Oven Controlled Crystal Oscillators SXO-8000K SERIES OCXO ± 0.01 to ± 0.05 ppm (+3.3V FIXED MODELS) 14.3x9.4 mm XTAL Specifications SXO-8000K*1 General part number Frequency range 5.000 MHz to 40.000 MHz ±0.5 ppm max. (VDD = +3.3V, Vcon = +1.65V, CL = 15 pF & 1 hour after warm-up time) Initial frequency tolerance at +25゜ C ±2゜ C CLK OSC 1.27 gm (wt.) SXO-8000K Frequency Stability 9.4±0.3 6.5±0.2 VCXO Absolute Max. Ratings 1.0 #3 #6 #5 #4 6.4±0.1 #2 TCXO Pin Connection Pin Connection Output Vcon 4 1 NC* NC* 5 2 VDD GND 6 3 (*) #2 & #5 : Pulled up internally and connected to #6 / +V DC. Connect #2, #5 & #6 to outer NC’s. SOLDERING PATTERN 3.0 OCXO 8.8 1.27 2.54 Temperature range Aging (after 30 days) at +25゜ C ±2゜ C Operating Conditions #1 AA2 / iii : ±10 ppb max. over -20゜ C to +70゜ C (referred to +25゜ C) BB2 / iii : ±20 ppb max. over -20゜ C to +70゜ C (referred to +25゜ C) CC2 / iii : ±30 ppb max. over -20゜ C to +70゜ C (referred to +25゜ C) EE2 / iii : ±50 ppb max. over -20゜ C to +70゜ C (referred to +25゜ C) BB2 / mll : ±20 ppb max. over -40゜ C to +85゜ C (referred to +25゜ C) CC2 / mll : ±30 ppb max. over -40゜ C to +85゜ C (referred to +25゜ C) EE2 / mll : ±50 ppb max. over -40゜ C to +85゜ C (referred to +25゜ C) ±10 ppb max. at VDD = +3.3V ±5% DC ±10 ppb max. at CL = 15 pF ±10% ±5 ppb max. per day ±500 ppb max. per year C to +70゜ C (Standard) -20゜ C to +85゜ C (W = Option) -40゜ +3.3V DC ±5% +1.65V DC ±1.65V -0.6V to +4.0V DC -0.6V to VDD +0.6V DC C to +85゜ C -55゜ 600 mA (during warm-up) 200 mA (steady state at +25゜ C) 45% to 55% at 1/2 VDD level 4 ns max. (10% VDD to 90% VDD level) Input voltage change Output load change 14.3±0.3 2.54 OUTPUT WAVEFORM Operating temperature Supply voltage (VDD) Control voltage (Vcon) Supply voltage Control voltage Storage temperature Input current (max.) Output (-40゜ C to +85゜ C) Frequency Adjustment Frequency slope Linearity Symmetry Rise and fall times "0" Level VOL : 10% VDD max. "1" Level Load Voltage control (+0.2V to +2.8V) VOH : 90% VDD min. 15 pF max. (CMOS) ±5 ppm min. Positive 5% max. SSB phase noise (at 19.200 MHz & +25゜ C) 10 Hz 100 Hz 1 kHz 10 kHz -94 dBc / Hz, Typical -124 dBc / Hz, Typical -145 dBc / Hz, Typical -155 dBc / Hz, Typical 5 minutes to ±20 ppb of final frequency at +25゜ C 1 MΩ max. ±1 ppb max. (Allan variance Tau = 0.1 sec.) +250゜ C ±10゜ C for 10 seconds +170゜ C ±10゜ C for 1 to 2 minutes (preheating) 10.000, 12.800, 13.000, 16.384, 19.200, 20.000, 25.000, 26.000, 30.720, 38.400, 38.880, 40.000 Warm-up time Vcon input impedance Short-term frequency stability Reflow condition Standard frequencies (MHz) ( * 1 ) Fi nal par t n um ber to be as s i gned w i th pac k age ty pe, fr equenc y s tabi l i ty and fr equenc y. e. g. S X O- 8000K -C C 2/i i i- 13.000M H z 4.0±0.1 SXO-8000K L ∅ 1.5 + 0 -0 .1 Metal Reflow soldering (4 corners) Terminal Tungsten (metalized) Terminal plating RoHS ( * ) C leani ng i s not r ec ommended. Gold / Nickel (surface) / (under) Compliant (Pb-free) D PCB Sealing C Base 2.0±0.1 M B J Lid 136 TAPE SPECIFICATIONS 1.75±0.1 Package A MCF PACKAGE DATA Item CMOS ● CMOS OUTPUT ● PACKAGE SIZE 14.3x9.4 mm Item Actual size 14.3x9.4 mm STANDARD SMD OCXO STANDARD SPECIFICATIONS SXO-8000K 5.08 5 to 40 MHz F A B C D F J L M ReelDia. Qty/Reel 14.7 10 24.0 11.5 16 2.0 0.5 7.0 330 500pcs