.05 0.6 +0.1 -0.05 4x 0.1 M 0.2 M A Foot Print 1.6 0.8 0.6 1.15 0.9 SOT363 (SC88, SOT-363) Package Outline 0.9 ±0.1 5 4 1 2 3 0.1 MAX. 0.1 2.1 ±0.1 6 0.1 M Pin 1 marking 0.65 A 1.25 ±0.1 6x 0.1 MIN. 2 ±0.2 0.2 +0.1 -0.05 0.15 +0.1 -0.05 0.65 0.2 M A Foot Print 1.6 0.9 0.7 0.3 0.65 All dimensions in mm 28 TSFP-3-1, -2 Package Outline 0.2 ±0.05 0.55 ±0.04 1 1.2 ±0.05 0.2 ±0.05 3 2 0.2 ±0.05 0.8 ±0.05 1.2 ±0.05 0.15 ±0.05 0.4 ±0.05 0.4 ±0.05 Foot Print 1.05 0.45 0.4 0.4 0.4 TSFP-4-1, -2 Package Outline 1 3 1.2 ±0.05 0.2 ±0.05 4 0.55 ±0.04 2 0.2 ±0.05 10° MAX. 0.2 ±0.05 0.8 ±0.05 1.4 ±0.05 0.15 ±0.05 0.5 ±0.05 0.5 ±0.05 Foot Print 0.9 0.45 0.35 0.5 0.5 All dimensions in mm 29 TSLP-2-1 Package Outline Top view Bottom view 0.4 +0.01 0.6 ±0.05 2 1±0.05 0.65 ±0.05 0.05 MAX. 1 0.25 ±0.035 1) 0.5 ±0.035 1) Cathode marking 1) Dimension applies to plated terminals 0.45 0.275 0.35 Copper 0.375 0.925 1 0.3 0.35 0.6 0.275 Foot Print Solder mask Stencil apertures TSLP-2-7, -17, -21 Package Outline Bottom view 0.39 +0.01 -0.03 0.6 ±0.05 0.65 ±0.05 0.05 MAX. 2 1±0.05 Top view 1 0.25 ±0.035 1) 0.5 ±0.035 1) Cathode marking 1) Dimension applies to plated terminals 0.45 Copper Solder mask 0.375 0.925 0.275 0.35 1 0.3 0.35 0.6 0.275 Foot Print Stencil apertures All dimensions in mm 30 TSLP-2-19, -20 Package Outline Bottom view 0.31 +0.01 -0.02 0.6 ±0.05 0.05 MAX. 0.65 ±0.05 2 1±0.05 Top view 1 0.25 ±0.035 1) 0.5 ±0.035 1) Pin 1 marking 1) Dimension applies to plated terminals Foot Print 0.35 0.28 0.38 0.93 0.3 1 Copper 0.28 0.45 0.35 0.6 Solder mask Stencil apertures TSLP-3-1 (SC-101) Package Outline Bottom view 0.4 +0.1 3 2 1 2 x 0.25 ±0.035 2 x 0.15 ±0.035 1 ±0.05 0.65 ±0.05 1) 0.35 ±0.05 Pin 1 marking 0.25 ±0.035 0.6 ±0.05 0.5 ±0.035 1) 0.05 MAX. 1) Top view 1) 1) Dimension applies to plated terminal 0.2 0.225 0.15 Copper 0.225 Solder mask R0.1 0.2 0.17 0.315 0.945 0.35 1 0.3 0.35 0.45 0.275 0.6 0.355 Foot Print Stencil apertures All dimensions in mm 31 TSLP-3-7 Package Outline Bottom view 0.39 +0.01 -0.03 1) Top view 1) 3 2 1 2 x 0.25 ±0.035 2 x 0.15 ±0.035 1) 0.35 ±0.05 Pin 1 marking 1 ±0.05 0.65 ±0.05 0.5 ±0.035 0.25 ±0.035 0.6 ±0.05 0.05 MAX. 1) 1) Dimension applies to plated terminal R0.1 0.2 0.225 0.2 0.225 0.17 0.15 Copper 0.315 0.35 1 0.3 0.945 0.35 0.45 0.275 0.6 0.355 Foot Print Solder mask Stencil apertures TSLP-3-9 Package Outline Top view Bottom view 2 1±0.05 3 1 2 x 0.15 ±0.035 1) 1) Dimension applies to plated terminal 2 x 0.25 ±0.035 1) 0.575 ±0.05 0.5 ±0.035 1) 0.35 ±0.05 Pin 1 marking 0.4 ±0.035 1) 0.6 ±0.05 0.31+0.01 -0.02 0.225 0.225 0.15 Copper Solder mask 0.2 0.2 0.17 0.315 0.5 0.95 0.2 0.35 1 0.45 R0.19 0.38 0.6 0.255 Foot Print R0.1 Stencil apertures All dimensions in mm 32 TSLP-4-7 Package Outline Bottom view 0.8 ±0.05 4 x 0.25 ±0.035 1) 2 0.75 ±0.05 0.05 MAX. 3 1 1.2 ±0.05 0.39 +0.01 -0.03 4 x 0.35 ±0.035 1) Top view 4 0.45 ±0.05 Pin 1 marking 1) Dimension applies to plated terminal Foot Print 0.8 0.4 0.38 0.42 1.18 0.4 1.2 0.4 0.38 0.78 0.28 0.3 0.3 0.2 Copper 0.28 0.22 Stencil apertures Solder mask TSLP-4-10 Package Outline 0.75 ±0.035 0.25 ±0.035 1) 0.05 MAX. 0.4 2 1 3 4 0.75 ±0.035 Bottom view +0.1 0.31-0.2 0.25 ±0.035 1) Top view 0.4 Pin 1 marking 1) Dimension applies to plated terminals Foot Print 0.4 0.4 0.25 All dimensions in mm 33 TSLP-5-2 Package Outline Bottom view +0.01 0.39 -0.03 0.2 ±0.035 1) 0.8 ±0.05 0.26 ±0.035 1) 3 0.5 ±0.05 0.05 MAX. 0.5 ±0.05 1.3 ±0.05 Top view 4 2 5 0.03 1 0.46 ±0.05 Pin 1 marking 1) Dimension applies to plated terminals Foot Print 0.5 0.5 0.46 0.46 0.26 0.2 0.26 0.2 0.5 0.5 Copper Stencil apertures Solder mask TSLP-6-2 Package Outline Top view Bottom view 3 4 2 5 1 6 0.2 ±0.05 Pin 1 marking 1.1 ±0.05 (0.05) (0.05) 0.2 ±0.05 0.05 MAX. 0.2 ±0.035 1) 0.2 ±0.035 1) (0.05) (0.05) 0.7 ±0.05 +0.01 0.39 -0.03 1) Dimension applies to plated terminals Foot Print NSMD 0.4 0.4 0.25 0.25 0.4 0.4 0.25 0.25 (stencil thickness 100 µm) Copper Solder mask Stencil apertures All dimensions in mm 34 TSLP-6-3 Package Outline 0.2 ±0.035 1) Bottom view +0.01 0.39 -0.03 0.9 ±0.05 0.25 ±0.035 1) 0.05 MAX. 0.8 ±0.05 3 5 6 1 0.4 ±0.05 Pin 1 marking 4 2 1.1 ±0.05 Top view 0.45 ±0.05 1) Dimension applies to plated terminals Foot Print NSMD 0.4 0.4 0.3 0.3 0.45 0.25 0.45 0.25 (stencil thickness 100 µm) Copper Stencil apertures Solder mask TSLP-6-4 Package Outline Top view Bottom view (0.05) 3 1.1 ±0.05 4 2 5 1 6 (0.05) 0.2 ±0.035 1) 0.05 MAX. 0.4 0.2 ±0.035 1) (0.05) 0.4 Pin 1 marking (0.05) 0.7 ±0.05 +0.01 0.31 -0.02 1) Dimension applies to plated terminals Foot Print NSMD 0.4 0.4 0.25 0.25 0.4 0.4 0.25 0.25 (stencil thickness 100 µm) Copper Solder mask Stencil apertures All dimensions in mm 35 TSLP-7-1 Package Outline Top view Bottom view 0.4 +0.1 1.3 ±0.05 0.05 MAX. 1 ±0.05 6 1.1 ±0.035 1) 1.7 ±0.05 1.2 ±0.035 1) 7 3 Pin 1 marking 2 ±0.05 5 6 x 0.2 ±0.035 1) 4 2 1 6 x 0.2 ±0.035 1) 1) Dimension applies to plated terminal Foot Print S MD 1.4 0.3 Copper 0.3 Solder mask 1.4 0.2 0.25 0.2 0.25 Stencil apertures R0.1 0.3 0.3 Copper 0.3 Solder mask 0.2 0.2 0.25 1.9 0.2 1.9 0.25 0.2 0.25 0.2 0.3 0.2 0.2 1.9 1.9 0.2 0.25 0.2 0.2 0.2 1.4 0.2 N SMD 1.4 0.25 0.25 R0.1 Stencil apertures All dimensions in mm 36 TSLP-7-4 Package Outline Top view Bottom view 0.4 +0.1 1.5 ±0.05 0.05 MAX. 1.1±0.05 1.9 ±0.05 1.4 ±0.035 1) 7 3 Pin 1 marking 2 2.3 ±0.05 6 6 x 0.3 ±0.035 1) 5 1.1±0.035 1) 4 1 6 x 0.3 ±0.035 1) 1) Dimension applies to plated terminal 0.25 0.175 0.175 0.3 0.3 Copper Solder mask 0.25 0.25 0.25 0.3 0.3 0.25 Stencil apertures 1.4 2.2 0.25 2.2 0.175 0.25 0.25 0.25 0.3 0.3 0.3 Copper Solder mask S MD 0.3 0.175 2.2 0.25 2.2 0.3 1.4 0.25 1.4 0.25 NS MD 0.25 1.4 0.3 Foot Print 0.25 Stencil apertures All dimensions in mm 37 TSLP-7-6 Package Outline Bottom view 1.26 ±0.05 0.03 A 4 5 6 0.05 B B 0.2 MIN. 0.5 ±0.0351) 1.1 A (0.05) 2) 0.05 MAX. 1.16 ±0.035 1) 0.96 7 3 2 Pin 1 marking 1 0.48 0.03 B (0.05) 2) 1) Dimension applies to plated terminals 2) Dimension of 0.02 MIN. is guaranteed 0.03 B 0.05 A 6 x 0.2 ±0.035 1) 0.39 +0.01 -0.03 1.4 ±0.05 Top view 6 x 0.2 ±0.035 1) Foot Print S MD 1.21 0.51 0.25 Copper 0.45 0.2 0.2 0.25 0.23 0.25 0.25 0.25 1.35 0.45 0.2 0.25 0.2 1.35 0.25 0.25 1.21 0.51 0.25 0.23 0.25 0.23 Solder mask Vias 0.23 Stencil apertures All dimensions in mm 38 TSLP-9-1 Package Outline Bottom view 1±0.035 A (0.03) 0.59 0.5 6 B 7 4 0.94 ±0.025 1) 2 0.05 A B 0.4 ±0.025 1) 5 3 0.05 A B 4 x 0.5 = 2 (0.05) 0.05 MAX. 0.05 A B 8 1 2.3 ±0.035 0.31+0.01 -0.02 8 x 0.2 ±0.025 1) Top view 9 Pin 1 marking 8 x 0.35 ±0.025 1) 0.05 A B 1) Dimension applies to plated terminals Foot Print 1 0.38 Copper Solder mask 0.2 0.3 0.2 0.3 0.2 0.3 0.2 2.3 0.3 0.2 0.2 0.3 0.24 0.38 0.38 0.3 0.38 0.3 0.3 0.2 2.3 0.3 0.3 0.2 1 0.24 Stencil apertures All dimensions in mm 39 TSLP-9-3 Package Outline Top view Bottom view 0.31 +0.01 -0.02 1.15 ±0.05 6 5 7 9 4 8 3 1 0.2 ±0.0351) 2 0.2 ±0.0351) Pin 1 marking 1.15 ±0.05 2 x 0.4 = 0.8 0.4 0.05 MAX. 0.4 2 x 0.4 = 0.8 1) Dimension applies to plated terminals Foot Print 0.25 0.4 0.4 0.25 0.25 0.4 0.4 (stencil thickness 100 µm) Copper Stencil apertures Solder mask TSLP-10-1 Package Outline Top view Bottom view 0.39 +0.01 -0.03 1.15 ±0.05 0.2 ±0.05 0.05 MAX. 7 2 8 9 1 0.2 ±0.0351) Pin 1 marking 1.55 ±0.05 6 3 0.2 ±0.0351) 0.2 ±0.05 5 4 10 1) Dimension applies to plated terminals Foot Print N SMD 0.25 0.4 0.4 0.25 0.25 0.4 0.4 Copper Solder mask (stencil thickness 100 µm) Stencil apertures All dimensions in mm 40 TSLP-12-4 Package Outline Bottom view 1.1±0.05 A 0.2 ±0.035 8 9 10 5 11 4 12 3 2 1 0.4 Pin 1 marking 0.1 A 0.1 B 1.9 ±0.05 7 0.1 A 0.2 ±0.035 12x 6 0.75 ±0.035 4 x 0.4 = 1.6 0.4 0.05 MAX. 0.1 B 0.39 +0.01 -0.03 0.2 ±0.035 12x Top view B 2 x 0.4 = 0.8 Foot Print 0.4 0.4 0.25 0.8 0.25 0.25 Copper 0.4 0.4 0.8 0.25 0.25 Solder mask Stencil apertures All dimensions in mm 41 TSLP-16-1 Package Outline Top view Bottom view 2.3 ±0.05 0.39 +0.01 -0.03 2 ±0.05 0.05 MAX. 1±0.05 9 10 11 12 14 1.4 ±0.035 1) 8 7 15 6 16 5 Pin 1 marking 4 3 1 6 x 0.2 ±0.035 2 0 . 0 5 x 45° 1 6 x 0.2 ±0.035 2.3 ±0.05 2 ±0.05 1.4 ±0.035 1±0.05 13 1 1) Dimension applies to plated terminals Foot Print NSMD 0.55 1.25 0.3 0.2 0.3 0.2 0.3 0.2 0.3 Stencil apertures Solder mask SMD - V1 SMD - V2 (e.g. BGA734L16) 0.15 2.3 0.55 1.25 0.35 0.225 2.3 0.55 1.25 0.35 0.225 0.2 0.3 0.3 0.2 0.3 Copper 0.2 0.3 0.2 0.2 0.3 0.3 0.3 Copper 0.2 0.3 0.2 Solder mask 0.2 0.3 0.3 0.2 0.15 0.3 2.3 2.3 0.2 0.3 0.075 0.275 0.225 1.25 0.225 0.3 0.3 0.2 0.3 0.2 0.3 0.2 Vias top to first inner layer All dimensions in mm 42 TSNP-2-2 0.02 MAX. B 0.35 ±0.05 0.8 ±0.05 0.7 ±0.05 0.1 A 0.95 1.6 ±0.05 A 0.1 B Bottom view 0.4 MAX. 0.75 ±0.05 Top view 0.1 B Package Outline 0.15 x 45° Pin 1 marking Foot Print 0.7 0.4 0.35 0.75 0.75 0.4 0.35 0.7 0.7 0.7 Copper Stencil apertures Solder mask TSNP-6-2 Package Outline Bottom view 0.7 ±0.05 0.2 ±0.05 1) 0.02 MAX. 0.8 ±0.05 3 4 2 5 1 6 1.1 ±0.05 +0.025 0.375 -0.015 0.2 ±0.05 1) Top view 0.4 ±0.05 Pin 1 marking 1) Dimension applies to plated terminals Foot Print N SMD 0.4 0.4 0.25 0.25 0.4 0.4 0.25 0.25 (stencil thickness 100 µm) Copper Solder mask Stencil apertures All dimensions in mm 43 TSNP-7-1 Package Outline Top view Bottom view 1.3 ±0.05 0.375 +0.025 -0.015 1.15 ±0.05 1) 0.02 MAX. 1 ±0.05 6 7 3 Pin 1 marking 2 2 ±0.05 6 x 0.25 ±0.05 1) 5 1.1 ±0.05 1) 1.75 ±0.05 4 1 6 x 0.2 ±0.05 1) 1) Dimension applies to plated terminals Foot Print S MD 1.4 Copper 1.4 0.2 0.25 0.2 0.3 0.3 Copper 0.2 0.2 Stencil apertures Solder mask 0.25 1.9 0.2 1.9 0.25 0.3 R0.1 0.25 0.25 0.2 0.3 0.3 0.25 0.2 0.3 0.2 0.2 1.9 1.9 0.2 0.25 0.2 0.2 0.2 1.4 0.2 NSM D 1.4 0.25 R0.1 Stencil apertures Solder mask TSNP-7-6 Package Outline Top view Bottom view 1.26 ±0.05 0.375 +0.025 -0.015 1.16 ±0.05 1) 0.02 MAX. 6 1.4 ±0.05 0.5 ±0.05 1) 1.175 ±0.05 5 7 3 Pin 1 marking 2 6 x 0.225 ±0.05 1) 0.96 ±0.05 4 1 6 x 0.2 ±0.05 1) 1) Dimension applies to plated terminals Foot Print Copper 0.35 0.2 0.2 0.25 0.35 0.25 0.23 0.25 1.55 0.2 0.45 0.35 0.25 0.35 0.2 1.55 0.25 1.21 0.51 0.45 SMD 1.21 0.51 0.23 0.25 0.23 Solder mask Vias 0.23 Stencil apertures All dimensions in mm 44 TSNP-7-10 Package Outline Top view Bottom view 1.7 ±0.05 1.47 ±0.05 0.73 +0.04 -0.03 0.05 MAX. 1.08 ±0.05 6 7 3 Pin 1 marking 2 6 x 0.31 ±0.05 5 2.3 ±0.05 1.28 ±0.05 1.99 ±0.05 4 1 6 x 0.275 ±0.05 1) Dimension applies to plated terminals Foot Print NS MD 0.3 1.28 1.09 0.5 0.28 1.09 0.5 0.28 0.19 1.5 0.54 0.57 S MD 0.8 0.28 0.5 1.09 0.3 0.49 0.2 0.465 0.58 0.35 1.09 0.5 0.28 0.19 0.54 0.575 Copper Solder mask 0.35 Vias top to first inner layer 0.54 0.57 Stencil apertures All dimensions in mm 45 TSNP-9-1 Package Outline Top view Bottom view 0.4 B 7 8 9 0.6 ±0.05 0.1 A 2x Pin 1 marking 6 0.4 0.2 ±0.05 8x 0.8 1.1 ±0.05 5 0.1 B 0.02 MAX. 1.5 ±0.05 4 3 2 1 Index marking 0.1 x 45° 0.2 ±0.05 A 3 x 0.4 = 1.2 0.1 B 0.77 MAX. 0.8 0.2 ±0.05 8x 0.1 A Foot Print 0.4 0.2 0.25 0.25 0.25 0.65 0.25 0.4 0.4 0.25 0.4 0.25 0.4 0.25 0.075 0.4 0.55 0.125 Copper Solder mask Stencil apertures All dimensions in mm 46 TSNP-10-1 Package Outline Top view Bottom view 0.4 MAX. B 7 3 8 2 9 1 10 0.2 ±0.05 10x Pin 1 marking 0.2 ±0.05 10x 6 4 0.4 1.5 ±0.05 3 x 0.4 = 1.2 5 0.1 B 0.4 0.02 MAX. 1.1 ±0.05 A 0.8 0.1 A Foot Print Optional solder mask dam 0.4 0.4 0.4 0.2 0.475 10x 0.25 0.4 0.475 10x 0.25 0.4 10x 0.25 Copper Solder mask 0.4 Stencil apertures All dimensions in mm 47 TSNP-14-3 0.1 B Package Outline Top view Bottom view 3 x 0.5 = 1.5 10 11 1.7 12 13 6 14 5 4 B 9 0.45 8 3 2 1 0.2 x 45° Pin 1 marking 1.1 ±0.05 14 x 0.17 ±0.05 0.45 0.1 B 1.1 ±0.05 2 x 0.4 = 0.8 2 ±0.05 0.5 7 0.4 0.05 MAX. 2 ±0.05 A 0.2 ±0.05 14x 0.77 MAX. 0.1 A 0.1 A Foot Print 14x 0.22 0.22 0.4 0.4 0.25 0.5 Copper 0.85 Solder mask 0.85 1.1 0.85 1.1 0.4 0.4 0.25 14x 0.25 1.1 0.25 0.5 0.85 (stencil thickness 80 µm) Stencil apertures All dimensions in mm 48 TSNP-16-1 Package Outline Top view Bottom view 2.3 ±0.05 1) 0.375 +0.025 -0.015 2 ±0.05 0.02 MAX. (0.08) 2.3 ±0.05 0.2 x 45° 16 16 x 0.2 ±0.035 1.4 ±0.035 1±0.05 1.4 ±0.035 2 ±0.05 1±0.05 1 16 x 0.2 ±0.035 1) Dimension applies to plated terminals Foot Print NS MD 0.2 0.3 0.3 0.55 1.25 0.2 0.3 0.3 0.3 0.2 0.3 Copper 0.2 0.3 0.2 0.2 0.3 0.2 0.3 0.2 0.3 Stencil apertures Solder mask S MD–V 1 S MD– V 2 0.2 0.3 0.3 0.3 Copper 0.2 0.3 0.2 Solder mask 0.2 0.3 0.3 0.2 0.15 0.15 2.3 0.55 1.25 0.35 0.225 2.3 0.55 1.25 0.35 0.225 0.075 0.275 0.225 2.3 2.3 1.25 0.225 0.3 0.3 0.2 0.3 0.2 0.3 0.2 Vias top to first inner layer All dimensions in mm 49 TSNP-16-6 Package Outline Top view Bottom view 2.3 ±0.05 1) 0.73 +0.04 -0.03 2 ±0.035 0.02 MAX. 16 16 x 0.2 ±0.035 2.3 ±0.05 16 x 0.2 ±0.035 0.2 x 45° 1.4 ±0.035 1±0.05 2 ±0.035 1.4 ±0.005 1±0.05 1 1) Dimension applies to plated terminals Foot Print NS MD 0.2 0.3 0.3 0.55 1.25 0.2 0.3 0.3 0.3 0.2 0.3 Copper 0.2 0.3 0.2 0.2 0.3 0.2 0.3 0.2 0.3 Stencil apertures Solder mask S MD–V 1 S MD– V 2 0.2 0.3 0.3 0.3 Copper 0.2 0.3 0.2 Solder mask 0.2 0.3 0.3 0.2 0.15 0.15 2.3 0.55 1.25 0.35 0.225 2.3 0.55 1.25 0.35 0.225 0.075 0.275 0.225 2.3 2.3 1.25 0.225 0.3 0.3 0.2 0.3 0.2 0.3 0.2 Vias top to first inner layer All dimensions in mm 50 TSNP-26-2 Package Outline Top view Bottom vew 3.4 ±0.05 0.4 ±0.05 0.02 MAX. 0.4 ±0.05 1.7 ±0.05 2.5 ±0.05 2.6 ±0.05 2 ±0.05 1.6 ±0.05 26x0.2 ±0.05 2.85 ±0.05 0.73 +0.04 -0.03 26 4x0.25 ±0.05 1 22x0.2 ±0.05 0.43 ±0.05 1) Dimension applies to plated terminals Foot Print NS MD 0.25 2.45 0.3 0.25 0.25 0.25 0.25 0.25 0.25 0.15 1.65 0.6 0.25 0.25 0.35 0.25 0.15 0.16 Copper Solder mask 0.3 1 0.25 0.35 (stencil thickness 100 µm) Stencil apertures All dimensions in mm 51 TSNP-26-3 Package Outline 0.1 B 1.7 ±0.05 6 x 0.4 = 2.4 2.8 ±0.05 B 0.4 0.4 0.05 MAX. 3.2 ±0.05 7 x 0.4 = 2.8 0.2 ±0.05 0.77 MAX. A Bottom view 0.1 B Top view 2.1 ±0.05 Pin 1 marking 0.2 ±0.05 0.1 A 0.1 A Foot Print 26x 0.25 2.1 0.9 0.25 26x 0.25 0.25 1.2 1.7 2.65 0.7 1.2 0.4 26x 0.25 Optional solder mask dam 1.4 0.4 1.4 (stencil thickness 100 µm) 3.05 Copper Solder mask Stencil apertures All dimensions in mm 52 TSSLP-2-1, -2 Package Outline Top view Bottom view 0.31 +0.01 -0.02 2 0.62 ±0.035 0.355 ±0.025 0.32 ±0.035 1 0.2 ±0.025 1) 0.26 ±0.025 1) Cathode marking 1) Dimension applies to plated terminal Foot Print 0.24 0.19 0.19 0.57 0.14 0.62 Copper 0.19 0.27 0.24 0.32 Solder mask Stencil apertures TSSLP-2-3, -4 Package Outline Top view Bottom view 0.31 +0.01 -0.02 0.32 ±0.05 0.355 0.62 ±0.05 2 1 0.05 MAX. 0.26 ±0.035 0.2 ±0.035 1) Pin 1 marking 1) 1) Dimension applies to plated terminals Foot Print Solder mask 0.19 0.19 0.57 0.14 0.24 0.62 Copper 0.19 0.27 0.24 0.32 Stencil apertures All dimensions in mm 53 VQFN-32-9, -15 Package Outline 0.9 MAX. (0.65) Index Marking C 0.55 ±0.07 26 27 32 11 1 10 0.1±0.05 (0.2) (3.9) 0.05 MAX. 4.4 (2.9) 0.5 5 x 0.5 = 2.5 32x 0.08 17 16 3.4 0.5 1) +0.03 SEATING PLANE B 4.3 5.3 9 x 0.5 = 4.5 0.1±0.03 A 4.5 ±0.1 5.5 ±0.1 Index Marking 0.25±0.05 32x 0.05 M A B C 1) Vertical burr 0.03 max. all sides Foot Print 4.3 3.9 Solder resist covering vias and segmenting thermal pad (optional) 0.5 0.25 3.3 2.9 0.85 Package outline 5.5 x 4.5 Space for via hole (optional) All dimensions in mm 54 WFWLB-119-1 Package Outline 11 x 0.5 = 5.5 0.5 0.8 MAX. A 12 11 10 9 8 7 6 5 4 3 6 ±0.1 SEATING PLANE 0.1 C C 119x 0.08 COPLANARITY Index Marking M L K J H G F E D C B A 11 x 0.5 = 5.5 6 ±0.1 0.5 B 2 1 Index Marking 119x ø0.15 M C A B ø0.05 M C 0.3 ±0.05 0.15 MIN. STANDOFF Foot Print 0.25 0.25 0.25 0.25 0.5 0.5 0.5 0.5 0.275 0.275 Copper Solder mask Stencil apertures All dimensions in mm 55 WLL-2-1 Package Outline Top view Bottom view 0.28 ±0.03 0.2 ±0.02 (0.16) 0.36 2 1 0.58 ±0.03 0.15 ±0.01 0.26 ±0.02 Foot Print 0.24 0.19 0.19 0.57 0.14 0.62 Copper 0.19 0.27 0.24 0.32 Solder mask Stencil apertures WLL-2-2 Package Outline Top view Bottom view 0.15 ±0.01 0.13 ±0.02 0.43 ±0.03 0.23 ±0.03 (0.15) 0.28 2 1 0.2 ±0.02 Foot Print Copper Solder mask 0.3 0.15 0.23 0.3 0.15 0.23 Stencil apertures All dimensions in mm 56 Packing Information (Tape and Reel) Tape and Reel (DIN IEC 286-3) Please consult your nearest Infineon sales offices (see list of addresses) if you have any queries relating to additional dimensions, dimensional tolerances or variations. Tape and Reel made of Plastic ø Reel 180mm and 330mm Carrier tape width: 8, 12mm ø330 12 11 10 Direction of unreeling 9 8 7 6 5 4 ø180 3 Upper side 2 Sd 1 Removable transparency foil 93 07 I n fi neo 8 Optional: additional customer label n I n fi neo n Barcode label (readable in this position and removable) Tape and Reel made of Paper (only for TSLP Packages) ø Reel 180mm Carrier tape width: 8mm Direction of unreeling Upper side Upper side Bottom side Sd Infi neo Optional: additional customer label n Barcode label (readable in this position and removable) All dimensions in mm 57 Packing Information (Tape and Reel) Fixing on the Tape 13 ±0.2 30 ±10 Carrier tape width: ≤ 12mm on Direction of unreeling 1.5 +0.1 4 ±0.1 Trailer (empty) Leader (empty) (1 x Circumference / Hub) min. 160mm (1 x Circumference / Reel) min. 400mm There shall be a leader of 400mm minimum of cover tape, which includes at least 100mm of carrier tape with empty compartments. All the leader may consist of the carrier tape with empty compartments, sealed by cover tape. For 1 Tape (resembling a pizza box) S d ine on O V RIG E PA R IN C PA AL K C IN K G T Inf Infineon packing label Up to 10 Tapes S d ine on O V RIG E PA R IN C PA AL K C IN K G T Inf Infineon packing label Inf ine Inf on ine on Barcode label All dimensions in mm 58 Support Material More detailed Information on RF & Protection Devices Data Sheets/Application Notes/Technical Reports www.infineon.com/esdprotection www.infineon.com/rf Please see also the product pages of this brochure for direct links. Brochures: Application Guide for Mobile Communication Application Guide for Protection Application Guide for Industrial Application Guide for Consumer Evaluation Boards Visit our ESD Protection Forum: www.infineon.com/esdforum www.infineon.com/rpd_appguide_mobile www.infineon.com/rpd_appguide_protection www.infineon.com/rpd_appguide_industrial www.infineon.com/rpd_appguide_consumer For more information please contact your sales counterpart. Ask Infineon. Get connected with the answers. Infineon offers its toll-free 0800/4001 service hotline as one central number, available 24/7 in English, Mandarin and German. Our global connection service goes way beyond standard switchboard services by offering qualified support on the phone. Call us! Germany ................... 0800 951 951 951 (German/English) China, mainland ....... 4001 200 951 (Mandarin/English) India .......................... 000 800 4402 951 (English) USA ............................ 1-866 951 9519 (English/German) Other countries ......... 00* 800 951 951 951 (English/German) Direct access ............. +49 89 234-0 (interconnection fee, German/English) * Please note: Some countries may require you to dial a code other than “00” to access this international number, please visit www.infineon.com/service for your country! Where to Buy Infineon Distribution Partners and Sales Offices: www.infineon.com/WhereToBuy Stay connected www.facebook.com/infineon Mobile Product Catalog Mobile app for iOS and Android. www.google.com/+infineon www.twitter.com/infineon www.infineon.com/linkedin www.infineon.com/xing www.youtube.com/infineon Visit us: www.infineon.com Attention please! The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Order Number: B132-I0011-V1-7600-EU-EC-P Date: 09 / 2014 Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Published by Infineon Technologies AG 85579 Neubiberg, Germany © 2014 Infineon Technologies AG. All Rights Reserved. Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain andsustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.